CN101107501B - Laser heating device and laser heating method - Google Patents
Laser heating device and laser heating method Download PDFInfo
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- CN101107501B CN101107501B CN2006800028693A CN200680002869A CN101107501B CN 101107501 B CN101107501 B CN 101107501B CN 2006800028693 A CN2006800028693 A CN 2006800028693A CN 200680002869 A CN200680002869 A CN 200680002869A CN 101107501 B CN101107501 B CN 101107501B
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- infrared ray
- heating device
- ray sensor
- temperature
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
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-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/60—Radiation pyrometry, e.g. infrared or optical thermometry using determination of colour temperature
- G01J5/602—Radiation pyrometry, e.g. infrared or optical thermometry using determination of colour temperature using selective, monochromatic or bandpass filtering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Human Computer Interaction (AREA)
- Laser Beam Processing (AREA)
- Radiation Pyrometers (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
A laser heating device and a laser heating method enabling soldering that does not burn the periphery and resin bonding that does not burn resin by detecting a temperature change when solder or resin at a processing point is melted and an abnormal heating that may indicate a possible burn occurrence. An IR sensor (9) generates a signal based on the integrated value of the spectral radiation luminance of an IR ray radiated from solder to be heated. Prior to an actual soldering, a relational expression between the calibration values of an output signal from the IR sensor (9) and an actual master solder measuring temperature is determined in advance. At an actual soldering, an IR ray radiated from solder (3) is received by the IR sensor (9) and the temperature of the solder (3) is calculated based on an output signal from the IR sensor (9) and the above relational expression.
Description
Technical field
The present invention relates to utilize the laser that for example penetrates, carry out soldering, resin-bonded or welding etc. and add laser heating device and the laser heating method that hot-working is handled from semiconductor laser.
Background technology
In the past, as utilizing laser to carry out the contactless laser heating device that hot-working is handled that adds, a kind of device is for example proposed, this device is made of (for example, with reference to JP2002-9388A) the condenser lens of a plurality of laser diodes being piled up the laser diode module (semiconductor laser array) that forms, will being focused on from the collimation lens of the collimating of laser (parallel photochemical) of aforementioned a plurality of laser diodes ejaculations and laser that will collimation.Constitute according to this, the object that is heated that laser heating device in the past can be opposite to the focal position of condenser lens adds the hot-working processing.
But, utilizing the adding during hot-working handles of laser, as long as prolonged exposure laser, the temperature that then is heated target object constantly rises, but in the formation of above-mentioned laser heating device in the past, when carrying out soldering or resin-bonded, can not measure the temperature that is heated target object, can not detect the abnormal heating of the sign that the periphery that becomes scolding tin or resin burn.
Summary of the invention
The present invention in view of the above problems, its purpose is to provide the abnormal heating that can detect the temperature variation when fusions such as the scolding tin of processing stand or resin or become the sign of burning, and carries out the laser heating device and the laser heating method of resin-bonded that soldering that periphery do not burn or resin do not burn etc.
In order to achieve the above object, the present invention is provided with the infrared ray sensor of generation according to the signal of the aggregate-value of the ultrared spectral radiance that is heated the target object radiation from scolding tin or resin etc.And, before carrying out LASER HEATING processing processing, obtain the output signal and the relational expression of calibration of aforementioned infrared ray sensor in advance with the calibration value of the observed temperature that is heated target object.Then, when carrying out LASER HEATING processing and handling,, calculate the temperature that is heated target object actual according to the output signal and the aforementioned relational expression of aforementioned infrared ray sensor.
That is, the described laser heating device in the present invention the 1st aspect has: penetrate the laser injection part to the laser that is heated the target object irradiation; Generation is according to the infrared ray sensor of the signal of the aggregate-value of the ultrared spectral radiance that is subjected to light with sensitive surface; Acceptance is from the aforementioned light that is heated target object and periphery radiation or reflection, and will be except the optical system of the infrared ray the light of the wavelength of aforementioned laser to the sensitive surface guiding of aforementioned infrared ray sensor; The storage part of the relational expression of the calibration value of the signal level that generates of the aforementioned infrared ray sensor of memory by using and the aforementioned observed temperature that is heated target object in advance; And according to signal and the aforementioned relational expression of utilizing aforementioned infrared ray sensor to generate, calculate the aforementioned temperature measuring portion that is heated the temperature of target object.
In addition, the described laser heating device in the present invention the 2nd aspect is aspect the present invention the 1st in the described laser heating device, and the aforementioned laser injection part penetrates the laser of the following wavelength of 1.6 μ m.
In addition, the described laser heating device in the present invention the 3rd aspect is aspect the present invention the 1st in the described laser heating device, and the sensitivity the during wavelength of aforementioned infrared ray sensor more than 1.2 μ m is peak value.
In addition, the described laser heating device in the present invention the 4th aspect is aspect the present invention the 1st in the described laser heating device, and aforementioned optical system is with the infrared ray of the long wavelength more than the aforementioned laser wavelength, to the sensitive surface guiding of aforementioned infrared ray sensor.
In addition, the described laser heating device in the present invention the 5th aspect is aspect the present invention the 2nd in the described laser heating device, and aforementioned optical system only sees through the infrared ray of particular range of wavelengths.
In addition, the described laser heating device in the present invention the 6th aspect is in the described laser heating device, also to have shooting from the aforementioned camera head that is heated the visible light of target object and periphery thereof aspect the present invention the 1st.
In addition, the described laser heating device in the present invention the 7th aspect is in the described laser heating device, the hole that regulation is carried out the zone of temperature measuring to be set aspect the present invention the 1st.
In addition, the described laser heating device in the present invention the 8th aspect, be aspect the present invention the 1st in the described laser heating device, aforementioned infrared ray sensor has relative sensitivity more than 10% for the wavelength more than the 1.2 μ m, generates according to be subjected to ultrared 10 of light with sensitive surface
-5W/ (cm
2Sr μ m) signal of the aggregate-value of Yi Shang spectral radiance.
In addition, the described laser heating device in the present invention the 9th aspect is aspect the present invention the 1st in the described laser heating device, and aforementioned infrared ray sensor is the InGaAsPIN photodiode.
In addition, the described laser heating device in the present invention the 10th aspect is aspect the present invention the 1st in the described laser heating device, and the laser radiation scope of processing stand forms point-like.
In addition, the described laser heating device in the present invention the 11st aspect is in the described laser heating device, also to have the optical system that the laser radiation scope that makes machined surface forms rectangle or oval usefulness aspect the present invention the 1st.
In addition, the described laser heating device in the present invention the 12nd aspect, be aspect the present invention the 1st in the described laser heating device, also has the scanning reflection mirror more than at least 1, the aforementioned laser that aforementioned scanning reflection mirror is used for penetrating from the aforementioned laser injection part reflects, machined surface is carried out line sweep irradiation or bidimensional scanning irradiation with aforementioned laser, make the laser radiation scope of machined surface form rectangle or ellipse.
In addition, the described laser heating device in the present invention the 13rd aspect, be aspect the present invention the 1st in the described laser heating device, the aforementioned laser injection part has the laser diode more than 2 that penetrates aforementioned laser, also has optical system, aforementioned optical system is used for aforementioned each laser that penetrates from aforementioned each laser diode is suppressed dispersing of FAST direction, utilizes and has suppressed this aforementioned each laser of dispersing, makes the laser radiation scope of machined surface form rectangle or ellipse.
In addition, the described laser heating device in the present invention the 14th aspect is aspect the present invention the 1st in the described laser heating device, and the aforementioned laser injection part has: the laser diode more than 2 that penetrates aforementioned laser; The lens of dispersing usefulness that aforementioned each laser that penetrates from aforementioned each laser diode suppressed the FAST direction; And engage with aforementioned lens, and can adjust aforementioned lens penetrate the position of end face with respect to aforementioned each laser diodes adjusting mechanism, be used to aforementioned each laser, make the laser radiation scope of machined surface form rectangle or ellipse from aforementioned lens.
