CN101178461A - Photoelectric substrates - Google Patents
Photoelectric substrates Download PDFInfo
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- CN101178461A CN101178461A CN 200610138108 CN200610138108A CN101178461A CN 101178461 A CN101178461 A CN 101178461A CN 200610138108 CN200610138108 CN 200610138108 CN 200610138108 A CN200610138108 A CN 200610138108A CN 101178461 A CN101178461 A CN 101178461A
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Abstract
The invention discloses a photoelectric baseboard which comprises an electricity guide board and a light guide board. The light guide board comprises a first metal baseboard; a light guiding layer which is formed on the first metal baseboard and consists of a light-wave guide and a covering layer wrapping the light-wave guide; and a metal supporting structure which is formed on the surrounding of the light guiding layer. When the electricity guide board is jointed with the light guide board as a pressing board technique, the metal supporting structure can absorb the press being applied by the photoelectric baseboard. The invention combines the light-wave guide and a printing circuit board technique flow so as to lead the light-wave guide to become one layer in the printing circuit board and lead the light-wave guide to transmit light signals, and the invention utilizes the brass as the light guiding layer so as to increase the rigidity of the whole photoelectricity baseboard, prevent the distortion or damage caused by the high temperature and high pressure domino effects to the light-wave guide self during the board pressing technique, can form much better reflection surface, increase light-coupling efficiency and reduce the transmitting lost of the common light-wave guide and the light disturbing phenomena among multi-channel light-wave guide.
Description
Technical field
The present invention relates to a kind of photoelectric substrates, relate in particular to a kind of photoelectric substrates with optical waveguide supporting construction.
Background technology
Along with the growth of the Internet (Internet), people increase day by day for the demand of network bandwidth, and fiber optic network is more and more towards high capacity, changeableization, high-reliability, and economical and effective aspect development.The development of optical communication, from backbone network, all can network, access network, storage network comprehensively fiberize at present, fiber optic networkization (Optical Networking) realizes that step by step fiber-to-the-home forms gradually.And that the bottleneck of frequency range can drop on is so-called " last rice ", last rice comprises following three fields: host-to-host (Rack to Rack), plate to plate (Board to Board) and chip to chip (Chip to Chip).
Present short distance interconnection technique is at present still based on copper conductor.Along with the VLSI development of technology, IC can handle more complicated scientific analysis and calculate, high performance network system also is achieved, advanced broadband service as fiber-to-the-home, constantly dwindling of IC volume, more realize products such as picture mobile phone, PDA, handheld computer, brought more easy-to-use and enjoyment.In the past 20 years of microprocessor, operating frequency constantly increases, and such trend also can be same several years of future continues, according to semiconductor technology blueprint (International Technology Roadmap for Semiconductor; ITRS) prediction expects microprocessor frequency in 2011 and will reach 10GHz, is very difficult yet IC will reach outside high frequency connection.Now, the electrical interconnects of chip mainly is that framework is at printed circuit board (PCB) (Printed CircuitBoard; PCB), the place in electric adapter, through hole (via holes) and branch, discontinuous decay and the distortion that causes signal of impedance, the distance of serious restriction transmission.
The performance that tradition electrically connects can be because of being subjected to problems such as signal attenuation, electromagnetic radiation and interference, and very big restriction is arranged.In order to overcome above-mentioned problem, the light interconnection can be used for realizing high frequency range and high performance information transmission, does not produce the problem of noise because of itself not having electromagnetic radiation with not being subjected to electromagnetic interference.The utilization method of optics connects computer chip, circuit board, base plate, main frame and processor, with high-speed light submode transmission signals, and bottleneck problem such as heating when solving the conditional electronic transmission, speed, frequency range are limited.
