CN101154610A - Conveying calibration device and wafer transmission system using the same - Google Patents
Conveying calibration device and wafer transmission system using the same Download PDFInfo
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- CN101154610A CN101154610A CNA200610113367XA CN200610113367A CN101154610A CN 101154610 A CN101154610 A CN 101154610A CN A200610113367X A CNA200610113367X A CN A200610113367XA CN 200610113367 A CN200610113367 A CN 200610113367A CN 101154610 A CN101154610 A CN 101154610A
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Abstract
The present invention discloses a transportation calibration device and a crystal wafer transmission system applying the same, comprising a terminal effector, wherein, the back end of the terminal effector is articulated with a manipulator, and the front end of the terminal effector is provided with a fetching device used to grab objects; the present invention also comprises a driving device which can drive the terminal effector to rotate around an articulated point and a calibration device used to position and calibrate a grabbed object; a fetching groove is arranged on the fetching device; the lower part of the fetching groove is provided with a positioning plane used for the center positioning to the grabbed object; a calibrator is arranged on the manipulator, which is used to define the circumferential angle of the grabbed object. The present invention is mainly used for a crystal wafer transmission system in the manufacturing process of semiconductor crystal wafers to transmit and calibrate the crystal wafers, is reliable in transportation, accurate in calibration, can be applied to both atmospheric environment and vacuum environment, cancels the transmission process of delivering the crystal wafers to the crystal wafer calibrator, reduces transmission path and time, improves the efficiency of production as well as transmission, and simplifies system equipment.
Description
Technical field
The present invention relates to a kind of semiconductor processing equipment, relate in particular to a kind of wafer transmission system of carrying calibrating installation and using this device.
Background technology
In semiconductor fabrication processes, wafer need be done technology to the technological reaction chamber from the wafer storehouse, finish technology after, again wafer is transmitted go back to the wafer storehouse from the technological reaction chamber.Atmosphere manipulator and vacuum mechanical-arm are enforcement parts, the core components of wafer transmission function in the whole process, are the nervous centralis of wafer transmission system, play the effect of transport hub.
As shown in Figure 1, be the transfer process of the wafer below 200 millimeters and 200 millimeters;
As shown in Figure 2, be the transfer process of 300 millimeters wafers.
As seen, in each link of wafer transmission carrying, atmosphere/vacuum mechanical-arm is absolutely necessary, and atmosphere manipulator and vacuum mechanical-arm are respectively applied for carrying and transmission wafer in atmosphere and vacuum environment.Simultaneously, no matter be the transfer process of the wafer below 200 millimeters, still the transfer process of 300 millimeters wafers all includes the wafer calibrator.
As shown in Figure 3, Figure 4, the effect of wafer calibrator is at the calibration of wafer with respect to the eccentricity of the carrying position of the end effectors of manipulator, and to the definition of wafer notch angle position.Have only when wafer is finished definition for the calibration of wafer off-centre and wafer notch position on the wafer calibrator after, atmosphere/vacuum mechanical-arm could carry out semiconductor technology with carrying wafers in the technological reaction chamber.
Because include the wafer calibrator and calibrate, location process, increased the link of transfer process, make transfer process too complicated.
At present, atmosphere/vacuum mechanical-arm mainly contains following three kinds to the bearing mode of wafer:
A kind of is the holding mode, and as shown in Figure 5, wafer is held in the palm by the end effectors of manipulator merely and carries, and relies on rubber cushion that end effectors is provided with and the frictional force that chip back surface is produced to guarantee the relative static of in handling process wafer and manipulator.This mode is mainly used in the carrying wafers of vacuum mechanical-arm in vacuum environment, and its reason is owing in vacuum environment, do not have resistance, disturbance and the interference of air-flow around the wafer, has guaranteed the reliability of wafer transmission.
Another kind is a vacuum adsorption type, as shown in Figure 6, cause the wafer tow sides to have pressure reduction by being bled in arm end effector and wafer back,, guarantee the relative static of in the carrying engineering wafer and manipulator so that chip sucking invests on the arm end effector.Because this mode needs atmospheric pressure to make the wafer tow sides have pressure reduction, so this mode can only be used for the atmosphere manipulator that uses in atmospheric environment.
