CN101116092B - 具有芯片和多个传感器的数据载体 - Google Patents
具有芯片和多个传感器的数据载体 Download PDFInfo
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Abstract
本发明涉及一种数据载体(100),该数据载体(100)具有:芯片(10),存储用于接触限制或非接触式感应通信的能量(13)以及信息;以及集成在芯片(10)内的多个可激励芯片传感器(11),在激励(12)之后,所述可激励芯片传感器(11)将信号(18)传送到芯片(10)的CPU(19),在CPU(19)中处理信号(18)。本发明的特征在于,独立于芯片(10)存储能量(13)以及信息,优选地,可由芯片(10)对激励(12)进行调整,以便附加地存储信息的目的,并且激励(12)适于CPU(19)中处理信号(18)的需要。
Description
技术领域
本发明涉及一种数据载体,该数据载体具有:芯片,存储用于接触限制(contact-bound)或非接触式感应通信的能量以及信息;以及集成在该芯片内的多个可激励传感器,在激励之后,可激励传感器将信号传送到芯片的CPU,在CPU中处理信号。
本发明还涉及一种通过集成在数据载体内的芯片进行通信的方法,其中存储来自芯片的能量以及信息,以用于接触限制或非接触式感应通信,其中激励集成在芯片的多个感应器,然后该感应器向CPU传送信号,以便处理的目的。
背景技术
具有芯片的数据载体在本领域是众所周知的,并且例如形成了机器可读移动文档(MRTD)的一部分,数据载体通常配备有基于半导体的芯片,提供了同时存储和处理复杂(生物统计)信息的可能性。
具有芯片的数据载体还可用于诸如芯片卡、智能卡、个人文件、护照、驾照、支票以及纸币之类的有价和安全文件。具体地,通过使用集成在芯片卡的卡主体中的芯片模块,芯片卡已经越来越多地应用于日常生活的新领域,同时成为了现代生活的自然部分。卡主体可由不同的材料制成。例如,适当的材料为:聚氯乙烯、聚碳酸酯、丙烯醛基丁二烯苯乙烯、聚对苯二甲酸乙二醇酯、(热塑性塑料)聚氨酯(T)PU,或也可以是纸和纸板(card board),然而,其中纸的复合材料/合成材料的层压、相纸或诸如Dupont的Tyvek的特殊材料也是令人关注的。将卡的组成称为卡元素。例如,重要的卡元素为贴箔和印刷颜色或墨水。诸如MLI(多激光图像)、OVI(光学变色墨水)、UR颜色或荧光颜色的卡元素也很重要。存在各种制造数据载体的方法,具体为诸如层压技术和注模技术。例如,对于数据载体的材料以及制造方法的详细描述可在Y.Haghiri/Th.Tarantino的书“Vom Plastik zurChipkarte”(“From plastic to chip card”),Carl HanserPublishers,Munich,Viena,1999;Chapter(1):“”(“Card bodies”)以及Chapter(3):“Herstellungsformen für”(“Methods of manufacturing card bodies”)中得到。
内置于卡主体的传统芯片模块实质上独立于围绕在其周围的材料类型。对于芯片而言,是否结合于PVC注模卡、PC化合物或PET自粘标签中并不是“问题”。与芯片的通信或数据交换可以通过接触限制或非接触式方式(RFID技术)来实现,这些方式均是传统的可能方式。在RFID技术中,通过磁场或电磁场来建立通信。
通过在芯片模块和测试站之间进行数据交换的传统方式来启用/禁用MRTD集成芯片模型,也可以通过RFID技术来实现该模型。在这种情况下,测试站向芯片“证明”其拥有某些秘密信息。例如,这个知识反过来向芯片证明该测试站被批准读取芯片的内容。这个过程也被称为传统的认证(authentication)。
当前芯片也配备了多个片上(on-chip)传感器。这些片上传感器通过监控例如温度、能量供给以及光线入射来提供对芯片进行适当操作的可能性。
例如,从US 2002/0,186,145A1中可了解这样的多个片上传感器。已知的传感器是智能卡(第2页,第1列,2到8行)芯片的附加组件,并被用于检测产品或者其周围环境的变化(第1页,第2列,[0013])。
