CN101151947A - Ball capturing device, solder ball arrangement device, ball capturing method, and solder ball arranging method - Google Patents
Ball capturing device, solder ball arrangement device, ball capturing method, and solder ball arranging method Download PDFInfo
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- CN101151947A CN101151947A CN200580049258.XA CN200580049258A CN101151947A CN 101151947 A CN101151947 A CN 101151947A CN 200580049258 A CN200580049258 A CN 200580049258A CN 101151947 A CN101151947 A CN 101151947A
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- ball
- solder ball
- afloat
- trap setting
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 187
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000007664 blowing Methods 0.000 claims abstract description 28
- 239000012530 fluid Substances 0.000 claims description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 239000000758 substrate Substances 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 206010010904 Convulsion Diseases 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A ball capturing device and a ball capturing method for capturing one ball from a plurality of balls of the same size and a solder ball arranging device and a solder ball arranging method for arranging solder balls with solder at prescribed positions on a circuit board, wherein one ball is securely captured from the plurality of balls of the same size. The ball capturing device comprises a storage body (111) in which a small hole (1111) larger in size than one ball (B) and smaller in size than two balls is formed in the upper part of a storage wall (111a) enclosing a space (S) storing the plurality of balls (B) of the same size, a blow-up means (112) blowing up the balls B stored in the storage body (111), and a capturing means (12) capturing the balls (B) blown up by the blow-up means (112) and reaching the hole (1111).
Description
Technical field
The present invention relates to from a plurality of balls of same size to catch solder ball arrangement device and and method that the ball capturing device of a ball and method thereof and the configuration of the precalculated position on printed circuit board (PCB) contain the solder ball of scolding tin.
Background technology
Catch this part thing of ball from a plurality of balls of same size, ball is more little just difficult more.For example, be provided with configuration between the pad of the electrode of flexible ribbon cable (FPC) of electrode and printed circuit board (PCB) covers the side face of copper ball with scolding tin the situation etc. of solder ball at front end, use the solder ball about diameter 0.15～0.2mm, it is difficult only taking out a solder ball from the solder ball of a plurality of such minor diameters.
Therefore, consider to use the technology of on a plurality of pads of printed circuit board (PCB), utilizing mask etc. to form solder ball in batch respectively, but when trial-production and when repairing, or has situation of pad etc. in the position that is difficult to place mask, can not utilize mask to form solder ball in batch, consequently, become and from a plurality of solder ball, take out a solder ball, configuration one by one on a plurality of pads of printed circuit board (PCB).
Here, blow afloat a plurality of solder ball, the device that attracts to catch the solder ball that has blown afloat by air has proposed a plurality of (for example, with reference to patent documentations 1～4 etc.).
Patent documentation 1:JP spy opens flat 7-307340 communique
Patent documentation 2:JP spy opens the 2001-44624 communique
Patent documentation 3:JP speciallys permit communique No. 3440836
Patent documentation 4:JP spy opens flat 9-18130 communique
Summary of the invention
The problem that invention will solve
But the device of patent documentation 1～4 record is a prerequisite to catch a plurality of solder ball in batch, and the air during owing to static that works between solder ball and air attraction is sewed, so can not only catch a solder ball.
The present invention its objective is that providing a kind of can reliably catch the ball capturing device and the method thereof of a ball and have this ball capturing device and the precalculated position on printed circuit board (PCB) configuration contains the solder ball arrangement device and the method thereof of the solder ball of scolding tin from a plurality of balls of same size in view of the above problems.
The means that are used to deal with problems
Solve the ball capturing device of the present invention of above-mentioned purpose, it is characterized in that having:
Host body, its top of accommodating wall in the space that has sealed a plurality of balls of accommodating same size are provided with bigger and than the little hole of size of two these balls than the size of this ball;
Blow afloat device, it blows afloat the ball of being accommodated by above-mentioned host body upward;
Trap setting, it is caught by above-mentioned and blows afloat the ball that device had blown afloat and arrived above-mentioned hole.
Solve the solder ball arrangement device of the present invention of above-mentioned purpose, the precalculated position configuration on printed circuit board (PCB) contains the solder ball of scolding tin, it is characterized in that having:
Host body, its top of accommodating wall in the space that has sealed a plurality of solder ball of accommodating same size are provided with bigger and than the little hole of size of two these solder ball than the size of this solder ball;
Blow afloat device, it blows afloat the solder ball of being accommodated by above-mentioned host body upward;
Trap setting, it is caught by above-mentioned and blows afloat the solder ball that device had blown afloat and arrived above-mentioned hole;
Collocation mechanism, it makes the position of the solder ball of being caught by above-mentioned trap setting and the above-mentioned precalculated position contraposition of printed circuit board (PCB), disposes this solder ball in this precalculated position.
According to these devices of the present invention, for example, even ball or solder ball (below be referred to as ball) are each other owing to electrostatic force clings, blow afloat blowing afloat of device because of above-mentioned, thereby ball is dispersed into one by one, owing to can be one by the ball in above-mentioned hole, so from a plurality of balls of same size, can catch a ball reliably.
And, even above-mentioned trap setting is the device of catching the ball that has arrived above-mentioned hole by attraction,, can not act on the sucking action of same degree simultaneously to two balls from the size in above-mentioned hole, can reliably catch a ball.
And preferred above-mentioned trap setting has stream that air flowed that has attracted and the flowmeter of measuring the flow of the air that flows through this stream,
Above-mentioned ball capturing device or above-mentioned solder ball arrangement device have test section, and this test section detects the situation that above-mentioned trap setting captures ball according to the fixed changes in flow rate of above-mentioned flow measurement.
