CN101163376A - Apparatus for supporting a printed circuit board substrate and method of forming printed circuit board using the same - Google Patents
Apparatus for supporting a printed circuit board substrate and method of forming printed circuit board using the same Download PDFInfo
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- CN101163376A CN101163376A CNA2007101011249A CN200710101124A CN101163376A CN 101163376 A CN101163376 A CN 101163376A CN A2007101011249 A CNA2007101011249 A CN A2007101011249A CN 200710101124 A CN200710101124 A CN 200710101124A CN 101163376 A CN101163376 A CN 101163376A
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- 238000000034 method Methods 0.000 title claims description 23
- 239000000758 substrate Substances 0.000 title abstract description 7
- 238000007639 printing Methods 0.000 claims abstract description 58
- 230000033001 locomotion Effects 0.000 claims abstract description 50
- 239000011159 matrix material Substances 0.000 claims description 49
- 230000004907 flux Effects 0.000 claims description 28
- 229910000679 solder Inorganic materials 0.000 claims description 20
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- 230000003068 static effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- QDZOEBFLNHCSSF-PFFBOGFISA-N (2S)-2-[[(2R)-2-[[(2S)-1-[(2S)-6-amino-2-[[(2S)-1-[(2R)-2-amino-5-carbamimidamidopentanoyl]pyrrolidine-2-carbonyl]amino]hexanoyl]pyrrolidine-2-carbonyl]amino]-3-(1H-indol-3-yl)propanoyl]amino]-N-[(2R)-1-[[(2S)-1-[[(2R)-1-[[(2S)-1-[[(2S)-1-amino-4-methyl-1-oxopentan-2-yl]amino]-4-methyl-1-oxopentan-2-yl]amino]-3-(1H-indol-3-yl)-1-oxopropan-2-yl]amino]-1-oxo-3-phenylpropan-2-yl]amino]-3-(1H-indol-3-yl)-1-oxopropan-2-yl]pentanediamide Chemical compound C([C@@H](C(=O)N[C@H](CC=1C2=CC=CC=C2NC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CC(C)C)C(N)=O)NC(=O)[C@@H](CC=1C2=CC=CC=C2NC=1)NC(=O)[C@H](CCC(N)=O)NC(=O)[C@@H](CC=1C2=CC=CC=C2NC=1)NC(=O)[C@H]1N(CCC1)C(=O)[C@H](CCCCN)NC(=O)[C@H]1N(CCC1)C(=O)[C@H](N)CCCNC(N)=N)C1=CC=CC=C1 QDZOEBFLNHCSSF-PFFBOGFISA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5136—Separate tool stations for selective or successive operation on work
- Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
- Y10T29/5138—Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to machine work part to fit cooperating work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
An apparatus is provided for supporting a PCB substrate during printing. The apparatus includes first and second fixing units that cooperate to edge-clamp the substrate. The first fixing unit includes a first movable plate, a first actuator, and a first stopper that limits outward movement of the first movable plate. The second fixing unit includes a second movable plate, a second actuator, and a second stopper that limits outward movement of the second movable plate. When printing the substrate from the first edge to the second edge, the first and second fixing units operate so that the second actuator moves the second movable plate outwardly to contact the second stopper, and the first actuator moves the first movable plate inwardly to press the substrate toward the second movable plate. When printing the substrate from the second edge to the first edge the first and second fixing units operate oppositely.
Description
The reference of related application
It is on October 13rd, 2006 that the application requires to enjoy the applying date, in the priority of the korean patent application No.10-2006-0100013 of Korea S Department of Intellectual Property application, the disclosed content of the document can be used in full as a reference in this application.
Technical field
The present invention relates generally to printed circuit board (PCB) (PCB).More particularly, the present invention relates to a kind of equipment that is used to support the PCB matrix and relate to a kind of printing equipment that is used for flux application on matrix surface simultaneously, and the application relates to a kind of method of utilizing this equipment to form PCB.
Background technology
Various electronic components are installed on the surface of printed circuit board (PCB) (PCB).Usually, PCB is by comprising the various technologies of silk-screen printing technique, element mounting process and reflux technique etc., and is mass-produced by automation equipment.
In the mass-produced silk-screen printing technique of PCB, on matrix surface, use the solder flux that is molten condition with predetermined pattern, so that the various electronic components with different shape can be installed on the surface of PCB, thereby they are communicated with each other.Solder flux is to utilize the equipment of so-called screen process press to use.Screen process press utilizes rubber to roll to push and is supplied to mask with predetermined pattern or the solder flux on the silk screen and uses pressurized solder flux on PCB.
