CN101141852A - Flexible printed circuit board surface sticked fixation method - Google Patents
Flexible printed circuit board surface sticked fixation method Download PDFInfo
- Publication number
- CN101141852A CN101141852A CNA2006100624848A CN200610062484A CN101141852A CN 101141852 A CN101141852 A CN 101141852A CN A2006100624848 A CNA2006100624848 A CN A2006100624848A CN 200610062484 A CN200610062484 A CN 200610062484A CN 101141852 A CN101141852 A CN 101141852A
- Authority
- CN
- China
- Prior art keywords
- supporting plate
- circuit board
- fpc
- flexible printed
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention discloses a fixation method for the surface placement of a flexible printed wiring board, the flexible printed wiring board is fixed and adsorbed through a vacuum, the procedure is as follows in sequence: (1) a FPC is horizontally arranged in the accurate location of a bearing plate; (2) a vacuum adsorption part integrated with the bearing plate as a whole is started up, the FPC vacuum adsorption is fixed and positioned in the accurate location of the bearing plate; (3) the bearing plate is arranged on a transmission guide rail, the beating plate is clamped with a opposite direction clamp device of the transmission guide rail; (4) the beating plate is respectively fed in a printer, a placement machine and a welding furnace to coat the soldering paste and the skim sheet in sequence and to weld. The flexible printing circuit board fixed with a glue can not be used in the present invention, the flexible printing circuit board can not be polluted, and can not occur the distortion, furthermore, an error caused by the high temperature deformation is inexistent, the bad rate of the flexible printing circuit board during the surface placement and production can be obviously decreased. In addition, due to not using an adhesive tape, the production cost of the surface placement can be lowered, the procedure of the erosive and residual glue is inexistent, the surface pasting efficiency can be improved, and the batch production is applicable.
Description
Technical field
The present invention relates to the manufacturing of printed substrate, especially relate to a kind of flexible printed circuit board surface sticked fixing means.
Background technology
Surface mounting technology (Surface Mounting Technology the is called for short SMT) process of flexible print circuit board (Flexible Printed Circuit board is called for short FPC) mainly comprises three basic links: coating soldering paste, paster and welding.Accurately whether the FPC fixed-site has directly determined surface-pasted quality in these links.Yet softness of FPC own and mechanical strength are not high, cause its position difficult with fixing.Having now utilizes double faced adhesive tape FPC to be fixed on the method for supporting plate, only be applicable to manual welding or only mount the situation of simple and easy part, and utilize high tempreture tape that FPC is fixed on supporting plate, and the method that FPC is fixed on the supporting plate of silica gel, when the viscosity of glue is too low, fixedly FPC owes firmly, easily causes the FPC dislocation; And when the viscosity of glue is too high, FPC and supporting plate are peeled off by being difficult to again behind the soldering furnace, it is contaminated that residual jelly on the FPC is stained with dust easily, and its height with supporting plate not exclusively on same plane, influence the accuracy of patch location, the capital increases the defective products rate of FPC, in addition, after above-mentioned several fixing means is put at FPC and is entered into the appropriate location on the transmission guide rail that is coated with the cream printing machine, two transmission guide rails clamping FPC in opposite directions can cause the distortion of FPC plate mid portion slight convex, this chucking power easily makes the FPC fracture, also causes the whole coated face injustice that needs of FPC, influences the quality of soldering paste coating.And on the paster platform, all do not have supporter owing to the FPC central bottom, and being vacant state, especially thin and FPC easy fracture can not guarantee fully that its plate face is not crooked, also can influence the accuracy of patch location.
Summary of the invention
Technical problem to be solved by this invention is the defective that overcomes prior art, proposes a kind ofly to fix and FPC does not pollute, indeformable flexible printed circuit board surface sticked fixing means without jelly.
Technical problem of the present invention is solved by following technical scheme:
The characteristics of this flexible printed circuit board surface sticked fixing means are by vacuum suction fixing flexible printed substrate, and following steps are arranged successively:
(1) FPC is lain in the accurate position of supporting plate;
(2) start vacuum adsorption part with the supporting plate one, the accurate position of supporting plate is fixed and be positioned to the FPC vacuum suction, make not have the gap between FPC and the supporting plate;
(3) supporting plate is placed on the transmission guide rail, clamps supporting plate by the clamping device in opposite directions that transmits guide rail; The power that transmits guide rail only acts on the supporting plate, and the clamping force of clamping device is not in opposite directions born on the FPC both sides;
(4) send supporting plate to printing machine, chip mounter and soldering furnace respectively and be coated with soldering paste, paster and welding successively.
