CN101162278A - Leaded light component structure in structure backlight module and preparation method thereof - Google Patents
Leaded light component structure in structure backlight module and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a light-guide module structure in a back light module, comprising light-guide base material and light-guide mesh points structure made on the surface of the light-guide base material; the invention is characterized in that: the light-guide module structure comprises at least two layers of light-guide base material overlapped, and each layer of the light-guide base material is a light-guide film with thickness of 50cm to 150 cm; the positions of the light-guide mesh points structure of all layers are complementary to each other; the manufacturing method of the invention is that: (1) the number of layers is determined according to the thickness of LED light source and the thickness of the light-guide film; (2) the original distribution of the light-guide mesh points are determined according to the lightness data and the lighting area of LED light source; (3) corresponding adjustment is performed according to the data of procedure(2) and the distributing way of the light-guide mesh points; (4) a corresponding sample of the light-guide module is manufactured; (5) each layer of light-guide film is manufactured and then is assembled. The invention makes fully use of the energy of the LED light source, and effectively enhances the lighting uniformity; the structure of a plurality of layers overlapped gives a better tactility.
Description
Technical field
The present invention relates to leaded light component that uses in a kind of backlight module and preparation method thereof,, be specifically related to a kind of leaded light component structure that is applicable in the ultra-thin side-light type module backlight as light guide plate, light guiding film.
Background technology
Along with demonstration and luminescent device develop to ultra-thin, energy-conservationization direction, the side illumination mode becomes the main flow lighting system of backlight module.Brightness of backlight module and homogeneity are to estimate the important indicator of product quality in the industry, thereby the area source that how to obtain high brightness, high uniformity becomes the focus of research.
The main composition parts of module backlight comprise: light source (Light source), light guide plate (Light guideplate) and some blooming pieces, and as diffusion barrier (diffuser), prismatic lens (prism sheet), reflecting plate (reflector) etc.Module backlight is divided into the down straight aphototropism mode set that incident light source is positioned at rear, the display panel back side according to the position of light source, and incident light source is positioned near the side-light type module backlight of side of display panel.
For the side-light type module, light source is placed on module side backlight, after light enters light guide plate from the side, line source or pointolite are changed into the area source that is evenly distributed, the light harvesting effect of the equal light action of process diffusion barrier and prismatic lens improves the brightness and the uniformity coefficient of light source again.Wherein, light guide plate is as the core leaded light device in the module, and its leaded light performance has directly determined the luminosity and the uniformity coefficient of module.
Along with the ultra-thinization trend of display device, devices such as the light guide plate in the module backlight, light source also forward slimming direction develop.At present, developed the ultra-thin light-leading film (when light guide plate＜0.2mm, can be called light guiding film) of 0.15mm left and right thickness in the industry, the thickness of ultra-thin LED light source then reaches 0.3mm～0.6mm.Therefore, in ultra-thin module backlight, if adopt the combination of ultra-thin LED light source and ultra-thin light-leading film, because the end face leaded light size of ultra-thin light-leading film can cause the very big loss of sidelight source energy less than the LED face size; And, then when being used for the occasions such as display device of mobile phone key, touch manner, will have a strong impact on the touch feeling of product if adopt the combination (at present the thinnest light guide plate is 0.7mm) of ultra-thin LED light source and light guide plate.
In addition, reducing the cost that shows product also is industry development trend.Therefore, in ultra-thinization of leaded light device, its price is the object of paying close attention in the industry equally in module backlight.Because the reduction of mode of printing and injection molding (the main flow mode that traditional light guide plate is made) yields when making the following thickness light guide plate of 1mm and the increase that equipment drops into, make that the price of the thin light guide panel that this method is made is higher, this also is that the traditional fabrication mode can't be made one of obstacle of ultra-thin light guide board.
Therefore, the ultra-thin leaded light device that how to obtain ultra-thin, high brightness, high evenness and low price is the problem that the industry is paid close attention to, and also is problem anxious to be solved at present.