If the internal diameter of the attraction mouth of above-mentioned trap setting greatly to a certain degree, then can catch (attraction) situation according to the pressure change-detection trap setting in the above-mentioned stream to ball, but the internal diameter of the attraction mouth of the more little trap setting of ball is just more little, and it is difficult that this detection becomes.But,,, also can detect the situation that ball is arrived in seizures (attraction) easily even then the internal diameter of the attraction mouth of trap setting is little if be conceived to flow through the changes in flow rate of the air of above-mentioned stream.
In addition, the above-mentioned device that blows afloat can blow out fluid from circular open in above-mentioned host body, but preferably blows out fluid from the opening of slit-shaped.
If the above-mentioned device that blows afloat blows out fluid from circular open, when stopping the blowing out of fluid, be the center with this circular open then, one side is avoided this opening one side around arranging ball around the opening like that, when blowing out fluid, ball arrives above-mentioned hole might need spended time next time.On the other hand, if slit-shaped openings when stopping fluid and blow out, has ball at this above the opening as clogging slit-shaped openings, when blowing out fluid, it is very short that ball arrives the time in above-mentioned hole, improved capturing efficiency next time.
And the above-mentioned device that blows afloat blows out fluid in above-mentioned host body, and has the stream that flows through this fluid and being provided with and the part of the pressure in this stream is released to the outside pressure device that removes of this stream midway, and this also is a kind of of desirable style.
Stop to blow out fluid during, consider for some reason in above-mentioned stream in addition unexpected pressure, blow afloat the ball of being accommodated upward and situation about flying out from above-mentioned hole by above-mentioned host body, but if according to aforesaid way, even in addition unexpected pressure in above-mentioned stream also can be emitted this unexpected pressure with above-mentioned except that pressure device.
Solve first kind of ball capturing method of the present invention of above-mentioned purpose, it is characterized in that comprising:
The contraposition step makes hole of accommodating the setting of wall top and the trap setting contraposition of catching this ball in the space that has sealed a plurality of balls of accommodating same size, and wherein the size of this ball of this boring ratio is big and littler than the sizes of two these balls;
Catch step, blow afloat the ball that is housed in the above-mentioned space upward, and catch the ball that is blown afloat and arrive above-mentioned hole by above-mentioned trap setting;
Stop step, stop above-mentioned ball blowing afloat upward.
Solve first kind of solder ball arranging method of the present invention of above-mentioned purpose, the precalculated position configuration on printed circuit board (PCB) contains the solder ball of scolding tin, it is characterized in that having:
The contraposition step makes hole of accommodating the setting of wall top and the trap setting contraposition of catching this solder ball in the space that has sealed a plurality of above-mentioned solder ball of accommodating same size, and wherein the size of this solder ball of this boring ratio is big and littler than the sizes of two these solder ball;
Catch step, blow afloat the solder ball that is housed in the above-mentioned space upward, and catch the solder ball that is blown afloat and arrive above-mentioned hole by above-mentioned trap setting;
Stop step, stop above-mentioned solder ball blowing afloat upward;
Configuration step, the solder ball that the above-mentioned precalculated position configuration on printed circuit board (PCB) is caught by above-mentioned trap setting.
If use these first methods of the present invention, for example, even ball is each other owing to electrostatic force clings, because of the above-mentioned ball that blows afloat that blows afloat device is dispersed into one by one, owing to can be one by the ball in above-mentioned hole, so from a plurality of balls of same size, can reliably catch a ball.
In these first methods of the present invention, preferably during stopping that above-mentioned ball blows afloat upward, attract to be housed in the ball in the above-mentioned space downwards.
During stopping that above-mentioned ball blows afloat upward, even the unexpected power that blows afloat upward acts on the ball of being accommodated by above-mentioned host body for some reason, owing to attract to be housed in the ball in the above-mentioned space downwards, from above-mentioned hole, fly out so can suppress this ball.
Preferred above-mentioned seizure step is by blowing out fluid from slit-shaped openings in above-mentioned space, blowing afloat the step that is housed in the ball in this space upward.
So, the time that ball arrives above-mentioned hole shortens, and has improved capturing efficiency.
Solve second kind of ball capturing method of the present invention of above-mentioned purpose, it is characterized in that comprising:
The contraposition step makes hole of accommodating the setting of wall top and the trap setting contraposition of catching this ball by attraction in the space that has sealed a plurality of balls of accommodating same size, and wherein the size of this ball of this boring ratio is big and littler than the sizes of two these balls;
Attract the beginning step, begin to carry out with the contraposition of above-mentioned hole after the attraction action of above-mentioned trap setting;
Catch step, blow afloat the ball that is housed in the above-mentioned space upward, attract to be blown afloat and arrive the ball in above-mentioned hole by above-mentioned trap setting, and catch this ball;
Stop step, stop above-mentioned ball blowing afloat upward.
