CN101148571A - Fire resistant epoxy conducting adhesive and preparation method thereof - Google Patents
Fire resistant epoxy conducting adhesive and preparation method thereof Download PDFInfo
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- CN101148571A CN101148571A CNA2007100472746A CN200710047274A CN101148571A CN 101148571 A CN101148571 A CN 101148571A CN A2007100472746 A CNA2007100472746 A CN A2007100472746A CN 200710047274 A CN200710047274 A CN 200710047274A CN 101148571 A CN101148571 A CN 101148571A
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- fire resistant
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- conducting adhesive
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- resistant epoxy
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Abstract
The present invention relates to one kind of heat resistant conducting epoxy adhesive and its preparation process. The adhesive consists of hydrogenated bisphenol A1 5-17 wt%, epoxy resin TGDDM 8-9.5 wt%, curing agent 1.5-2.5 wt%, promoter 1-2 wt%, silver powder 27-30 wt% and silver clad copper powder 41-44 wt%, and is prepared through well mixing said components. The present invention has conducting particle mixed into heat resistant resin base, and the conducting adhesive has high heat resistance, low cost and high application value in electronic industry.
Description
Technical field
The invention belongs to adhesive area, particularly relate to fire resistant epoxy conducting adhesive and preparation method thereof.
Background technology
The conductivity type tackiness agent is called for short conductive resin, is a kind ofly can glued joint various materials effectively, has the tackiness agent of conductivity again.Conductive resin can be divided into structure-type and filled-type two big classes by its composition.Structure-type is meant the conductive resin that promptly has electroconductibility as the macromolecular material of conductive resin matrix itself; Filled-type is meant common tackiness agent as matrix, and relies on the interpolation electroconductive stuffing to make glue have the conductive resin of electric action.The present widely used filled conductive glue that is.The electroconductive stuffing that adds in filled conductive glue is metal-powder usually, and what generally use is the silver powder filled conductive glue.
Along with development of high-tech, the thermotolerance of conductive resin is required more and more highlyer (long-time heat-resistingly to reach 200 ℃, instantaneous heat-resisting 250 ℃), fields such as especially space flight, aviation, military project, electronics, electric power, automobile, machinery, more urgent to the demand of high-temperature resistant conducting glue.Therefore, develop a kind of good heat resistance, epoxy conducting adhesive that electric conductivity is high is very necessary, according to data-searching and market study, yet there are no the relevant report that relevant conducting particles is the epoxy conducting adhesive of stuff and other stuff, good heat resistance.
Summary of the invention
The object of the present invention is to provide a kind of fire resistant epoxy conducting adhesive and preparation method thereof, the thermotolerance of this electro-conductive adhesive is higher, and cost is low, and the development of electron trade is had very high practical value.
Fire resistant epoxy conducting adhesive of the present invention, the weight percent of its prescription is: Hydrogenated Bisphenol A 15%～17%, Resins, epoxy TGDDM (N, N, N ', N '-four glycidyl group-4,4 '-diaminodiphenylmethane) 8%～9.5%, solidifying agent 1.5%～2.5%, promotor 1%～2%, silver powder 27%～30%, silver-coated copper powder, 41%～44%.
Described TGDDM is the N that Shanghai EMST Electron Material Co., Ltd produces, N, N ', N '-four glycidyl group-4,4 '-diaminodiphenylmethane;
Described solidifying agent is the latent curing agent that Shanghai EMST Electron Material Co., Ltd produces;
Described promotor is homemade 144BAPB (Chinese patent, application number are 200710041410.0).
Fire resistant epoxy conducting adhesive preparation method of the present invention takes by weighing composition according to the fire resistant epoxy conducting adhesive prescription, and thorough mixing gets final product.
Beneficial effect:
Fire resistant epoxy electrically conducting adhesive of the present invention has added the hybrid conductive particle in the resin matrix of good heat resistance, improved the thermotolerance of conductive resin effectively, and has reduced cost.