When being applied to solder flux on the matrix, PCB support apparatus operation is with fixing (promptly be maintained fixed, clamping or fastening) PCB, so that PCB can not moved.The PCB support apparatus comprises cylinder, and the side surface that this cylinder is pushed PCB is with fixing PCB, so that make the motion of PCB reduce to minimum during printing operation.
Fig. 1 is for showing the plane graph of traditional PCB support apparatus; Fig. 2 is the end view of the PCB support apparatus of displayed map 1.
Traditional PCB support apparatus is pushed the side of PCB10 or edge with fixing PCB10.Traditional PCB support apparatus comprises the movable plate 12 that the static plate 11 and at an edge of supporting PCB10 is pushed another edge of PCB10.Movable plate 12 is handled to push another edge of PCB10 by cylinder 13.Push PCB10 and be fixed in static plate 11 and movable plate 12 between the time, subsequently, carry out the printing operation of flux application on PCB10.
On PCB10, in the printing operation of flux application, roll the solder flux that is supplied on mask or the silk screen pushing on the PCB10 by rubber.Therefore, exert pressure on PCB10 at print direction (that is, to roll in the direction of pushing solder flux on the PCB10) towards rubber.
The moulding pressure scope is 3～20kg/cm
2On the other hand, the pressure that acts on the movable plate 12 by cylinder 13 is about 2kg/cm to the maximum
2Therefore, when when cylinder 13 is pushed with low pressure and is supported PCB10, when carrying out the printing operation of flux application on PCB10 and applying high moulding pressure, for example at print direction from static plate 11 during towards movable plate 12, PCB10 may move.
If when printing tiny element (that is, size of component is about 0.3-0.6mm) on PCB10, PCB10 moves along print direction, then PCB10 just can influence printing operation greatly along very little the moving of print direction, therefore, can reduce printing quality.
In order to prevent PCB10 motion, can increase by cylinder 13 and be applied to pressure on the PCB10, still, because the big pressure that is applied, PCB10 may be crooked, warpage or damage.
Summary of the invention
According to an aspect of the present invention, provide a kind of during the printing operation that printed circuit board (PCB) (PCB) is shaped the equipment of support base.An example of this equipment comprises: first fixed cell, this unit comprises first movable plate at first edge that engages the PCB matrix, make first movable plate with towards the motion of first inward direction at first edge and make its first actuator, and limit first retainer of first movable plate with the motion of first outward direction with first outward direction motion of leaving first edge; And second fixed cell, this unit separates with the first fixed cell almost parallel and with first fixed cell, second fixed cell comprises second movable plate at second edge that engages the PCB matrix, second actuator, this actuator is used to make second movable plate with second inward direction motion towards second edge, and, can make it to leave second outward direction motion at second edge; And limit second retainer of second movable plate with second outward direction motion.From first edge when second edge prints solder flux to the PCB matrix, operating this equipment makes second actuator that second movable plate is moved to contact second retainer along second outward direction, and first actuator makes first movable plate move so that the PCB matrix is pressed to second movable plate along first inward direction.Equally, from second edge to first edge, when printing solder flux to the PCB matrix, operating this equipment makes the actuator of winning that first movable plate is moved to contact first retainer with first outward direction, and second actuator makes second movable plate move so that the PCB matrix is pressed to first movable plate along second inward direction.
Described equipment can also comprise the PCB conveying equipment, and this equipment can be carried PCB between first and second fixed cells.
Described equipment can also comprise: the downside bearing unit of supporting PCB bottom surface, and it can be adjusted to the height of PCB roughly the height corresponding to first and second movable plate of first and second fixed cells.
Described equipment can also comprise vacuum nozzle, and this vacuum nozzle is used for the bottom surface of PCB is applied vacuum pressure.
First fixed cell and second fixed cell can move relative to each other, so that the spacing between first and second fixed cells is adjusted to width corresponding to PCB.
Another aspect of the present invention provides a kind of method of utilizing the equipment formation printed circuit board (PCB) (PCB) of supporting PCB, this equipment comprises first and second fixed cells, and this method comprises: PCB is installed in the presumptive area of the described equipment between first and second fixed cells; The print direction of determining printing equipment is the first direction from first side of PCB to second side shifting of PCB, still the second direction from second side of PCB to first side shifting of PCB; When the print direction of printing equipment is second direction, fix first side of first fixed cell with supporting PCB, and, by second fixed cell PCB is pressed to first fixed cell; When print direction is first direction, fix second side of second fixed cell with supporting PCB, and, by first fixed cell PCB is pressed to second fixed cell; And, utilize printing equipment, by flux application on PCB, carry out printing operation.
