CN101122037A - Pyrophosphate copper plating used as grounding electroplate liquid for cyanogen-free copper plating - Google Patents
Pyrophosphate copper plating used as grounding electroplate liquid for cyanogen-free copper plating Download PDFInfo
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- CN101122037A CN101122037A CNA2007100302783A CN200710030278A CN101122037A CN 101122037 A CN101122037 A CN 101122037A CN A2007100302783 A CNA2007100302783 A CN A2007100302783A CN 200710030278 A CN200710030278 A CN 200710030278A CN 101122037 A CN101122037 A CN 101122037A
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- pyrophosphate
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- copper plating
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Abstract
The invention discloses a strike bath solution with pyrophosphate plating copper as the cyanide-free copper, which contains a make-up agent and rehydration salt; the make-up agent contains the following raw materials: potassium pyrophosphate, copper pyrophosphate, ammonium citrate, sorbol, sulfosalt, phenyl carboxylate, dextrin, alkyl thiourea and nitrogen heterocyclic; the rehydration salt is as supplementation of all raw materials in the make-up agent during the plating process; the invention does not contain harmful substances, such as cyanidum, heavey metal, etc and is in compliance with EU RoHS Directive (2002/95/EC) with stable bath solution and wide cathode current density range, and the plating layer prepared by the invention is fine, even and in a semi-bright state; and the make-up is conducted with original solution, supplementation is conducted with single rehydration salt, which is convenient in operation and simple in management; the plating layer is well adhesive to the matrix, with good straggling capability and covering capability. The invention is applicable in pre-plating of iron materials, zinc alloys, aluminum alloys and copper alloys, as well as barrel plating and suspension plating, with the waste water easy to dispose, which will not bring the secondary pollution.
Description
Technical field
The present invention relates to a kind of copper plating bath, particularly pyrophosphate copper plating bottoming electroplate liquid as cyanide-free copper electroplating.
Background technology
Owing to NaCN cupric ion there is very strong complexing power in the cyanide electroplating solution, dispersive ability and covering power are better, the coating crystallization is careful, plating bath is alkalescence, the ability of deoiling, thereby can guarantee to obtain the good coating of bonding force, be widely used in the bottoming coating on steel substrate, aluminium alloy, zinc alloy diecasting and the copper alloy plating Cu/Ni/Cr, have incomparable advantage.But cyanide electroplating current efficiency low (only about 63%) contains a large amount of CN
-, severe toxicity is arranged, big to site operation personnel's Health cost; Exhaust gas discharged, sewage also are unfavorable for environment protection simultaneously.
In recent years in order further to protect environment; reduce public hazards,, " containing cyanogen electroplates " listed in and " eliminated outmoded production capacity according to country promulgation " promotion law on cleaner production " and State Economic and Trade Commission's 32 commands; the catalogue of technology and product " (the 3rd batch) the 23rd, ordered for the end of the year 2003 within a certain time and eliminate.For this reason, Chinese scholars has been done number of research projects at the aspects such as selection of plating bath type, complexing agent and additive, below introduces several cyanide-free copper electroplating technologies respectively.
(1) hydrosulphate copper facing
The hydrosulphate copper plating bath mainly is made up of copper sulfate and sulfuric acid, after 20th century, developed the vitriol copper plating additive sixties, has obtained widespread use industrial.Its coating has excellent light and leveling property, does not need polishing to get final product direct nickel plating; The cost of plating bath is low, current efficiency height (about 100%), and sedimentation velocity is fast, and internal stress is little, is rich in ductility, is particularly suitable for Copper Foil, plastic component plating bottom and electroforming; Plating bath has good dispersive ability and covering power, the modern multilayer printed circuit board that can satisfy high thickness, the small-bore galvanized needs of boring a hole.But its maximum shortcoming is comparatively harsh to the requirement of brightening agent, and plating needs preplating cyanogen copper on steel part, zinc casting, aluminum component.
(3) HEDP copper facing
HEDP is a hydroxy ethylene diphosphonic acid, and plating bath covering power, homogeneity are good, and directly plating on steel part need not preplating and just can obtain good careful half bright coating of bonding force.But because of its current efficiency is lower, sedimentation velocity is slower, and waste liquid is difficult to handle, and is not used widely.
(4) quadrol copper facing
Quadrol copper facing is main complexing agent with quadrol, and the covering power of plating bath is good, and the coating crystallization is careful, outward appearance is good, but needs can be used for the decorative plating and the anti-carburizing copper facing of copper, ironware after bottoming, and nickel plating bonding force again is poor after the copper facing, seldom uses so plant technology.