Summary of the invention
The object of the invention provides a kind of leaded light component structure that can make full use of side view LED energy of light source in the ultra-thin module, obtains to have the area source of high brightness, high evenness with lower cost of manufacture.
For achieving the above object, the technical solution used in the present invention is: the leaded light component structure in a kind of module backlight, comprise light guide base material, and according to the leaded light demand, leaded light lattice point structure in the formation of light guide base material surface preparation, by overlapping the constituting of two-layer at least light guide base material, every layer of described light guide base material is the light guiding film of thickness 50um～150um; Leaded light lattice point structure distributing position on the described base material of each layer makes derives luminous energy complementation mutually, constitutes uniform surface light source.
Above, in the module backlight of side ray structure, use the ultra-thin light guiding film of multilayer monolithic to carry out overlapping combination, the overlapping number of plies is decided by the thickness of the led light source of reality employing and the thickness of actual individual layer light guiding film, at present in the industry the thickness of the ultra-thin LED light source of commercial applications at 0.3mm～0.6mm, be effective thickness thinning, the leaded light component thickness after the overlapping combination is preferably less than or equals the thickness of led light source; After the combination each layer light guiding film fully is coupled to the light that led light source sends with the port that contacts of LED, and realizes the utilization to led light source lateral emitting energy, thereby avoids optical energy loss; Simultaneously, the lip-deep leaded light lattice point structure of light guiding film carries out complementary design, so-called complementary design, the layout that is the leaded light site on each layer light guiding film is intersected mutually, the complementation of derivation light energy distribution, the area source that the derivation light of the sandwich construction after the feasible combination forms has better homogeneity, and this point is that individual layer light guide plate (or film) was difficult for realizing in the past.
In the technique scheme, described leaded light lattice point structure is little taper concave, convex structure, its diameter is 10um～100um, the degree of depth is 5um～20um, according to the even light-guiding requirement, carry out the leaded light site on the described light guiding film of each layer surface based on folding/reflection-type geometric optical theory and arrange, overlapping back is derived light and is constituted uniform area light source.
Concrete network point distribution method for designing is:
1. whole design, dot density and locations complementary are adopted in the site.As whole the distribution in ground floor site, density is near and far from dredging to close from light source, whole the distribution in second layer site, dot density from light source near and far from close to dredging, but the position of the site of the second layer is different with the position of ground floor site; The whole structure of three-layer network dot density after according to preceding two-layer combination, determine the distribution situation of dot density, and by that analogy, N layer light guiding film site design makes the luminous irregular part of N-1 layer before the luminous zone energy supplement of N layer, finally make the led light source energy be fully used, and obtain the area source of high evenness;
2. the localized design mode is adopted in the site.Only designing the specific density site from the light source specific location as ground floor, the second layer is in other ad-hoc locations design specific mesh points, and by that analogy, the network point distribution density of determining other each layers is with regional;
3. integral body+localized design mode is adopted in the site.After ground floor, second layer employing global design mode, only there is non-uniform phenomenon in whole unitized construction at regional area, at this moment, can improve whole illumination effect to the 3rd layer of local site of employing design.
The uniformity of luminance of above sandwich construction can be adjusted realization by the dot density and the position of each layer.
Another kind of technical scheme is, described leaded light lattice point structure is the diffraction gratings structure, diffraction grating dot structure minimum feature is 0.4um, grating depth is 150nm～400nm, according to the even light-guiding requirement, based on coupled wave theory, arrange that by the leaded light site that change grating orientation, the grooved degree of depth, each parameter of live width are carried out on the described light guiding film of each layer overlapping back is derived light and constituted uniform area light source.