此外,根据现有技术可知,例如,多个片上传感器可包括光传感器、温度传感器、频率传感器以及被激励时可向芯片的CPU传送信号的其它传感器,在芯片的CPU中处理该信号。通常情况下,传感器通过两种可能方式之一来与CPU进行通信。一种方式是触发由操作***适当处理的异常(例如,重复计算、终止计算或以更详细的方式测试计算结果)。另一种方式是由传感器来触发热复位(warm reset),即,使CPU完全地中断正在处理的例程,并从起始处再次重复。这是更激烈的反应,并且通常应用于被认为处于临界的传感器。
因此,根据现有技术的具有多个片上传感器的已知芯片表现出了集成在芯片中的传感器主要被用于检测外部参数的普通变化,以便根据异常以及热复位来与CPU进行通信。由此,芯片在CPU中执行给定且特定处理以及操作的可能性自然受到限制,例如,基于RFID技术,该可能性扩展到传统可能性以外,并需要例如特定且复杂的光信号。根据技术发展状态,对于传统RFTD信号和由特定、复杂的传感器激励所产生的复杂信号的处理,以及由此产生的新并且复杂的处理,都不能在芯片中进行操作。
发明内容
因此,本发明的目的是提供一种具有芯片和多个芯片传感器的数据载体,在多个芯片传感器中,CPU不只处理接触限制或非接触式通信中所产生的传统信号,还被激活以用于需要激励芯片传感器的给定的更复杂过程。
这个目的通过权利要求1中限定的典型特征来实现。
本发明基于这样的认识:芯片的CPU不仅适于对在接触限制或非接触式感应通信中所产生的传统信号进行的激活和接收,还可用于由集成在芯片内的芯片传感器以物理上独立的方式提供的信号。按照这种方式,通信的传统可能性伴随着与芯片进行通信的其它可能性,这种可能性尤其适于将特定激励所需要的复杂信号传输到CPU。于是,处理复杂信号的芯片的CPU可以激活芯片,以用于例如传统认证以外的其它处理。例如,还能够在CPU中以组合的方式对通过传统通信模式传输的信号以及由芯片传感器通过独立的物理连接传输的信号进行处理,以便触发芯片中的其它处理。
在权利要求2中限定了根据本发明的数据载体的有利实施例,其中多个芯片传感器与过滤材料进行通信,在该过滤材料中,激励优选是可调的,并且适于CPU中处理信号的需要。这保证了可将化学/物理现象相关材料用于特定的激励。通过使用与芯片传感器进行通信的过滤材料,在一定范围内产生化学-物理“过滤”,该范围仅允许给定芯片传感器的特定激励,因此还保证了芯片只在“正确的”材料环境下起作用。按照这种方式,将材料特性与芯片组合到一个功能单元。芯片只在“正确的”材料环境下起作用。相反地,在这样的受控材料环境下,可根据定义的硬件签名来检验芯片的硬件特性。
例如,具有芯片的数据载体经常被用于芯片卡、个人文件和支票,因此数据载体的材料可用作过滤材料。因此,权利要求3中限定了过滤材料包括卡材料,而权利要求4中限定了过滤材料包括文件材料。
有利地,文件材料被形成为材料压印(imprint)或作为附加物。
本发明的另一个优选实施例的特征在于,多个芯片传感器包括用于检测脉冲激光束的激励的光传感器。由于光传感器检测了脉冲激光束的激励,因而创建了不同的光激励简档(profile)。由此形成的激励简档适于将复杂信息传输到芯片。
有利地,CPU对于接触限制或非接触式感应通信的信号和由多个芯片传感器所提供的信号执行组合处理操作。在这样的组合通信中,二进制代码可被分成两个信息路径,并被组成为CPU中的有效代码。按照这种方式,例如,可通过使用传统的信息路径以及触发热复位来传输逻辑“0”。通过触发荧光传感器并由此进行热复位来传输逻辑“1”,其中光传感器源的特征在于状态变量。通过反复询问状态变量,CPU最后根据单个信息段来构成要传输的信息。
在权利要求9中限定了根据本发明的数据载体的有利实施例,其中多个芯片传感器包括光传感器以及过滤材料,过滤材料包括:卡材料,该卡材料在小于800nm的波长处不透明,而在800到1100nm的波长处透明;与卡材料相邻的UC转换器;以及与UC转换器相邻的干扰过滤层压板,在过滤材料中,脉冲激光束首先穿过卡材料,然后穿过UC转换器。根据ISO 7810,传统的卡材料仅在800到1100nm之间的波长NIR范围内透明,因此,该波长范围内的脉冲激光束尤其可以激励光传感器,并创建不同的光激励简档,结果,对应编程的CPU处理了与“习惯的”RFID信号一起激活芯片以进行进一步处理的复杂信号。