In addition, the described laser heating device in the present invention the 15th aspect, be aspect the present invention the 1st in the described laser heating device, also has control part, if the variable quantity of the output signal level of aforementioned infrared ray sensor reaches the setting variable quantity, then aforementioned control part makes the aforementioned laser injection part stop to penetrate aforementioned laser, and perhaps the laser power with regulation penetrates aforementioned laser intermittently.
In addition, the described laser heating method in the present invention the 16th aspect, be to heat the laser heating method that this is heated target object to being heated the target object irradiating laser, to during being heated the target object irradiating laser, towards the aforementioned sensitive surface of generation according to the infrared ray sensor of the signal of the aggregate-value of the ultrared spectral radiance that is subjected to light with sensitive surface, guiding is from the aforementioned light that is heated target object and periphery radiation or reflection, infrared ray except the light of the wavelength of aforementioned laser, according to the signal that utilizes aforementioned infrared ray sensor to generate, and the aforementioned relational expression that is heated observed temperature with the calibration value of the signal level of utilizing aforementioned infrared ray sensor to generate of target object of trying to achieve in advance, calculate the aforementioned temperature that is heated target object.
In addition, the described laser heating method in the present invention the 17th aspect, be aspect the present invention the 16th, in the described laser heating method, machined surface to be carried out line sweep irradiation or bidimensional scanning irradiation with aforementioned laser, make the laser radiation scope of machined surface form rectangle or ellipse.
In addition, the described laser heating method in the present invention the 18th aspect, be aspect the present invention the 16th in the described laser heating method, if the variable quantity of the output signal level of aforementioned infrared ray sensor reaches the setting variable quantity, then stop to penetrate aforementioned laser, perhaps the laser power with regulation penetrates aforementioned laser intermittently.
According to the present invention, the rapid temperature variation of temperature variation, scolding tin or resin etc. by detecting processing stand before and after fusion changes and the rapid temperature variation of burning front and back at the periphery or the resin of scolding tin, can the situation of having carried out desirable processing such as soldering or resin-bonded be detected and detect burning, prevent and burn etc.Have again, can also utilize camera head to observe machining state.In addition, utilize the hole to detect to be heated target object periphery small ad-hoc location or be heated the temperature variation of the small ad-hoc location on the target object, can detect this ad-hoc location and burn and prevent and burn etc.
In addition, form rectangle or ellipse, can adapt to fully terminal pad and resin substrate machined surface side by side as FPIC or FPC etc. is carried out soldering etc. by making the laser radiation scope.
In addition, the variable quantity of the output signal level by monitoring infrared ray sensor can access the output signal of the infrared ray sensor that does not contain the temperature drift equal error, and stable control is heated the temperature of target object.
Description of drawings
Figure 1 shows that the pie graph of the laser heating device of the invention process form 1.
Figure 2 shows that the spectral sensitivity performance plot of the InGaAsPIN photodiode of the invention process form 1.
Figure 3 shows that the infrared absorption character figure of optical component material.
Figure 4 shows that ultrared spectral radiance performance plot from blackbody radiation.
Figure 5 shows that the practical radiance figure (temperature of processing stand is 227 ℃ a situation) of the InGaAsPIN photodiode detection of the invention process form 1.
Figure 6 shows that the practical radiance figure (temperature of processing stand is 127 ℃ a situation) of the InGaAsPIN photodiode detection of the invention process form 1.
Figure 7 shows that the practical radiance figure (temperature of processing stand is 327 ℃ a situation) of the InGaAsPIN photodiode detection of the invention process form 1.
Figure 8 shows that the pie graph of the laser heating device of the invention process form 2.
Figure 9 shows that the pie graph of the laser heating device of the invention process form 3.
Figure 10 shows that the pie graph of the laser heating device of the invention process form 4.
Figure 11 shows that the pie graph of the laser heating device of the invention process form 5.
Figure 12 shows that the pie graph of the laser heating device of the invention process form 6.
Figure 13 shows that the pie graph of the laser heating device of the invention process form 7.
Figure 14 shows that the pie graph of the laser heating device of the invention process form 8.
Figure 15 shows that the pie graph of the laser heating device of the invention process form 9.
The key diagram of shape (laser radiation scope) usefulness of the laser that Figure 16 forms on machined surface for the laser heating device of explanation the invention process form 9.
Figure 17 shows that the pie graph of a concrete example of the laser injection part that the laser heating device of the invention process form 10 has.
The key diagram that Figure 18 uses for the laser power control of the laser heating device of explanation the invention process form 11.
The key diagram that Figure 19 uses for the laser power control of the laser heating device of explanation the invention process form 11.
Embodiment
Below, with reference to the laser heating device and the laser heating method of description of drawings the invention process form.
In following example, the infrared ray sensor of generation according to the signal of the aggregate-value of the ultrared spectral radiance that is subjected to light with sensitive surface is set.And, before carrying out LASER HEATING processing processing, obtain the output signal and the relational expression of calibration of aforementioned infrared ray sensor in advance with the calibration value of the observed temperature that is heated target object.Then, actual when carrying out LASER HEATING processing and handling, will be from the aforementioned light that is heated target object and periphery radiation or reflection, the infrared ray except the light of the wavelength of aforementioned laser is to the aforementioned sensitive surface guiding of aforementioned infrared ray sensor, the signal that generates according to aforementioned infrared ray sensor reaches the aforementioned relational expression of obtaining in advance, calculates the temperature that is heated target object.
(example 1)
Figure 1 shows that the formation of the laser heating device of this example 1.Laser heating device heats this and is heated target object being heated the target object irradiating laser.
In Fig. 1, laser injection part 1 penetrates the laser of certain wavelength.The laser injection part has for example semiconductor laser or semiconductor excitation laser.Here to produce wavelength be that the situation of laser diode of the laser generation of 920nm is that example describes to have.In addition, optical maser wavelength is not limited to 920nm certainly.Usually, the wavelength of laser diodes is below the 1.6 μ m.
If utilize laser radiation that scolding tin 3 is heated, then from the terminal pad 5 and tellite 4 infrared radiations of scolding tin 3 and periphery thereof.In addition, from scolding tin 3 and periphery thereof laser and the visible light that shines reflected.The light that laser cutoff filter 6 is accepted from scolding tin 3 radiation such as grade or reflection is by the light of Wavelength of Laser (920nm).Visible light cutoff filter 7 is accepted the transmitted light of laser cutoff filter 6, by visible light.Thereby the infrared ray of the light except Wavelength of Laser from the infrared ray of scolding tin 3 radiation such as grade (infrared ray) is incident to condenser lens 8.
The signal that infrared ray sensor 9 generates according to the aggregate-value of the ultrared spectral radiance that is subjected to light with sensitive surface 10.Here as infrared ray sensor, be to be that the InGaAsPIN photodiode of the range of sensitivity of the regulation of peak value is that example describes to have sensitivity when the wavelength of 2.3 μ m.
In addition, though not shown, this laser heating device has: the storage part of the relational expression of the calibration value (corrected value) of the signal level of memory by using infrared ray sensor 9 generations in advance and the observed temperature of scolding tin 3; And according to signal and the aforementioned relational expression of utilizing infrared ray sensor 9 to generate, the temperature measuring portion of calculating the temperature of scolding tin 3 is a microcomputer.
Below, with the curve of Fig. 2 to Fig. 7, the principle of the temperature measuring of this example 1 is described.Figure 2 shows that the sensitivity that has when the wavelength of 2.3 μ m is the spectral sensitivity characteristic of InGaAsPIN photodiode of the range of sensitivity of the regulation of peak value.As shown in Figure 2, this InGaAsPIN photodiode has relative sensitivity more than 10% for the wavelength of 1.2 μ m～2.6 μ m.