U.S. publication U.S.6,804,423 disclose a kind of photoelectric traverse substrate " OPTICAL/ELECTRICAL WIRING MOUNTED BOARD AND METHOD OF MANUFACTURINGOPTICAL-ELECTRICAL WIRING BOARD ", with reference to Fig. 1 and Fig. 2.Fig. 1 shows the vertical view of the photoelectric substrates 10 of prior art.Fig. 2 shows the cut open side view of the photoelectric substrates 10 of prior art along 2-2 hatching line among Fig. 1.As shown in Figures 1 and 2, the photoelectric substrates 10 of prior art includes a photoconductive layer 12 and an electric guide plate 14 is formed on the photoconductive layer.Include light nuclear (core) in the photoconductive layer 12 with as optical waveguide (waveguide), it is made up of a horizon light waveguide 20 and a vertical light waveguide 22, with the light signal of carry high frequency.Electricity guide plate 14 has a through hole with ccontaining vertical light waveguide 22.In addition, photoconductive layer 12 include in addition a horizontal overlayer (clad) 30 be formed at horizon light waveguide 20 around so that horizon light waveguide 20 be embedded in wherein, and a vertical overlayer 32 be formed at vertical light waveguide 22 on every side so that vertical light waveguide 22 be embedded in wherein.In addition, four light connection pads (pad) 52,54,56 and 58 are formed at the surface of electric guide plate 14 so that photoconductive layer 12 produces electrical interconnects with electric guide plate 14.
In addition, dispose a catoptron 40 in the photoconductive layer 12 in addition, its with respectively and horizon light waveguide 20 and vertical light waveguide 22 mode that forms 45s be disposed between horizon light waveguide 20 and the vertical light waveguide 22.Because, horizontal overlayer 30 and vertical overlayer 32 are made by the material that refractive index is lower than light nuclear, so reflex to vertical light waveguide 22 through catoptron 40 again after light signal from the emission of optical element (not shown), enters horizon light waveguide 20, and reach good optical signal transmission.
The advantage of above-mentioned framework is optical waveguide and circuit board can be integrated, and can easily optical element be engaged with optical waveguide and circuit board, produces the photoelectricity base version that can transmit light signal and electric signal.But because of the joint technology of circuit board and optical waveguide layer adopts pressing plate technology, it is the technology of a High Temperature High Pressure, and optical waveguide is made by macromolecular material, so produce distortion easily among High Temperature High Pressure, and the transition temperature of optical waveguide has only 180 ℃ approximately, in the High Temperature High Pressure process of pressing plate, can cause the optical path skew of overall optical waveguide, even get back under the normal temperature and pressure, still can't return back to due light coupling efficient, cause a large amount of loss of light signal.Consult Fig. 3, Fig. 3 is the mirror angle of optical waveguide of prior art and the curve map of light coupling efficient, as shown in Figure 3, in pressing plate technology, when the mirror surface of optical waveguide when 45 ° are deformed into 38 °, light coupling efficient can reduce to 39% from 83%.
Therefore, how facilitating not influencing under the pressing plate technology of traditional printing circuit board, with combining with circuit board of the optical waveguide success of fragile structure, and be unlikely to have influence on the characteristic of optical waveguide, will be industry problem anxious to be solved.
Summary of the invention
The present invention wants the technical solution problem to be to provide a kind of photoelectric substrates, making the distortion of optical waveguide reduce to minimum in the pressing plate technology under High Temperature High Pressure, and can not produce the phenomenon of surface deformation.
For realizing above-mentioned purpose, the invention provides a kind of photoelectric substrates, it includes an electric guide plate in order to transmission of electric signals, and an optical plate engages in order to transmitting optical signal with electric guide plate.Optical plate includes one first metal substrate, an optical waveguide layer, is formed on first metal substrate and a metal support structure, be formed at optical waveguide layer around.In addition, optical waveguide layer is made up of the overlayer of an optical waveguide and a coating optical waveguide.When electric guide plate engages with pressing plate technology with optical plate, but the pressure that metal support structure absorbing light electric substrate is bestowed.