Also having a kind of is that the edge is clipping, as shown in Figure 7, the arm end effector is equipped with fixture block, when wafer is carried by manipulator, end effectors is by the clamping of fixture block to Waffer edge, to finish the fixing of relative position between wafer and the arm end effector.This sharp mode can realize all that in vacuum and atmospheric environment wafer is difficult for producing relative motion or falling sheet with manipulator in handling process, and higher reliability is arranged.But, owing to adopt edge to carry out the mechanical type clamping to wafer, and the wafer thin and fragile has increased Waffer edge because of stressed and damaged possibility in the process of clamping, reduced reliability.
More than three kinds of each have their own advantages of mode, also each have their own shortcoming, all the reliability to wafer transmission has certain influence, and they have a common shortcoming, is exactly all can not be to the calibration of wafer off-centre and the definition of wafer notch position.Therefore, three kinds of modes all must be provided with the wafer calibrator in whole transmission system, before atmosphere/vacuum mechanical-arm carries out semiconductor technology with carrying wafers in the technological reaction chamber, aimed wafer must be delivered to the wafer calibrator and calibrate, define, make transfer process too complicated.
Summary of the invention
The purpose of this invention is to provide and a kind ofly transmit reliable and can be to being transmitted the carrying calibrating installation that object positions calibration, and transfer process be simply used the wafer transmission system of this device.
The objective of the invention is to be achieved through the following technical solutions:
Carrying calibrating installation of the present invention comprises end effectors, and the rear end of end effectors is connected with mechanical arm, and front end is provided with gets sundries, is used to grasp object, and the rear end and the mechanical arm of described end effectors are hinged;
Also be provided with drive unit on the described carrying calibrating installation, can drive end effectors and rotate around pin joint;
Also be provided with calibrating installation on the described carrying calibrating installation, be used for the location calibration of crawled object.
Described end effectors has two, is respectively first end effectors, second end effectors, and the rear end of described first end effectors and second end effectors is hinged with mechanical arm respectively; Front end is connected with first respectively and gets sundries, second and get sundries.
Described first gets sundries and second gets sundries and is respectively equipped with and gets the thing groove, and the two acting in conjunction realizes grasping object;
Described calibrating installation comprises gets the locating surface that thing groove bottom is provided with, and is used for crawled object is carried out centralized positioning.
Described locating surface is included in inclined-plane, location and the plane of orientation that the bottom of getting the thing groove is provided with from top to bottom successively.
The described thing groove of getting is an arc.
Described drive unit has two, be connected with second end effectors with first end effectors respectively, can drive first end effectors and second end effectors respectively and rotate or rotate or rotate around pin joint around pin joint in the same way around pin joint separately with speed is incorgruous with speed.
Described drive unit is a micro servo motor, is located at the hinged place of end effectors and mechanical arm.
Described calibrating installation comprises the calibrator of being located on the mechanical arm, is used for crawled thing is carried out the circumference viewpoint definition.
The wafer transmission system of the above-mentioned carrying calibrating installation of application of the present invention, comprise wafer storehouse, vacuum transmission cavity, technological reaction chamber, described wafer transmission system also comprises at least one carrying calibrating installation, described carrying calibrating installation carrying is calibration chip also, and institute's carrying wafer is sent to the technological reaction chamber from the wafer storehouse through the vacuum transmission cavity.
Also comprise the propagation in atmosphere unit, described carrying calibrating installation carrying and calibration chip, and wafer is carried by institute, and process propagation in atmosphere unit, vacuum transmission cavity are sent to the technological reaction chamber successively from the wafer storehouse.
As seen from the above technical solution provided by the invention, carrying calibrating installation of the present invention and use the wafer transmission system of this carrying calibrating installation because rear end and the mechanical arm of end effectors are hinged, and is rotated around pin joint by the drive unit driving; And also comprise calibrating installation, can be easily to the location calibration of crawled object.
Owing to get sundries and be provided with and get the thing groove, get the locating surface that thing groove bottom is provided with again, can carry out centralized positioning to crawled object very easily.