Figure 3 shows that employed optical component materials such as condenser lens and half-mirror described later are the transmissivity (infrared absorption character) of BK7 (borosilicic acid crown glass), synthetic quartz and anhydrous synthetic quartz.In Fig. 3, solid line is represented the transmittance graph of BK7, and dot-and-dash line is represented the transmittance graph of synthetic quartz, and dotted line is represented the transmittance graph of anhydrous synthetic quartz.Below, describe as example as the situation of optical component material to use BK7.
Fig. 4 is for being called as so-called Planck's law of radiation, and expression is from the ultrared spectral radiance characteristic of blackbody radiation.Here as an example, be illustrated in 0 ℃ (273K), measure near near the i.e. spectral radiance curve of temperature the fusing point of 127 ℃ (400K), Pb-free solder when promptly 227 ℃ (500K) and near the temperature the temperature that the periphery of Pb-free solder burns are 327 ℃ (600K) of temperature the lower limit temperature.In addition, the radiance of curve represents 10
-8More than the W/ (cm2sr μ m), but practical going up for fear of the influence of disturbing uses 10
-5W/ (cm2sr μ m) is above as practical zone.
Fig. 5 is to the temperature that Figure 7 shows that processing stand (being heated target object) the practical radiance that infrared ray sensor (InGaAsPIN photodiode) 9 detects 227 ℃, 127 ℃, 327 ℃ the time.In Fig. 5 to Fig. 7, dotted line is represented the ultrared spectral radiance curve from the processing stand radiation, the optical component material that dot-and-dash line represents to see through condenser lens etc. is the ultrared spectral radiance curve behind the BK7, and solid line is represented the ultrared practical radiance curve that infrared ray sensor 9 detects.
Like this, in fact infrared ray sensor 9 detects Fig. 5 that spectral sensitivity characteristic shown in Figure 2 and infrared absorption character shown in Figure 3 and spectral radiance characteristic shown in Figure 4 are multiplied each other to solid line shown in Figure 7.Then, infrared ray sensor 9 generates according to this solid line and 10
-5The area of the scope that the straight line of W/ (cm2sr μ m) surrounds (is subjected to ultrared 10 of light with sensitive surface 10
-5The signal of the signal level aggregate-value of the spectral radiance that W/ (cm2sr μ m) is above).
To shown in Figure 7, the output signal level of infrared ray sensor 9 is very little in the time of 127 ℃ as Fig. 5, if become 227 ℃, then increases to more than 5 times, and in the time of 327 ℃, monotone increasing adds to more than 10 times again.
Thereby, before implementing actual LASER HEATING processing processing, to imbedding the calibration scolding tin irradiating laser of the thermopair of calibrating usefulness, obtain the relational expression of the calibration value of the output signal level of infrared ray sensor 9 and the output signal level of thermopair (observed temperature) in advance, by like this in the processing of the LASER HEATING of reality is handled, can correctly measure the temperature of scolding tin 3 basically.
In addition, only for example also can use the long wavelength that can the tranmittance Wavelength of Laser will grow particular range of wavelengths light optical bandpass filter (below, be called BPF), for example, replace the laser cutoff filter at the sensitive surface configuration BPF of infrared ray sensor 9.When using BPF,, use the infrared ray sensor that the light of the particular range of wavelengths that sees through BPF is had practical sensitivity as the infrared ray sensor of the transmitted light of accepting BPF.Utilize this formation, can detect the situation that processing stand (being heated target object) is reached specified temp.That is, according to this formation, because when processing stand was reached specified temp, the output signal level of infrared ray sensor 9 sharply rose, so BPF produces effect when detecting specified temp.
For example, only seeing through wavelength is that 1064nm and full width at half maximum are the ultrared BPF of the narrow bandwidth of 10 μ m, near about 200 degree (near the temperature the fusing point of scolding tin) of situations reach to(for) the detection processing stand are useful, by keeping this temperature, can realize the soldering that certain fusion and periphery do not burn.
In addition, by spectral radiance characteristic shown in Figure 4 as can be known, in order to measure the temperature be heated target object more than 400K, the sensitivity when infrared ray sensor preferably has wavelength more than 1.2 μ m is the range of sensitivity of the regulation of peak value.
As mentioned above, according to this example 1, if processing stand (being heated target object) is reached the above temperature of 100 degree, then capture the output signal level of the infrared ray sensor of rapid increase, can correctly measure the temperature that is heated target object that always rises in the laser radiation basically, more than 400K.
Thereby, the rapid temperature variation of temperature variation, scolding tin or resin etc. by detecting processing stand (being heated target object) before and after fusion changes and the rapid temperature variation of burning front and back at the periphery or the resin of scolding tin, can detect, reach and detect oneself situation of desirable processing such as soldering or resin-bonded, prevent and burn through finishing to burning.
(example 2)
Figure 8 shows that the formation of the laser heating device of this example 2.Among the figure, for the identical member of member according to Fig. 1 explanation, additional same label, and omit explanation.
In Fig. 8, optical fiber 11 will be from the laser of laser injection part 1 to aerial ejaculation.Collimation lens 12 will form directional light (below, be called collimated light) from the laser of optical fiber 11.Half-mirror 13 is added Thin Film Filter,, make from the terminal pad 5 of scolding tin 3 and periphery thereof and the light transmission of tellite 4 radiation or reflection with the collimated light reflection.In addition, also can use the half-mirror that adds the thin-film covering layer that only for example 920nm (light of Wavelength of Laser) is reflected.In addition, also can dispose the folding BPF that the infrared ray of the particular range of wavelengths that can only make the long wavelength longer than Wavelength of Laser sees through, replace half-mirror.
In this example 2, optical system is accepted the light from scolding tin 3 and periphery radiation or reflection, will be except sensitive surface 10 guiding of the infrared ray of the light of Wavelength of Laser (920nm) to infrared ray sensor 9, this optical system utilizes half-mirror 13 and laser cutoff filter 6 and visible light cutoff filter 7 and condenser lens 8 to constitute.In addition, the configuration sequence of condenser lens 8 and laser cutoff filter 6 and visible light cutoff filter 7 can be arbitrarily.
In addition, this laser heating device adopts from the formation of measurement instrument 15 to laser injection part 1 output detection signal.According to this formation, when detecting rapid temperature variation before and after fusion changes of scolding tin 3 for example, can reduce laser power, perhaps in the front and back that the periphery that detects scolding tin 3 burns during rapid temperature variation, stop laser generation, thereby can finish soldering automatically and prevent to burn.
According to above formation, temperature displayed changes on the measurement instrument 15 by observing, and can carry out the fusion detection of scolding tin, general temperature detection and the detection of burning generation.In addition, as mentioned above, can also finish soldering automatically and prevent to burn.In addition, identical with example 1, also can be on the sensitive surface 10 of infrared ray sensor 9, the ultrared BPF of the long wavelength's that configuration only can the tranmittance Wavelength of Laser will be grown particular range of wavelengths.In addition, be to be illustrated for the situation that laser is formed directional light, even but the F value of adjustment collimation lens forms non-collimating status, but, also can access same effect by the exit wound of bullet of shortening optical fiber and the distance between the half-mirror.
(example 3)
Figure 9 shows that the formation of the laser heating device of this example 3.Among the figure, for the identical member of member according to Fig. 1, Fig. 8 explanation, additional same label, and omit explanation.
In Fig. 9, hot mirror 16 is accepted the transmitted light of half-mirror 13 by condenser lens 8, and with infrared reflection, sensitive surface 10 guiding to infrared ray sensor 9 make visible light transmissive, to 17 guiding of the 2nd laser cutoff filter.Accept camera (camera head) 18, take scolding tin 3 and periphery thereof by the visible light of laser cutoff filter 17.