The method for making of leaded light component structure of the present invention is may further comprise the steps:
(1), determines the number of plies of multiple layer combination according to the thickness and the individual layer light guiding film material thickness of the led light source that uses;
(2) according to led light source brightness data and light-emitting area, simulate in the mode of monolithic leaded light, determine initial leaded light network point distribution;
(3) distribution initial value to determine in the step (2) adjusts accordingly according to the cloth point mode, determines the network point distribution of ground floor light guiding film; According to energy distribution and each layer model configuration, determine the network point distribution of other each layers successively;
(4) make leaded light die sample according to each layer lattice point structure of design, carry out data test, when requiring greater than setting, each layer network point distribution adjusted accordingly as the deviate of test data and design data;
(5) after sample brightness, uniformity coefficient test are passed through, make each layer light guiding film, and carry out superimposed assembling.
In the technique scheme, to the making of light guiding film, can adopt the 1. concora crush mode of the prior art or the 2. printing mode of volume to volume in the step (5):
1. the moulding process of concora crush is, light guide plate (film) die is exerted pressure from top to bottom, make die fully contact with base material, because the temperature of die is generally about 100 ℃, substrate material deforms during contact, thereby the microstructure on die surface is transferred to material surface, form the leaded light site;
2. the volume to volume moulding process is, by relatively rotating of drive roll and driven voller, the microstructure site on die surface is impressed into substrate surface.This moulding process is the line contact, the plate roller is in uniform rotation in moulding process, therefore, pressure in the surface of contact is very even, and the PC rolls of rolling is around plate roller surface, and moulding process is not subjected to area constraints, be suitable for making thickness and only be the flexible web of 50um～150um, speed can reach tens of meter per seconds, and speed is very fast, but is not suitable for the PC sheet material of making＞0.3mm.
Because the technique scheme utilization, the present invention compared with prior art has following advantage:
1. the leaded light component among the present invention is made of the multilayer light guiding film, by the optically-coupled effect between the overlapping light guiding film of multilayer, has made full use of the energy of led light source side, avoids energy loss, reaches energy-conservation effect from another angle;
2. the mode that adopts the multilayer light guiding film to make up makes that the leaded light network point distribution on every layer of light guiding film has bigger degree of freedom, is the distribution principle with the energy complement, makes the multilayer light guide structure have higher uniformity coefficient after overlapping;
3. the combination of layer flexible light-leading film is compared than individual layer sheet light guide plate with whole light guide structure, and sense of touch is better, satisfies the commercialization needs of product;
4. be easy to make: the individual layer light guiding film can adopt high efficiency volume to volume impression mode, and production efficiency is 10 times of concora crush mode (sheet material light guide plate), can greatly improve production capacity, and reduce cost, more meets the trend of industry development.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention one;
Fig. 2 is a multilayer light guiding film leaded light synoptic diagram among the embodiment one;
Fig. 3 is the multilayer light guiding film synoptic diagram (a) of whole design site among the embodiment one;
Fig. 4 is the multilayer light guiding film synoptic diagram (b) of whole design site among the embodiment one
Fig. 5 is the multilayer light guiding film synoptic diagram (a) of localized design site among the embodiment two;
Fig. 6 is the multilayer light guiding film synoptic diagram (b) of localized design site among the embodiment two;
Fig. 7 is the multilayer light guiding film synoptic diagram (c) of localized design site among the embodiment two;
Fig. 8 is the multilayer light guiding film synoptic diagram (a) of whole+localized design site among the embodiment three;
Fig. 9 is the multilayer light guiding film synoptic diagram (b) of whole+localized design site among the embodiment three;
Figure 10 is the multilayer light guiding film synoptic diagram (c) of whole+localized design site among the embodiment three;
Figure 11 is that the concora crush mode is made light guide plate (film) synoptic diagram;
Figure 12 is that volume to volume impression mode is made the light guiding film synoptic diagram.
Wherein: 1, sheet light guide plate (film) die; 2, microstructure site; 3, PC base material; 10, side-emitting LED light source; 11, light guiding film; 12, the anchor clamps in the module backlight.