Technical problem of the present invention is solved by following further technical scheme:
Described and the vacuum adsorption part supporting plate one is to connect as one by securing member.
Described and the vacuum adsorption part supporting plate one is to be fabricated to one by moulding.
The beneficial effect that the present invention is compared with the prior art is:
The inventive method is without jelly fixing flexible printed substrate, and flexible print circuit board can not pollute, can not be out of shape yet, and the error that does not exist high temperature deformation to cause, can significantly reduce the defective products rate of flexible print circuit board when surface mount is produced.In addition,, there is not the operation of peeling off residual jelly, can improves surface mount efficient, be fit to produce in enormous quantities owing to, can reduce the surface mount production cost without adhesive tape.
Description of drawings
Below in conjunction with embodiment and contrast accompanying drawing the present invention is further described.
Accompanying drawing is the structural representation that the embodiment of the inventive method adopts device.
Embodiment
The surface-pasted vacuum suction fixing means of a kind of FPC by vacuum suction fixing flexible printed substrate, has following steps successively:
(1) FPC1 is lain in the accurate position of supporting plate 2;
(2) start vacuum adsorption part 3 with supporting plate 2 one, the accurate position of supporting plate 2 is fixed and be positioned to the FPC1 vacuum suction, make between FPC1 and the supporting plate 2 not have the gap;
(3) supporting plate 2 is placed on the transmission guide rail 4, clamps supporting plates 2 by the clamping device in opposite directions 2 that transmits guide rail 4; The power that transmits guide rail 4 only acts on the supporting plate 2, and the clamping force of clamping device 2 is not in opposite directions born on the FPC1 both sides;
(4) send supporting plate 2 to printing machine, chip mounter and soldering furnace respectively and be coated with soldering paste, paster and welding successively.
Described coating soldering paste is to send FPC to printing machine coating soldering paste, since not yielding with the supporting plate of vacuum adsorption part one, the FPC distortion just can not influenced, can avoid because of the uneven problem that influences the solder(ing) paste coating quality of FPC plate face.
Described paster is to send the FPC after the coating soldering paste to chip mounter to carry out paster, because FPC only can be subjected to the absorption affinity of vacuum adsorption part, and be attached to fully on the supporting plate with the vacuum adsorption part one, can be not unsettled and cause distortion, can avoid being subjected to the clamping force in opposite directions of clamping device in opposite directions or not having supporter to influence patch location problem accurately because of FPC.
Described welding is to send the FPC after the paster to soldering furnace to carry out Reflow Soldering, owing to adopt vacuum suction to replace fixedly FPC of adhesive tape, can avoid producing the planarization of adhesive tape deformation effect FPC and the welding error that causes by high temperature, and, there is not the operation of peeling off residual jelly after the Reflow Soldering, can improve surface mount efficient, be fit to produce in enormous quantities.
This embodiment is used for the defective products rate of flexible printed circuit board surface sticked production in tens PPM.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to the scope of patent protection that the present invention is determined by claims of being submitted to.
Claims (3)
1. flexible printed circuit board surface sticked fixing means is characterized in that:
By vacuum suction fixing flexible printed substrate, following steps are arranged successively:
(1) FPC is lain in the accurate position of supporting plate;
(2) start vacuum adsorption part with the supporting plate one, the FPC vacuum suction is fixed and is positioned at the accurate position of supporting plate;
(3) supporting plate is placed on the transmission guide rail, clamps supporting plate by the clamping device in opposite directions that transmits guide rail;
(4) send supporting plate to printing machine, chip mounter and soldering furnace respectively and be coated with soldering paste, paster and welding successively.
2. according to the described flexible printed circuit board surface sticked fixing means of claim 1, it is characterized in that:
Described and the vacuum adsorption part supporting plate one is to connect as one by securing member.