In this example 3, optical system is accepted the light from scolding tin 3 and periphery radiation or reflection, will be except sensitive surface 10 guiding of the infrared ray of the light of Wavelength of Laser (920nm) to infrared ray sensor 9, simultaneously with visible light to camera 18 guiding, this optical system utilize half-mirror 13 and condenser lens 8 and 2 laser cutoff filters 6 and 17 and hot mirror 16 constitute.In addition, also can use the optical filter or the BPF of the long wavelength's that the tranmittance Wavelength of Laser will grow light, for example, replace laser cutoff filter 6 at the sensitive surface 10 configuration BPF of infrared ray sensor 9.
In this laser heating device, near the optical path axis 20 of the sensitive surface 10 of infrared ray sensor 9, installation provision carries out the hole 19 of the position of temperature measuring.Thereby, by changing size, shape or the allocation position in hole 19, change processing stand and detect the visual field 21, then can detect the temperature anomaly etc. of the periphery of scolding tin 3, perhaps measure the temperature of the specific part of laser radiation scope.
As mentioned above, according to this example 3,, can observe in the laser radiation appearance change with the temperature variation processing stand simultaneously of processing stand by having infrared ray sensor 9 and camera 18.In addition, because allocation position by changing hole 19 and size etc., can change the visual field of processing stand, therefore can detect the temperature change of burning and detect small ad-hoc location that periphery takes place, can prevent and burn etc.
In addition, also can use cold reflector to replace hot mirror with the allocation position of infrared ray sensor 9 and camera 18 conversely.In addition, also can be conversely with the allocation position of infrared ray sensor 9 and camera 18, the folding BPF that configuration can only make the infrared ray of the long wavelength's longer than Wavelength of Laser particular range of wavelengths see through replaces hot mirror.When configuration BPF replaces hot mirror, be incident to camera 18 with the BPF reflection and through the visible light behind the laser cutoff filter 17.Like this, camera 18 can be taken processing stand.According to this example 3, can one side monitor that one side realizes that certain fusion and periphery do not have the soldering of burning with camera.
In addition, be to be that example is illustrated with the soldering, but when carrying out the plural resin-bonded of resin-bonded or resin mark, can implement too.In addition, as infrared ray sensor, be to have adopted the InGaAsPIN photodiode, but, for example also can use compound semiconductor etc. so long as the sensitivity the during wavelength more than 1.2 μ m is the infrared ray sensor of peak value gets final product.
In addition, here for the purpose of simplifying the description,, be to adopt the ultrared BK7 of the above wavelength of the tectal absorption 1.7 μ m of no AR to describe, but also can be crown glass or achromat as optical components such as each condenser lens and catoptrons.Particularly anhydrous synthetic quartz, even at the limit point of the sensitivity of InGaAsPIN photodiode promptly near the 2.7 μ m, transmissivity does not reduce yet, and can improve the S/N ratio, is proper.In addition, also can apply AR overlayer to the wavelength of the range of sensitivity of infrared ray sensor.
(example 4)
In the laser heating device of above-mentioned each example 1～3, the shape (laser radiation scope) of the laser that forms at processing stand is defined as point-like (circle).Therefore, in the laser heating device of above-mentioned each example 1～3, not exclusively can adapt to for FPIC (field programmable interconnect component) and FPC such terminal pads such as (flexible printing wiring boards) and resin substrate machined surface side by side.
In this example 4, form rectangle or ellipse (below, be called rectangle etc.) by the shape that makes the laser that forms on the machined surface, can adapt to fully terminal pad and resin substrate machined surface side by side as FPIC or FPC etc. is carried out soldering etc.
In addition, in this example 4, will comprise the laser radiation scope of this rectangle etc. and periphery thereof in a big way as the sensing range (temperature observation zone) of infrared ray sensor.According to the Si Difen boltzmann law, because the proportional increase of 4 powers of infrared energy and temperature, therefore by enlarging the temperature observation zone of infrared ray sensor, the temperature that infrared ray sensor can promptly detect in this temperature observation zone when abnormal heating takes place rises, and can promptly reduce control such as laser power.
Figure 10 (a) is depicted as the formation of the laser heating device of this example 4.Among the figure, for the identical member of member according to Fig. 1, Fig. 8, Fig. 9 explanation, additional same label, and omit explanation.
In the laser heating device of this example 4, forming the optical system of usefulness such as rectangle as the shape that makes the laser that forms on the machined surface, is between half-mirror 13 and machined surface, the configuration cylindrical lens, replace condenser lens, this point is different with aforesaid example 3.
In Figure 10 (a), it is half-mirror 13 laser light reflected that cylindrical lens 22 is accepted to utilize folding mirror, forms the laser of rectangle etc. on machined surface.Here, as being heated target object, be to be that example describes with the scolding tin on each terminal pad that is coated on FPIC23.
The side view of Figure 10 (b) for from y direction laser heating device the time selects wherein collimation lens 12 and half-mirror 13 and cylindrical lens 22 and FPIC23 to represent.In addition, the vertical view of the shape of the laser that forms on the machined surface for expression of Figure 10 (c).
Shown in Figure 10 (b), (c), cylindrical lens 22 forms rectangle or ellipse (laser radiation scope 24) with the laser of the point-like (circle) of acceptance on machined surface.
By changing the distance of cylindrical lens 22, can adjust the size of the x direction of laser radiation scope 24 to machined surface.In addition, shown in Figure 10 (c), in this example 4, will be than the big scope of laser radiation scope 24 as temperature observation zone 25.
In addition, by adjusting the distance of collimation lens 12, can adjust the angle of divergence of laser to optical fiber 11.In addition, as described later, when the configuration cylindrical lens replaces collimation lens 12,, also can adjust the angle of divergence of laser by adjusting the distance of this cylindrical lens to optical fiber 11.
In Figure 10 (a), folding mirror 26 applied make visible light transmissive, near the thin-film covering layer or the Thin Film Filter of the infrared reflection the 2 μ m.Folding mirror 26 is accepted the transmitted light of half-mirror 13 by condenser lens 8 (achromat etc. have carried out the convex lens of spherical aberration correction), with near the infrared reflection the 2 μ m, sensitive surface 10 guiding to infrared ray sensor 9 guide visible light simultaneously to camera (for example CCD face of CCD camera) 18.The camera 18 of the visible light of the 2nd laser cutoff filter 17 has been passed through in acceptance, can amplify the observation machined surface undistortedly.
In addition, prime amplifier (amplifying circuit) the 14th, high-gain amplifier is amplified to the output signal level of infrared ray sensor 9 more than the hundred times.
In this example 4, the light of optical system acceptance (is heated target object and periphery thereof) from the temperature observation zone 25 radiation or reflection, will be except sensitive surface 10 guiding of the infrared ray of the light of Wavelength of Laser to infrared ray sensor 9, simultaneously with visible light to camera 18 guiding, this optical system utilizes half-mirror 13 and condenser lens 8 and folding mirror 26 and 2 laser cutoff filters 6 and 17 to constitute.
The laser power control of the laser heating device of this example 4 then, is described.
In Figure 10 (a), laser control apparatus 27 control laser powers, make the temperature be heated target object reach predefined design temperature Ts, this laser control apparatus 27 has: laser injection part 1, calculate the temperature levels translation circuit (temperature measuring portion) 28 of the temperature that is heated target object, control part 30 that the electric current of the laser diode (LD element) that laser injection part 1 has is supplied with in potentiometer 29 that design temperature Ts is set and control.In addition, though it is not shown, but laser control apparatus 27 also has storage part, the observed temperature of the scolding tin on the output signal level that this storage part is stored prime amplifier 14 in advance and each terminal pad that is coated on FPIC23 (for example be coated on the scolding tin on each terminal pad observed temperature mean value or be coated on the observed temperature etc. of the scolding tin on the specific terminal pad) the relational expression of calibration value (corrected value).