(5) fluoroborate copper facing
The fluoroborate copper plating bath is based on the simple ion plating bath of fluoroborate, and its maximum characteristics are that cathode current density is big, and coating deposition rate is fast, easily obtain thicker coating, therefore be usually used in electroforming, but shortcoming is a plating bath cost height, big to equipment corrosion, the wastewater treatment difficulty.
(6) other copper facing
Except that above-mentioned technology, also have citrate copper-plating, tartrate copper facing, trolamine copper facing etc., though each technology all has its advantage, but be subjected to separately due to the limitation, more loaded down with trivial details as preparation because of plating bath, or difficult because of plating solution maintenance, or the operator had relatively high expectations, or the more high reason of plating bath cost, and be difficult to realize suitability for industrialized production.
Summary of the invention
Be deficiency or the limitation that the cyanide-free copper electroplating technology that solves prior art exists, adapt to the development and the environmental protection requirement of electroplating industry, the invention provides the bottoming electroplate liquid of a kind of pyrophosphate copper plating of pyrophosphate salt system as cyanide-free copper electroplating.
The technical solution adopted for the present invention to solve the technical problems is:
Pyrophosphate copper plating is as the bottoming electroplate liquid of cyanide-free copper electroplating, it is characterized in that it includes out cylinder agent and additional salt, described open the cylinder agent by weight percentage densitometer include following raw material: potassium pyrophosphate 20-35%, cupric pyrophosphate 1-5%, ammonium citrate 1-2%, sorbyl alcohol 1-3%, sulfonate 0.2-2%, phenyl carboxylate 3-5%, dextrin 1-1.5%, alkyl thiourea 0.1-0.5%, nitrogen heterocyclic 0.05-0.5%; Described additional salt includes the raw material of following weight ratio: potassium pyrophosphate 2-8%, cupric pyrophosphate 75-85%, ammonium citrate 2-3%, sorbyl alcohol 3-4%, sulfonate 1-2%, phenyl carboxylate 2-3%, dextrin 1.5-5%, alkyl thiourea 0.1-0.2%, nitrogen heterocyclic 0.05-0.15%.
As optimized technical scheme of the present invention, the described weight percent concentration of opening each raw material in the cylinder agent is: potassium pyrophosphate 25-30%, cupric pyrophosphate 3-4%, ammonium citrate 1.5-2%, sorbyl alcohol 1-1.5%, sulfonate 0.2-0.8%, phenyl carboxylate 3-4%, dextrin 1-1.5%, alkyl thiourea 0.1-0.3%, nitrogen heterocyclic 0.1-0.25%; The weight ratio of each raw material is in the described additional salt: potassium pyrophosphate 3-6%, cupric pyrophosphate 80-85%, ammonium citrate 2-2.5%, sorbyl alcohol 3-3.5%, sulfonate 1.5-1.8%, phenyl carboxylate 2.1-2.6%, dextrin 3-3.5%, alkyl thiourea 0.15-0.18%, nitrogen heterocyclic 0.05-0.12%.
As improvement of the technical scheme of the present invention, wherein also include tranquilizer, tranquilizer can increase the stability of plating bath, prevents cupprous generation.Described tranquilizer by volume percentage concentration meter includes following material: 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid 10-20%, tripoly phosphate sodium STPP 1-5%, EDTA2Na1-2%.
As further improvement in the technical proposal of the present invention, wherein also include gloss-imparting agent, gloss-imparting agent can be assisted other composition dissolving, improves coating gloss, improves the coating planarization.Described gloss-imparting agent by volume percentage concentration meter includes following material: ethylene glycol 5-8%, methylthiourea pyridine 1-2%, diphenylamine sulfonic acid 0.5-1%.
Above-mentioned nitrogen heterocyclic can adopt 8-hydroxyl naphthalene benzene or benzene a pair of horses going side by side triazole.
Above-mentioned sulfonate can adopt 2-ethyl group sulfonic acid pyridine, naphthalene disulfonic acid or pentanedioic acid sulphonate; Phenyl carboxylate can adopt 3-methanol-based pyridine, 2,3-pyridine dicarboxylic acid or nicotinic acid butyl ester.
EDTA2Na of the present invention is a sodium ethylene diamine tetracetate.
