CN101109839A - Lens module and manufacturing method thereof - Google Patents
Lens module and manufacturing method thereof Download PDFInfo
- Publication number
- CN101109839A CN101109839A CNA2006101062710A CN200610106271A CN101109839A CN 101109839 A CN101109839 A CN 101109839A CN A2006101062710 A CNA2006101062710 A CN A2006101062710A CN 200610106271 A CN200610106271 A CN 200610106271A CN 101109839 A CN101109839 A CN 101109839A
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- image chip
- lead frame
- camera lens
- pins
- lens module
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Abstract
The invention provides a manufacturing method for a lens assembly. The method comprises: an image chip having an image-sensing area and a plurality of contacts is provided; a wire stand having a first and a second surface is provided, on the first surface, a plurality of first pins are provided corresponding to the plurality of contacts on the image chip, and the second surface has a plurality of second pins, the first pins of the first surface are electrically connected with the second pins of the second surface; an adhering layer is provided for binding the image chip with the wire stand; a plurality of metallic wires are provided for electrically connecting the plurality of contacts of the image chip with the plurality of pins on the first surface of the wire stand and forming an image chip assembly; the image chip assembly is placed into a mold; a filler is provided in the mold, and the mold is removed after the filler is shaped; a transparent carrier is provided onto the image chip assembly; a lens stand is provided on the image chip assembly to form a lens assembly. The invention additionally provides a lens assembly made by above method.
Description
Technical field
The present invention is about a kind of camera lens module; Clearer and more definite, the present invention is a kind of micro-lens module and manufacture method thereof with side pin.
Background technology
The electronic industry in modern age is flourish constantly, electronic product miscellaneous makes people's life more comfortable and convenient, many electronic products all face the challenge higher yield and quality with meet in the manufacturing demand simultaneously the target of product also stride forward towards littler Yu thinner product module, increase dealer's competitive power.
See also shown in Figure 3, sectional view for existing camera lens module, its structure is mainly combined with a lens mount 82 by a substrate 21, these substrate 21 belows are by scolding tin 81 electric binding one films 80 (film), and lens mount 82 inside are provided with image chip 10 and plain conductor 30, wherein this plain conductor 30 is electrically connected this image chip 10 and this substrate 21, makes it become an existing camera lens module.
In existing camera lens module, reach by plain conductor 30 and to be electrically connected this substrate 21 and this image chip 10, this application has been reduced or remitted and has been increased scolding tin again connect substrate 21 below chip 10, and can spy on the height that reduces the camera lens module has been the trend place.
Yet, the camera lens module can clean lens mount 82 inside of ccontaining image chip 10 in the process of making, in existing process of cleaning, plain conductor 30 has the risk that is interrupted, and further, existing camera lens module is on using, need to see through the next electric binding of electrical equipment module of film 80 (film) to the outside, in this process, limited the target that reduces camera lens module height, also need spend cost simultaneously and be forwarded on the film (film) at these external electrical equipment.
To sum up,, need one can improve fine ratio of product and protection quality bills of materials at present, also can reach the method that reduces cost simultaneously in the face of the challenge of yield and competitive power lifting.
Summary of the invention
Because the shortcoming of prior art; the object of the present invention is to provide a kind of camera lens module and manufacture method thereof; by defining the stuff of camera lens module body; the metal lead wire protection that will link image chip and lead frame is lived when avoiding cleaning it is destroyed; also utilize lead frame to reach camera lens module side simultaneously and have the characteristic of contact, the convenient chimeric equipment of going into to use on using with side pin.
The invention provides a kind of manufacture method of camera lens module, comprising: an image chip is provided, and this image chip has an image sensing district and a plurality of contact; One lead frame is provided, this lead frame has a first surface and a second surface, a plurality of contacts of the corresponding aforementioned image chip of this first surface are provided with a plurality of first pins, this second surface is provided with a plurality of second pins, the second pin electrical communication of first pin of this first surface and this second surface; One adhesion layer is provided, and this adhesion layer is in conjunction with this image chip and this lead frame; A plurality of plain conductors are provided, and this plain conductor is electrically connected a plurality of contacts of this image chip and a plurality of first pins of this lead frame first surface, forms an image chip module; Aforementioned image chip module is inserted a mould; Provide stuff to this mould and treat this stuff setting back this mould of removal; Provide a transparent carrier to this image chip module; And provide lens mount to this image chip module, to form the camera lens module.