Solve second kind of solder ball arranging method of the present invention of above-mentioned purpose, the precalculated position configuration on printed circuit board (PCB) contains the solder ball of scolding tin, it is characterized in that comprising:
The contraposition step, make hole of accommodating the setting of wall top and the trap setting contraposition of catching this solder ball by attraction in the space that has sealed a plurality of above-mentioned solder ball of accommodating same size, wherein the size of this solder ball of this boring ratio is big and littler than the sizes of two these solder ball;
Attract the beginning step, begin to carry out with the contraposition of above-mentioned hole after the attraction action of above-mentioned trap setting;
Catch step, blow afloat the solder ball that is housed in the above-mentioned space upward, attract to be blown afloat and arrive the ball in above-mentioned hole by above-mentioned trap setting, and catch this ball;
Stop step, stop above-mentioned solder ball blowing afloat upward;
Configuration step after the contraposition in the position of the solder ball of having carried out being caught by above-mentioned trap setting and the above-mentioned precalculated position on the printed circuit board (PCB), stops the attraction action of this trap setting, to this precalculated position configuration solder ball that device catches that is captured.
If use these second methods of the present invention, from the size in above-mentioned hole, can not act on the sucking action of the above-mentioned trap setting of same degree simultaneously to two balls, can catch a ball reliably.
In addition, the above-mentioned step that stops is the step that with the attraction more weak than the attraction of above-mentioned trap setting ball is attracted downwards when stopping above-mentioned ball blowing afloat upward, and then,
In second kind of solder ball arranging method of the present invention, preferred above-mentioned configuration step is to implement the above-mentioned step implemented after the step of stopping.
Regularly be in by the enforcement that makes above-mentioned configuration step and implement above-mentioned stopping after the step, even supposition makes other ball be connected with the nodule number pearl that arrives above-mentioned hole and clings owing to electrostatic force, effect by the attraction more weak than the attraction of above-mentioned trap setting is drawn back these other ball from the ball that arrives above-mentioned hole, can catch a ball more reliably from a plurality of balls of same size, the precalculated position on printed circuit board (PCB) disposes this ball.
In addition, the preferred above-mentioned step that stops is following step: the air mass flow of receiving the stream that air flowed that above-mentioned trap setting has attracted is less than the information of predetermined flow, and stops above-mentioned ball blowing afloat upward.
If above-mentioned trap setting attracts ball, the air mass flow that then flows through above-mentioned stream is less than predetermined flow.Therefore, the above-mentioned step that stops to be implemented after above-mentioned trap setting captures ball, can catch a ball more reliably from a plurality of balls of same size.
The invention effect
According to the present invention, provide and can be reliably from a plurality of balls of same size, catch the ball capturing device and the method thereof of a ball and have this ball capturing device and the configuration of the precalculated position on printed circuit board (PCB) contains the solder ball arrangement device and the method thereof of the solder ball of scolding tin.
Description of drawings
Fig. 1 is the figure of the schematic configuration of the expression device suitable with embodiment of solder ball arrangement device of the present invention.
Fig. 2 is the flow chart of the solder ball arranging method implemented of solder ball arrangement device that expression is represented with Fig. 1.
The curve chart of the changes in flow rate of the air that flows through attraction mechanism pipe arrangement when Fig. 3 is expression with the different 3 kinds of capillaries experiment of internal diameter.
Fig. 4 is the figure of expression host body shown in Figure 1 and this host body periphery.
Fig. 5 is the hole site of expression host body and begins to blow afloat the back to the curve chart that the time relation of solder ball is arranged in capillary attraction.
Fig. 6 is the curve chart of the relation of the size of supply hole of expression host body and service time.
Fig. 7 is illustrated in the figure of appearance that the bottom is provided with the host body inside of circular open.
Fig. 8 is the figure that the bottom that is illustrated in host body is provided with the example of slit-shaped openings.
Fig. 9 is the structure chart of the bottom of the host body that observed Fig. 8 represents from the top.
Figure 10 is illustrated in the figure of appearance that the bottom is provided with the host body inside of slit-shaped openings.
Embodiment
Below, with reference to the description of drawings embodiments of the invention.
Fig. 1 is the figure of the schematic configuration of the expression device suitable with embodiment of solder ball arrangement device of the present invention.
The solder ball arrangement device 1 that Fig. 1 represents is the device that disposes solder ball on the lip-deep a plurality of pads of circuit board substrate one by one being arranged at.Solder ball is that diameter is the small ball of 0.15mm, and the side face that covers copper ball with scolding tin forms.Here, will vertical direction be that X-direction, left and right directions are that Y direction, above-below direction are that Z-direction describes with the paper of relative Fig. 1.Solder ball arrangement device 1 has pedestal 21, X-direction positioning table 22, Y direction positioning table 23, Z-direction positioning table 24.
In addition, on the solder ball arrangement device 1 that Fig. 1 represents, assembling suitable solder ball trap setting 10 with embodiment of solder ball arrangement device of the present invention.This solder ball trap setting 10 has ball supply unit 11 and handle portion 12.
Ball supply unit 11 has the host body 111 of a plurality of solder ball of accommodating same size.This host body 11 is funnelform shapes, and the opening on top is used in the board member that central authorities are provided with the supply hole 1111 big and littler than 0.30mm than 0.15mm and clogs.That is, the host body 11 that Fig. 1 represents is provided with the little supply hole 1111 of size that compares two solder ball than the size of a solder ball greatly on the top of accommodating wall of the space S that has sealed a plurality of balls of accommodating same size.This host body 111 is fixed on the pedestal 21 of solder ball arrangement device 1.In addition, ball supply unit 11 also has the mechanism of blowing afloat 112.Blowing afloat mechanism 112 has pump 1121 and an end and is connected pipe arrangement 1122 on this pump 1121.The other end of this pipe arrangement 1122 is connected on the bottom of host body 111, flows in pipe arrangement 1122 with the air of pump 1121 compressions and the air that is attracted.If compressed air is mobile pipe arrangement 1122 in, blow out air upward then from the bottom of host body 111.And then, blow afloat mechanism 112 and have T branch 1123.This T branch 1123 is arranged on pipe arrangement 1122 midway, has from stream branch that is connected with pump 1121 and stream from throttling action to the outside connection that bring into play, a part of pressure in the outside emits pipe arrangement 1122.On the stream of performance throttling action, unidirectional valve is set.