Embodiment
Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiment only to be used to the present invention is described and be not used in and limit the scope of the invention.Should be understood that in addition those skilled in the art can make various changes or modifications the present invention after the content of having read the present invention's instruction, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
TGDDM is the N that Shanghai EMST Electron Material Co., Ltd produces in the present embodiment, N, N ', N '-four glycidyl group-4,4 '-diaminodiphenylmethane, solidifying agent is the latent curing agent that Shanghai EMST Electron Material Co., Ltd produces, and promotor is homemade 144BAPB (Chinese patent, application number are 200710041410.0); E-51 is a bisphenol A type epoxy resin, and oxirane value is 0.51.
Embodiment 1
The weight percent of fire resistant epoxy conducting adhesive prescription is:
Hydrogenated Bisphenol A: 16%
TGDDM： 9％
Solidifying agent: 2.2%
Promotor: 1.4%
Silver powder: 29%
Silver-coated copper powder: 43%
With the mentioned component thorough mixing, its result of use can reach purpose of the present invention, and performance data is as shown in table 1.
The comparative example 1
Hydrogenated Bisphenol A: 16%
E-51： 9％
Solidifying agent: 2.2%
Promotor: 1.4%
Silver powder: 29%
Silver-coated copper powder: 43%
With the mentioned component thorough mixing, its performance data is as shown in table 1.
Table 1 embodiment 1 tests with comparative example 1 conductive adhesive performance
| Conductive resin | Volume specific resistance Ω .cm | 150 ℃/100h of volume specific resistance Ω .cm | 220 ℃/24h of volume specific resistance Ω .cm |
| Embodiment 1 | 1.5×10 -3 | 1.4×10 -3 | 1.5×10 -3 |
| The comparative example 1 | 3.9×10 -3 | 7.5×10 -3 | Non-conductive |
By the table in as can be seen, changed the TGDDM resin system of good heat resistance after, the thermotolerance of its conductive resin is significantly improved.
Embodiment 2
Hydrogenated Bisphenol A: 17%
TGDDM： 8％
Solidifying agent: 2.2%
Promotor: 1.4%
Silver powder: 30%
Silver-coated copper powder: 42%
With the mentioned component thorough mixing.Its result of use can reach purpose of the present invention.
Embodiment 3
Hydrogenated Bisphenol A: 16%
TGDDM： 9％
Solidifying agent: 2.4%
Promotor: 1.2%
Silver powder: 31%
Silver-coated copper powder: 41%
With the mentioned component thorough mixing.Its result of use can reach purpose of the present invention.
Embodiment 4
Hydrogenated Bisphenol A: 17%
TGDDM： 8％
Solidifying agent: 2.4%
Promotor: 1.2%
Silver powder: 30%
Silver-coated copper powder: 42%
With the mentioned component thorough mixing.Its result of use can reach purpose of the present invention.
Embodiment 5
Hydrogenated Bisphenol A: 16%
TGDDM： 9％
Solidifying agent: 2%
Promotor: 1%
Silver powder: 29%
Silver-coated copper powder: 43%
With the mentioned component thorough mixing.Its result of use can reach purpose of the present invention.
Embodiment 6
Hydrogenated Bisphenol A: 18%
TGDDM： 8％
Solidifying agent: 2%
Promotor: 1%
Silver powder: 30%
Silver-coated copper powder: 42%
With the mentioned component thorough mixing.Its result of use can reach purpose of the present invention.
Experiment showed, that Hydrogenated Bisphenol A is lower than 16%, TGDDM is lower than 8%, and hybrid conductive particle and content are lower than 70%, and solidifying agent is lower than 2%, and promotor is lower than 1%, and the thermotolerance of its electro-conductive adhesive is bad, and electric conductivity is not high.And Hydrogenated Bisphenol A is higher than 16%, and TGDDM is higher than 8%, and the hybrid conductive particle content is higher than 72%, and solidifying agent is higher than 2%, and promotor is higher than 1%, though reduced the room temperature storage phase of conductive resin, has improved the thermotolerance and the electric conductivity of electro-conductive adhesive.Therefore, so long as in formula range class of the present invention, the effect that obtains is satisfactory.