在权利要求10中限定了根据本发明的数据载体的有用变体,其中多个芯片传感器包括光传感器以及过滤材料,该过滤材料包括卡材料以及与该卡材料相邻的基质,该基质产生已调制的荧光,并且在过滤材料中,脉冲激光束首先穿过卡材料,然后穿过基质。这样的特定脉冲激励触发了不同于传统的异常例程并导致CPU中复杂操作的例程。
可选地,多个芯片传感器包括至少两个相同或不同的光传感器,该光传感器的过滤材料不同,其中过滤材料包括卡材料,脉冲激光束穿过过滤材料,然后激励将信号分别传送到CPU的光传感器。这具有的优点在于:该信息可被划分为不同的光波长。例如,这可以用于实现三进制逻辑。
权利要求12中限定了根据本发明的数据载体的可实现变体,其中多个芯片传感器包括光传感器以及过滤材料,该过滤材料包括:用于对波长进行移位的光转换器;以及与光转换器相邻的卡材料,卡材料在800到1000nm的波长范围内透明,以及脉冲激光束只能穿过光转换器。这样的过滤材料具有优点:只包括两个层,即光转换器和卡材料,并且仍然可以创建复杂的光激励简档。
根据本发明的数据载体有利地集成在有价或安全文件内。这考虑了这样的事实:数据载体经常用于有价和安全文件。
此外,根据本发明的数据载体可用于权利要求14中所限定的与集成在数据载体内的芯片进行通信的方法,其中存储来自芯片的能量和信息,以用于接触限制或非接触式感应通信,其中独立地,激励集成在芯片中的多个芯片传感器,然后芯片传感器将信号传送到CPU,以用于处理的目的,优选地,芯片对激励进行调整,以便信息的附加存储,并且激励适于CPU中处理的需要。
如权利要求15和16中所限定的,可使芯片传感器能够与过滤材料通信,在该过滤材料中,优选地,激励被调整并适于CPU中处理信号的需要,而将用于检测脉冲激光束的激励的光传感器集成在多个芯片传感器中。
参考下文描述的实施例,本发明的这些和其它方面将显而易见,并被加以说明。
附图说明
在附图中:
图1示意性地示出了多个传统芯片传感器;
图2示意性地示出了根据本发明的具有芯片以及多个芯片传感器的卡;
图3示意性地示出了根据本发明具有配备有基质的过滤材料的多个芯片传感器;
图4示意性地示出了根据本发明具有配备有UC转换器以及干扰过滤层压板的过滤材料的多个芯片传感器;
图5示意性地示出了根据本发明具有配备有光转换器的过滤材料的多个芯片传感器;
图6示意性地示出了根据本发明具有两个光传感器的多个芯片传感器。
具体实施方式
图1示出了多个传统芯片传感器11。芯片传感器11通过监控例如温度、电源电压、时钟频率以及光入射之类的环境参数来向芯片10提供可能的适当操作。多个芯片传感器11包括光传感器14、温度传感器15、频率传感器16以及其它传感器17。在激励12芯片传感器11的情况下,芯片传感器11将信号18传送到芯片的CPU 19,在CPU 19处理信号18。主要存在两种处理这种信号18的方法。在一种方法中,CPU 19产生“异常”信号,通过芯片10的操作***进一步对该“异常”信号进行处理。在引入感应电磁场30后,芯片10的操作***希望得到由芯片传感器11触发的各个异常信号的明确定义序列。因此,光传感器14可以首先触发异常信号,并且随后温度传感器15可以触发该异常信号。只有在频率传感器16最后也触发了异常信号之后,芯片10才能通过接触限制或非接触式接口来启用传统的通信,并且可以执行传统的认证。
另外一种方法是通过CPU 19来触发芯片的热复位。在引入感应电磁场30之后,芯片的操作***希望得到热复位的明确定义序列。第一热复位触发了光传感器14,并且第二热复位触发了温度传感器15。最后,由频率传感器16触发第三热复位。在每次热复位之后,芯片10的操作***更新存储在EEPROM中的测试变量。只在当该变量达到给定值时,才启用通过非接触式接口的传统通信,并且可以执行传统的认证。