According to above-mentioned purpose, the present invention provides a kind of photoelectric substrates again, and it includes an electric guide plate in order to transmission of electric signals, and an optical plate engages in order to transmitting optical signal with electric guide plate.Optical plate includes one first metal substrate and an optical waveguide layer, is formed on this first metal substrate.In addition, optical waveguide layer is made by a sheet metal, and has most bar grooves on the sheet metal, makes to form a protection rib between per two grooves.When electric guide plate engages with pressing plate technology with optical plate, but the pressure that the protection rib absorbing light electric substrate of optical waveguide layer is bestowed.
The present invention can reach following effect: 1. optical waveguide is combined with the printed circuit board technology flow process, make optical waveguide become one deck in the printed circuit board (PCB), make it can transmit light signal; 2. utilize copper as optical waveguide layer, can increase the rigidity of whole photoelectricity base version, avoid in pressing plate technology, the distortion or the infringement that optical waveguide itself are caused because of high pressure high temperature dependence; 3. the copper optical waveguide layer can form preferable reflecting surface and can increase light coupling efficient behind suitable processing or plated film, reduces the transmission loss of general optical waveguide, and the light interference phenomenon between the multichannel light waveguide; 4. with traditional pressing plate process compatible, do not need to develop pressing plate flow process or board especially, so can significantly reduce the cost of manufacture of photoelectric substrates because of development photoelectric substrates technology.
Above about content of the present invention explanation and the explanation of following embodiment in order to demonstration with explain principle of the present invention, and provide claim of the present invention further to explain.
Description of drawings
Fig. 1 is the vertical view of the photoelectric substrates of prior art;
Fig. 2 is the cut open side view of the photoelectric substrates among Fig. 1 along the 2-2 hatching line;
Fig. 3 is the mirror angle of optical waveguide of prior art and the curve map of light coupling efficient;
Fig. 4 is the synoptic diagram of first embodiment of the optical plate of photoelectric substrates of the present invention;
Fig. 5 is the synoptic diagram of first embodiment of photoelectric substrates of the present invention;
Fig. 6 is the synoptic diagram of second embodiment of the optical plate of photoelectric substrates of the present invention; And
Fig. 7 is the synoptic diagram of second embodiment of photoelectric substrates of the present invention.
Wherein, Reference numeral:
10: photoelectric substrates 12: photoconductive layer
14: electric guide plate 20: horizon light waveguide
22: vertical light waveguide 30: horizontal overlayer
32: vertical overlayer 40: catoptron
52,54,56,58: light connection pad 100,300: optical plate
110,310: fine nuclear 112,360: overlayer
120,320: optical waveguide layer 130,230,330: fiberglass layer
150,350: metal substrate 152: metal support structure
160: knitting layer 200: electric guide plate
210: go up metal substrate 220: following metal substrate
322: protection rib 324: light reflection surface
Embodiment
With reference to Fig. 4, Fig. 4 is the synoptic diagram of first embodiment of the optical plate 100 of photoelectric substrates of the present invention.As shown in Figure 4, the optical plate 100 of first embodiment of the invention comprises a metal substrate 150, a fiberglass layer 130, be formed on the metal substrate 150, an optical waveguide layer 120, be formed on the fiberglass layer 130, an and metal support structure 152, be formed at optical waveguide layer 120 around and on the fiberglass layer 130.
With reference to Fig. 5.The synoptic diagram of first embodiment of Fig. 5 photoelectric substrates of the present invention.As shown in Figure 5, photoelectric substrates of the present invention is made up of an electric guide plate 200 and optical plate 100, and disposes a knitting layer 160 between electric guide plate 200 and optical plate 100.In present embodiment, electric guide plate 200 includes metal substrate 210 on, once metal substrate 220 and a fiberglass layer 230 are formed between metal substrate 210 and the following metal substrate 220.When making photoelectric substrates of the present invention with pressing plate technology, at first, on the optical waveguide layer 120 of optical plate 100 and metal support structure 152, form knitting layer 160, then, again metal substrate 220 under the electric guide plate 200 is fitted in knitting layer 160, at last, on electric guide plate 200, exert pressure and make electric guide plate 200 and optical plate 100 fluid-tight engagement.