Installing additional of PCB can comprise: by the PCB conveying equipment, carry PCB between first and second fixed cells.
The preform of printing operation can comprise: before flux application on the PCB, adjust PCB.
The preform of printing operation also comprises: by after the adjustment of PCB, provide vacuum to support PCB to the bottom pressure face of PCB.
In described method, first fixed cell can comprise: first movable plate that engages first edge of PCB matrix, first actuator, this actuator can make first movable plate move with first inward direction towards first edge and can make first movable plate to leave first outward direction motion at first edge, is used to limit first retainer that first movable plate is moved along first outward direction; And, second fixed cell can comprise: second movable plate that engages second edge of PCB matrix, second actuator, this actuator can make second movable plate move with second inward direction towards second edge and can make second movable plate to leave second outward direction motion at second edge, and be used to limit second retainer that second movable plate is moved along second outward direction, and, the actuating force that utilization is applied by first and second actuators can be carried out the fixing of first fixed cell and second fixed cell.
Description of drawings
Fig. 1 is for showing the plane graph of traditional printed circuit board (PCB) (PCB) support apparatus;
Fig. 2 is for showing the end view of traditional PCB support apparatus shown in Figure 1;
Fig. 3 is for showing a kind of perspective view of the printing equipment as example, and this printing equipment comprises the PCB support apparatus of one embodiment of the invention;
Fig. 4 is for showing the fragmentary, perspective view of PCB support apparatus shown in Figure 3;
Fig. 5 is the enlarged perspective of the part " A " of demonstration PCB support apparatus shown in Figure 4;
Fig. 6 is an end view, and it has shown the PCB support apparatus that the PCB that provides shown in Figure 3 is provided;
Fig. 7 is the end view of the PCB support apparatus in the displayed map 3, and this equipment can be carried out printing operation along the past backward directions of invention;
Fig. 8 is a plane graph, and it has schematically shown the mode of operation of PCB support apparatus shown in Figure 7;
Fig. 9 is the end view of the PCB support apparatus in the displayed map 3, and this equipment can be carried out printing operation along the direction extremely preceding from the back;
Figure 10 is a plane graph, and it has schematically shown the mode of operation of PCB support apparatus shown in Figure 9; With
Figure 11 is a flow chart, and it has shown an example that utilizes the PCB support apparatus to form the method for PCB.
Embodiment
Below, the accompanying drawing with reference to having shown illustrative embodiment of the present invention illustrates more fully to the present invention.
According to an aspect of the present invention, Fig. 3 is for showing a kind of perspective view of printing equipment, and this printing equipment comprises as the printed circuit board (PCB) of an example (PCB) support apparatus.Fig. 4 is for showing the perspective view of PCB support apparatus shown in Figure 3.Fig. 5 is the amplification stereogram of the part " A " of demonstration PCB support apparatus shown in Figure 4, and Fig. 6 is an end view, and it has shown the PCB support apparatus that has PCB shown in Figure 3.Because should understand equipment of the present invention can receive matrix so that help to print out circuitous pattern thereon, thereby form PCB, therefore, for easy, term matrix and PCB exchange use to a certain extent here.
Referring to Fig. 3～6, the PCB support apparatus comprises first fixed cell 110 and second fixed cell 120.Printing equipment was carried out printing operation (being flux application) on PCB90 when, the PCB support apparatus was fixed PCB90 (that is, make its maintenance static, clamping keeps, and is fastening) between first and second fixed cells 110 and 120.Therefore, first and second fixed cells 110 and 120 structure are roughly parallel to each other, and separate and toward each other with preset distance, so that first edge 91 that supports PCB90 respectively is (according to the arrow that marks " FRONT " among Fig. 3, be forward edge) and second edge 92 (according to the arrow that marks " BACK " among Fig. 3, being posterior edges).
Though can use first movable plate 112 that different modes or device make first fixed cell 110 on first guide unit 111, move along the y-axis direction, but in the illustrated embodiment, used linear motion guide member 115 and guiding block 116 so that first movable plate 112 on first guide unit 111, along inwardly and outward direction move.Linear motion guide member 115 is installed on first guide unit 111, and making slidably, guiding block 116 combines with linear motion guide member 115 and it is installed on first movable plate 112.Therefore, first movable plate 112 can be moved along inside and outside direction with linear motion guide member 115.
Second fixed cell 120 of PCB support apparatus constitutes and is roughly parallel to first fixed cell 110 and separates with this unit, so that second edge 92 of supporting PCB90.Second fixed cell 120 comprises second movable plate 122, second actuator 123 and second retainer 124 (referring to Fig. 7 and 9).As can be appreciated, second fixed cell 120 of PCB support apparatus is similar to first fixed cell 110 basically or be the substantial mirror images setting with it.