3. according to the described flexible printed circuit board surface sticked fixing means of claim 1, it is characterized in that:
Described and the vacuum adsorption part supporting plate one is to be fabricated to one by moulding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100624848A CN101141852A (en) | 2006-09-06 | 2006-09-06 | Flexible printed circuit board surface sticked fixation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100624848A CN101141852A (en) | 2006-09-06 | 2006-09-06 | Flexible printed circuit board surface sticked fixation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101141852A true CN101141852A (en) | 2008-03-12 |
Family
ID=39193511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100624848A Pending CN101141852A (en) | 2006-09-06 | 2006-09-06 | Flexible printed circuit board surface sticked fixation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101141852A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102469688A (en) * | 2010-11-10 | 2012-05-23 | 嘉联益科技股份有限公司 | Bonding device for production equipment for flexible circuit boards and manufacturing method thereof |
| CN103945649A (en) * | 2014-04-25 | 2014-07-23 | 机科发展科技股份有限公司 | Film automatic pasting device used for flexible printed circuit board |
| CN104853540A (en) * | 2015-04-14 | 2015-08-19 | 中山市智牛电子有限公司 | SMT chip packaging process |
| CN112053819A (en) * | 2020-09-02 | 2020-12-08 | 杭州瞳阳科技有限公司 | Production line based on paster electronic components |
| CN112087943A (en) * | 2019-06-15 | 2020-12-15 | 王定锋 | Production method of long-board-mounted component |
| CN112736180A (en) * | 2020-11-20 | 2021-04-30 | 深圳市山本光电股份有限公司 | LED surface mounting technology |
-
2006
- 2006-09-06 CN CNA2006100624848A patent/CN101141852A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102469688A (en) * | 2010-11-10 | 2012-05-23 | 嘉联益科技股份有限公司 | Bonding device for production equipment for flexible circuit boards and manufacturing method thereof |
| CN102469688B (en) * | 2010-11-10 | 2013-09-25 | 嘉联益科技股份有限公司 | Bonding device for production equipment for flexible circuit boards and manufacturing method thereof |
| CN103945649A (en) * | 2014-04-25 | 2014-07-23 | 机科发展科技股份有限公司 | Film automatic pasting device used for flexible printed circuit board |
| CN103945649B (en) * | 2014-04-25 | 2018-02-02 | 机科发展科技股份有限公司 | A kind of film for flexible PCB sticks equipment automatically |
| CN104853540A (en) * | 2015-04-14 | 2015-08-19 | 中山市智牛电子有限公司 | SMT chip packaging process |
| CN112087943A (en) * | 2019-06-15 | 2020-12-15 | 王定锋 | Production method of long-board-mounted component |
| CN112053819A (en) * | 2020-09-02 | 2020-12-08 | 杭州瞳阳科技有限公司 | Production line based on paster electronic components |
| CN112736180A (en) * | 2020-11-20 | 2021-04-30 | 深圳市山本光电股份有限公司 | LED surface mounting technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101028479B1 (en) | Member for circuit board, method for manufacturing circuit board, apparatus for manufacturing circuit board | |
| CN101141852A (en) | Flexible printed circuit board surface sticked fixation method | |
| KR100910188B1 (en) | Circuit board, circuit board-use member and production method therefor and method of laminating flexible film | |
| WO2007103836B1 (en) | Fiber-coupled optical device mounted on a circuit board | |
| KR20050030622A (en) | Transfer carrier for flexible printed circuit board and electronic parts mounting method to flexible printed circuit board | |
| KR100839219B1 (en) | Reinforcement film cep method and machine for fpcb | |
| KR101209502B1 (en) | Assembling apparatus of flat panel display module | |
| JP2517040B2 (en) | Conveying method of printed wiring board | |
| JP3142934U (en) | Circuit board reflow jig | |
| US20080087178A1 (en) | Apparatus for supporting a printed circuit board substrate and method of forming printed circuit board using the same | |
| US7517419B2 (en) | Substrate support jig, circuit board production apparatus, and method of producing circuit board | |
| JP4873093B2 (en) | Screen printing device | |
| JP3981259B2 (en) | Substrate support jig | |
| CN213196108U (en) | Welding jig for soft belt of 100G module laser | |
| CN211267292U (en) | Automatic chip mounter | |
| CN110890451B (en) | Method for applying electronic components | |
| CN201690687U (en) | Supporting board base for surface mounting of flexible printed circuit boards | |
| KR102045812B1 (en) | flexible printed circuit board soldering jig | |
| JP2008053408A (en) | Mounting method of led module array | |
| CN112312675A (en) | Chip attaching method and camera module | |
| CN204598469U (en) | PCB connecting plate device | |
| CN104837299B (en) | PCB connecting plates device and its connecting plate method | |
| CN221468263U (en) | Chip mounter | |
| CN113453447A (en) | Plate printing method | |
| CN219322894U (en) | Printed circuit board fixing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080312 |