Because pressing plate technology is a High Temperature High Pressure process, when the pressure of being bestowed when electric guide plate 200 is passed to optical plate 100, because of sheet metal 220 and metal support structure 152 under the electric guide plate 200 all are that metal material is made,, the metal support structure 152 around the optical waveguide layer 120 do not cause the fibre nuclear 110 of optical waveguide in the optical waveguide layer 120 to cause destructions, be out of shape so can absorbing from the pressure of electric guide plate 200.
With reference to Fig. 6 and Fig. 7.Fig. 6 is the synoptic diagram of second embodiment of optical plate of the present invention.The synoptic diagram of second embodiment of Fig. 7 photoelectric substrates of the present invention.As shown in Figure 6, the optical plate 300 of second embodiment of the invention comprises a metal substrate 350, a fiberglass layer 330, is formed on the metal substrate 350, an optical waveguide layer 320, is formed on the fiberglass layer 330.
The optical waveguide layer 320 of present embodiment and the optical waveguide layer of first embodiment, 120 maximum differences are that the optical waveguide layer 320 of present embodiment is formed the groove of most bar optical channels thereon with the fibre nuclear 310 as optical waveguide by a sheet metal, in the present invention, the mode that forms groove is made with dry ecthing (Dry etching) technology, and after forming groove, make each groove part have level and smooth light reflection surface 324 by suitable PROCESS FOR TREATMENT (as coating process) again, then, form an overlayer 360 in optical waveguide layer 320 again, and the refractive index of the material that overlayer 360 is selected is less than the refractive index of fibre nuclear 310, so when transmitting optical signal, light signal only can be examined in 310 in fibre and transmit.In addition, each 310 of fine nuclear is kept the spacing that a desire is established, and this spacing is then as the protection rib 322 of optical waveguide layer 320.
As shown in Figure 7, also dispose a knitting layer 160 between electric guide plate 200 and the optical plate 300, and electric guide plate 200 also includes metal substrate 210 on, metal substrate 220 and a fiberglass layer 230 are formed between metal substrate 210 and the following metal substrate 220 once.When making the photoelectric substrates of present embodiment with pressing plate technology, at first, on the optical waveguide layer 320 of optical plate 300, form knitting layer 160, then, following metal substrate 220 with electric guide plate 200 fits in knitting layer 160 again, at last, on electric guide plate 200, exert pressure and make electric guide plate 200 and optical plate 300 fluid-tight engagement.
Because the optical waveguide layer 320 of present embodiment is made by metal material; and each is as all having protection rib 322 between the groove of optical waveguide; when the pressure of being bestowed when electric guide plate 200 is passed to optical plate 300; because of the following sheet metal 220 of electric guide plate 200, the metal substrate 350 and the protection rib 322 of optical plate 300 all are that metal material is made; so the protection rib 322 of optical waveguide layer 320 can disperse to conduct to the pressure of optical plate 300 and do not cause the fibre nuclear 310 of optical waveguide in the optical waveguide layer 320 to cause destruction, distortion from electric guide plate 200.
In addition, because each groove part has level and smooth light reflection surface 324 and process coating film treatment technology in the optical waveguide layer 320, in addition in overlayer 360 in the face of the surface of fine nuclear 310 on also through coating film treatment (as plating metal level), so can when light signal transmits, bring into play reflex, reduce the optical signal transmission loss, increase the optical signal transmission energy, and when the multichannel light waveguide, light reflection surface 324 and can block light interference phenomenon between the optical waveguide well through the overlayer 360 of coating film treatment.
