CN101100044A - Adsorptive pad of fixed polished delay element and manufacturing method thereof - Google Patents
Adsorptive pad of fixed polished delay element and manufacturing method thereof Download PDFInfo
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- CN101100044A CN101100044A CNA2006100901747A CN200610090174A CN101100044A CN 101100044 A CN101100044 A CN 101100044A CN A2006100901747 A CNA2006100901747 A CN A2006100901747A CN 200610090174 A CN200610090174 A CN 200610090174A CN 101100044 A CN101100044 A CN 101100044A
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- ground
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- top layer
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Abstract
The adsorptive gasket for fixing element to be polished includes one bottom layer and one surface layer on the bottom layer. The surface layer has through holes, and after the element to be polished contacts with the surface layer, the air in between may be exhausted fluently via the through holes and the element to be polished may be adsorbed to the adsorptive gasket in great adsorption force, reaching raised polishing effect.
Description
Technical field
The present invention relates to adsorptivity pad and its manufacture method of a kind of fixed polished element, in particular to a kind of adsorptivity pad and its manufacture method that is used in the fixed polished element of CMP process.
Background technology
Polishing generally is meant in cmp (CMP) technology, for the abrasion control that just is rough surface, the grinding milk that its utilization contains fine particle on average is scattered in the upper surface of a grinding pad, rubs mill with the hands to repeat the rule action after simultaneously a polished element being propped up described grinding pad.Described polished element is such as objects such as semiconductor, storage medium base material, integrated circuit, LCD flat panel glass, optical glass and photoelectric panels.In polishing process, must use an adsorptivity pad with carrying and fixing described polished element, the quality of described adsorptivity pad then directly influences the polishing effect of described polished element.
With reference to figure 1, show United States Patent (USP) US5, the schematic diagram of 781, No. 393 milling apparatus that patent disclosed with conventional adsorptivity pad.Described milling apparatus 1 comprises a bottom base (Lower Base Plate) 11, one adsorptivity pad (Sheet), 12, one polished element (Polishing Workpiece) 13, one top base (Upper Base Plate) 14, one polishing pad (Polishing Pad) 15 and one grinding milk (Slurry) 16.Described adsorptivity pad 12 utilizes an adhesive-layer 17 to adhere on the described bottom base 11, and described adsorptivity pad 12 is in order to carrying and fixing described polished element 13.Described polishing pad 15 is fixed in described top base 14.
The actuating mode of described milling apparatus 1 is as follows.At first described polished element 13 is fixed on the described adsorptivity pad 12, then, rotate described top base 14 and described bottom base 11, and simultaneously described top base 14 is moved down, make described polishing pad 15 touch the surface of described polished element 13, by constantly replenish described grinding milk 16 with the effect of described polishing pad 15, can carry out polishing operation to described polished element 13.
With reference to figure 2, show the partial schematic diagram of the adsorptivity pad of Fig. 1.Described adsorptivity pad 12 is a single layer structure, and its material is generally PU (Polyurethane), and it is a kind of foam material, moreover, described adsorptivity pad 12 is processed by wet process, therefore the inside of the described adsorptivity pad 12 foaming hole 121 that can have a plurality of continous ways.Its shortcoming is, to cause the soft durometer of described adsorptivity pad 12 and rerum natura to change, and need readjust grinding condition easily with described grinding milk 16 suctions at the hole 121 of foaming described in the polishing process; Moreover therefore the life-span of described adsorptivity pad 12 also reduces.In addition, described adsorptivity pad 12 utilizes wet process obtained, and its unevenness is spent greatly, is difficult to reach the above homogeneous thickness comprehensively of 0.5mm.At last, foaming holes 121 in the described adsorptivity pad 12 make described adsorptivity pad 12 when the described polished element 13 of absorption, the phenomenon that has the bag air produces, thereby cause in the bad and polishing process of adhering to of described polished element 13 and break easily, and the burnishing surface unevenness of described polished element 13 after polishing.