Preferably, this plain conductor material is gold, copper or aluminium.
Preferably, a plurality of second pins of this second surface of this lead frame place on this lead frame edge, and these a plurality of second pin, one ends extend into relatively this first and opposite side the 3rd surface of this second surface on.
Preferably, providing stuff to this mould and behind this mould of removal, clean this image chip module.
In addition, the present invention also provides a kind of camera lens module of being made by preceding method, comprising: an image chip, this image chip have an image sensing district and a plurality of contact; One lead frame, this lead frame has a first surface and a second surface, a plurality of contacts of the corresponding aforementioned image chip of this first surface are provided with a plurality of first pins, and this second surface is provided with a plurality of second pins, the second pin electrical communication of first pin of this first surface and this second surface; One adhesion layer, this adhesion layer is in conjunction with this image chip and this lead frame; At least one plain conductor, this plain conductor connect a plurality of contacts of this image chip first surface and a plurality of first pins of this lead frame first surface; One stuff place on this image chip, this lead frame and this plain conductor to define its body; One transparent carrier, this transparent carrier place this image chip top; And a lens mount, be arranged on these stuff, form a camera lens module.
Preferably, this plain conductor material is gold, copper or aluminium.
Preferably, these stuff are glue.
Preferably, a plurality of second pins of this lead frame second surface place on the lead frame edge, and second pin, one end extends into the 3rd surface of first and second surperficial opposite side relatively.
The present invention is significant with respect to the effect of prior art: camera lens module of the present invention and manufacture method thereof, can reach the height and the fine ratio of product of raising in cleaning course that reduce the camera lens module, also conveniently be applied to the distinct device module by the side pin in addition, camera lens module of the present invention has significantly concrete effect really.
Description of drawings
Figure 1A is the sectional view of image chip of the present invention.
The sectional view that Figure 1B combines with lead frame for image chip of the present invention.
Fig. 1 C is the sectional view of image chip module of the present invention.
Fig. 1 D inserts the sectional view of mould for image chip module of the present invention.
Fig. 1 E is the sectional view of removal mould after the image chip module of the present invention filling.
Fig. 1 F is provided with the sectional view of transparent carrier for image chip module of the present invention.
Fig. 1 G is the sectional view of camera lens module of the present invention.
Fig. 2 A is for being provided with the front elevational view of transparent carrier after the image chip module of the present invention filling.
Fig. 2 B is for being provided with the stereo rearview of transparent carrier after the image chip module of the present invention filling.
Fig. 3 is the sectional view of existing camera lens module.
The main element symbol description
1......... camera lens module 1 ' ... ... the image chip module
10......... image chip 11......... image sensing district
12......... contact 13......... first surface
20......... lead frame 21......... substrate
22......... the first pin 23......... first surface
24......... second surface 25......... second pin
26......... the 3rd surperficial 30......... plain conductor
40......... mould 50......... stuff
55......... adhesion layer 60......... transparent carrier
70......... lens mount 80......... film
81......... scolding tin 82......... lens mount
Embodiment
Filled and part described though the present invention will consult contain preferred embodiment of the present invention appended graphic, before this describes, be should be appreciated that the personage who is familiar with one's own profession can be modified in invention described herein, obtains effect of the present invention simultaneously.Therefore, must understand following description to the personage that is familiar with one's own profession skill and Yan Weiyi discloses widely, and its content does not lie in restriction the present invention.
See also shown in Figure 1A to Fig. 1 G, be the synoptic diagram of the manufacture method embodiment of camera lens module of the present invention.One image chip 10 at first is provided, and the first surface 13 of this image chip 10 has an image sensing district 11 and a plurality of contact 12, shown in Figure 1A.