根据本发明的数据载体100(如图2中芯片卡所示)包括芯片10以及多个芯片传感器11,多个芯片传感器11包括光传感器14,光传感器14用于检测已调制的脉冲激光束22的激励12。数据载体100包括卡材料23,脉冲激光束22可穿过卡材料23。传统的卡材料在800到1100nm的NIR范围内是透明的,使得尤其可以在此波长范围内调整脉冲激光束22的激励12,并且激励12适于在CPU 19中处理信号18的需要。通常可以通过针对具有对应附加物的卡材料23选择合成材料来调整定义的透明度。创建不同的光激励简档,其中光传感器14用于检测脉冲激光束22的激励12。这样的激励简档适于将复杂信息传输到芯片10。光传感器的激励触发了异常信号,并因此表示针对CPU 19的输入命令。以这种方式来对CPU 19进行编程,使得其不仅希望得到“习惯的”RFID信号,而且希望得到来自光传感器14的异常信号,并因此另外地激活芯片10以用于进一步处理。芯片10存储通过传统的天线20以及天线***21耦合到芯片10的能量13以及信息,从而产生RFID信号。应注意,这个实施例以及其它实施例还可用于接触技术的范围内,即能量和信息还可通过传统的接触方式来传输。
图3示出了具有光传感器14的多个芯片传感器11。过滤材料包括卡材料23以及与卡材料23相邻的基质24,基质24产生已调制的荧光,其中脉冲激光束22首先穿过卡材料23,然后穿过基质24。
调整卡材料24,以使该卡材料24在NIR范围内完全吸收850nm以下波长的光,并在850nm波长以上是透明的。按照已知的方式,通过天线20以及天线***21将能量13和信息耦合到并存储于芯片10,从而产生RFID信号。其中独立地,脉冲激光束22以980nm的发射来照射基质24,而UP转换处理产生了800nm(670,550或430nm)的荧光。这个原地产生的光(荧光发射31)入射到光传感器14上,并且在激励12之后以异常信号的方式来触发信号18,即,表示了针对CPU 19的输入命令。应当选择UP转换材料的荧光动态特性,以便可以“传送”脉冲激光束22的调制,从而使已调制荧光到达光传感器14,并且由此可以耦合进复杂的光信息。这意味着例如习惯的异常例程之类的光传感器14的简单连续激励可以去激活芯片。然而,已定义的脉冲激励触发了在CPU 19中产生复杂操作的其它例程。对CPU 19进行编程,使得CPU 19不仅希望“习惯的”RFID信号,还希望来自光传感器14的已定义异常信号,以在处理操作过程中得到复杂的结果。此外,例如可使用特定材料(组合物)来形成基质24,因此可利用例如光致发光或不可见的Stokes荧光的其它光转换处理。利用诸如丝印、凹印、苯胺油墨印刷(flexoprinting)、胶印、铅字印刷(letter set)、喷墨、热转移等的已知印刷技术,可以在对卡的复合材料进行层压之前来涂敷基质24,或者可在利用环氧树脂物质容纳芯片时采用UC染料,以便只有一个脉冲激光束22是适合的,并且脉冲“NIR光”的强度不足以产生足够的荧光。
在图4中,以明显较大比例示出的芯片传感器11与过滤材料进行通信,该过滤材料包括:卡材料23,所述卡材料在低于800nm的波长处不透明,而在800到1100nm之间的波长处是透明的;与卡材料23相邻的UC转换器25;以及与UC转换器相邻的干扰过滤层压板27,在该过滤材料中,脉冲激光束22穿过材料23,然后穿过UC转换器25。印刷在卡材料23后侧上的UC转换器25包括例如以及作为荧光体的掺杂镱和钬的氧硫化钆,并且有利地,按照以下方式形成:UC辐射26主要向下朝向Si光传感器形式的光传感器14的方向,并用作激励。干扰过滤层压板27具有非常尖锐的吸收边缘,以吸收800到1100nm之间波长的光。由于所使用的荧光体,UC转换器在550nm处产生辐射。荧光仅沿Si光传感器的方向延伸,其中Si光传感器中触发了传送到CPU 19的信号18。然而,最后,激励所需的激光束在过滤层压层中被吸收,并因此不能激活Si光传感器。