Handle portion 12 has capillary 121 and attracts mechanism 122.Capillary 121 so that front end be installed on the Z axle positioning table 24 towards the posture of the supply hole 1111 of host body 111.This Z axle positioning table 24 by the rotation of motor 241 along Z-direction (with reference to the arrow Z among the figure), be that above-below direction moves.In this solder ball arrangement device 1, on X-direction, the position of the position of capillary 121 front ends and the supply hole 1111 of host body 111 always is in the state of contraposition.In Fig. 1, represented to make 24 risings of Z axle positioning table and made capillary 121 front ends be positioned at the appearance of the position of the supply hole 1111 that leaves host body 111 more greatly, but by Z axle positioning table 24 is descended, capillary 121 front ends can move to from the supply hole 1111 of host body 111 and leave upward as the position about the 0.075mm of solder ball radius (below, claim that this position is for attracting the position).And then Z axle positioning table 24 is installed on the Y-axis positioning table 22 freely movably along Y direction (with reference to the arrow Y among the figure), by the rotation of motor 221, and moves along Y-axis positioning table 22.The attraction mechanism 122 that constitutes handle portion 12 has pump 1221, an end is connected the pipe arrangement 1222 on this pump 1221.When this pump 1221 is driven, suck air, attract action from capillary 121 front ends.The other end of pipe arrangement 1222 is connected on the rear end of capillary 121, flows in pipe arrangement 1222 from capillary 121 front end inhaled airs.Attract mechanism 122 that flowmeter 1223 is also arranged.Flowmeter 123 is measured the flow of the air that flows through pipe arrangement 1222.
In addition, the solder ball arrangement device 1 represented of Fig. 1 is being provided with X-axis positioning table 21 in the position of leaving from host body 111 along Y direction.Circuit substrate is placed on the X-axis positioning table 21.X-axis positioning table 21 by the rotation of motor 211 along moving on the X-direction (relative to the vertical direction of paper).
And then the solder ball arrangement device 1 that Fig. 1 represents has control part 25.The control of solder ball trap setting is also managed in all control of these control part 25 management solder ball arrangement devices.
Fig. 2 is the flow chart of the solder ball arranging method implemented of solder ball arrangement device that expression is represented with Fig. 1.
As preparation, Fig. 1 represents that host body 111 contains the solder ball that a plurality of diameters are 0.15mm.Here, the pump 1121 that blows afloat mechanism 112 attracts action, and sucks air state from the supply hole 1111 of host body 111.At this state, on supply hole 1111, place solder ball one by one, in host body 111, introduce solder ball one by one.In addition, on the X-axis positioning table 21 that Fig. 1 represents, placing the circuit substrate that the surface is provided with a plurality of pads.
After being ready to complete like this, implement solder ball arranging method.At first, make the front end contraposition (step S1) of the supply hole 1111 and the capillary 121 of the host body 111 that contains a plurality of solder ball.Promptly, on X-direction, state in the position contraposition of the supply hole 1111 of the position of capillary 121 front ends and host body 111, by Z axle positioning table 24 is moved along Y direction, thereby on Y direction, make supply hole 1111 contrapositions of the front end and the host body 111 of capillary 121, then, by Z-direction positioning table 24 is moved along Z-direction, thereby the front end that makes capillary 121 is to attracting the position to move.In addition, also can constitute the position of fixed capillary 121 front ends, and host body 111 is moved along Y direction and Z-direction, make the front end contraposition of the supply hole 1111 and the capillary 121 of host body 111.
Then, be positioned under the state that attracts the position, drive the pump 1221 that attracts mechanism 122, begin to suck the attraction action (step S2) of air from the front end of capillary 121 at the front end of capillary 121.
Then, the pump 1121 that blows afloat mechanism 112 carries out compressed action, sends into compressed air (step S3) to pipe arrangement 112.So, the blow out air upward from the bottom of host body 111 blows afloat the solder ball of being accommodated by host body 111 upward with this air, and the front end of capillary 121 attracts to have been blown afloat and arrived the solder ball of supply hole 1111, and catches solder ball.That is,, blow afloat the solder ball of being accommodated upward, attract to have been blown afloat and arrived the solder ball of supply hole 1111 with capillary 121, and catch solder ball by host body 111 at step S3.
Then, stop to blow afloat the compressed action of the pump 1121 of mechanism 112, and make pump 1121 attract action (step S4) specifically.The attraction action that blows afloat the pump 1121 of mechanism 112 is the action that produces the attraction more weak than the attraction of pump 1221 generations that attract mechanism 122, attracts the pump 1221 of mechanism 122 to continue to attract action from step S2.Therefore, the solder ball of using the air that blows out from the bottom of host body 111 to blow afloat pulls to bottom side and falls, but the solder ball that is attracted by the front end of capillary 121 is still attracted by the front end of capillary 121 owing to attract the attraction of the pump 1221 in the mechanism 122.
