CN101187674A - Differential capacitance type micromechanical accelerometer - Google Patents
Differential capacitance type micromechanical accelerometer Download PDFInfo
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- CN101187674A CN101187674A CNA2007101795966A CN200710179596A CN101187674A CN 101187674 A CN101187674 A CN 101187674A CN A2007101795966 A CNA2007101795966 A CN A2007101795966A CN 200710179596 A CN200710179596 A CN 200710179596A CN 101187674 A CN101187674 A CN 101187674A
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Abstract
The invention discloses a differential-capacitive type micromachine accelerometer, which belongs to the inertia sensor field of a micro electric system (MEMS). The accelerometer comprises a sensitive quality component which is composed of a silicon chip, an insulating layer and movable electrodes, fixing electrodes, a base piece and a folding beam. The movable electrodes are distributed in equal distance on the silicon chip, the insulating layer is used to separate each movable electrode in space, the folding beam is arranged on two ends of the sensitive quality component and is fixed on the base plate through a vertical prop, thereby whole surfaces of the movable electrodes are pending and in parallel, the fixing electrodes are distributed in equal distance on the base plate and are arranged crisscross with the movable electrodes to form a group of differential-capacitive capacitances. The invention increases greatly sensitive quality of a quality block, thereby sensitivity and distinguish ability are increased greatly. The invention has simple structure and uses integrated circuit plane manufacturing technique to process the movable electrodes and the fixing electrodes. The invention has low cost, simple manufacturing technique, high reproducibility and high rate of finished products, and is easy to produce in batches.
Description
Technical field
The invention belongs to the inertial sensor field in the MEMS (micro electro mechanical system) (MEMS), particularly a kind of differential capacitance type micro-mechanical accelerometer, the motion state that can be widely used in automotive electronics, Aero-Space, weaponry is measured and control.
Background technology
To the measurement of object moving state be controlled at the product for civilian use and the defence product field has a wide range of applications.Accelerometer is mainly used in the kinematic parameter of measuring moving object relative inertness space, and traditional accelerometer is subjected to the restriction of factors such as volume, weight and cost, is difficult to apply at civil area.With integrated circuit (IC) technology and precision optical machinery processing technology serves as that micro-mechanical accelerometer that the basis makes has that volume is little, in light weight, cost is low, the high outstanding advantage of reliability, its volume and price be than little three, four orders of magnitude of conventional accelerometer and even more, thereby can be used for civil applications field widely such as motion state of automobile control system, camera stabilization system, movable machinery control, robot observing and controlling, geodetic surveying, medical apparatus.
1993, U.S. AD company was successfully with the micro-mechanical accelerometer commercialization, and large quantities of safe automobile air bag that is applied to, and the iMEMS accelerometer of existing 100,000,000 5 thousand ten thousand AD companies is installed in the vital automobile air-bag system of safety now.At present, the micro-mechanical accelerometer of China development mainly adopts body processing technology, utilizes the comb structure that processes (Chinese invention patent: CN1139815C) or grating structure (Chinese invention patent: CN1844935A) form one group of pectination differential capacitor.Figure 1 shows that the micro-mechanical accelerometer sensitive structure of comb structure, comprise the responsive mass elements that the tooth pivot 11 that is processed to form by body, the moving tooth 12 of many groups and folded beam 13 are formed, fixed teeth 14, column 15.Moving tooth 12 is stretched out to both sides by toothed hub, forms bilateral comb-tooth-type structure, and the folded beam 13 at these tooth pivot two ends is fixed on the substrate by column, makes tooth pivot, moving unsettled the be arrangeding in parallel of the relative substrate of tooth of many groups; Fixed teeth 14 is for directly being fixed on the one-sided comb structure of on-chip many groups.Each moving tooth of responsive mass elements is a float electrode of variable capacitance, and is interconnected with each broach of fixed teeth, totally forms differential capacitor.In order to form the moving tooth of many groups in the mass both sides, mass is removed a lot of materials, and the responsive quality of micro-mechanical accelerometer is reduced significantly.