Claims (2)
1. fire resistant epoxy conducting adhesive, it is characterized in that: the weight percent of this adhesive formulation is: Hydrogenated Bisphenol A 15%～17%, Resins, epoxy N, N, N ', N '-four glycidyl group-4,4 '-diaminodiphenylmethane TGDDM 8%～9.5%, solidifying agent 1.5%～2.5%, promotor 1%～2%, silver powder 27%～30%, silver-coated copper powder, 41%～44%.
2. the fire resistant epoxy conducting adhesive preparation method takes by weighing composition according to the fire resistant epoxy conducting adhesive prescription, and thorough mixing gets final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100472746A CN101148571B (en) | 2007-10-19 | 2007-10-19 | Fire resistant epoxy conducting adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100472746A CN101148571B (en) | 2007-10-19 | 2007-10-19 | Fire resistant epoxy conducting adhesive and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN101148571A true CN101148571A (en) | 2008-03-26 |
| CN101148571B CN101148571B (en) | 2010-10-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2007100472746A Expired - Fee Related CN101148571B (en) | 2007-10-19 | 2007-10-19 | Fire resistant epoxy conducting adhesive and preparation method thereof |
Country Status (1)
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101717613A (en) * | 2009-12-07 | 2010-06-02 | 东华大学 | High-temperature resistant copper foil glue and preparation and application thereof |
| CN101887767A (en) * | 2010-06-11 | 2010-11-17 | 山东大学 | Method for preparing conductive paste by taking copper powder with surface coverage silver nanostructures as packing |
| CN101928540A (en) * | 2009-10-16 | 2010-12-29 | 北京工业大学 | Epoxy conductive adhesive and preparation method thereof |
| CN101503608B (en) * | 2008-11-21 | 2012-05-09 | 东华大学 | Phenolic epoxy resin system conductive adhesive and preparation thereof |
| CN101544879B (en) * | 2009-04-30 | 2012-06-13 | 东华大学 | Preparation method for high strength solventless epoxy adhesive |
| CN102810344A (en) * | 2012-08-03 | 2012-12-05 | 江苏欧耐尔新型材料有限公司 | Silver-plated copper containing paste for solar cell back electrode and method for preparing silver-plated copper containing paste |
| CN101649174B (en) * | 2009-07-10 | 2012-12-12 | 东华大学 | Preparation method of high temperature resistant single-component solventless epoxy adhesive |
| CN103013414A (en) * | 2012-12-20 | 2013-04-03 | 东华大学 | Alpha-cyanogroup-beta-ethyl ethoxyacrylate modified epoxy resin adhesive and preparation method thereof |
| CN103059767A (en) * | 2013-01-15 | 2013-04-24 | 宁波晶鑫电子材料有限公司 | Conductive silver paste with high-temperature resistance and low sheet resistance and preparation method of conductive silver paste |
| CN104017511A (en) * | 2014-06-20 | 2014-09-03 | 莱芜金鼎电子材料有限公司 | Preparation method of epoxy resin conductive adhesive film and conductive adhesive layer of epoxy resin conductive adhesive film |
| WO2016172911A1 (en) * | 2015-04-30 | 2016-11-03 | Henkel Ag & Co. Kgaa | A one-part curable adhesive compositionand the use thereof |
| CN107987747A (en) * | 2017-12-22 | 2018-05-04 | 有研粉末新材料（北京）有限公司 | A kind of preparation method of nanometer of silver-coated copper powder collaboration flake silver powder conducting resinl |
| CN111918946A (en) * | 2018-03-30 | 2020-11-10 | 田中贵金属工业株式会社 | Conductive adhesive composition |
Family Cites Families (4)
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| US5891367A (en) * | 1998-02-23 | 1999-04-06 | General Motors Corporation | Conductive epoxy adhesive |
| CN1260317C (en) * | 2004-03-11 | 2006-06-21 | 刘萍 | Preparation precess of anisotropic conductive coating |