Then, will be disposed at by the solder ball that the front end of capillary 121 attracts on the desirable pad that is provided with on the circuit substrate surface (step S5).Promptly, still drive the pump 1221 that attracts mechanism 122, Z axle positioning table 24 is risen, then, move Z axle positioning table 24 along Y direction, at first, in Y direction, carry out the position of desired pad among a plurality of pads on the circuit substrate surface of placing on the X-axis positioning table 21 and the contraposition of the position of the solder ball that attracted by the front end of capillary 121.Then, move X-axis positioning table 22 along X-direction (relative to the vertical direction of the paper of Fig. 1), in X-direction, carry out the contraposition of the position of the position of desired pad and solder ball, then, Z axle positioning table 24 is descended, the solder ball that is being attracted by the front end of capillary 121 is located on the desirable pad that is provided with on the circuit substrate surface.At last, stop to attract the driving of the pump 1221 in the mechanism 122, the solder ball that configuration has been attracted by the front end of capillary 121 on the desired pad of printed circuit board surface setting.
Then, Z axle positioning table 24 is risen,,, then finish (step S6) if do not need if need then return step S1 to remaining pad configuration solder ball.
In addition,, finish or return under the situation of step S1, continue to implement to be attracted to the below by the solder ball that host body 111 is accommodated up to beginning step S3 at this flow chart in step S4 attraction action that implement, that blow afloat the pump 1121 in the mechanism 112.So, act on some bat and accommodated on 111 solder ball of accommodating,, can suppress solder ball and fly out from supply hole 1111 owing to attract the solder ball of being accommodated downwards by host body 111 even blow afloat unexpected power upward.In addition, as Fig. 1 represents, owing to be provided with T branch 1123 midway at the pipe arrangement 1122 that blows afloat mechanism 112, even in pipe arrangement 1122, send into unexpected compressed air with some bat, stream by throttling action T branch 1123, that be connected with the outside, it is empty also to bleed off unexpected compression to the outside, also can suppress solder ball according to this point and fly out from supply hole 1111.
Then, be described in detail the flowmeter 1223 that Fig. 1 represents.
If the internal diameter of capillary 121 is greatly to a certain degree, can change according to the pressure in the pipe arrangement 1222 that attracts mechanism 122 and detect capillary 121 and whether attracted solder ball, but the internal diameter of the more little capillary 121 of solder ball to be also more little, this detection is difficult.Therefore, in the solder ball arrangement device 1 that the Fig. 1 that handles this small solder ball of 0.15mm represents,, detect capillary 121 and whether attracted solder ball according to the changes in flow rate of the air that flows through the pipe arrangement 1222 that attracts mechanism 122.
The curve chart of the changes in flow rate that flows through the air that attracts mechanism's pipe arrangement when Fig. 3 represents with the different 3 kinds of capillaries experiment of internal diameter.
The transverse axis of the curve chart that Fig. 3 represents is represented internal diameter capillaceous (μ m), and the longitudinal axis represents to flow through the flow (ml/min) of the air that attracts mechanism's pipe arrangement.In addition, the result the when part of black circle represents that capillary does not attract solder ball in the curve chart, the result the when part of white circle is represented the capillary attraction solder ball.
The capillary that this experiment is used is respectively the capillary of internal diameter 51 μ m, internal diameter 64 μ m and internal diameter 89 μ m.Know that from the curve chart of Fig. 3 even use any capillary, during the capillary attraction solder ball, relatively, the flow that flows through the air that attracts mechanism's pipe arrangement descends when not attracting.That is, even use the capillary of any internal diameter, when capillary did not attract solder ball, the flow-rate ratio 10ml/min that flows through the air that attracts mechanism's pipe arrangement was more, but when the capillary attraction solder ball, its underfed 10ml/min.Therefore, in the solder ball arrangement device 1 that Fig. 1 represents, when the measured value of the flowmeter 1223 of attraction mechanism 122 is less than 10ml/mi, send signals from flowmeter 1223 to the control part 25 that Fig. 1 represents, control part 25 receives these signals, carries out the step S4 that Fig. 2 represents.
The result of the curve chart of representing from Fig. 3 knows that can detect the internal diameter lower limit capillaceous that has attracted solder ball is about 30 μ m.
Then, be described in detail the host body 111 that Fig. 1 represents and the periphery of this host body 111.
Fig. 4 is the figure of the periphery of the host body 111 of presentation graphs 1 expression and this host body 111.
Fig. 4 has represented such a case, that is, the blow out air upward from the bottom of host body 111 blows afloat the solder ball B that is accommodated by host body 111 upward with this air, and the solder ball B that has blown afloat and arrived supply hole 1111 is attracted by the front end of capillary 121.
Be provided with in the bottom of host body 111 and connected the circular open 1112 that blows afloat mechanism 1122, the compressed air by pipe arrangement 1122 blows out to the inside of host body 111 from this circular open 1112.The diameter of this circular open 1112 is 0.08mm, and the diameter of part pipe arrangement 1122, that be connected with circular open 1112 is 0.16mm.
In Fig. 4, in this both direction of X-direction (the vertical direction of paper of Fig. 4 relatively) and Y direction (left and right directions), the position consistency of the supply hole 1111 of the position of circular open 1112 and host body 111.
Here, the experimental result of examination in the position of the supply hole 1111 of Y direction change host body 111 is described.In the test here, be provided with the solder ball of accommodating a plurality of diameter 0.15mm in the host body of circular open (diameter 0.08mm) in the bottom, blowing out of setting air pressed to 6kPa, carries out the time instrumentation per 10 times with identical condition.
Fig. 5 is the hole site of expression host body and begins to blow afloat there is the time relation of solder ball the back to capillary attraction curve chart.