图5示出了包括以Si光传感器形式的光传感器14的多个芯片传感器11,具有过滤材料,所述过滤材料包括:用于对波长进行移位的光转换器28,以及与光转换器28相邻的卡材料23,卡材料23在800到1100nm之间的波长范围内是透明的,并且脉冲激光束22穿过光转换器28。光转换器28包括掺杂(铬)锕的钇钒酸盐(钇磷酸盐,钇硼酸盐),用于吸收红光,并在NIR范围内产生发射。因此,原始的激励光被移位为长波。在最简单的情况下,利用传统的印刷方法或放置在前部作为箔附加物,来印刷光转换器。例如,诸如铬以及由通式YAG:Cr,Nd定义的掺杂钕的钇铝石榴子石(yttrium aluminum garnet)也可用作光转换器。根据ISO 7810,与光转换器28相邻的卡材料23只在800到1100nm的NIR范围内是透明的。光转换器28实质上完全地吸收800到1100nm之间的脉冲激光束,因此激光束就不会到达光传感器14。然而,根据光转换器28的设计,红色激光(630-690nm)触发900到100nm之间的荧光29,该荧光通过卡材料23到达光传感器14,并作为对光传感器14的激励,此外还作为信号18到达CPU 19。例如,根据光时钟,执行异常或已定义的热复位,随后通过CPU 19的操作***将其作为信息进行处理。
图6所示的多个芯片传感器包括至少两个光传感器14、14a,其过滤材料是不同的,该过滤材料包括卡材料23,在该卡材料中,脉冲激光束22、22a穿过过滤材料并激励分别将信号18传送到CPU 19的光传感器14、14a。
基于卡材料23的不同的配备/掺杂,光传感器14、14a对于不同的波长敏感。在此示例中,卡材料23a掺杂有镱磷酸盐,并以如下的方式形成:在低于800nm波长处透明,并且实质上在高于800nm波长处不透明。光传感器14a检测脉冲激光束22a(波长650nm)的激励12,并将其转换成针对CPU 19的信号18,此信号被用于启用现在可以在980nm波长处检测脉冲激光束的激励12的第二光传感器。按照这种方式,信息被划分在不同的光传感器14、14a之间,结果可实现三进制逻辑。
附图标记列表
100 数据载体
10 芯片
11 多个芯片传感器
12 激励
13 能量
14 光传感器
14a 光传感器
15 温度传感器
16 频率传感器
17 传感器
18 信号
19 CPU
20 天线
21 天线***
22 脉冲激光束
22a 脉冲激光束
23 卡材料
23a 镱磷酸盐卡材料
24 基质
25 UC转换器
26 UC辐射
27 干扰过滤层压板
28 光转换器
29 荧光
30 电磁场
31 荧光发射
Claims (16)
1.一种数据载体,具有:芯片(10),存储用于接触限制或非接触式感应通信的能量(13)以及信息;以及集成在芯片(10)上的多个可激励芯片传感器(11),在激励之后,将信号(18)传送到芯片(10)的CPU(19),在CPU(19)中处理信号(18),所述数据载体的特征在于,芯片(10)独立地存储能量(13)以及信息以产生RFID信号;可由芯片(10)对激励(12)进行调整,以便附加地存储信息的目的,并且激励(12)适于CPU(19)中处理信号(18)的需要。
2.根据权利要求1所述的数据载体,其特征在于,所述多个芯片传感器(11)与过滤材料进行通信,在所述过滤材料中,对激励(12)进行调整,并且适于CPU(19)中信号(18)处理的需要。
3.根据权利要求2所述的数据载体,其特征在于,所述过滤材料包括用于制造卡的材料(23)。
4.根据权利要求2所述的数据载体,其特征在于,所述过滤材料包括用于制造文件的材料。
5.根据权利要求4所述的数据载体,其特征在于,所述用于制造文件的材料被形成为材料压印。
6.根据权利要求4所述的数据载体,其特征在于,所述用于制造文件的材料被形成为附加物。
7.根据权利要求1所述的数据载体,其特征在于,所述多个芯片传感器(11)包括用于检测脉冲激光束(22)的激励(12)的光传感器(14)。
8.根据权利要求1所述的数据载体,其特征在于,所述CPU(19)对于接触限制或非接触式感应通信的信号以及由多个芯片传感器(11)所提供的信号(18)执行组合处理操作。
9.根据权利要求2所述的数据载体,其特征在于,所述多个芯片传感器(11)包括光传感器(14)以及过滤材料,所述过滤材料包括:卡材料(23),所述卡材料在小于800nm的波长处为不透明,而在800到1100nm的波长处为透明;与卡材料(23)相邻的UC转换器(25);以及与UC转换器(25)相邻的干扰过滤层压板(27),在所述过滤材料中,脉冲激光束(22)首先穿过卡材料(23),然后穿过UC转换器(25)。