One lead frame 20 is provided, this lead frame 20 has a first surface 23, the 3rd surface 26 on one second surface 24 and relative this first and second surface, wherein, this first surface 23 has a plurality of first pins 22, these a plurality of first pins 22 are with respect to a plurality of contacts 12 on the aforementioned image chip 10, and the second surface 24 of this lead frame 20 has second pin 25 that a plurality of design configurations are crossed, what deserves to be mentioned is, second pin, 25 1 ends of this second surface 24 extend on relative the 3rd surface 26, but form the pin of a contacts side surfaces, and first pin 22 of this first surface 23 and second pin, 25 electrical communication of this second surface 24.Then, provide an adhesion layer 55, in conjunction with this image chip 10 and this lead frame 20, shown in Figure 1B.
A plurality of plain conductors 30 are provided, these plain conductor 30 materials are gold, copper or aluminium, and method by the circuit printing plate routing, with corresponding a plurality of first pin, 22 electrical communication on the first surface 23 of a plurality of contacts 12 of this image chip 10 and this lead frame 20, form an image chip module 1 ', shown in Fig. 1 C.
Aforementioned image chip module 1 ' is inserted in the mould 40 that a body design configurations crosses, shown in Fig. 1 D.And when this image chip module 1 ' places in the mould 40; after utilizing stuff 50 to insert these mould 40 interior typings; this mould 40 of removal again; the body of this image chip module 1 ' is to define shaping at this moment; these stuff 50 are protection plain conductor 30 further; shown in Fig. 1 E, what deserves to be mentioned is that these stuff 50 are glue.
Then utilize air pressure gun to clean this image chip module, the grit that will be located at 11 tops, image sense lateral areas during by cleaning is got rid of to the image chip module, to improve fine ratio of product, after cleaning, provide a transparent carrier 60 to be bonded on this image chip module, this transparent carrier 60 can be a glass, shown in Fig. 1 F.
At last, provide a lens mount 70 to be bonded on this image chip module 1 ', form a camera lens module 1, shown in Fig. 1 G.
The present invention also provides a kind of camera lens module, please continue to be the sectional view of camera lens module of the present invention with reference to shown in the figure 1G.Camera lens module 1 of the present invention comprises an image chip 10, a lead frame 20, at least one plain conductor 30, an adhesion layer 55, a transparent carrier 60, stuff 50 and a lens mount 70.
The first surface 13 of this image chip 10 has an image sensing district 11 and a plurality of contact 12.And this lead frame 20 has the 3rd surface 26 on a first surface 23, a second surface 24 and relative this first and second surface, this first surface 23 has a plurality of first pins 22 of a plurality of contacts 12 of corresponding aforementioned image chip 10, this second surface 24 has a plurality of second pins 25, first pin 22 of this first surface 23 and second pin, 25 electrical communication of this second surface 24.
Above-mentioned image chip 10 and lead frame 20 are the plain conductor 30 and an adhesion layer 55 combinations of gold by material, this plain conductor 30 is electrically connected a plurality of contacts 12 and this lead frame 20 first surfaces 23 corresponding a plurality of first pins 22 of these image chip 10 first surfaces 13, this adhesion layer 55 then links this image chip 10 and this lead frame 20, makes it to be combined as a whole.
These stuff 50 are arranged at and have defined its body on this image chip 10, this lead frame 20 and this plain conductor 30 and protected this plain conductor 30.And this transparent carrier 60 is positioned at this image chip top, in order to protect the image sensing district 11 of this image chip 10.This lens mount 70 is arranged on these stuff 50 at last, forms a camera lens module 1.
What deserves to be mentioned is again, please refer to shown in Fig. 2 A and the 2B, for the front elevational view and the rear view of transparent carrier are set after the image chip module of the present invention filling.This image chip module 1 ' can pass through the characteristic of the side contact of second pin 25 after stuff 50 fillings are defined body and transparent carrier 60 is set, the distinct device module is advanced in ease of assembly and embedding.