Because mechanical arm is provided with calibrator, can realize crawled thing is carried out the circumference viewpoint definition again.
The present invention mainly is used in the wafer transmission system in the semiconductor wafer course of processing, transmission and calibration chip, carrying is reliable, calibration is accurate, both can be applied in the atmospheric environment, can be applied to again in the vacuum environment, make wafer transmission system cancel the transmission course that wafer is sent to the wafer calibrator, reduce the transmission path time, improve the production efficiency of transmission, and simplified system equipment.
The present invention also is applicable to other circular or non-circular object of carrying calibration.
Description of drawings
Fig. 1 is the transfer process figure of the wafer of prior art below 200 millimeters;
Fig. 2 is the transfer process figure of 300 millimeters wafers of prior art;
Fig. 3 is the eccentric calibration process reference diagram of prior art wafer;
Fig. 4 is a prior art wafer notch viewpoint definition process reference diagram;
State reference map when Fig. 5 carries wafer for the end effectors holder of prior art one manipulator;
State reference map when Fig. 6 carries wafer for the end effectors holder of prior art two manipulators;
State reference map when Fig. 7 seizes wafer on both sides by the arms for the end effectors of prior art three manipulators;
Fig. 8 carries the structural representation of calibrating installation for the present invention;
Fig. 9 carries the partial structurtes schematic diagram of calibrating installation for the present invention;
Process when Figure 10 grasps wafer for the present invention carries calibrating installation is with reference to figure one;
Process when Figure 11 grasps wafer for the present invention carries calibrating installation is with reference to figure two;
Process when Figure 12 carries out centralized positioning for the present invention carries calibrating installation to wafer is with reference to figure one;
Process when Figure 13 carries out centralized positioning for the present invention carries calibrating installation to wafer is with reference to figure two;
Process when Figure 14 carries out the recess definition for the present invention carries calibrating installation to wafer is with reference to figure one;
Process when Figure 15 carries out the recess definition for the present invention carries calibrating installation to wafer is with reference to figure two;
Process when Figure 16 carries out the recess definition for the present invention carries calibrating installation to wafer is with reference to figure three;
Figure 17 is the transfer process figure of wafer transmission system specific embodiment one of the present invention;
Figure 18 is the transfer process figure of wafer transmission system specific embodiment two of the present invention.
Embodiment
The present invention carries the preferable embodiment of calibrating installation as shown in Figure 8, comprise end effectors, the rear end of end effectors is connected with mechanical arm 5, front end is provided with gets sundries, be used to grasp object, the rear end of end effectors and mechanical arm 5 adopt hinged, also can adopt other connected mode as required.
Described end effectors has two, is respectively first end effectors 1, second end effectors 3, and the rear end of described first end effectors 1 and second end effectors 3 is hinged with mechanical arm 5 respectively, can rotate around pin joint separately; Front end is connected with first respectively and gets sundries 2, second and get sundries 4.
As shown in Figure 9, described first gets sundries 2 and second gets sundries 4 and is respectively equipped with and gets thing groove 8, and the two acting in conjunction realizes grasping object, and the described thing groove 8 of getting is arc.Also can be linear pattern or other shape as required.
Get the locating surface that thing groove 8 bottoms are provided with, be used for crawled object is carried out centralized positioning, locating surface is included in inclined-plane, location 9 and the plane of orientation 10 that the bottom of getting thing groove 8 is provided with successively.
Also be provided with calibrating installation on the described carrying calibrating installation, be used for the location calibration of crawled object.Described calibrating installation comprises the calibrator of being located on the mechanical arm 56, is used for crawled thing is carried out the circumference viewpoint definition, and calibrator 6 is a reflective photoelectric sensor, also can adopt the calibrator of other form.
Inclined-plane 9, foregoing location and plane of orientation 10 also belong to calibrating installation, be mainly used in crawled object is carried out centralized positioning.Can also be provided with other calibrating installation as required.