Temperature levels translation circuit 28 calculates the temperature that is heated target object according to the output signal and the aforementioned relational expression of prime amplifier 14, generates the signal of this temperature of expression.
In advance potentiometer 29 is set design temperature Ts, control part 30 is according to the output signal (being equivalent to be heated the temperature of target object) of temperature levels translation circuit 28 and the signal (being equivalent to design temperature Ts) that utilizes potentiometer 29 to produce, the electric current that control is supplied with laser injection part 1 makes the temperature that is heated target object become design temperature Ts.
Like this, according to this example 4, utilize cylindrical lens, can make the shape of the laser that forms on the machined surface form rectangle etc., for the soldering on such terminal pad such as FPIC and FPC and the resin substrate machined surface side by side or the resin-bonded of rectangular region or elliptical region, can adapt to fully.
In addition, move forward and backward, can amplify/dwindle the shape of the laser that forms on the machined surface arbitrarily, in addition, the length breadth ratio of the shape of this laser is changed arbitrarily by focal position or the fixed position that makes collimation lens 12 and cylindrical lens 22.
In addition, also can dispose cylindrical lens and replace collimation lens 12, the convex lens that configuration achromat etc. has carried out spherical aberration correction replace cylindrical lens 22.That is, also can at first utilize cylindrical lens that the length breadth ratio of laser is changed after, the laser convex lens focus with this length breadth ratio changes makes the shape of the laser that forms on the machined surface form rectangle etc.In this case, also move forward and backward, can amplify/dwindle the shape of the laser that forms on the machined surface arbitrarily, in addition, the length breadth ratio of the shape of this laser is changed arbitrarily by focal position or the fixed position that makes cylindrical lens and convex lens.
(example 5)
Figure 11 shows that the formation of the laser heating device of this example 5.Among the figure, for the identical member of member according to Fig. 1, Fig. 8, Fig. 9, Figure 10 explanation, additional same label, and omit explanation.
The laser heating device of this example 5 will return optical fiber from the infrared ray of temperature observation zone 25 radiation or reflection, to detect with laser injection part 1 built-in infrared ray sensor except the infrared ray from the light (infrared ray) of the Wavelength of Laser of temperature observation zone 25 radiation, this point is different with aforesaid example 4.
In Figure 11, optical fiber 11 has fiber core part 31 and cladding part 32.Penetrate laser from the fiber core part 31 of optical fiber 11.
Folding mirror 33 is applied infrared reflection, the thin-film covering layer that makes visible light transmissive or Thin Film Filter.Folding mirror 33 is accepted from the light of temperature observation zone 25 radiation or reflection by cylindrical lens 22, with infrared reflection, to collimation lens 12 guiding, makes visible light transmissive simultaneously, to condenser lens 8 guiding.
In this example 5, laser injection part 1 has LD element 34, condenser lens 35, folding mirror 36, infrared ray sensor 9 and prime amplifier 14.
Folding mirror 36 applied infrared ray is seen through but the Thin Film Filter or the thin-film covering layer of the reflection of the light of Wavelength of Laser.Folding mirror 36 will be from the laser-bounce of LD element 34 ejaculations, to condenser lens 35 guiding.Condenser lens 35 laser of autofolding catoptron 36 in the future guides to fiber core part 31.Like this, laser and optical fiber 11 couplings of penetrating from LD element 34.
On the other hand, folding mirror 36 is isolated the infrared ray of Wavelength of Laser from return the infrared ray that comes by cladding part 32, will guide to the sensitive surface 10 of infrared ray sensor 9 except the ultrared infrared ray of Wavelength of Laser.
In this example 5, optical system is accepted from the light of temperature observation zone 25 radiation or reflection, will be except sensitive surface 10 guiding of the infrared ray of the light of Wavelength of Laser to infrared ray sensor 9, this optical system utilize 2 folding mirrors 33 and 36 and condenser lens 35 constitute.In addition, also can between the sensitive surface 10 of folding mirror 36 and infrared ray sensor 9, the laser cutoff filter be set.In addition, identical with example 4, also can dispose cylindrical lens and replace collimation lens 12, the configuration convex lens replace cylindrical lens 22.
(example 6)
Figure 12 shows that the formation of the laser heating device of this example 6.Among the figure, for the identical member of member according to Fig. 1, Fig. 8～youngster explanation, additional same label, and omit explanation.
The shape of the laser that the laser heating device of this example 6 utilizes scanning reflection mirror to make to form on the machined surface forms rectangle etc., and this point is different with aforesaid example 5.That is, machined surface is carried out line sweep irradiation or bidimensional scanning irradiation with laser, make the laser radiation scope of machined surface form rectangle or ellipse.
In Figure 12, scanning reflection mirror 37 is applied infrared reflection, the thin-film covering layer that makes visible light transmissive or Thin Film Filter.In addition, scanning reflection mirror 37 can serve as that axle shakes with turning axle 38.Scanning reflection mirror 37 one sides serve as that axle back and forth only shakes predetermined angular with turning axle 38, and one side is the laser-bounce of self-focus lens 12 in the future.Condenser lens (achromat etc. have carried out the convex lens of spherical aberration correction) 2 will utilize these scanning reflection mirror that back and forth shakes 37 laser light reflected to focus on, and machined surface is carried out line sweep irradiation or bidimensional scanning irradiation with laser.The scope of this line sweep or bidimensional scanning becomes laser radiation scope 24.
In addition, also can constitute like this, the scanning reflection mirror more than 2 promptly is set, utilize back and forth shaking of each scanning reflection mirror, machined surface is carried out line sweep irradiation or bidimensional scanning irradiation with laser.
In addition, scanning reflection mirror 37 one sides are back and forth shaken, and one side will reflect from the infrared ray of temperature observation zone 25 radiation or reflection, by scanning reflection mirror 37, returns the cladding part 33 of optical fiber 11.
In this example 6, optical system is accepted from the light of temperature observation zone 25 radiation or reflection, will be except sensitive surface 10 guiding of the infrared ray of the light of Wavelength of Laser to infrared ray sensor 9, this optical system utilizes scanning reflection mirror 37 and folding mirror 36 and condenser lens 35 to constitute.
In addition, the transmitted light of scanning reflection mirror 37 is incident to camera 18 by condenser lens 8 and laser cutoff filter 17.
(example 7)
Figure 13 shows that the formation of the laser heating device of this example 7.Among the figure, for the identical member of member according to Fig. 1, Fig. 8～12 explanation, additional same label, and omit explanation.
In Figure 13, scanning reflection mirror 39 applied infrared ray is seen through and the Thin Film Filter or the thin-film covering layer of the reflection of the light of Wavelength of Laser.Scanning reflection mirror 39 is identical with example 6, and one side serves as that axle back and forth only shakes predetermined angular with turning axle 38, and one side is the laser-bounce of self-focus lens 12 in the future.
Except from the infrared ray of the light of the Wavelength of Laser of temperature observation zone 25 radiation by scanning reflection mirror 39, identical with aforesaid example 2, utilize condenser lens 8, by laser cutoff filter 6 and visible light cutoff filter 7, to sensitive surface 10 guiding of infrared ray sensor 9.
In this example 7, optical system is accepted from the light of temperature observation zone 25 radiation or reflection, will be except sensitive surface 10 guiding of the infrared ray of the light of Wavelength of Laser to infrared ray sensor 9, this optical system utilizes scanning reflection mirror 39 and laser cutoff filter 6 and visible light cutoff filter 7 and condenser lens 8 to constitute.
Like this, the laser heating device of this example 7 can constantly monitor from the infrared ray amount of whole temperature observation zone 25 radiation.
(example 8)
The laser heating device of this example 8 does not use optical fiber. the laser itself that the LD element (laser diode) that utilization has from the laser injection part penetrates shines machined surface, and this point is different with above-mentioned example 1～7.