The transverse axis of the curve chart that Fig. 5 represents represents the position of the supply hole 1111 of host body 111 only is offset how many (units: mm) from the position of circular open 1112 along Y direction, the longitudinal axis represents to begin to blow afloat there is solder ball B the back to capillary 121 attractions time (second) (below, be called service time).Whether the changes in flow rate detection capillary 121 that the air of the pipe arrangement 1222 that attracts mechanism 122 is flow through in utilization has attracted solder ball B (following identical.)。In addition, four jiaos the part that Fig. 5 represents is represented the longest service time among 10 time instrumentations, and the part of triangle is represented the shortest service time among 10 time instrumentations, and the part of circle is represented average service time among 10 time instrumentations.The numeral service time of the next door record of various piece.Know that from the curve chart of Fig. 5 the position of the supply hole 1111 of host body 111 is long more away from the position service time of circular open 1112 more.If service time is long, capturing efficiency descends, and is undesirable.Therefore, in Y direction, preferably the position of the supply hole 1111 of host body 111 as far as possible with the position consistency of opening 1112.
Just the result of experiment of the size of the supply hole 1111 of examination change host body 111 is advanced good explanation.In the experiment here, the bottom is provided with the solder ball of accommodating a plurality of diameter 0.15mm in the host body of circular open (diameter 0.08mm), and setting air blows out presses to 6kPa, carries out the time instrumentation per 10 times with identical condition.
Fig. 6 is the curve chart of the relation of the size of supply hole of expression host body and service time.
The transverse axis of the curve chart that Fig. 6 represents is represented the size (mm) of the supply hole 1111 of host body 111, and the longitudinal axis is represented service time (second).Four jiaos the part that Fig. 6 represents is represented the longest service time among 10 time instrumentations, and the part of triangle is represented the shortest service time among 10 time instrumentations, and the part of circle is represented the average service time of 10 time instrumentations.The numeral service time of various piece next door record.Know that from the curve chart of Fig. 6 when the size of the supply hole 1111 of host body 111 was too big, service time was elongated.Conclusion is, the bottom is provided with the size of supply hole 1111 of the host body 111 of circular open 1112, the diameter of the solder ball of accommodating relatively, the preferably size below 140% more than 120%.
Fig. 7 is illustrated in the figure of appearance that the bottom is provided with the host body inside of round opening.
Fig. 7 represents circular open 1112 blow out air that are provided with from the bottom, the appearance when blowing afloat the air that stops behind the solder ball B from circular open 1112 and blowing out.In Fig. 6, solder ball B is that this circular open 1112 is simultaneously avoided at the center with circular open 1112, and one side is according to perisporium the arranging like that on every side around circular open 1112 along host body 111.If solder ball B arranges as Fig. 7 represents, when then next time was from circular open 1112 blow out air, initial, air did not directly touch solder ball B, and the supply hole 1111 (with reference to Fig. 4) above solder ball B arrives is spended time before, and the elongated tendency of service time is arranged.
Fig. 8 is the figure that the bottom that is illustrated in host body is provided with the example of slit-shaped openings, and Fig. 9 is the structure chart of the bottom of the host body that observed Fig. 8 represents from the top.
In the following description, to the structural elements of the title same names of the structural elements that illustrated in the past, the additional Reference numeral identical with the Reference numeral of using in the past describes.
Here, about being provided with the host body 111 of the slit-shaped openings 1114 that Fig. 8 and Fig. 9 represent, because according to being provided with the identical test of having carried out changing the size of the test of position of supply hole 1111 of host body 111 and the supply hole 1111 that examination changes host body 111 like that respectively of the host body of opening, so those results are described in the Y direction examination with the bottom.In these trials, the test except the shape difference of the opening that is provided with in the bottom of host body and when being provided with the host body of circular open is similarly carried out.For being provided with along the host body 111 of the slit-shaped openings 1114 of X-direction prolongation, even the position of the supply hole 1111 of host body 111 from the position of slit-shaped openings 1114 along the Y direction 2.0mm that staggers, the service time of service time when making both position consistency about Y direction is consistent, is 0.3 second.For the host body 111 that slit-shaped openings 1114 is set, even the size of the supply hole 1111 of host body 111 is changed over 0.226mm, the service time the when size of service time and supply hole 1111 is 0.179mm is consistent, is 0.3 second.But,, confirm that solder ball is attracted by the front end of capillary 121 with the appearance of skew if the size of the supply hole 1111 of host body 111 is 0.226mm.Thereby, even the host body 111 of slit-shaped openings 1114 is set, the size of supply hole 1111, the diameter of the solder ball of accommodating relatively preferably also is the size below 140% more than 120%.
Figure 10 is illustrated in the figure of appearance that the bottom is provided with the host body inside of slit-shaped openings.
This Figure 10 has represented from the bottom to be provided with slit-shaped openings 1114 blow out air, the appearance when blowing afloat the air that stops behind the solder ball B from slit-shaped openings 1114 and blowing out.In Figure 10, as clogging slit-shaped openings 1114, there is solder ball B above the slit-shaped openings 1114 at this, in next time during from slit-shaped openings 1114 blow out air, air directly touches the top solder ball B that is positioned at slit-shaped openings 1114, arrive the supply hole 1111 (with reference to Fig. 4) of top in the solder ball B short time, improve capturing efficiency.
As described above, be assemblied in the solder ball trap setting 10 of the solder ball arrangement device 1 of present embodiment, simple structure does not spend cost of equipment so, can reliably catch a solder ball from a plurality of solder ball of same size.