In comb structure or grating structure, in order to form one group of pectination differential capacitor, a lot of partial etchings on the mass to be fallen, cause the responsive quality under limited bulk to reduce significantly, the efficient that acceleration is converted into inertial force is low, reduce the resolution and the sensitivity of micro-mechanical accelerometer, be difficult for realizing high-precision acceleration analysis.
Summary of the invention
The objective of the invention is in order to overcome the too small weak point of the responsive quality of prior art, provide a kind of simple in structure, mass big, adopt planar technology to form the high sensitivity differential capacitance type micro-mechanical accelerometer of comb electrode, to solve existing micro-mechanical accelerometer sensitivity and the not high enough problem of resolution.
A kind of differential capacitance type micro-mechanical accelerometer that the present invention proposes comprises responsive mass elements, fixed electorde, substrate, a folded beam of being made up of silicon chip, insulation course and movable electrode; Wherein, the main body of responsive mass elements is a silicon chip, and movable electrode equidistantly is distributed on the silicon chip with palisade, and insulation course is spatially kept apart each movable electrode; Folded beam is configured in responsive mass elements two ends, constitutes resiliency supported, and is fixed on the substrate by column, makes the relative substrate plane in whole movable electrode plane unsettled parallel; This fixed electorde equidistantly is arranged on the substrate, and fixed electorde and movable electrode are interconnected, forms one group of differential capacitor.
Described silicon chip can adopt the monoblock type rectangular parallelepiped to constitute mass;
Described substrate adopts glass substrate to make material.
Described movable electrode can be formed on the responsive mass surface by the integrated circuit processing technology.
In addition, also can be provided with two-way protecting against shock stop, can realize overload protection effectively, prevent under stronger vertical or horizontal impact, to cause the folded beam structural break at the two ends of responsive mass elements.
On substrate, (be preferably in middle position) and can be provided with an anti-adhesive stop, applying under measuring voltage or the high frequency interference effect, when producing very strong electrostatic suction power between responsive mass elements and the substrate, the short circuit that can prevent fixed electorde and movable electrode adhesive and cause, and prevent the damage of responsive mass elements structure.
The present invention's advantage compared with prior art:
(1) owing to adopt whole rectangle mass, under the same structure volume, can realize maximum responsive quality, improve the sensitivity and the resolution of micro-mechanical accelerometer;
(2) processing technology is simple, easily produces in batches.Use traditional integrated circuit plane processing technology to realize comb electrode at silicon chip surface (mass), need not to use the body silicon process technology that silicon chip is processed into three-dimensional broach or three-dimensional grid type spatial structure, reduce the processing cost of micro-mechanical accelerometer, improve working (machining) efficiency.
(3) further, the two-way stop of convex is set.Effectively prevent vertically, side knock or overload; Anti-adhesive stop is set.Prevented that effectively the micro-mechanical accelerometer that electric pole short circuit causes from damaging.
Description of drawings
Fig. 1 is conventional comb-tooth-type micro-mechanical accelerometer planar structure synoptic diagram;
Fig. 2 is a cross-sectional structure synoptic diagram of the present invention;
Fig. 3 is a plan structure synoptic diagram of the present invention.
Embodiment
A kind of differential capacitance type micro-mechanical accelerometer that the present invention proposes reaches embodiment in conjunction with the accompanying drawings and is described in detail as follows:
Structure of the present invention such as Fig. 2, shown in Figure 3 comprise substrate 1, fixed electorde 2, mass 3, movable electrode 4, movable electrode lead-in wire 5, insulation course 6, folded beam 7, column 8, anti-adhesive stop 9, protecting against shock stop 10.Mass 3 is done main body by silicon chip and is adopted the monoblock type rectangular parallelepiped to constitute, the equidistant movable electrode 4 of arranging on silicon chip, isolate with insulation course 6 between the movable electrode 3, respectively there is folded beam 7 at mass 3 two ends, constitute resiliency supported, folded beam is connected with substrate 1 by column 8, make movable electrode 4 planes parallel with substrate 1, substrate 1 adopts glass substrate to make material, arrange one group of fixed electorde 2 on the substrate 1 below each movable electrode 4, it comprises two electrodes, divides to be listed in each movable electrode 4 axis both sides, equate all movable electrodes 4 and fixed electorde 2 overall formation differential capacitors with movable electrode 4 overlapping areas.Anti-adhesive stop 9 is set in the middle of substrate 1, anti-adhesive stop 9 is made by insulating material, 2 distances of movable electrode 4 and fixed electorde are 4 μ m in an embodiment, and anti-adhesive stop 9 exceeds fixed electorde plane 1 μ m, can prevent movable electrode 4 and fixed electorde 2 contingent adhesives.Protecting against shock stop 10 can be realized the vertical and horizontal overload protection, prevents that stronger impact from causing the folded beam structural break.