Second movable plate 122 of second fixed cell 120 is installed in also can be along the horizontal movement of y-axis direction on second guide unit 121, and this second guide unit is installed on the pedestal 100.Second movable plate 122 can be along inwardly (that is direction motion and can moving along outside (that is, the backward) direction at second edge 92 that leaves PCB90 forward), towards second edge 92 of PCB90.As clearly illustrating in Fig. 3 and 4, second movable plate 122 is along the suitable segment length part of second guide unit 121, extend along the x-axis direction.
Second movable plate 122 is by 123 motions of second actuator, and, its combine with linear motion guide member (not shown) in being installed in second guide unit 121 in case can with towards and leave PCB90 second edge 92 inwardly or outward direction move.Second retainer 124 is installed on the linear motion guide member, leaves the outside motion at second edge 92 of PCB90 to limit second movable plate 122.
In one embodiment, first and second fixed cells 110,120 can move relative to each other on pedestal 100, so that can regulate the distance between first and second guide units 111,121.As being clear that in Fig. 3 and 4, in one embodiment, second guide unit 121 can slide by the guide member 191 along pedestal 100, and, can drive second guide unit 121 so that it leaves first guide unit 111 towards 111 motions of first guide unit or motion by motor 192.
The PCB support apparatus can also comprise downside bearing unit 140 (referring to Fig. 6), and this unit has the structure of supporting PCB90 bottom surface.Downside bearing unit 140 is by supporting the bottom surface of PCB90 upward to motion in the PCB90 lower edge, therefore, the height of PCB90 can be adjusted to roughly corresponding with the height of first and second movable plate 112 and 122 so that PCB90 for example roughly is in same plane with plate 112,122.That is, when carrying PCB90 between first and second fixed cells 110 and 120, downside bearing unit 140 raises with supporting PCB90 and regulates the height of PCB90.
Downside bearing unit 140 comprises vertical movable plate 141, and this movable plate can be moved with direction up and down from pedestal 100.Downside bearing unit 140 also comprises from vertical movable plate 141 upwardly extending supporting wing plate 142 and fulcrum posts 143.The both sides of the bottom surface of supporting wing plate 142 supporting PCB90, and, the middle body of the bottom surface of fulcrum post 143 supporting PCB90.
The PCB support apparatus can also comprise vacuum nozzle 150, and this nozzle applies vacuum fixing PCB90 vertically by the bottom surface to PCB90.Vacuum nozzle 150 can move with downside bearing unit 140, edge direction up or down, so that after supporting wing plate 142 and fulcrum post 143 contacts the bottom surface of PCB90, vacuum nozzle 150 applies vacuum pressure by the bottom surface to PCB90 and fixes PCB90.
Below, will the operation of equipment that is used to support PCB with said structure be described.
PCB90 is installed on the PCB conveying equipment 130 of PCB support apparatus, and, between first and second fixed cells 110 and 120, it is carried.Before installing PCB90 additional, for example, in one embodiment, by making second guide unit 121 toward or away from 111 motions of first guide unit, thereby the spacing between first and second guide units 111,121 can be adjusted to roughly width (that is the spacing between the edge 91 and 92) corresponding to PCB90.
The front and back end of the bottom surface of PCB90 is by first and second conveyer belts 131 and 132 supportings of PCB conveying equipment 130.Therefore, when first and second conveyer belts 131 and 132 of PCB conveying equipment 130 rotate, between first and second fixed cells 110 and 120, carry PCB90.
First and second conveyer belts 131 and 132 of PCB conveying equipment 130 are lower than first and second fixed heads 112 and 122 and constitute, so that PCB90 is when being carried by first and second conveyer belts 131 and 132, not can with other parts, interfere as first and second fixed heads 112 and 122.Downside bearing unit 140 is regulated the height of the PCB90 that is carried so that roughly be in same plane with the plate 112,122 of first and second fixed cells 110 and 120.When side bearing unit 140 moves under PCB90 in the upward direction instantly, by supporting PCB90 from vertical movable plate 141 upwardly extending supporting wing plates 142 and fulcrum post 143.First and second sides and first and second movable plate 112 and 122 that downside bearing unit 140 rises until PCB90 roughly are in same plane.
Fig. 7 is the end view of the PCB support apparatus in the displayed map 3, and this equipment can be carried out printing operation along the past print direction backward; Fig. 8 is a plane graph, and it has schematically shown the mode of operation of PCB support apparatus shown in Figure 7.