Here, use the example of diameter 0.15mm solder ball as object described, but the invention is not restricted to solder ball, can also not limit the size of ball especially ball miscellaneous as object.But the more little effect of the present invention of ball is remarkable more.
Claims (22)
1. ball capturing device is characterized in that having:
Host body, it is provided with porose on the top of accommodating wall, and wherein this accommodates the space that wall has sealed a plurality of balls of accommodating same size, and the size of this ball of this boring ratio is big and littler than the size of two these balls;
Blow afloat device, it blows afloat the ball of being accommodated by above-mentioned host body upward;
Trap setting, it is caught by above-mentioned and blows afloat the ball that device blew afloat and arrived above-mentioned hole.
2. as the ball capturing device of claim 1 record, it is characterized in that,
The above-mentioned device that blows afloat blows out fluid from slit-shaped openings in above-mentioned host body.
3. as the ball capturing device of claim 1 record, it is characterized in that,
The above-mentioned device that blows afloat blows out fluid in above-mentioned host body, and has the mobile stream of this fluid and be released to the outside pressure device that removes in the setting midway of this stream and with a part of pressure in this stream.
4. as the ball capturing device of claim 1 record, it is characterized in that,
Above-mentioned trap setting is by attracting to catch the ball that arrives above-mentioned hole.
5. as the ball capturing device of claim 4 record, it is characterized in that,
Above-mentioned trap setting has the stream of the air flows that is attracted and measures the flowmeter of the air mass flow that flows through this stream,
This ball capturing device has test section, and this test section detects the situation that above-mentioned trap setting captures ball according to the variation of the flow of being measured by above-mentioned flowmeter.
6. solder ball arrangement device, the precalculated position configuration on printed circuit board (PCB) contains the solder ball of scolding tin, it is characterized in that having:
Host body, it is provided with porose on the top of accommodating wall, and wherein this accommodates the space that wall has sealed a plurality of above-mentioned solder ball of accommodating same size, and the size of this solder ball of this boring ratio is big and littler than the size of two these solder ball;
Blow afloat device, it blows afloat the solder ball of being accommodated by above-mentioned host body upward;
Trap setting, it is caught by above-mentioned and blows afloat the solder ball that device blew afloat and arrived above-mentioned hole;
Collocation mechanism, it makes the position of the solder ball of being caught by above-mentioned trap setting and the above-mentioned precalculated position contraposition on the printed circuit board (PCB), disposes this solder ball in this precalculated position.
7. as the solder ball arrangement device of claim 6 record, it is characterized in that,
The above-mentioned device that blows afloat blows out fluid from slit-shaped openings in above-mentioned host body.
8. as the solder ball arrangement device of claim 6 record, it is characterized in that,
The above-mentioned device that blows afloat blows out fluid in above-mentioned host body, and has the mobile stream of this fluid and be released to the outside pressure device that removes in the setting midway of this stream and with a part of pressure in this stream.
9. as the solder ball arrangement device of claim 6 record, it is characterized in that,
Above-mentioned trap setting is by attracting to catch the solder ball that arrives above-mentioned hole.
10. as the solder ball arrangement device of claim 9 record, it is characterized in that,
Above-mentioned trap setting have attraction air flows stream and measure the flowmeter of the flow of the air flow through this stream,
This solder ball arrangement device has test section, and this test section detects the situation that above-mentioned trap setting captures above-mentioned solder ball according to the variation of the flow of being measured by above-mentioned flowmeter.
11. a ball capturing method is characterized in that comprising:
The contraposition step, make the hole and the trap setting contraposition that are provided with on the top of accommodating wall, wherein, this accommodates the space that wall has sealed a plurality of balls of accommodating same size, the size of this ball of this boring ratio is big and littler than the size of two these balls, and this trap setting is used to catch this ball;
Catch step, blow afloat the ball that is housed in the above-mentioned space upward, and catch the ball that is blown afloat and arrive above-mentioned hole by above-mentioned trap setting;
Stop step, stop above-mentioned ball blowing afloat upward.
12. the ball capturing method as claim 11 record is characterized in that,
During stopping that above-mentioned ball blows afloat upward, attract the ball of in above-mentioned space, accommodating downwards.
13. the ball capturing method as claim 11 record is characterized in that,
Above-mentioned seizure step is by blowing out fluid from slit-shaped openings in above-mentioned space, thereby blows afloat the step of the ball of being accommodated in this space upward.
14. a ball capturing method is characterized in that comprising:
The contraposition step, make the hole and the trap setting contraposition that are provided with on the top of accommodating wall, wherein, this accommodates the space that wall has sealed a plurality of balls of accommodating same size, the size of this ball of this boring ratio is big and littler than the size of two these balls, and this trap setting is caught this ball by attraction;
Attract the beginning step, begin to carry out with the contraposition of above-mentioned hole after the attraction action of above-mentioned trap setting;
Catch step, blow afloat the ball that is housed in the above-mentioned space upward, attract to be blown afloat and arrive the ball in above-mentioned hole by above-mentioned trap setting, and catch this ball;
Stop step, stop above-mentioned ball blowing afloat upward.
15. the ball capturing method as claim 14 record is characterized in that,
The above-mentioned step that stops is when stopping above-mentioned ball and blowing afloat upward, the step that ball is attracted downwards with the attraction more weak than the attraction of above-mentioned trap setting.