Above-mentioned movable electrode can be formed on the responsive quality silicon chip surface by the integrated circuit processing technology.
Principle of work of the present invention: the capacitance type micromechanical accelerometer of being on duty experience sensitive axes to acceleration change the time, be converted into inertial force by responsive mass degree of will speed up, inertial force is subjected to displacement mass, movable electrode is along with mass also is subjected to displacement, movable electrode and fixed electorde relative area change immediately, output differential capacitor amount is changed, can realize the detection of acceleration by the variation that detects the differential capacitor amount.
In sum, the present invention innovates capacitance type micromechanical accelerometer in design, it can realize sensitivity and the resolution higher than the comb-tooth-type micro-mechanical accelerometer of routine, the sensitivity and the resolution of micro-mechanical accelerometer have not only been promoted, and can under HI high impact, high overload condition, use, and have extraordinary manufacturability and reliability.
Claims (6)
1. a differential capacitance type micro-mechanical accelerometer is characterized in that: comprise responsive mass elements, fixed electorde, substrate, folded beam, a column that is made of silicon chip, insulation course and movable electrode; Wherein the main body of responsive mass elements is a silicon chip, and movable electrode equidistantly is distributed on the silicon chip lower surface with palisade, and insulation course is spatially kept apart each movable electrode; Folded beam is configured in responsive mass elements two ends, and is fixed on the substrate by column, makes the relative substrate in whole movable electrode plane unsettled parallel; This fixed electorde equidistantly is arranged on the substrate, and fixed electorde and movable electrode are interconnected, forms one group of differential capacitor.
2. differential capacitance type micro-mechanical accelerometer as claimed in claim 1 is characterized in that, described silicon chip adopts the monoblock type rectangular parallelepiped to constitute responsive mass.
3. differential capacitance type micro-mechanical accelerometer as claimed in claim 2 is characterized in that, movable electrode is formed on the responsive mass surface by the integrated circuit processing technology.
4. differential capacitance type micro-mechanical accelerometer as claimed in claim 1 is characterized in that, is provided with two-way convex protecting against shock stop at responsive mass elements two ends.
5. differential capacitance type micro-mechanical accelerometer as claimed in claim 1 is characterized in that, substrate is provided with anti-electrode adhesive stop.