| CN1247729C (en) * | 2004-11-11 | 2006-03-29 | 宁波晶鑫电子材料有限公司 | Monocomponent room-temperature cured flexible and elastic epoxy conductive silver adhesive |
| CN100465206C (en) * | 2006-07-06 | 2009-03-04 | 东华大学 | Process for preparing glycidic amine type polyfunctional epoxy resin |
-
2007
- 2007-10-19 CN CN2007100472746A patent/CN101148571B/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101503608B (en) * | 2008-11-21 | 2012-05-09 | 东华大学 | Phenolic epoxy resin system conductive adhesive and preparation thereof |
| CN101544879B (en) * | 2009-04-30 | 2012-06-13 | 东华大学 | Preparation method for high strength solventless epoxy adhesive |
| CN101649174B (en) * | 2009-07-10 | 2012-12-12 | 东华大学 | Preparation method of high temperature resistant single-component solventless epoxy adhesive |
| CN101928540B (en) * | 2009-10-16 | 2013-07-10 | 北京工业大学 | Epoxy conductive adhesive and preparation method thereof |
| CN101928540A (en) * | 2009-10-16 | 2010-12-29 | 北京工业大学 | Epoxy conductive adhesive and preparation method thereof |
| CN101717613A (en) * | 2009-12-07 | 2010-06-02 | 东华大学 | High-temperature resistant copper foil glue and preparation and application thereof |
| CN101717613B (en) * | 2009-12-07 | 2014-04-02 | 东华大学 | High-temperature resistant copper foil glue and preparation and application thereof |
| CN101887767A (en) * | 2010-06-11 | 2010-11-17 | 山东大学 | Method for preparing conductive paste by taking copper powder with surface coverage silver nanostructures as packing |
| CN101887767B (en) * | 2010-06-11 | 2011-08-17 | 山东大学 | Method for preparing conductive paste by taking copper powder with surface coverage silver nanostructures as packing |
| CN102810344A (en) * | 2012-08-03 | 2012-12-05 | 江苏欧耐尔新型材料有限公司 | Silver-plated copper containing paste for solar cell back electrode and method for preparing silver-plated copper containing paste |
| CN102810344B (en) * | 2012-08-03 | 2014-12-31 | 江苏欧耐尔新型材料有限公司 | Silver-plated copper containing paste for solar cell back electrode and method for preparing silver-plated copper containing paste |
| CN103013414A (en) * | 2012-12-20 | 2013-04-03 | 东华大学 | Alpha-cyanogroup-beta-ethyl ethoxyacrylate modified epoxy resin adhesive and preparation method thereof |
| CN103059767B (en) * | 2013-01-15 | 2015-06-17 | 宁波晶鑫电子材料有限公司 | Conductive silver paste with high-temperature resistance and low sheet resistance and preparation method of conductive silver paste |
| CN103059767A (en) * | 2013-01-15 | 2013-04-24 | 宁波晶鑫电子材料有限公司 | Conductive silver paste with high-temperature resistance and low sheet resistance and preparation method of conductive silver paste |
| CN104017511A (en) * | 2014-06-20 | 2014-09-03 | 莱芜金鼎电子材料有限公司 | Preparation method of epoxy resin conductive adhesive film and conductive adhesive layer of epoxy resin conductive adhesive film |
| WO2016172911A1 (en) * | 2015-04-30 | 2016-11-03 | Henkel Ag & Co. Kgaa | A one-part curable adhesive compositionand the use thereof |
| US10280346B2 (en) | 2015-04-30 | 2019-05-07 | Henkel Ag & Co. Kgaa | One-part curable adhesive composition and the use thereof |
| CN107987747A (en) * | 2017-12-22 | 2018-05-04 | 有研粉末新材料（北京）有限公司 | A kind of preparation method of nanometer of silver-coated copper powder collaboration flake silver powder conducting resinl |
| CN111918946A (en) * | 2018-03-30 | 2020-11-10 | 田中贵金属工业株式会社 | Conductive adhesive composition |
| CN111918946B (en) * | 2018-03-30 | 2021-12-14 | 田中贵金属工业株式会社 | Conductive adhesive composition |
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| CN101148571B (en) | 2010-10-06 |
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