But the present invention opens the potassium pyrophosphate complexing metal cupric ion in the cylinder agent, improves electroconductibility, increases the cathodic polarization degree, improves bath stability; Cupric pyrophosphate provides the source of cupric ion, improves electroconductibility; Ammonium citrate increases auxiliary complexing function, improves the stability of plating bath; Sorbyl alcohol increases auxiliary complexing function, improves the stability of plating bath, changes the coating crystalline-granular texture; Sulfonate improves the stability of plating bath, changes the coating crystalline-granular texture, eliminates pin hole; Phenyl carboxylate improves the stability of plating bath, improves the cathode current density higher limit; Dextrin increases auxiliary complexing function, improves the stability of plating bath, changes the coating crystalline-granular texture, improves the covering power of coating; Alkyl thiourea make the coating crystallization careful, be semi-gloss, can suitably enlarge the cathode current density scope; Nitrogen heterocyclic cooperation alkyl thiourea uses together and can make the coating crystallization more careful; The restraining effect of having separated out to copper.
The present invention replenishes potassium pyrophosphate, cupric pyrophosphate, ammonium citrate, sorbyl alcohol, sulfonate, phenyl carboxylate, dextrin, alkyl thiourea, the nitrogen heterocyclic and basic identical in the above-mentioned effect of opening in the cylinder agent in the salt, gives unnecessary details no longer one by one at this.
The present invention can adopt following method preparation: add the pure water that accounts for its volume 70% earlier in reactive tank; Add burnt potassium, stirring and dissolving; Add burnt copper, stirring and dissolving; Add ammonium citrate, sorbyl alcohol, sulfonate, phenyl carboxylate, dextrin, alkyl thiourea, nitrogen heterocyclic, stirring and dissolving; Fixed molten, solution is mazarine.
The invention has the beneficial effects as follows: the present invention does not contain prussiate, objectionable impuritiess such as heavy metal, meet the RoHS of European Union instruction (2002/95/EC), bath stability, the cathode current density wide ranges, gained coating is careful, evenly, be half bright state, can save follow-up electroplating time, and in plating bath, pyrophosphate ion and metal copper ion form stable complex compound, the while Citrate trianion, sorbyl alcohol, sulfonate, phenyl carboxylate, dextrin, alkyl thiourea, the adding of additives such as nitrogen heterocyclic, cupric ion in the plating bath is played the effect of assisting complexing, increased the cathodic polarization effect, thereby made the cupric deposition potential near cupprous deposition potential in the cyanide electroplating, reduce the displacement phenomenon of copper, the cathode current density scope is also widened simultaneously, makes the coating of gained more even, careful.Remove in addition, also have the following advantages: 1, stoste is opened cylinder, and single additional salt replenishes, and is easy to operate, and management is simple; 2, coating and basal body binding force are good, and dispersive ability and covering power are good; 3, be suitable for the preplating of iron material, zinc alloy, aluminium alloy, copper alloy; 4, barrel plating, to hang plating all applicable; 5, wastewater treatment is simple, can not cause secondary pollution.
The present invention is further described below in conjunction with embodiment.
Embodiment
Embodiment 1
In reactive tank, add the pure water that accounts for its volume 70% earlier; Add burnt potassium, stirring and dissolving; Add burnt copper, stirring and dissolving; Add ammonium citrate, sorbyl alcohol, 2-ethyl group sulfonic acid pyridine, 3-methanol-based pyridine, dextrin, alkyl thiourea, 8-hydroxyl naphthalene benzene, stirring and dissolving, be mixed with the electroplate liquid that contains following weight percent concentration: potassium pyrophosphate 25%, cupric pyrophosphate 2%, ammonium citrate 2%, sorbyl alcohol 3%, 2-ethyl group sulfonic acid pyridine 0.8%, 3-methanol-based pyridine 3%, dextrin 1.5%, alkyl thiourea 0.1%, 8-hydroxyl naphthalene benzene 0.08%, restock added and contains following raw materials by weight percent when electroplate liquid concentration was not enough in plating production process: potassium pyrophosphate 6%, cupric pyrophosphate 82.5%, ammonium citrate 2%, sorbyl alcohol 3%, 2-ethyl group sulfonic acid pyridine 1%, 3-methanol-based pyridine 2%, dextrin 3.3%, alkyl thiourea 0.1%, 8-hydroxyl naphthalene benzene 0.1%.Adopt the cathode efficiency of present embodiment copper plating bath: 40%, cathode current density: 0.1-0.5A/dm
2,, the gained binding force of cladding material is good. coating outward appearance light.