16. the ball capturing method as claim 14 record is characterized in that,
The above-mentioned step that stops is to receive that the air mass flow in the stream of the air flows that above-mentioned trap setting attracts is less than the information of predetermined flow, and stops the step that above-mentioned ball blows afloat upward.
17. a solder ball arranging method, the precalculated position configuration on printed circuit board (PCB) contains the solder ball of scolding tin, it is characterized in that comprising:
The contraposition step, make the hole and the trap setting contraposition that are provided with on the top of accommodating wall, wherein, this accommodates the space that wall has sealed a plurality of above-mentioned solder ball of accommodating same size, the size of this solder ball of this boring ratio is big and littler than the size of two these solder ball, and this trap setting is used to catch this solder ball;
Catch step, blow afloat the solder ball that is housed in the above-mentioned space upward, and catch the solder ball that is blown afloat and arrive above-mentioned hole by above-mentioned trap setting;
Stop step, stop above-mentioned solder ball blowing afloat upward;
Configuration step, the solder ball that the above-mentioned precalculated position configuration on printed circuit board (PCB) is caught by above-mentioned trap setting.
18. the solder ball arranging method as claim 17 record is characterized in that,
During stopping that above-mentioned ball blows afloat upward, the ball of being accommodated in the above-mentioned space is attracted downwards.
19. the solder ball arranging method as claim 17 record is characterized in that,
Above-mentioned seizure step is by blowing out fluid from slit-shaped openings in above-mentioned space, thereby blows afloat the step of the solder ball of being accommodated in this space upward.
20. a solder ball arranging method, the precalculated position configuration on printed circuit board (PCB) contains the solder ball of scolding tin, it is characterized in that comprising:
The contraposition step, make the hole and the trap setting contraposition that are provided with on the top of accommodating wall, wherein, this accommodates the space that wall has sealed a plurality of above-mentioned solder ball of accommodating same size, the size of this solder ball of this boring ratio is big and littler than the size of two these solder ball, and this trap setting is caught this solder ball by attraction;
Attract the beginning step, begin to carry out with the contraposition of above-mentioned hole after the attraction action of above-mentioned trap setting;
Catch step, blow afloat the solder ball that is housed in the above-mentioned space upward, attract to be blown afloat and arrive the ball in above-mentioned hole by above-mentioned trap setting, and catch this ball;
Stop step, stop above-mentioned solder ball blowing afloat upward;
Configuration step after the contraposition in the position of the solder ball of having carried out being caught by above-mentioned trap setting and the above-mentioned precalculated position on the printed circuit board (PCB), stops the attraction action of this trap setting, to this precalculated position configuration solder ball that device catches that is captured.
21. the solder ball arranging method as claim 20 record is characterized in that,
The above-mentioned step that stops is when stopping above-mentioned solder ball and blowing afloat upward, the step that ball is attracted downwards with the attraction more weak than the attraction of above-mentioned trap setting;
Above-mentioned configuration step is to implement the above-mentioned step implemented after the step of stopping.
22. the ball capturing method as claim 20 record is characterized in that,
The above-mentioned step that stops is that the flow of receiving the air in the stream of the air flows that above-mentioned trap setting attracts is less than the information of predetermined flow, and stops the step that above-mentioned solder ball blows afloat upward.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2005/006099 WO2006103766A1 (en) | 2005-03-30 | 2005-03-30 | Ball capturing device, solder ball arrangement device, ball capturing method, and solder ball arranging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101151947A true CN101151947A (en) | 2008-03-26 |
| CN101151947B CN101151947B (en) | 2010-05-12 |
Family
ID=37053040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200580049258.XA Expired - Fee Related CN101151947B (en) | 2005-03-30 | 2005-03-30 | Ball capturing method and solder ball arrangement method |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7717317B2 (en) |
| JP (1) | JP4576424B2 (en) |
| CN (1) | CN101151947B (en) |
| WO (1) | WO2006103766A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101982281A (en) * | 2010-10-19 | 2011-03-02 | 哈尔滨工业大学 | Tin ball feeding device of ball planting bonding machine |
| CN110313632A (en) * | 2019-06-26 | 2019-10-11 | 苏州英派克自动化设备有限公司 | A kind of filter stick for cigarettes flavoring pearl device and flavoring pearl method |
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| US10730128B2 (en) | 2016-01-20 | 2020-08-04 | Western Digital Technologies, Inc. | Reliable transportation mechanism for micro solder balls |
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| CN101982281A (en) * | 2010-10-19 | 2011-03-02 | 哈尔滨工业大学 | Tin ball feeding device of ball planting bonding machine |
| CN101982281B (en) * | 2010-10-19 | 2012-05-30 | 哈尔滨工业大学 | Tin ball feeding device of ball planting bonding machine |
| CN110313632A (en) * | 2019-06-26 | 2019-10-11 | 苏州英派克自动化设备有限公司 | A kind of filter stick for cigarettes flavoring pearl device and flavoring pearl method |
| CN110313632B (en) * | 2019-06-26 | 2024-04-02 | 苏州英派克自动化设备有限公司 | Cigarette filter stick flavoring bead device and flavoring bead method |
Also Published As
| Publication number | Publication date |
|---|---|
| US7717317B2 (en) | 2010-05-18 |
| WO2006103766A1 (en) | 2006-10-05 |
| US20080020561A1 (en) | 2008-01-24 |
| JP4576424B2 (en) | 2010-11-10 |
| CN101151947B (en) | 2010-05-12 |
| JPWO2006103766A1 (en) | 2008-09-04 |
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