Embodiment
Below in conjunction with drawings and Examples the present invention is further described:
Embodiment one: extremely shown in Figure 4 referring to Fig. 1, leaded light component structure in a kind of module backlight, mainly by 4 layers of overlapping constituting of light guide base material, every layer of light guiding film 11 that described light guide base material is thickness 0.12mm, thickness after each layer combination is less than the thickness (0.5mm) of side-emitting LED light source 10, and the overlapping back of each layer light guiding film is located by 12 clampings of the anchor clamps in the module backlight; According to the inhomogeneity requirement of leaded light, form the leaded light lattice point structure in the light guide base material surface preparation, the leaded light lattice point structure distributing position on the described base material of each layer is complementary mutually, makes the derivation uniform surface light source; Described leaded light lattice point structure is little taper concave, convex structure, its diameter is 50um, and the degree of depth is 10um, according to the even light-guiding requirement, carry out the leaded light site on the described light guiding film of each layer surface based on folding/reflection-type geometric optical theory and arrange that uniform area light source is derived in overlapping back.
In the present embodiment, the leaded light site is arranged and is adopted whole design, as whole the distribution in ground floor site, density is near and far from dredging to close from light source, whole the distribution in second layer site, dot density from light source near and far from close to dredging, but the position of the site of the second layer is different with the position of ground floor site; The whole structure of three-layer network dot density after according to preceding two-layer combination, determine the distribution situation of dot density, and by that analogy, N layer light guiding film site design makes the luminous irregular part of N-1 layer before the luminous zone energy supplement of N layer, finally make the led light source energy be fully used, and obtain the area source of high evenness; With two-layer unitized construction is that example illustrates above-mentioned global design mode, as shown in Figure 3, according near and far from dredging to close distribution from light source, and the luminosity curve of the led light source that uses according to reality carries out density and arranges, be illustrated in figure 4 as the light guiding film of whole design of second layer site, stagger in its network point distribution and position, ground floor site, particular location can be determined by the software simulation effect.
The method for making of leaded light component structure is in the present embodiment, and its step comprises:
(1) thickness and the individual layer light-leading film material thickness of the led light source that uses according to reality are determined the number of plies of multiple layer combination;
(2) according to led light source brightness data and light-emitting area, simulate in the mode of monolithic leaded light, determine initial leaded light network point distribution;
(3) distribution initial value to determine in the step (2) adjusts accordingly according to the cloth point mode, determines the network point distribution of ground floor light guiding film; According to energy distribution and each layer model configuration, determine the network point distribution of other each layers successively;
(4) make corresponding leaded light die sample according to each layer lattice point structure of design, carry out data test, in case of necessity, each layer network point distribution adjusted accordingly;
(5) after sample brightness, uniformity coefficient test are passed through, adopt volume to volume impression mode to make each layer light guiding film, and assemble.
Make the synoptic diagram of light guiding film as Figure 12 for volume to volume impression mode.Moulding process relatively rotates by drive roll and driven voller, and the microstructure site on die surface is impressed into substrate surface.This moulding process is the line contact, and the plate roller is in uniform rotation in moulding process, and therefore, the pressure in the surface of contact is very even.The PC rolls of rolling is around plate roller surface, and moulding process is not subjected to area constraints.Simultaneously, the speed of takeup type impression can reach tens of meter per seconds, has greatly improved production efficiency.
Show that after tested when light source is a side-emitting LED, LED thickness is 0.5mm, if the ultra-thin light-leading film that adopts monolithic 0.12mm thickness is as leaded light device, its thickness only is 1/4 of led light source thickness.If the light source side is sent energy and is directly proportional with its thickness, the monolithic light guiding film has only been utilized 25% of energy of light source, has lost 75% energy; But, if adopt the leaded light component as the sandwich construction of present embodiment, every layer of newly-increased monolithic light guiding film can be coupled to the energy of led light source loss, and passes through the leaded light site of each layer, side direction luminous energy is converted to positive energy, and the leaded light synoptic diagram of its each layer site is referring to Fig. 2.This structure also can improve the final homogeneity that obtains the area source energy by adjusting the position of each layer leaded light site except making full use of the energy of light source.