Embodiment 2
In reactive tank, add the pure water that accounts for its volume 70% earlier; Add burnt potassium, stirring and dissolving; Add burnt copper, stirring and dissolving; Add ammonium citrate, sorbyl alcohol, naphthalene disulfonic acid, 2,3-pyridine dicarboxylic acid, dextrin, alkyl thiourea, benzene a pair of horses going side by side triazole, stirring and dissolving, be mixed with the electroplate liquid that contains following weight percent concentration: potassium pyrophosphate 35%, cupric pyrophosphate 4%, ammonium citrate 2%, sorbyl alcohol 2%, naphthalene disulfonic acid 1%, 2,3-pyridine dicarboxylic acid 4%, dextrin 1%, alkyl thiourea 0.3%, benzene a pair of horses going side by side triazole 0.4%; Add 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid 10-20%, tripoly phosphate sodium STPP 1-5%, EDTA2Na1-2%, ethylene glycol 5-8%, methylthiourea pyridine 1-2%, the diphenylamine sulfonic acid 0.5-1% that contains following concentration of volume percent again; Restock added and contains following raw materials by weight percent when electroplate liquid concentration was not enough in plating production process: potassium pyrophosphate 6%, cupric pyrophosphate 80%, ammonium citrate 2.5%, sorbyl alcohol 4%, naphthalene disulfonic acid 1.5%, 2,3-pyridine dicarboxylic acid 2%, dextrin 3.8%, alkyl thiourea 0.1, benzene a pair of horses going side by side triazole 0.1%.Adopt the cathode efficiency of present embodiment copper plating bath: 60%, cathode current density: 0.1-0.5A/dm
2,, the gained binding force of cladding material is good. coating outward appearance light.
Embodiment 3
In reactive tank, add the pure water that accounts for its volume 70% earlier; Add burnt potassium, stirring and dissolving; Add burnt copper, stirring and dissolving; Add ammonium citrate, sorbyl alcohol, pentanedioic acid sulphonate, nicotinic acid butyl ester, dextrin, alkyl thiourea, 8-hydroxyl naphthalene benzene, stirring and dissolving is mixed with the electroplate liquid that contains following weight percent concentration: potassium pyrophosphate 30%, cupric pyrophosphate 3%, ammonium citrate 2%, sorbyl alcohol 1.2%, pentanedioic acid sulphonate 0.8%, nicotinic acid butyl ester 3%, dextrin 1%, alkyl thiourea 0.3%, 8-hydroxyl naphthalene benzene 0.25%; Add 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid 10-20%, tripoly phosphate sodium STPP 1-5%, EDTA2Na1-2%, ethylene glycol 5-8%, methylthiourea pyridine 1-2%, the diphenylamine sulfonic acid 0.5-1% that contains following concentration of volume percent again; Restock added and contains following raw materials by weight percent when electroplate liquid concentration was not enough in plating production process: potassium pyrophosphate 7%, cupric pyrophosphate 79%, ammonium citrate 3%, sorbyl alcohol 4%, nicotinic acid butyl ester 1%, 2,3-pyridine dicarboxylic acid 2%, dextrin 3.8%, alkyl thiourea 0.1,8-hydroxyl naphthalene benzene 0.1%.Adopt the cathode efficiency of present embodiment copper plating bath: 65%, cathode current density: 0.3-2.0A/dm
2,, the gained binding force of cladding material is good. coating outward appearance half light.
Claims (6)
1. pyrophosphate copper plating is as the bottoming electroplate liquid of cyanide-free copper electroplating, it is characterized in that it includes out cylinder agent and additional salt, described open the cylinder agent by weight percentage densitometer include following raw material: potassium pyrophosphate 20-35%, cupric pyrophosphate 1-5%, ammonium citrate 1-2%, sorbyl alcohol 1-3%, sulfonate 0.2-2%, phenyl carboxylate 3-5%, dextrin 1-1.5%, alkyl thiourea 0.1-0.5%, nitrogen heterocyclic 0.05-0.5%; Described additional salt includes the raw material of following weight ratio: potassium pyrophosphate 2-8%, cupric pyrophosphate 75-85%, ammonium citrate 2-3%, sorbyl alcohol 3-4%, sulfonate 1-2%, phenyl carboxylate 2-3%, dextrin 1.5-5%, alkyl thiourea 0.1-0.2%, nitrogen heterocyclic 0.05-0.15%.