Also be provided with drive unit 7 on the described carrying calibrating installation, can drive end effectors and rotate around pin joint; Described drive unit 7 has two, be connected with second end effectors 3 with first end effectors 1 respectively, can drive first end effectors 1 and second end effectors 3 and rotate or rotate or rotate around pin joint around pin joint in the same way around pin joint separately with speed is incorgruous with speed.Described drive unit 7 is a micro servo motor, is located at the hinged place of end effectors and mechanical arm 5.The driving shaft that the concrete mode that is provided with can be end effectors and micro servo motor is rigidly connected, and the fuselage of micro servo motor is rigidly connected with mechanical arm again.That is to say, the fuselage of micro servo motor and mechanical arm relative fixed, the driving shaft of micro servo motor and end effectors relative fixed rely on the driving shaft rotation relative and fuselage of micro servo motor to finish end effectors rotatablely moving with respect to mechanical arm.
The quantity of drive unit 7, mounting means and installation site can be selected and arrange as required arbitrarily, also can not adopt micro servo motor, and adopt other drive unit.
Carrying calibrating installation of the present invention mainly is used in the wafer transmission system in the semiconductor wafer course of processing, transmission and calibration chip, carrying is reliable, calibration accurately, both can be applied to can be applied in the vacuum environment again in the atmospheric environment.
Also can be used to carry the circular or non-circular object of calibrating other.
In the wafer transmission process, described carrying calibrating installation is manipulator, comprises atmosphere manipulator and vacuum mechanical-arm, is respectively applied for carrying and transmission wafer in atmosphere and vacuum environment.It grasps wafer and is such to the principle that wafer carries out centralized positioning:
As shown in figure 10, when manipulator will be got sheet, first gets sundries 2 and second got sundries 4 and is in the initial condition of closing up, and manipulator is got sheet along A to travelling forward.
As shown in figure 11, when the end effectors of manipulator moves to when getting the sheet position, two drive unit 7 counter motions drive first end effectors 1 and second end effectors 3 and rotate around pin joint with speed is incorgruous, make first to get sundries 2 and second and get sundries 4 and launch to be 180 degree distributions.At this moment, wafer 11 just is in first and gets sundries 2 and second and get getting in the thing groove 8 of sundries 4.
At this moment, as shown in figure 12, manipulator is in low level and gets sheet, and first gets sundries 2 and second gets sundries 4 and do not contact with the wafer lower surface.
Then, as shown in figure 13, manipulator by the next rise to upper, first gets sundries 2 and second gets the inclined-plane, location 9 of the bottom of getting thing groove 8 of sundries 4 and at first contacts with wafer 11, at this moment, wafer 11 exists eccentric with end effectors, manipulator is risen in the upper process by the next, wafer 11 slides into plane of orientation 10 by inclined-plane 9, location, the profile camber line of this plane of orientation 10 is identical with wafer 11 diameters, so, can finish the calibration of the off-centre of wafer 11 with spacing by this structure, promptly realize centralized positioning to wafer 11.Finish final extracting to aimed wafer 11.
By above-mentioned we as can be known, finish when manipulator and to get sheet when action, finished extracting and eccentric calibration and spacing work automatically to wafer 11.Then, manipulator will define the recess angle position of wafer 11.
Shown in Figure 14,15,16, principle and specific implementation process that the recess angle position of wafer 11 is defined are such:
The end effectors of manipulator and mechanical arm 5 are hinged.Prior art, 5 of mechanical arms are merely a transition link, and the present invention is provided with a calibrator 6 on mechanical arm 5, calibrator 6 is a reflective photoelectric sensor.The light emission direction is perpendicular to wafer 11 surfaces, and it is the edge critical point of wafer 11 that the position is set.After manipulator has been got wafer 11, two drive units 7 are micro servo motor, two micro servo motors rotate with speed simultaneously in the same way, drive first end effectors 1 and second end effectors 3 simultaneously in the same way with the speed rotation, keep static relatively between first end effectors 1 and second end effectors 3.First gets sundries 2 and second gets 11 rotations of sundries 4 drive wafers.When the process photoelectric sensor of the non-recess position of wafer 11, light is penetrated on wafer 11 surfaces, this transducer of reflected back.And when the recess position of wafer 11 through under the transducer time, light leaked wafer by recess and was not reflected back toward transducer, this moment, transducer assert that this position is the recess position of wafer 11.And note currency, according to the recess position calculation of default wafer 11 angle that deviates, arrive its precalculated position then by rotation.Finish definition to the recess angle position of wafer 11.