The above is embodiments of the invention only, is not in order to limit interest field of the present invention; All other do not break away from the equivalence of being finished under the disclosed spirit and changes or modification, all should be included in the claim scope of the present invention.
Claims (8)
1. the manufacture method of a camera lens module is characterized in that, comprising:
One image chip is provided, and this image chip has an image sensing district and a plurality of contact;
One lead frame is provided, this lead frame has a first surface and a second surface, a plurality of contacts of the corresponding aforementioned image chip of this first surface are provided with a plurality of first pins, this second surface is provided with a plurality of second pins, the second pin electrical communication of first pin of this first surface and this second surface;
One adhesion layer is provided, and this adhesion layer is in conjunction with this image chip and this lead frame;
A plurality of plain conductors are provided, and this plain conductor is electrically connected a plurality of contacts of this image chip and a plurality of first pins of this lead frame first surface, forms an image chip module;
Aforementioned image chip module is inserted a mould;
Provide stuff to this mould and treat this stuff setting back this mould of removal;
Provide a transparent carrier to this image chip module; And
Provide lens mount to this image chip module, to form the camera lens module.
2. the manufacture method of camera lens module as claimed in claim 1 is characterized in that, this plain conductor material is gold, copper or aluminium.
3. the manufacture method of camera lens module as claimed in claim 1, it is characterized in that, a plurality of second pins of this second surface of this lead frame place on this lead frame edge, and these a plurality of second pin, one ends extend into relatively this first and opposite side the 3rd surface of this second surface on.
4. the manufacture method of camera lens module as claimed in claim 1 is characterized in that, providing stuff to this mould and behind this mould of removal, cleans this image chip module.
5. a camera lens module is characterized in that, comprising:
One image chip, this image chip have an image sensing district and a plurality of contact;
One lead frame, this lead frame has a first surface and a second surface, a plurality of contacts of the corresponding aforementioned image chip of this first surface are provided with a plurality of first pins, and this second surface is provided with a plurality of second pins, the second pin electrical communication of first pin of this first surface and this second surface;
One adhesion layer, this adhesion layer is in conjunction with this image chip and this lead frame;
At least one plain conductor, this plain conductor connect a plurality of contacts of this image chip first surface and a plurality of first pins of this lead frame first surface;
One stuff place on this image chip, this lead frame and this plain conductor to define its body;
One transparent carrier, this transparent carrier place this image chip top; And
One lens mount is arranged on these stuff, forms a camera lens module.
6. camera lens module as claimed in claim 5 is characterized in that, this plain conductor material is gold, copper or aluminium.
7. camera lens module as claimed in claim 5 is characterized in that, these stuff are glue.
8. camera lens module as claimed in claim 5 is characterized in that, a plurality of second pins of this lead frame second surface place on the lead frame edge, and second pin, one end extends into the 3rd surface of first and second surperficial opposite side relatively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101062710A CN101109839A (en) | 2006-07-17 | 2006-07-17 | Lens module and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101062710A CN101109839A (en) | 2006-07-17 | 2006-07-17 | Lens module and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101109839A true CN101109839A (en) | 2008-01-23 |
Family
ID=39041981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101062710A Pending CN101109839A (en) | 2006-07-17 | 2006-07-17 | Lens module and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101109839A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103364911A (en) * | 2012-04-11 | 2013-10-23 | 全球微型光学有限公司 | Optical lens module and manufacturing method thereof |
| CN103513387A (en) * | 2012-06-27 | 2014-01-15 | 全球微型光学有限公司 | Method for manufacturing optical lens module |
-
2006
- 2006-07-17 CN CNA2006101062710A patent/CN101109839A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103364911A (en) * | 2012-04-11 | 2013-10-23 | 全球微型光学有限公司 | Optical lens module and manufacturing method thereof |
| CN103513387A (en) * | 2012-06-27 | 2014-01-15 | 全球微型光学有限公司 | Method for manufacturing optical lens module |
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