Below, for the laser heating device of this example 8, the part different with above-mentioned each example 1～7 is described.But, then omit explanation for the part identical with above-mentioned each example 1～7.
Figure 14 shows that the formation of the laser heating device of this example 8.Among the figure, the side view of Figure 14 (a) for the time, Figure 14 (b) side view for from the direction laser heating device vertical the time with the SLOW direction of laser from the SLOW direction laser heating device of laser.In addition, for the identical member of member according to Fig. 1, Fig. 8～13 explanation, additional same label, and omit explanation.
In Figure 14 (a) and (b), LD element 40 penetrates the laser of certain wavelength.Here, as the LD element, use single radiator of monolithic.Cylindrical lens 41 is configured in the direction of dispersing that the laser that penetrates from LD element 40 is suppressed the FAST direction.Cylindrical lens 41 makes the laser that penetrate from LD element 40 form directional light or disperse for a short time in the FAST direction.
Half-mirror 13 will reflect from the laser 42 of cylindrical lens 4l, and condenser lens 2 will focus on from the laser of half-mirror 13.Utilize cylindrical lens 4l and condenser lens, then the shape of the laser that forms on the machined surface becomes rectangle etc.
Like this, in this example 8, form the optical system of rectangle or oval usefulness, have cylindrical lens 41 and condenser lens 2 as the laser radiation scope that makes machined surface.That is, after the laser that utilize 41 pairs of cylindrical lenses to penetrate from LD element 40 have suppressed dispersing of FAST direction, utilize condenser lens 2 to focus on, make the shape of the laser that forms on the machined surface form rectangle etc.
(example 9)
The laser heating device of this example 9 does not use condenser lens, utilizes 2 LD elements (laser diode), makes the shape of the laser that forms on the machined surface form rectangle etc., and this point is different with aforementioned example 8.
Below, for the laser heating device of this example 9, the part different with above-mentioned each example 1～8 is described.But, then omit explanation for the part identical with above-mentioned each example 1～8.
Figure 15 shows that the formation of the laser heating device of this example 9.Among the figure, the side view of Figure 15 (a) for the time from the SLOW direction laser heating device of laser.In addition, the side view of Figure 15 (b) for from the direction laser heating device vertical with the SLOW direction of laser the time selects that wherein half-mirror 13 and collimation lens 43 are represented.In addition, for the identical member of member according to Fig. 1, Fig. 8～13 explanation, additional same label, and omit explanation.
In Figure 15 (a), the laser injection part has 2 LD elements 40 and heating radiator 45.Heating radiator 45 for example is made of copper.2 LD elements 40 engage with heating radiator 45.Shown in Figure 15 (a) and (b), 2 LD elements 40 with the interval d configuration of regulation at grade, make laser from the end face of heating radiator 45 to the parallel ejaculation of same direction with optical axis.
Like this with 2 LD elements 40 with the interval d configuration of regulation at grade, when making that laser constitutes to the parallel ejaculation with optical axis of same direction, by adjusting distance, can make the laser power density distribution of the SLOW direction on the machined surface 46 form trapezoidal shape from LD element 40 (outgoing plane of collimation lens 43) to machined surface 46.Perhaps, can make the Temperature Distribution of the SLOW direction on the machined surface 46 form trapezoidal shape.This is according to following reason.
In Figure 16, the distance from the ejecting end of collimation lens 43 to machined surface 46 when establishing machined surface 46 and being positioned at each position of A, B, C is WDA, WDB, WDC.The half value laser power density of the SLOW direction on the machined surface 46 when in addition, establishing machined surface 46 and be positioned at each position of A, B, C is respectively PA, PB, PC.The Temperature Distribution of the SLOW direction on the machined surface 46 when in addition, establishing machined surface 46 and be positioned at each position of A, B, C is respectively TA, TB, TC.
Shown in Figure 16 (a), restraint laser from the end face 2 of heating radiator 45 and penetrate in the angle of divergence of SLOW direction (being made as directions X) with regulation along identical optical axis direction.Laser utilizes collimation lens 43 to form directional lights or disperses for a short time in FAST direction (direction vertical with Figure 16 paper).
Here if machined surface 46 from position A to position B away from, then shown in Figure 16 (b), it is 2 trapezoidal distribute power that laser power density is distributed in position A, but some interferes with each other at position B.Its result, at position B, though the power of central part is low, temperature-density distributes and becomes evenly.
It is extremely effective that the temperature-density of this trapezoidal shape (TOP HAT shape) distributes for FP worker C and FPC and wire resin-bonded, because temperature-density is evenly distributed, therefore can reduces central part and produce and burn or damages raising thermal bonding quality.
If the further again in-position C of machined surface 46, then shown in Figure 16 (c), laser power density distributes becomes trapezoidal shape (TOP HAT shape).Become trapezoidal shape if laser power density distributes, the thermograde when then heating raises at central part.But, be under the situation of short time in the irradiation time of laser, be not subjected to the influence of the difference of thermograde, can evenly heat.
In this example 9, optical system is used for the 2 bundle laser that penetrate from 2 LD elements (laser diode) are suppressed dispersing of FAST direction, utilization has suppressed these 2 bundle laser of dispersing, makes the laser radiation scope form rectangle etc., and this optical system utilizes collimation lens to constitute.
In addition, also can use cylindrical lens to replace collimation lens 43.In addition, collimation lens 43 more than 2 also can be set.In addition, the quantity of LD element also can be more than 2.
(example 10)
The laser injection part of the laser heating device of this example 10 has collimation lens, infrared ray sensor, laser cutoff filter, and condenser lens, and this point is different with aforesaid example 9.Below, with reference to the laser injection part of the laser heating device of this example of description of drawings 10.
Figure 17 (a) is depicted as the vertical view of the laser injection part of this example 10.In addition, Figure 17 (b) is depicted as the front view of the laser injection part of this example 10.In addition, Figure 17 (c) is depicted as the laser injection part of this example 10 at the vertical view that removes under the state of loam cake.In addition, Figure 17 (d) is depicted as the shape of the laser that forms of this example 10 on machined surface.In addition, Figure 17 (e) is depicted as the perspective side elevation view of the laser injection part of this example 10.In addition, Figure 17 (f) is depicted as the shape of the laser that forms of this example 10 on machined surface.Among the figure, for the identical member of member according to Fig. 1, Fig. 8～16 explanation, additional same label, and omit explanation.
As shown in figure 17, this laser injection part 1 has the loam cake 48 that keeps box 47, reaches maintenance box 47.In the inside that keeps box 47, the heating radiator 45 that engages with 2 LD elements 40 is set.Laser cutoff filter 6, condenser lens 8 are housed in the heating radiator 45, reach infrared ray sensor 9 etc.
In addition, the inside keeping box 47 is provided with movable piece 50 and 51.Though not shown, the two sides in the inboard that keeps box 47 are provided with the support sector that supports upper movable part 50 usefulness.
In the lower face side of upper movable part 50, utilize 2 screw 49 regular lengths and width to want little lower movable part 51 with upside movable piece 50.Lower movable part 51 utilizes the amount of screwing of 2 screws 49, is fulcrum with jut 52, is the motion of seesaw shape.Collimation lens 43 engages with lower movable part 51, and the laser ejecting end that is located at LD element 40 is square in front.Like this, this laser injection part 1 forms and can penetrate the structure that end face is adjusted the fixed position of collimation lens 43 along the vertical direction to the laser of LD element 40.Thereby, according to laser injection part 1, laser radiation scope 24 is changed arbitrarily.In addition, jut 52 also can be arranged on any one party of upper movable part 50 and lower movable part 51.