2. pyrophosphate copper plating according to claim 1 is characterized in that as the bottoming electroplate liquid of cyanide-free copper electroplating the described weight percent concentration of opening each raw material in the cylinder agent is: potassium pyrophosphate 25-30%, cupric pyrophosphate 3-4%, ammonium citrate 1.5-2%, sorbyl alcohol 1-1.5%, sulfonate 0.2-0.8%, phenyl carboxylate 3-4%, dextrin 1-1.5%, alkyl thiourea 0.1-0.3%, nitrogen heterocyclic 0.1-0.25%; The weight ratio of each raw material is in the described additional salt: potassium pyrophosphate 3-6%, cupric pyrophosphate 80-85%, ammonium citrate 2-2.5%, sorbyl alcohol 3-3.5%, sulfonate 1.5-1.8%, phenyl carboxylate 2.1-2.6%, dextrin 3-3.5%, alkyl thiourea 0.15-0.18%, nitrogen heterocyclic 0.05-0.12%.
3. pyrophosphate copper plating according to claim 1 and 2 is as the bottoming electroplate liquid of cyanide-free copper electroplating, it is characterized in that it also includes tranquilizer, described tranquilizer by volume percentage concentration meter includes following material: 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid 10-20%, tripoly phosphate sodium STPP 1-5%, EDTA2Na1-2%.
4. pyrophosphate copper plating according to claim 1 and 2 is as the bottoming electroplate liquid of cyanide-free copper electroplating, it is characterized in that it also includes gloss-imparting agent, described gloss-imparting agent by volume percentage concentration meter includes following material: ethylene glycol 5-8%, methylthiourea pyridine 1-2%, diphenylamine sulfonic acid 0.5-1%.
5. pyrophosphate copper plating according to claim 1 and 2 is characterized in that as the bottoming electroplate liquid of cyanide-free copper electroplating described nitrogen heterocyclic is 8-hydroxyl naphthalene benzene or benzene a pair of horses going side by side triazole.
6. pyrophosphate copper plating according to claim 1 and 2 is characterized in that as the bottoming electroplate liquid of cyanide-free copper electroplating described sulfonate is 2-ethyl group sulfonic acid pyridine, naphthalene disulfonic acid or pentanedioic acid sulphonate; Phenyl carboxylate is 3-methanol-based pyridine, 2,3-pyridine dicarboxylic acid or nicotinic acid butyl ester.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101643926B (en) * | 2008-08-04 | 2011-05-25 | 比亚迪股份有限公司 | Non-cyanide pre-plating copper plating solution |
| US8147671B2 (en) * | 2008-12-26 | 2012-04-03 | Byd Co. Ltd. | Electroplating method and electroplated product |
| CN102534704A (en) * | 2012-01-16 | 2012-07-04 | 青岛大学 | Acidic electroplating copper solution chloride ion alternative method |
| CN113430595A (en) * | 2021-06-24 | 2021-09-24 | 惠州市安泰普表面处理科技有限公司 | Method for plating copper on surface of brass casting |
| CN114150257A (en) * | 2021-12-17 | 2022-03-08 | 江西洪都航空工业集团有限责任公司 | Vacuum heat treatment anti-carburizing method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1055325A (en) * | 1991-02-12 | 1991-10-16 | 姜文戈 | Rapid matrix-making technique of cloisonne enamel |
| GB2264717A (en) * | 1992-03-06 | 1993-09-08 | Zinex Corp | Cyanide-free copper plating bath |
| CN1303250C (en) * | 2004-08-05 | 2007-03-07 | 广州杰赛科技股份有限公司 | Magnesium alloy non cyanogen plating copper chemical plating nickle and its plating process |
| CN100999819A (en) * | 2006-08-04 | 2007-07-18 | 广州大学 | Process of zine pressure casting non cyanogen alkaline immersion plating copper |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101643926B (en) * | 2008-08-04 | 2011-05-25 | 比亚迪股份有限公司 | Non-cyanide pre-plating copper plating solution |
| US8147671B2 (en) * | 2008-12-26 | 2012-04-03 | Byd Co. Ltd. | Electroplating method and electroplated product |
| CN102534704A (en) * | 2012-01-16 | 2012-07-04 | 青岛大学 | Acidic electroplating copper solution chloride ion alternative method |
| CN102534704B (en) * | 2012-01-16 | 2014-07-16 | 青岛大学 | Acidic electroplating copper solution chloride ion alternative method |
| CN113430595A (en) * | 2021-06-24 | 2021-09-24 | 惠州市安泰普表面处理科技有限公司 | Method for plating copper on surface of brass casting |
| CN114150257A (en) * | 2021-12-17 | 2022-03-08 | 江西洪都航空工业集团有限责任公司 | Vacuum heat treatment anti-carburizing method |
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