When PCB90 and first and second movable plate 112 and 122 roughly are in same plane,, PCB90 is bearing between them according to print direction.In printing operation, solder flux is applied on the surface of PCB90.When rolling by rubber solder flux is pressed in PCB90 when going up, the print direction of solder flux can be for from the place ahead of PCB90 backwards or from the rear of PCB90 forward.Roll by rubber, PCB90 is exerted pressure, thereby cause PCB90 to move along print direction along print direction.In order to prevent the motion of PCB90, determine the direction of motion of PCB90 according to print direction, and, operate first and second fixed cells 110 and 120 to avoid the motion of PCB90.
When print direction be from first edge 91 of PCB90 when second edge 92 of PCB90 (that is, in the past backward), because from the pressure of printing equipment, PCB90 is motion backward often.In this case, second movable plate 122 at second edge 92 of supporting PCB90 and 124 operations of second retainer are not so that PCB90 can move along print direction.
In this case, the work of second actuator 123 so that second movable plate 122 move along outward direction so that the rear surface of second movable plate 122 contacts second retainer 124.When the rear surface of second movable plate 122 contacted second retainer 124, because second retainer can limit the outside motion of second movable plate 122, therefore, second movable plate 122 this moments can not be with outside direction motion.
When second movable plate 122 and second actuator 123 have quit work, 113 work of first actuator so that first movable plate 112 move along inside direction, thereby PCB90 be pressed in or be clamped between the plate 112,122.Shown in Fig. 7 and 8, PCB90 is supported by the supporting wing plate 142 and the fulcrum post 143 of downside bearing unit 140, but fixing.Therefore, when first movable plate 112 was pushed first edge 91 of PCB90, PCB90 was towards 122 motions of second movable plate, and therefore, second edge 92 contacts second movable plate 122.
In this state, because second edge, 92 contact second movable plate 122 and the PCB90 of PCB90 can further not move along direction backward, therefore, the PCB support apparatus can support PCB90 reliably during printing operation.
Fig. 9 is the end view of the PCB support apparatus in the displayed map 3, this equipment can along from after forward print direction carry out printing operation; Figure 10 is a plane graph, and it has schematically shown the mode of operation of PCB support apparatus shown in Figure 9.
When print direction be from second edge 92 of PCB90 when first edge 91 (promptly from after forward), because by the printing equipment applied pressure, PCB90 is often with print direction motion (forward).In this case, first movable plate 112 at first edge 91 of supporting PCB90 and 114 work of first retainer are not so that PCB90 can travel forward.
In this case, shown in Fig. 7 and 8, PCB90 fixes in the mode relative with PCB.That is, the work of first actuator 113 so that first movable plate 112 move along outward direction so that the rear surface of first movable plate 112 contacts first retainer 114.When the rear surface of first movable plate 112 contacted first retainer 114, because the outside motion of first retainer, 114 restrictions, first movable plate 112, therefore, first movable plate 112 was fixing, thereby it can not further move along outside direction.
When first movable plate 112 fixing, when therefore first actuator 113 has quit work, 123 work of second actuator so that second movable plate 122 move along inside direction, thereby PCB90 be pressed in or be clamped on first movable plate 112.As shown in Figures 9 and 10, PCB90 is supported by the supporting wing plate 142 and the fulcrum post 143 of downside bearing unit 140, but fixing.Therefore, when second movable plate 122 was pushed second edge 92, PCB90 was towards 112 motions of first movable plate, and therefore, first edge 91 contacts first movable plate 112.
In this state, because first edge 91 of PCB90 contacts first movable plate 112 and PCB90 can further not move along direction forward.Therefore, the PCB support apparatus can support PCB90 reliably during printing operation.
When according to print direction, when being bearing in PCB90 between first and second fixed cells 110 and 120, vacuum nozzle 150 work are with supporting PCB90, so that provide vacuum pressure to keep it to be vertically oriented by the bottom surface to PCB90.
When setting up the supporting of PCB90, can adjust PCB90 at printing operation.In one embodiment, can aim at PCB90 so that carry out printing operation by the aligning equipment 160 (referring to Fig. 3) that is installed in pedestal 100 belows.Aligning equipment 160 makes pedestal 100 move or pedestal 100 is rotated regulating the angle of pedestal 100 along x-axis direction and y-axis direction, thereby regulates the position of PCB90 so that carry out printing operation.
When finishing the adjustment of PCB90, carry out printing operation so that solder flux is applied on the surface of PCB90 with predetermined pattern.When finishing the printing operation of PCB90, from printing equipment, discharge by PCB conveying equipment 130 conveying PCB90 and with it.Immediately, carry another PCB and will repeat aforesaid operations by PCB conveying equipment 130.