What the spy gave explanation is, in various embodiments of the present invention, the last metal substrate 210 of electric guide plate 200 is made with copper material with following metal substrate 220, other, knitting layer 160 is made with polypropylene (Polypropylene) material.In addition, also made in metal support structure 152 and the optical waveguide layer 320 of first, second embodiment of the present invention with copper material.In addition; in the present invention, also dispose as the described mirror surface of the technology of prior art (not shown) in optical waveguide; because metal support structure 152 and protection rib 322 have preferable rigidity; to be dispersed in the pressure that conducts to light guide plate in the pressing plate technology under the High Temperature High Pressure; so can make the distortion of optical waveguide reduce to minimum, and can not produce the phenomenon of the technology surface deformation of prior art.
Compared to the technology of prior art, the present invention can reach following effect: 1. optical waveguide is combined with the printed circuit board technology flow process, make optical waveguide become one deck in the printed circuit board (PCB), make it can transmit light signal; 2. utilize copper as optical waveguide layer, can increase the rigidity of whole photoelectricity base version, avoid in pressing plate technology, the distortion or the infringement that optical waveguide itself are caused because of high pressure high temperature dependence; 3. the copper optical waveguide layer can form preferable reflecting surface and can increase light coupling efficient behind suitable processing or plated film, reduces the transmission loss of general optical waveguide, and the light interference phenomenon between the multichannel light waveguide; 4. with traditional pressing plate process compatible, do not need to develop pressing plate flow process or board especially, so can significantly reduce the cost of manufacture of photoelectric substrates because of development photoelectric substrates technology.Therefore, the present invention proposes a photoelectric substrates, and the advantage that it combines cost, technology and the rigidity of structure own can be used as the framework of future development photoelectric substrates.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; being familiar with those of ordinary skill in the art ought can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (21)
1. a photoelectric substrates is characterized in that, includes:
One electric guide plate is in order to transmission of electric signals; And
One optical plate engages with this electricity guide plate, and in order to transmitting optical signal, this optical plate includes:
One first metal substrate;
One optical waveguide layer is formed on this first metal substrate, and this optical waveguide layer is made up of an optical waveguide and an overlayer that coats this optical waveguide; And
One metal support structure, be formed at this optical waveguide layer around;
When this electricity guide plate engaged with pressing plate technology with this optical plate, this metal support structure can absorb the pressure that this photoelectric substrates is bestowed.
2. photoelectric substrates according to claim 1 is characterized in that, this optical plate includes one first fiberglass layer in addition and is formed between this first metal substrate and this optical waveguide layer and this metal support structure.
3. photoelectric substrates according to claim 1 is characterized in that, other includes a knitting layer and is formed between this electricity guide plate and this optical plate.
4. photoelectric substrates according to claim 3 is characterized in that, the material of this knitting layer is a polypropylene.
5. photoelectric substrates according to claim 1 is characterized in that, the material of this first metal substrate is a copper.
6. photoelectric substrates according to claim 1 is characterized in that, the material of this metal support structure is a copper.
7. photoelectric substrates according to claim 1 is characterized in that, this electricity guide plate contains:
One second metal substrate;
One the 3rd metal substrate; And
One second fiberglass layer is formed between this second metal substrate and the 3rd metal substrate.
8. photoelectric substrates according to claim 7 is characterized in that, the material of this second metal substrate is a copper.
9. photoelectric substrates according to claim 7 is characterized in that, the material of the 3rd metal substrate is a copper.
10. a photoelectric substrates is characterized in that, includes:
One electric guide plate is in order to transmission of electric signals; And
One optical plate engages with this electricity guide plate, and in order to transmitting optical signal, this optical plate includes:
One first metal substrate;
One optical waveguide layer is formed on this first metal substrate, and this optical waveguide layer is made by a sheet metal, and has most bar grooves on this sheet metal, makes to form a protection rib between per two grooves; And
One overlayer is formed on this optical waveguide layer;
When this electricity guide plate engaged with pressing plate technology with this optical plate, this protection rib of this optical waveguide layer can absorb the pressure that this photoelectric substrates is bestowed.