Embodiment two: referring to shown in Fig. 5 to 7, leaded light component structure in a kind of module backlight, comprise light guide base material, and according to the leaded light demand, leaded light lattice point structure in the formation of light guide base material surface preparation, comprise 10 layers of overlapping constituting of light guide base material, every layer of described light guide base material is the light guiding film of thickness 50um, and the thickness after each layer combination equals the thickness 0.5mm of led light source; Leaded light lattice point structure distributing position on the described base material of each layer is complementary mutually, makes the derivation uniform surface light source; Described leaded light lattice point structure is a vertebra shape concave, convex structure, and its diameter is 60um, and the degree of depth is 8um, according to the even light-guiding requirement, carries out the leaded light site on the described light guiding film of each layer surface based on folding/reflection-type geometric optical theory and arranges that uniform area light source is derived in overlapping back.
In order to make full use of energy of light source, improve the uniformity coefficient of area source, present embodiment adopts the design of local light conduction site, is the mode that example illustrates localized design leaded light site with three layers of unitized construction.The local location of site on three layers of monolithic light guiding film staggers relatively, and its dot density is determined according to die-away curve in the LED luminous energy communication process.Fig. 5 is nearest from light source, and energy is the strongest, the density minimum; Fig. 6 is far away from light source, and energy takes second place, and density increases; Fig. 7 from light source farthest, energy minimum, density maximum; By that analogy, the site design concept of 10 layers of combination is the same, and certainly, the present embodiment synoptic diagram has only been explained and adopted 1 zone design site on the monolithic light guiding film, according to the luminous situation of reality, can design a plurality of local luminous districts simultaneously on the monolithic light guiding film.
Embodiment three: the similar in the present embodiment is in embodiment one or two, and difference is the layout of leaded light site, adopts the design of integral body+part.The leaded light site of designing for integral way as Fig. 8,9, if under thickness permission situation, still there is local non-uniform phenomenon as ground floor, the second layer at regional area, at this moment, can adopt the site of local mode design that whole illumination effect is improved by increasing, referring to Figure 10.
Embodiment four: the leaded light component structure in a kind of module backlight, comprise light guide base material, and according to the leaded light demand, leaded light lattice point structure in the formation of light guide base material surface preparation, it is characterized in that: comprise overlapping the constituting of two-layer at least light guide base material, every layer of described light guide base material is the light guiding film of thickness 50um～100um, and the thickness after each layer combination is less than the thickness of led light source; Leaded light lattice point structure distributing position on the described base material of each layer is complementary mutually, makes the derivation uniform surface light source; Described leaded light lattice point structure is the diffraction gratings structure, this structure live width at least is 0.4um, grating depth is 150nm～400nm, according to the even light-guiding requirement, based on coupled wave theory, arrange that by the leaded light site that change grating orientation, the grooved degree of depth, each parameter of live width are carried out on the described light guiding film of each layer uniform area light source is derived in overlapping back.
In the present embodiment, when making light guiding film, adopt the concora crush mode, as shown in figure 11, moulding process is for to exert pressure from top to bottom to light guide plate (film) die 1, make die fully contact with PC base material 3, because the temperature of die 1 is generally about 100 ℃, material deforms during contact, thereby PC base material 3 surfaces are transferred in the microstructure site 2 on die surface, form the leaded light site.In the concora crush process, die needs fully to contact with base material, just can guarantee the consistance of depth of indentation, thereby guarantees the leaded light performance of site.But along with the increase of die area, the pressure of unit area reduces, and the degree of depth of impression site is affected.General concora crush area＜60mm * 60mm, the degree of depth of impression just can be guaranteed, and relatively evenly, still, the size impact of impression area production efficiency.Impression base material 3 can be the PC/PMMA material of all thickness.