As shown in figure 17, the present invention uses the preferable specific embodiment of wafer transmission system of above-mentioned carrying calibrating installation, comprise wafer storehouse, vacuum lock, vacuum transmission cavity, technological reaction chamber, described wafer transmission system also comprises at least one carrying calibrating installation, described carrying calibrating installation carrying and calibration chip, and wafer is carried by institute, and process vacuum lock, vacuum transmission cavity are sent to the technological reaction chamber successively from the wafer storehouse.
Native system is mainly used in the transmission system of the wafer below 200 millimeters and 200 millimeters, also can be applied to the transmission of other wafer.
As shown in figure 18, another preferable specific embodiment of wafer transmission system of the present invention, on the basis of a last embodiment, also comprise the propagation in atmosphere unit, described carrying calibrating installation carrying and calibration chip, and wafer is carried by institute, and process propagation in atmosphere unit, vacuum lock, vacuum transmission cavity are sent to the technological reaction chamber successively from the wafer storehouse.Be mainly used in the transmission system of 300 millimeters wafers, also can be applied to the transmission of other wafer.
Wafer transmission system of the present invention has compared with prior art been cancelled the wafer calibrator, has saved the device space, has saved equipment cost.And cancelled the transmission course that wafer is sent to the wafer calibrator, and reduced the transmission path time, improved the production efficiency of transmission, increased yield in unit time.Be not limited to the transmission path described in these two embodiment in the practical application, also can be used for other transmission path, and can cancel the wafer calibrator as required.
The above; only for the preferable embodiment of the present invention, but protection scope of the present invention is not limited thereto, and anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.
Claims (10)
1. a carrying calibrating installation comprises end effectors, and the rear end of end effectors is connected with mechanical arm, and front end is provided with gets sundries, is used to grasp object, it is characterized in that, the rear end and the mechanical arm of described end effectors are hinged;
Also be provided with drive unit on the described carrying calibrating installation, can drive end effectors and rotate around pin joint;
Also be provided with calibrating installation on the described carrying calibrating installation, be used for the location calibration of crawled object.
2. carrying calibrating installation according to claim 1, it is characterized in that, described end effectors has two, is respectively first end effectors, second end effectors, and the rear end of described first end effectors and second end effectors is hinged with mechanical arm respectively; Front end is connected with first respectively and gets sundries, second and get sundries.
3. carrying calibrating installation according to claim 2 is characterized in that, described first gets sundries and second gets sundries and be respectively equipped with and get the thing groove, and the two acting in conjunction realizes grasping object;
Described calibrating installation comprises gets the locating surface that thing groove bottom is provided with, and is used for crawled object is carried out centralized positioning.
4. carrying calibrating installation according to claim 3 is characterized in that, described locating surface is included in inclined-plane, location and the plane of orientation that the bottom of getting the thing groove is provided with from top to bottom successively.
5. according to claim 3 or 4 described carrying calibrating installations, it is characterized in that the described thing groove of getting is an arc.
6. carrying calibrating installation according to claim 2, it is characterized in that, described drive unit has two, be connected with second end effectors with first end effectors respectively, can drive first end effectors and second end effectors respectively and rotate or rotate or rotate around pin joint around pin joint in the same way around pin joint separately with speed is incorgruous with speed.
7. carrying calibrating installation according to claim 6 is characterized in that described drive unit is a micro servo motor, is located at the hinged place of end effectors and mechanical arm.
8. according to claim 1 or 3 described carrying calibrating installations, it is characterized in that described calibrating installation comprises the calibrator of being located on the mechanical arm, be used for crawled thing is carried out the circumference viewpoint definition.
9. wafer transmission system of using above-mentioned carrying calibrating installation, comprise wafer storehouse, vacuum transmission cavity, technological reaction chamber, it is characterized in that, described wafer transmission system also comprises at least one carrying calibrating installation, described carrying calibrating installation carrying is calibration chip also, and institute's carrying wafer is sent to the technological reaction chamber from the wafer storehouse through the vacuum transmission cavity.