Figure 11 is a flow chart, and it has shown the sample method that forms PCB according to a further aspect in the invention.
The sample method of the formation PCB of an example comprises according to the present invention: PCB is installed in the printing equipment, and this printing equipment comprises the foregoing support apparatus (S100) with first and second fixed cells; Determine print direction (S200); With respect to described determining step, fix the second time of (S300) or PCB the first time of carrying out PCB and fix (S400); Aim at PCB (S500) and printing (S600).
In operation S100, the PCB90 that will be used for printing operation is installed at the presumptive area of the printing equipment that comprises foregoing support apparatus (it has first and second fixed cells), and this presumptive area is between first and second fixed cell.For example, can pass through PCB conveying equipment 130, between first fixed cell 110 and second fixed cell 120, carry the PCB90 that is provided to the PCB support apparatus.Immediately, by downside bearing unit 140, can make the PCB90 motion in the upward direction, so that the height of PCB90 is adjusted to roughly corresponding to first and second movable plate 112 of first and second fixed cells 110,120 and 122 height.
In operation S200, determine solder flux is applied to the direction of the lip-deep printing operation of PCB90.Print direction can be the first direction that second edge 92 from first edge 91 to PCB90 of PCB90 moves, or the second direction that moves from first edge 91 at second edge 92 to PCB90 of PCB90.
Owing to print direction pressure is applied on the PCB90, therefore, can carries out the fixing operation of suitable substance P CB according to the print direction of in operation S200, determining.
When print direction is second direction, carry out the first fixing operation S300.That is, fix first edge 91 of first movable plate 112 of first fixed cell 110, and second fixed cell 120 is pressed to first fixed cell 110 with PCB90 with supporting PCB90.
When print direction is first direction, carry out the second fixing operation S400.That is, fix second edge 92 of second movable plate 122 of second fixed cell 120, and first fixed cell 110 is pressed to second fixed cell 120 with PCB90 with supporting PCB90.
When PCB90 being fixed between the plate 112,122, carry out printing operation S600.In operation S600, solder flux is applied on the surface of PCB90, to produce predetermined pattern.Operation S600 can comprise alignment function S500 or be undertaken by alignment function S500.In operation S500, before flux application, regulate the position of PCB90.Operation S600 can comprise also that vacuum applies the operation (not shown).Apply in the operation in vacuum, the bottom surface of 150 couples of PCB90 of vacuum nozzle provides vacuum to avoid for example vertical motion after alignment function S500 of PCB90.
As mentioned above, support the equipment of PCB and the method that forms PCB,, therefore, can during printing operation, support PCB better because the supporting of PCB changes according to print direction according to being used to.
Though with reference to illustrative embodiment of the present invention the present invention is specified, but, those of ordinary skills it is to be understood that under the situation of thought of the present invention that does not break away from the claims qualification and scope, can make various changes in form and details.
Claims (20)
1. one kind is used for during printing the equipment that supporting has the PCB matrix at the first relative edge and second edge, and this equipment comprises:
First fixed cell, this unit comprise first movable plate at first edge that engages the PCB matrix; First actuator that makes first movable plate move and it is moved with first outward direction that leaves first edge with first inward direction towards first edge; And limit first retainer of first movable plate with first outward direction motion; And
Second fixed cell, this unit separates with the first fixed cell almost parallel and with first fixed cell, and second fixed cell comprises second movable plate at second edge that engages the PCB matrix; Second actuator, this actuator are used to make second movable plate with second inward direction motion towards second edge, and, can make it to leave second outward direction motion at second edge; And limit second retainer of second movable plate with second outward direction motion;
Wherein, from first edge when second edge prints solder flux to the PCB matrix, second actuator makes second movable plate move to contact second retainer with second outward direction, and, first actuator makes first movable plate move so that the PCB matrix is pressed to second movable plate along first inward direction, and
From second edge when first edge prints solder flux to the PCB matrix, first actuator makes first movable plate move to contact first retainer with first outward direction, and second actuator makes second movable plate move so that the PCB matrix is pressed to first movable plate along second inward direction.
2. equipment according to claim 1, it also comprises: the PCB conveying equipment, this equipment can be carried the PCB matrix between first and second fixed cells.
3. equipment according to claim 1, it also comprises: the bearing unit of the bottom surface of supporting PCB matrix.
4. equipment according to claim 3, wherein: bearing unit makes the lifting of PCB matrix so that itself and first and second movable plate roughly are in same plane.
5. equipment according to claim 3, wherein: bearing unit also comprises vacuum nozzle, this vacuum nozzle applies vacuum pressure to the bottom surface of PCB.