In addition, the length of the fore-and-aft direction of upper movable part 50 is shorter than the length of the fore-and-aft direction that keeps box 47, and is gapped between the front/rear end of upper movable part 50 and maintenance box 47.Contact with the front/rear end of upper movable part 50 from 3 the outstanding screws 53 of front/rear end that keep box 47 inboards.Like this, utilize the amount of screwing of 3 screws 53, upper movable part 50 moves along the fore-and-aft direction that keeps box 47.Thereby the fixed position of collimation lens 43 can utilize 3 screws 53 to adjust along the fore-and-aft direction that keeps box 47.Like this, this laser injection part 1 forms and can penetrate end face is adjusted the fixed position of collimation lens 43 along fore-and-aft direction structure to the laser of LD element 40.In addition, the quantity of screw 53 is not limited to 3.
Thereby, according to this laser injection part 1, the length breadth ratio of the shape (laser radiation scope) of the laser that forms on the machined surface 46 is changed arbitrarily.For example, shown in Figure 17 (f), can become the laser radiation scope 24 that dots from the laser radiation scope 24 of the length breadth ratio of representing laser radiation scope 24 with solid line.
Have again,, can adjust distance, the laser power density of the SL0w direction on the machined surface 46 is distributed form trapezoidal shape from the ejecting end of collimation lens 43 to machined surface 46 according to this laser injection part 1.Perhaps, can make the Temperature Distribution of the SL0w direction on the machined surface 46 form trapezoidal shape.
In addition, this laser injection part l has laser cutoff filter 6, condenser lens 8, reaches infrared ray sensor 9 as shown in figure 17, and formation can detect the ultrared structure from the temperature observation area radiation.In addition, condenser lens 8 engages with the lens mount of the distance of the sensitive surface 10 that can adjust to infrared ray sensor 9.Like this, according to this laser injection part 1, the size in temperature observation zone is changed arbitrarily.For example, shown in Figure 17 (f), can become the temperature observation zone 25 that dots from the temperature observation zone 25 of representing temperature observation zone 25 with solid line.
In this example 10, the lens of dispersing usefulness as the laser that penetrates from the LD element being suppressed the FAST direction have collimation lens 43.In addition, as engage, can adjust the adjusting mechanism of collimation lens 43 with collimation lens 43, have screw 49, movable piece 50 and 51, jut 52, reach screw 52 with respect to the position of the laser ejaculation end face of LD element.
In addition, also can use cylindrical lens to replace collimation lens 43.In addition, collimation lens 43 more than 2 also can be set.In addition, the quantity of LD element also can be more than 2.
(example)
If want the infrared ray of nw grade is amplified to the signal level of the mv grade of common control circuit action, then the prime amplifier of using as the output signal level that amplifies infrared ray sensor needs high-gain amplifier.But, as high-gain amplifier, no matter use how senior operational amplifier, even perhaps use the operational amplifier with temperature compensation function, this amplifier output also all has very big drift to change.
In above-mentioned each example 1～10, the relational expression of the calibration value (corrected value) of the output signal level by obtaining infrared ray sensor in advance or the output signal level of prime amplifier and observed temperature is measured temperature.But, owing to environment changes, thereby, perhaps can not carry out correct temperature measuring when calibration is handled with actual LASER HEATING processing during with temperature measuring only according to aforementioned relational expression.
In addition, because laser itself is infrared ray, the power of the laser of processing such as soldering usefulness is stronger, reach the w grade, even therefore the laser cutoff filter is set, for the faint ultrared infrared ray sensor that can detect the nW grade, laser can exert an influence as stray light.
Therefore, in this example youngster, the variable quantity of the output signal level of the firm postradiation infrared ray sensor of monitoring laser, whether judge this variable quantity greater than predefined variable quantity, whether the output signal level (being equivalent to be heated the temperature of target object) by such judgement infrared ray sensor reaches design temperature Ts.Then,, then stop to penetrate laser, or penetrate laser intermittently with the laser power of regulation if the variable quantity of the output signal level of infrared ray sensor reaches the setting variable quantity.
The formation of this example youngster's laser heating device is identical with the formation of above-mentioned example 4 to 10.Here, the example that constitutes with the laser heating device of example 4 describes (with reference to Figure 10).
Figure 18 (a) is depicted as the laser power P of laser and the curve of elapsed time t.In addition, Figure 18 (b) is depicted as the output signal level of prime amplifier 14 and the curve of elapsed time t.In addition, Figure 18 (c) is depicted as being the differential level of output signal level benchmark, prime amplifier 14 and the curve of elapsed time t from laser radiation start time ts through the output signal level of the prime amplifier 14 of the time t0 behind the △ t.
In Figure 18 (b), solid line represents to comprise the output signal level of prime amplifier 14 of reality of the Leak Detection component of temperature drift and laser.In addition, dotted line represents not comprise the output signal level of desirable prime amplifier 14 of the Leak Detection component of temperature drift and laser.In addition, in Figure 18 (a) and (b), t1 represents that the output signal level of actual prime amplifier 14 reaches the level PDs time of (being equivalent to design temperature Ts).In addition, t2 represents that the output signal level of desirable prime amplifier 14 reaches the time of level PDs.
Shown in Figure 18 (a) and (b), from the laser of time ts irradiating laser power P s the time, the Leak Detection component △ PDL that comprises temperature drift component △ PD and laser in the output signal level of the prime amplifier 14 of this laser radiation start time ts is greater than the output signal level of desirable prime amplifier 14.Therefore, even want to stop laser generation in the moment (time t1) that the output signal level of prime amplifier 14 reaches level PDs, but the time t2 that should time t1 also reaches level PDs from the output signal level of desirable prime amplifier 14 departs from.
Therefore, in the laser heating device of this example 11, shown in Figure 18 (c), if to be that the differential level △ PD of output signal level benchmark, prime amplifier 14 reaches and sets variable quantity APDs from laser radiation start time ts through the output signal level of the prime amplifier 14 of the time t0 behind the △ t, then control part 30 stops laser.In addition, control part 30 is set setting variable quantity △ PDs according to the signal level of utilizing potentiometer 29 to produce.
Because differential level △ PD is not subjected to the influence of varying in size of the Leak Detection of temperature drift and laser and laser power Ps etc., differential level △ PD from 0 level arrive to set variable quantity △ PDs during (time t3) be certain official hour, so can laser radiation be stopped.
In addition, also can as shown in figure 19 laser radiation be stopped, and, be benchmark, carry out laser generation (copped wave action) intermittently to set variable quantity △ PDs with the laser power of the following regulation of laser power Ps.
Like this, this example youngster's laser heating device can be eliminated Leak Detection, and the temperature drift of infrared ray sensor or prime amplifier of laser, can stablize and good reproducibility ground moves.
In addition, because P worker N photodiode can obtain bigger dynamic range, even therefore the big stray light of laser generation is arranged, but pass through the variable quantity of the output signal level of supervision prime amplifier, also can access the infrared detection signal (output signal of prime amplifier) that does not comprise the temperature drift equal error.Like this, this laser heating device can be stablized the temperature that control is heated target object.
Industrial practicality
The laser heating device that the present invention is relevant and laser heating method, can detect the variations in temperature when the meltings such as the scolding tin of processing stand or resin or become the abnormal heating of the sign of burning, carry out resin-bonded that soldering that periphery do not burn or resin do not burn etc., such as being useful for utilizing the laser that penetrates from semiconductor laser to carry out that the LASER HEATING processing such as soldering, resin-bonded, resin mark or welding process.
Claims (13)
1. laser heating device is characterized in that having:
Ejaculation is to the laser injection part of the laser that is heated the target object irradiation;
Generation is according to the infrared ray sensor of the signal of the aggregate-value of the ultrared spectral radiance that is subjected to light with sensitive surface;
Take the camera head of visible light;
Optical system, this optical system comprises to be accepted described laser and penetrates this described laser that receives, accepts the half-mirror that is heated the light of target object and periphery radiation or reflection from described simultaneously towards described heating object, and this optical system is among the described light that is heated target object and periphery radiation thereof or reflection and receives with described half-mirror, will except the infrared ray the light of described Wavelength of Laser to the sensitive surface guiding of described infrared ray sensor, visible light is guided to described camera head;
The storage part of the relational expression of the calibration value of the signal level that generates of the described infrared ray sensor of memory by using and the described observed temperature that is heated target object in advance;
According to signal and the described relational expression of utilizing described infrared ray sensor to generate, calculate the described temperature measuring portion that is heated the temperature of target object; And
Can change the hole in the zone of carrying out temperature measuring.