10. wafer transmission system according to claim 9, it is characterized in that, also comprise the propagation in atmosphere unit, described carrying calibrating installation carrying and calibration chip, and wafer is carried by institute, and process propagation in atmosphere unit, vacuum transmission cavity are sent to the technological reaction chamber successively from the wafer storehouse.
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| CN200610113367A CN101154610B (en) | 2006-09-25 | 2006-09-25 | Conveying calibration device and wafer transmission system using the same |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102017121B (en) * | 2008-05-07 | 2013-01-02 | 朗姆研究公司 | Dynamic alignment of wafers using compensation values obtained through a series of wafer movements |
| CN103811292A (en) * | 2012-11-07 | 2014-05-21 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Silicon chip processing system and processing method thereof |
| CN105552010A (en) * | 2015-12-11 | 2016-05-04 | 中国电子科技集团公司第四十八研究所 | Substrate conveying system for silicon epitaxial growth |
| CN106409741A (en) * | 2015-07-30 | 2017-02-15 | 朗姆研究公司 | Vision-based wafer notch position measurement |
| TWI681852B (en) * | 2015-07-30 | 2020-01-11 | 美商蘭姆研究公司 | System and method for wafer alignment and centering with ccd camera and robot |
| CN113838791A (en) * | 2021-08-30 | 2021-12-24 | 威科赛乐微电子股份有限公司 | Wafer taking and circle center positioning device, method, system and readable storage medium |
| US11823939B2 (en) | 2021-09-21 | 2023-11-21 | Applied Materials, Inc. | Apparatus and methods for processing chamber lid concentricity alignment |
| TWI835911B (en) * | 2018-11-05 | 2024-03-21 | 美商蘭姆研究公司 | Apparatus, method, and non-transitory, computer-readable medium for handling wafers |
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| CN107591351B (en) * | 2016-07-06 | 2020-02-14 | 北京北方华创微电子装备有限公司 | Robot and semiconductor processing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999043021A1 (en) * | 1998-02-18 | 1999-08-26 | Applied Materials, Inc. | End effector for wafer handler in processing system |
| IL143467A (en) * | 1998-12-02 | 2005-05-17 | Newport Corp | Specimen holding robotic arm and effector |
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2006
- 2006-09-25 CN CN200610113367A patent/CN101154610B/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102017121B (en) * | 2008-05-07 | 2013-01-02 | 朗姆研究公司 | Dynamic alignment of wafers using compensation values obtained through a series of wafer movements |
| CN103811292A (en) * | 2012-11-07 | 2014-05-21 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Silicon chip processing system and processing method thereof |
| CN103811292B (en) * | 2012-11-07 | 2016-08-10 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Silicon chip process and treat system and processing method |
| CN106409741A (en) * | 2015-07-30 | 2017-02-15 | 朗姆研究公司 | Vision-based wafer notch position measurement |
| TWI681852B (en) * | 2015-07-30 | 2020-01-11 | 美商蘭姆研究公司 | System and method for wafer alignment and centering with ccd camera and robot |
| CN106409741B (en) * | 2015-07-30 | 2022-04-19 | 朗姆研究公司 | Position measurement based on visible wafer notch |
| CN105552010A (en) * | 2015-12-11 | 2016-05-04 | 中国电子科技集团公司第四十八研究所 | Substrate conveying system for silicon epitaxial growth |
| TWI835911B (en) * | 2018-11-05 | 2024-03-21 | 美商蘭姆研究公司 | Apparatus, method, and non-transitory, computer-readable medium for handling wafers |
| CN113838791A (en) * | 2021-08-30 | 2021-12-24 | 威科赛乐微电子股份有限公司 | Wafer taking and circle center positioning device, method, system and readable storage medium |
| US11823939B2 (en) | 2021-09-21 | 2023-11-21 | Applied Materials, Inc. | Apparatus and methods for processing chamber lid concentricity alignment |
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| CN101154610B (en) | 2010-05-12 |
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Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100016, building 2, block M5, No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
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