Claims (5)
1. the leaded light component structure in the module backlight, comprise light guide base material, and according to the leaded light demand, leaded light lattice point structure in the formation of light guide base material surface preparation, it is characterized in that: by overlapping the constituting of two-layer at least light guide base material, every layer of described light guide base material is the light guiding film of thickness 50um～150um; Leaded light lattice point structure distributing position on the described base material of each layer makes derives luminous energy complementation mutually, constitutes uniform surface light source.
2. the leaded light component structure in the module backlight according to claim 1, it is characterized in that: described leaded light lattice point structure is little taper concave, convex structure, its diameter is 10um～100um, the degree of depth is 5um～20um, according to the even light-guiding requirement, carry out the leaded light site on the described light guiding film of each layer surface based on folding/reflection-type geometric optical theory and arrange, overlapping back is derived light and is constituted uniform area light source.
3. the leaded light component structure in the module backlight according to claim 1, it is characterized in that: described leaded light lattice point structure is the diffraction gratings structure, diffraction grating dot structure minimum feature is 0.4um, grating depth is 150nm～400nm, according to the even light-guiding requirement, based on coupled wave theory, arrange that by the leaded light site that change grating orientation, the grooved degree of depth, each parameter of live width are carried out on the described light guiding film of each layer overlapping back is derived light and constituted uniform area light source.
4. the leaded light component structure in the module backlight according to claim 1 is characterized in that: the thickness after described each layer light guide base material combination is less than or equal to the thickness of led light source.
5. the method for making of the leaded light component structure in the module backlight, its step comprises:
(1), determines the number of plies of multiple layer combination according to the thickness and the individual layer light guiding film material thickness of the led light source that uses;
(2) according to led light source brightness data and light-emitting area, simulate in the mode of monolithic leaded light, determine initial leaded light network point distribution;
(3) distribution initial value to determine in the step (2) adjusts accordingly according to the cloth point mode, determines the network point distribution of ground floor light guiding film; According to energy distribution and each layer model configuration, determine the network point distribution of other each layers successively;
(4) make leaded light die sample according to each layer lattice point structure of design, carry out data test, when requiring greater than setting, each layer network point distribution adjusted accordingly as the deviate of test data and design data;
(5) after sample brightness, uniformity coefficient test are passed through, make each layer light guiding film, and carry out superimposed assembling.
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| CN102169204A (en) * | 2011-04-14 | 2011-08-31 | 无锡睿涛光电科技有限公司 | Light-guide film capable of displaying divisionally and light guide structure thereof |
| CN102323638A (en) * | 2011-07-04 | 2012-01-18 | 映瑞光电科技(上海)有限公司 | Method for manufacturing multiple layers of light guide films in backlight module |
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| CN102323638A (en) * | 2011-07-04 | 2012-01-18 | 映瑞光电科技(上海)有限公司 | Method for manufacturing multiple layers of light guide films in backlight module |
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| CN103447694A (en) * | 2013-09-17 | 2013-12-18 | 瑞安市博业激光应用技术有限公司 | Design and manufacturing method of light guide points on light guide plate |
| US9568658B2 (en) | 2013-12-11 | 2017-02-14 | Hon Hai Precision Industry Co., Ltd. | Backlight module and method for manufacturing the same |
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| CN106772761A (en) * | 2016-12-27 | 2017-05-31 | 广东晶科电子股份有限公司 | A kind of colour gamut side entering-type LED backlight module high |
| CN106950639A (en) * | 2017-04-11 | 2017-07-14 | 力纳克传动***（深圳）有限公司 | A kind of method for designing of light guiding film |
| CN107632423A (en) * | 2017-09-16 | 2018-01-26 | 合肥惠科金扬科技有限公司 | A kind of manufacturing process of the guide-lighting board supporting structure of liquid crystal panel backlight module |
| CN110554533A (en) * | 2018-06-01 | 2019-12-10 | 苏州苏大维格光电科技股份有限公司 | Dodging device and light-emitting equipment comprising same |
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| CN100529810C (en) | 2009-08-19 |
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