11. photoelectric substrates according to claim 10 is characterized in that, this optical plate includes one first fiberglass layer in addition and is formed between this first metal substrate and this optical waveguide layer.
12. photoelectric substrates according to claim 10 is characterized in that, this groove of this optical waveguide layer is made in the dry ecthing mode.
13. photoelectric substrates according to claim 12 is characterized in that, the surface of this majority bar groove forms light reflection surface in the coating process mode.
14. photoelectric substrates according to claim 10 is characterized in that, this cover layer face is made mode and is formed light reflection surface with plated film a surface of this groove.
15. photoelectric substrates according to claim 10 is characterized in that, other includes a knitting layer and forms between this electricity guide plate and this optical plate.
16. photoelectric substrates according to claim 15 is characterized in that, the material of this knitting layer is a polypropylene.
17. photoelectric substrates according to claim 10 is characterized in that, the material of this first metal substrate is a copper.
18. photoelectric substrates according to claim 10 is characterized in that, the material of this optical waveguide layer is a copper.
19. photoelectric substrates according to claim 10 is characterized in that, this electricity guide plate contains:
One second metal substrate;
One the 3rd metal substrate; And
One second fiberglass layer is formed between this second metal substrate and the 3rd metal substrate.
20. photoelectric substrates according to claim 19 is characterized in that, the material of this second metal substrate is a copper.
21. photoelectric substrates according to claim 19 is characterized in that, the material of the 3rd metal substrate is a copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101381082A CN100510812C (en) | 2006-11-09 | 2006-11-09 | Photoelectric substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101381082A CN100510812C (en) | 2006-11-09 | 2006-11-09 | Photoelectric substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101178461A true CN101178461A (en) | 2008-05-14 |
| CN100510812C CN100510812C (en) | 2009-07-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101381082A Active CN100510812C (en) | 2006-11-09 | 2006-11-09 | Photoelectric substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100510812C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101808470A (en) * | 2010-03-02 | 2010-08-18 | 上海美维科技有限公司 | Method for manufacturing printed circuit board with optical function |
| CN101394713B (en) * | 2007-09-19 | 2011-01-19 | 欣兴电子股份有限公司 | Photoelectric circuit board and manufacturing method thereof |
| CN101592760B (en) * | 2008-05-27 | 2012-12-12 | 日东电工株式会社 | Opto-electric hybrid module and manufacturing method thereof |
| CN102928936A (en) * | 2012-11-12 | 2013-02-13 | 依利安达(广州)电子有限公司 | Manufacture method of optical printed wiring board |
| WO2021082287A1 (en) * | 2019-10-30 | 2021-05-06 | 南昌欧菲生物识别技术有限公司 | Support structure and flexible printed circuit board |
-
2006
- 2006-11-09 CN CNB2006101381082A patent/CN100510812C/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101394713B (en) * | 2007-09-19 | 2011-01-19 | 欣兴电子股份有限公司 | Photoelectric circuit board and manufacturing method thereof |
| CN101592760B (en) * | 2008-05-27 | 2012-12-12 | 日东电工株式会社 | Opto-electric hybrid module and manufacturing method thereof |
| CN101808470A (en) * | 2010-03-02 | 2010-08-18 | 上海美维科技有限公司 | Method for manufacturing printed circuit board with optical function |
| CN102928936A (en) * | 2012-11-12 | 2013-02-13 | 依利安达(广州)电子有限公司 | Manufacture method of optical printed wiring board |
| WO2021082287A1 (en) * | 2019-10-30 | 2021-05-06 | 南昌欧菲生物识别技术有限公司 | Support structure and flexible printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100510812C (en) | 2009-07-08 |
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