6. equipment according to claim 1, wherein: at least one unit in first fixed cell and second fixed cell can be with respect to another motion in first fixed cell and second fixed cell, so that the spacing between first and second edges of adjusting PCB matrix.
7. equipment according to claim 1, wherein: at least one in first and second actuators is linear actuator.
8. method that forms printed circuit board (PCB) (PCB), this method comprises:
The PCB matrix is installed in the printing equipment, this printing equipment comprises support apparatus, this support apparatus has first fixed cell and second fixed cell, first fixed cell comprises first retainer and engages first movable plate at first edge of PCB matrix that second fixed cell comprises second retainer and engages second movable plate at second edge of PCB matrix;
The print direction of determining printing equipment is the first direction that moves from edge, first edge to the second, still the second direction that moves from edge, second edge to the first;
When print direction is second direction, make first movable plate motion contacting first retainer, and, by second movable plate PCB matrix is pressed to first fixed cell, so that the PCB matrix is clamped between first and second movable plate;
When print direction is first direction, make second movable plate motion contacting second retainer, and, by first movable plate PCB matrix is pressed to second fixed cell, so that the PCB matrix is clamped between first and second movable plate; And
Utilize printing equipment, solder flux is applied on the PCB matrix along print direction.
9. method according to claim 8, wherein: install step additional and comprise and utilize the PCB conveying equipment, between first and second fixed cells, provide PCB matrix.
10. method according to claim 8, it also comprises: the step of aiming at the PCB matrix before described step of applying with respect to printing equipment.
11. method according to claim 8, it also comprises: the step that the bottom surface of PCB matrix is provided vacuum pressure before described step of applying.
12. method according to claim 10, it also comprises: the step that the bottom surface of PCB matrix is provided vacuum pressure after described alignment procedures.
13. an equipment that is used for supporting the PCB matrix with relative first and second edges during printing, this equipment comprises:
Pedestal;
First guide unit, it is installed on the pedestal and along first axle and extends;
Be installed in second guide unit on the pedestal, described second guide unit and first axle almost parallel also leave first guide unit;
Conveying equipment, this equipment move the PCB matrix along first axle between first and second guide units;
Engage first movable plate at first edge of PCB matrix, described first movable plate combines with first guide unit, so that second axial-movement that edge and first axle intersect;
First actuator, this actuator can make first movable plate with towards first inward direction at first edge, along second axial-movement, and, can make first movable plate with first outward direction that leaves first edge, along second axial-movement;
First retainer, it is used to limit first movable plate moving along first outward direction;
Engage second movable plate at second edge of PCB matrix, described second movable plate combines with second guide unit, so that along second axial-movement;
Second actuator, this actuator can make second movable plate with towards second inward direction at second edge, along second axial-movement, and, can make second movable plate with second outward direction that leaves second edge, along second axial-movement; With
Second retainer, it is used to limit second movable plate moving along second outward direction;
Wherein, from first edge to second edge during at PCB matrix printing solder flux, second actuator makes second movable plate move to contact second retainer along second outward direction, and first actuator makes first movable plate move so that the PCB matrix is pressed to second movable plate along first inward direction; And
From second edge to first edge during at PCB matrix printing solder flux, first actuator makes first movable plate move to contact first retainer along first outward direction, and second actuator makes second movable plate move so that the PCB matrix is pressed to first movable plate along second inward direction.
14. equipment according to claim 13, it also comprises: the bearing unit of supporting PCB matrix bottom surface.
15. equipment according to claim 14, wherein: bearing unit makes the lifting of PCB matrix so that itself and first and second movable plate roughly are in same plane.
16. equipment according to claim 14, wherein: bearing unit also comprises vacuum nozzle, and this vacuum nozzle is used for the bottom surface of PCB is applied vacuum pressure.
17. equipment according to claim 13, wherein: at least one unit in first guide unit and second guide unit can be with respect to another motion in first guide unit and second guide unit, so that the spacing between first and second edges of adjusting PCB matrix.
18. equipment according to claim 13, wherein: at least one in first and second actuators is linear actuator.
19. equipment according to claim 13, it also comprises: aligning equipment, this equipment are used to adjust the orientation of PCB matrix with respect to printing equipment.