6. differential capacitance type micro-mechanical accelerometer as claimed in claim 1 is characterized in that, described substrate adopts glass substrate to make material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101795966A CN101187674A (en) | 2007-12-14 | 2007-12-14 | Differential capacitance type micromechanical accelerometer |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2007101795966A CN101187674A (en) | 2007-12-14 | 2007-12-14 | Differential capacitance type micromechanical accelerometer |
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| CN101187674A true CN101187674A (en) | 2008-05-28 |
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| CNA2007101795966A Pending CN101187674A (en) | 2007-12-14 | 2007-12-14 | Differential capacitance type micromechanical accelerometer |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102128953A (en) * | 2010-12-10 | 2011-07-20 | 中国科学院上海微***与信息技术研究所 | Capacitive micro-acceleration sensor with symmetrically inclined folded beam structure |
| CN102155987A (en) * | 2010-12-31 | 2011-08-17 | 北京遥测技术研究所 | Differential capacitor type micro-vibration sensor |
| CN103183306A (en) * | 2011-12-29 | 2013-07-03 | 财团法人工业技术研究院 | Micro-electromechanical device with multiple electrical channels and manufacturing method thereof |
| WO2014106361A1 (en) * | 2013-01-05 | 2014-07-10 | 中国科学院上海微***与信息技术研究所 | Variable-area capacitive transverse acceleration sensor and fabrication method |
| CN104991086A (en) * | 2015-06-24 | 2015-10-21 | 上海芯赫科技有限公司 | Method for machining MEMS acceleration sensor and acceleration sensor |
| WO2019114390A1 (en) * | 2017-12-11 | 2019-06-20 | 华南师范大学 | Sensor, and manufacturing method thereof |
| CN111077344A (en) * | 2019-12-30 | 2020-04-28 | 华中科技大学 | Acceleration sensor |
| CN111223671A (en) * | 2020-02-27 | 2020-06-02 | 清华大学 | Self-sensing super capacitor with energy storage and impact sensing functions and manufacturing method thereof |
| CN112444275A (en) * | 2019-08-28 | 2021-03-05 | 株式会社东芝 | Sensor with a sensor element |
| CN114279442A (en) * | 2021-12-30 | 2022-04-05 | 中国电子科技集团公司第十三研究所 | Micro-mechanical detection structure for preventing electrostatic attraction |
-
2007
- 2007-12-14 CN CNA2007101795966A patent/CN101187674A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102128953A (en) * | 2010-12-10 | 2011-07-20 | 中国科学院上海微***与信息技术研究所 | Capacitive micro-acceleration sensor with symmetrically inclined folded beam structure |
| CN102128953B (en) * | 2010-12-10 | 2012-10-17 | 中国科学院上海微***与信息技术研究所 | Capacitive micro-acceleration sensor with symmetrically inclined folded beam structure |
| CN102155987A (en) * | 2010-12-31 | 2011-08-17 | 北京遥测技术研究所 | Differential capacitor type micro-vibration sensor |
| CN102155987B (en) * | 2010-12-31 | 2012-06-13 | 北京遥测技术研究所 | Differential capacitor type micro-vibration sensor |
| CN103183306A (en) * | 2011-12-29 | 2013-07-03 | 财团法人工业技术研究院 | Micro-electromechanical device with multiple electrical channels and manufacturing method thereof |
| US9051170B2 (en) | 2011-12-29 | 2015-06-09 | Industrial Technology Research Institute | Microelectromechanical system device with electrical interconnections and method for fabricating the same |
| CN103183306B (en) * | 2011-12-29 | 2015-10-21 | 财团法人工业技术研究院 | Micro-electromechanical device with multiple electrical channels and manufacturing method thereof |
| WO2014106361A1 (en) * | 2013-01-05 | 2014-07-10 | 中国科学院上海微***与信息技术研究所 | Variable-area capacitive transverse acceleration sensor and fabrication method |
| CN104991086A (en) * | 2015-06-24 | 2015-10-21 | 上海芯赫科技有限公司 | Method for machining MEMS acceleration sensor and acceleration sensor |
| CN104991086B (en) * | 2015-06-24 | 2018-01-12 | 上海芯赫科技有限公司 | A kind of processing method and acceleration transducer of MEMS acceleration transducers |
| WO2019114390A1 (en) * | 2017-12-11 | 2019-06-20 | 华南师范大学 | Sensor, and manufacturing method thereof |
| CN112444275A (en) * | 2019-08-28 | 2021-03-05 | 株式会社东芝 | Sensor with a sensor element |
| CN112444275B (en) * | 2019-08-28 | 2023-07-07 | 株式会社东芝 | Sensor for detecting a position of a body |
| CN111077344A (en) * | 2019-12-30 | 2020-04-28 | 华中科技大学 | Acceleration sensor |
| CN111077344B (en) * | 2019-12-30 | 2021-03-26 | 华中科技大学 | Acceleration sensor |
| CN111223671A (en) * | 2020-02-27 | 2020-06-02 | 清华大学 | Self-sensing super capacitor with energy storage and impact sensing functions and manufacturing method thereof |
| CN114279442A (en) * | 2021-12-30 | 2022-04-05 | 中国电子科技集团公司第十三研究所 | Micro-mechanical detection structure for preventing electrostatic attraction |
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