10.根据权利要求2所述的数据载体,其特征在于,所述多个芯片传感器包括光传感器以及过滤材料,所述过滤材料包括卡材料(23)以及与所述卡材料(23)相邻的基质(24),所述基质产生已调制荧光,在所述过滤材料中,其中脉冲激光束(22)首先穿过卡材料(23),然后穿过基质(24)。
11.根据权利要求2所述的数据载体,其特征在于,所述多个芯片传感器(11)包括至少两个相同或不同的光传感器(14,14a),所述光传感器(14,14a)的过滤材料不同,其中所述过滤材料包括卡材料(23),并且其中脉冲激光束(22,22a)穿过过滤材料,并激励用于分别将信号(18)传送到CPU(19)的光传感器(14,14a)。
12.根据权利要求2所述的数据载体,其特征在于,所述多个芯片传感器(11)包括光传感器(14)以及过滤材料,所述过滤材料包括用于对波长进行移位的光转换器(28),以及与所述光转换器(28)相邻的卡材料(23),所述卡材料在800到1100nm波长范围内是透明的,同时脉冲激光束(22)只能穿过光转换器(28)。
13.根据前述的任一权利要求所述的数据载体,其特征在于,所述数据载体被集成在有价或安全文件内。
14.一种用于与集成在数据载体内的芯片进行通信的方法,其中独立地存储来自芯片(10)的能量(13)以及信息,以用于接触限制或非接触式感应通信,激励集成在所述芯片的多个芯片传感器(11),然后将信号(18)传送到CPU(19)以便处理,可由芯片(10)对激励(12)进行调整,以便附加地存储信息的目的,并且激励(12)适于CPU(19)中处理信号(18)的需要。
15.根据权利要求14所述的方法,其特征在于,使所述多个芯片传感器(11)与过滤材料通信,其中对激励(12)进行调整,并且激励(12)适于CPU(19)中处理信号(18)的需要。
16.根据权利要求14所述的方法,其特征在于,用于检测脉冲激光束(22)的激励(12)的光传感器(14)被集成在多个芯片传感器(11)内。
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PCT/IB2005/054081 WO2006061780A1 (en) | 2004-12-10 | 2005-12-06 | Data carrier with a chip and a plurality of sensors |
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EP (1) | EP1866845B1 (zh) |
CN (1) | CN101116092B (zh) |
BR (1) | BRPI0518880A2 (zh) |
CA (1) | CA2590150C (zh) |
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EP1866845B1 (en) | 2013-03-27 |
PL1866845T3 (pl) | 2013-08-30 |
EP1866845A1 (en) | 2007-12-19 |
BRPI0518880A2 (pt) | 2008-12-16 |
US8899486B2 (en) | 2014-12-02 |
CA2590150A1 (en) | 2006-06-15 |
CN101116092A (zh) | 2008-01-30 |
CA2590150C (en) | 2013-05-14 |
WO2006061780A1 (en) | 2006-06-15 |
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US20090294535A1 (en) | 2009-12-03 |
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