2. laser heating device as claimed in claim 1 is characterized in that,
Described laser injection part penetrates the laser of the following wavelength of 1.6 μ m.
3. laser heating device as claimed in claim 1 is characterized in that,
Sensitivity during the wavelength of described infrared ray sensor more than 1.2 μ m is peak value.
4. laser heating device as claimed in claim 1 is characterized in that,
Described optical system is with the infrared ray of the long wavelength more than the described optical maser wavelength, to the sensitive surface guiding of described infrared ray sensor.
5. laser heating device as claimed in claim 2 is characterized in that,
Described optical system only sees through the infrared ray of particular range of wavelengths.
6. laser heating device as claimed in claim 1 is characterized in that,
Described infrared ray sensor has relative sensitivity more than 10% for the wavelength more than the 1.2 μ m, generates according to be subjected to ultrared 10 of light with sensitive surface
-5W/ (cm
2Sr μ m) signal of the aggregate-value of Yi Shang spectral radiance.
7. laser heating device as claimed in claim 1 is characterized in that,
Described infrared ray sensor is the InGaAsPIN photodiode.
8. laser heating device as claimed in claim 1 is characterized in that,
The laser radiation scope of processing stand forms point-like.
9. laser heating device as claimed in claim 1 is characterized in that,
Also has the optical system that the laser radiation scope that makes machined surface forms rectangle or oval usefulness.
10. laser heating device as claimed in claim 1 is characterized in that,
Also has the scanning reflection mirror more than at least 1, the described laser that described scanning reflection mirror is used for penetrating from described laser injection part reflects, machined surface is carried out line sweep irradiation or bidimensional scanning irradiation with described laser, make the laser radiation scope of machined surface form rectangle or ellipse.
11. laser heating device as claimed in claim 1 is characterized in that,
Described laser injection part has the laser diode more than 2 that penetrates described laser,
Described optical system also is used for described each laser that penetrates from described each laser diode is suppressed dispersing of FAST direction, utilizes and has suppressed this described each laser of dispersing, makes the laser radiation scope of machined surface form rectangle or ellipse.
12. laser heating device as claimed in claim 1 is characterized in that,
Described laser injection part has:
Penetrate the laser diode more than 2 of described laser;
The lens of dispersing usefulness that described each laser that penetrates from described each laser diode suppressed the FAST direction; And
Engage with described lens, and can adjust the adjusting mechanism of described lens with respect to the position of described each laser diodes ejaculation end face,
Be used to described each laser, make the laser radiation scope of machined surface form rectangle or ellipse from described lens.
13. laser heating device as claimed in claim 1 is characterized in that,
Also have control part, if the variable quantity of the output signal level of described infrared ray sensor reaches the setting variable quantity, then described control part makes described laser injection part stop to penetrate described laser, and perhaps the laser power with regulation penetrates described laser intermittently.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005059761 | 2005-03-04 | ||
| JP059761/2005 | 2005-03-04 | ||
| PCT/JP2006/304074 WO2006093264A1 (en) | 2005-03-04 | 2006-03-03 | Laser heating device and laser heating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101107501A CN101107501A (en) | 2008-01-16 |
| CN101107501B true CN101107501B (en) | 2011-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2006800028693A Expired - Fee Related CN101107501B (en) | 2005-03-04 | 2006-03-03 | Laser heating device and laser heating method |
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| JP (1) | JP5042013B2 (en) |
| CN (1) | CN101107501B (en) |
| WO (1) | WO2006093264A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| FR2913210B1 (en) * | 2007-03-02 | 2009-05-29 | Sidel Participations | IMPROVEMENTS IN THE HEATING OF PLASTIC MATERIALS BY INFRARED RADIATION |
| DE102010016628A1 (en) * | 2010-02-26 | 2011-09-29 | Reis Group Holding Gmbh & Co. Kg | Method and arrangement for the cohesive joining of materials |
| EP2527156A1 (en) * | 2011-05-25 | 2012-11-28 | RLS Merilna Tehnika D.O.O. | Apparatus and method for writing a pattern in a substrate |
| JP5977583B2 (en) * | 2012-05-29 | 2016-08-24 | 株式会社日本マイクロニクス | Bonding pad, probe assembly, and bonding pad manufacturing method |
| JP6367194B2 (en) * | 2012-08-09 | 2018-08-01 | ロフィン−ラザーク アクチエンゲゼルシャフトＲｏｆｉｎ−Ｌａｓａｇ Ａｇ | Workpiece processing apparatus using laser beam |
| JP2014155932A (en) * | 2013-02-14 | 2014-08-28 | Toyota Motor Corp | Laser irradiation device and laser irradiation method |
| CN103862136B (en) * | 2014-03-14 | 2015-08-12 | 吉林大学 | The monitoring device of fusion process and monitoring method |
| CN103838273B (en) * | 2014-03-26 | 2016-04-06 | 徐云鹏 | A kind of temperature control system for fluid analysis |
| CN103895227A (en) * | 2014-03-26 | 2014-07-02 | 西安交通大学 | Front heating and monitoring device of laser beam for 3D printing |
| TW201636144A (en) * | 2015-04-13 | 2016-10-16 | 翊鼎光電股份有限公司 | Laser soldering device |
| CN105458730B (en) * | 2015-12-28 | 2018-01-23 | 哈尔滨理工大学 | A kind of fixed device for laser and the method that temperature self-adaptation is realized using the device |
| CN107552951A (en) * | 2017-09-01 | 2018-01-09 | 中国科学院长春光学精密机械与物理研究所 | Laser heating device |
| KR102019853B1 (en) | 2017-12-14 | 2019-09-09 | 조국환 | Welding temperature control system reflecting emissivity of base material of laser welding machine and control method thereof |
| CN108311767B (en) * | 2017-12-18 | 2020-08-14 | 武汉凌云光电科技有限责任公司 | Laser welding safety control method and system based on infrared temperature measurement variable emissivity |
| TWI778205B (en) * | 2018-03-13 | 2022-09-21 | 日商住友重機械工業股份有限公司 | Laser power control device, laser processing device, and laser power control method |
| JP7075675B2 (en) * | 2020-04-10 | 2022-05-26 | 株式会社ジャパンユニックス | Laser reflow soldering method and equipment |
| DE102020116394B4 (en) | 2020-06-22 | 2022-03-24 | Pac Tech - Packaging Technologies Gmbh | Method for monitoring a laser soldering process and laser soldering system |
| JP2022017863A (en) * | 2020-07-14 | 2022-01-26 | 株式会社東京精密 | Laser processing device, wafer processing system, and control method of laser processing device |
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- 2006-03-03 WO PCT/JP2006/304074 patent/WO2006093264A1/en active Application Filing
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| CN1276064A (en) * | 1997-08-27 | 2000-12-06 | 数字光学公司 | Integrated beam shaper and use thereof |
| JP2003103382A (en) * | 2001-09-28 | 2003-04-08 | Babcock Hitachi Kk | Setting method for laser beam irradiation position |
| US20030141002A1 (en) * | 2002-01-28 | 2003-07-31 | Aiden Flanagan | Apparatus and method for closed-loop control of laser welder for welding polymeric catheter components |
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| Publication number | Publication date |
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| JP5042013B2 (en) | 2012-10-03 |
| CN101107501A (en) | 2008-01-16 |
| WO2006093264A1 (en) | 2006-09-08 |
| JPWO2006093264A1 (en) | 2008-08-07 |
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