20. equipment according to claim 19, wherein: described aligning equipment combines with pedestal so that pedestal moves linearly or rotates.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020060100013A KR101164593B1 (en) | 2006-10-13 | 2006-10-13 | Fixing apparatus for printed circuit board and printing method of PCB |
| KR10-2006-0100013 | 2006-10-13 | ||
| KR1020060100013 | 2006-10-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101163376A true CN101163376A (en) | 2008-04-16 |
| CN101163376B CN101163376B (en) | 2012-07-04 |
Family
ID=39298169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101011249A Active CN101163376B (en) | 2006-10-13 | 2007-04-29 | Apparatus for supporting a printed circuit board substrate and method of forming printed circuit board using the same |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7617587B2 (en) |
| KR (1) | KR101164593B1 (en) |
| CN (1) | CN101163376B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105235366A (en) * | 2015-11-09 | 2016-01-13 | 惠州Tcl移动通信有限公司 | Printed circuit board (PCB) fixing device of solder paste printer |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200445714Y1 (en) * | 2007-12-21 | 2009-08-27 | 주식회사 휘닉스 디지탈테크 | Apparatus for introducing printed circuit boards in a screen printer |
| CN103137522B (en) * | 2011-12-01 | 2015-08-19 | 仁宝资讯工业(昆山)有限公司 | Plant ball tool |
| JP5878219B1 (en) * | 2014-10-09 | 2016-03-08 | 千住金属工業株式会社 | Soldering equipment |
| KR20160048301A (en) * | 2014-10-23 | 2016-05-04 | 삼성전자주식회사 | bonding apparatus and substrate manufacturing equipment including the same |
| JP6843115B2 (en) * | 2016-04-01 | 2021-03-17 | 株式会社Ｆｕｊｉ | Solder printing machine |
| JP6823429B2 (en) * | 2016-11-16 | 2021-02-03 | 株式会社Ｆｕｊｉ | Screen printing machine |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0131466Y1 (en) * | 1994-03-16 | 1999-04-15 | 김광호 | Pcb's position fixing device |
| JP3462658B2 (en) * | 1996-03-04 | 2003-11-05 | 日立ビアメカニクス株式会社 | Printed circuit board positioning device and printed circuit board drilling machine |
| US6568069B1 (en) * | 1997-02-24 | 2003-05-27 | Siemens Aktiengesellschaft | Apparatus for manufacture of electrical assemblies |
| JP3659003B2 (en) * | 1998-07-03 | 2005-06-15 | 松下電器産業株式会社 | Electronic component mounting method |
| US6324752B1 (en) * | 1999-11-05 | 2001-12-04 | U.S. Philips Corporation | Component placement machine |
| KR100412273B1 (en) * | 2001-11-22 | 2003-12-31 | 미래산업 주식회사 | Apparatus for Transferring Printed Circuit Board |
| JP4037097B2 (en) * | 2001-12-10 | 2008-01-23 | 松下電器産業株式会社 | Substrate support device |
-
2006
- 2006-10-13 KR KR1020060100013A patent/KR101164593B1/en active IP Right Grant
-
2007
- 2007-02-20 US US11/708,791 patent/US7617587B2/en active Active
- 2007-04-29 CN CN2007101011249A patent/CN101163376B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105235366A (en) * | 2015-11-09 | 2016-01-13 | 惠州Tcl移动通信有限公司 | Printed circuit board (PCB) fixing device of solder paste printer |
| CN105235366B (en) * | 2015-11-09 | 2017-12-22 | 惠州Tcl移动通信有限公司 | The pcb board fixing device of stencil printer |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101164593B1 (en) | 2012-07-11 |
| US7617587B2 (en) | 2009-11-17 |
| US20080087178A1 (en) | 2008-04-17 |
| CN101163376B (en) | 2012-07-04 |
| KR20080034067A (en) | 2008-04-18 |
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Address after: Gyeongnam, South Korea Patentee after: HANWHA TECHWIN Co.,Ltd. Patentee after: Phoenix Digital Technology Co.,Ltd. Address before: Gyeongnam, South Korea Patentee before: Samsung Techwin Co.,Ltd. Patentee before: Phoenix Digital Technology Co.,Ltd. |
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Address after: Gyeongnam, South Korea Co-patentee after: Phoenix Digital Technology Co.,Ltd. Patentee after: HANWHA AEROSPACE Co.,Ltd. Address before: Gyeongnam, South Korea Co-patentee before: Phoenix Digital Technology Co.,Ltd. Patentee before: HANWHA TECHWIN Co.,Ltd. |
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Effective date of registration: 20190416 Address after: Gyeonggi Do Korea Pyeongtaek Co-patentee after: Hanwha Precision Machinery Co.,Ltd. Patentee after: Phoenix Digital Technology Co.,Ltd. Address before: Gyeongnam, South Korea Co-patentee before: Phoenix Digital Technology Co.,Ltd. Patentee before: HANWHA AEROSPACE Co.,Ltd. |