Therefore, be necessary to provide adsorptivity pad and its manufacture method of a kind of innovation and tool progressive, to address the above problem.
Summary of the invention
Main purpose of the present invention is to provide a kind of adsorptivity pad of fixing a polished element, and it comprises a ground and a top layer.Described ground has a surface.Described top layer is positioned on the surface of described ground, and the inside on described top layer does not have the hole structure, and a plurality of through holes of described top layer tool.By this, when described polished element contacts with described top layer, air therebetween can be discharged to described ground and discharge smoothly via described through hole, and can not produce the bag air phenomenon, can improve the absorption affinity between described polished element and described adsorptivity pad, increase the polishing effect of described polished element.
Another object of the present invention is to provide a kind of manufacture method of fixing the adsorptivity pad of a polished element, may further comprise the steps:
(a) form a top layer on a release liners, the inside on described top layer does not have the hole structure;
(b) form a ground on described top layer;
(c) oven dry;
(d) remove described release liners; With
(e) utilize a high energy laser to form a plurality of through holes on described top layer, described through hole runs through described top layer.
Description of drawings
Fig. 1 shows United States Patent (USP) US5, the schematic diagram of 781, No. 393 milling apparatus with conventional adsorptivity pad that patent disclosed;
Fig. 2 shows the partial schematic diagram of the adsorptivity pad of Fig. 1;
Fig. 3 shows the partial schematic diagram of the adsorptivity pad of the fixed polished element of the present invention; With
Each processing step schematic diagram of the manufacture method of the adsorptivity pad of the fixed polished element of Fig. 4 to 6 demonstration the present invention.
The main element symbol description
1 milling apparatus
2 adsorptivity pads of the present invention
11 bottom bases
12 adsorptivity pads
13 polished elements
14 top bases
15 polishing pads
16 grinding milks
17 adhesive-layers
21 grounds
22 top layers
30 release liners
40 high energy lasers
121 foaming holes
211 ground first surfaces
212 ground second surfaces
213 holes
214 potholes
The surface on 221 top layers
222 through holes
The specific embodiment
With reference to figure 3, show the partial schematic diagram of the adsorptivity pad of the fixed polished element of the present invention.Adsorptivity pad 2 of the present invention is a two-layer structure, and it comprises a ground 21 and a top layer 22.Described ground 21 has a first surface 211 and a second surface 212, and described second surface 212 is in order on the bottom base (not shown) that adheres to a milling apparatus.The material of described in the present embodiment ground 21 is the PU of high solid composition (High Solid), and its inside has the hole 213 of a plurality of continous ways or discontinuous formula, and its thickness can be greater than 0.5mm.Yet be understandable that the material of described ground 21 also can be acryl resin or other resin.
Described top layer 22 is positioned on the first surface 211 of described ground 21, and the inside on described top layer 22 does not have the hole structure, and described top layer 22 has a surface 221 and an a plurality of through hole 222.The macromolecular elastomer (for example PU, acryl resin or other resin) of the material on described top layer 22 for not foaming, it has the thickness of homogeneous, and its thickness is less than the thickness of described ground 21.The material on described top layer 22 can be identical or different with the material of described ground 21.Described top layer 22 described surperficial 221 in order to carrying and fix a polished element (not shown).
When described polished element when described surperficial 221 contact, air therebetween can be discharged to described ground 21 and discharge smoothly via described through hole 222, and can not produce the bag air phenomenon, can improve the absorption affinity of 2 on described polished element and described adsorptivity pad, increase the polishing effect of described polished element.Described through hole 222 runs through described top layer 22.Preferably, described through hole 222 further extends to described ground 21.Be that described ground 21 has a plurality of potholes 214, be arranged at the relative position of described through hole 222, to be communicated with described through hole 222.
In addition,, therefore in polishing process, grinding milk can be do not sucked, the life-span of described adsorptivity pad 2 can be improved because the inside on described top layer 22 does not have the hole structure.
The present invention relates to a kind of manufacture method of adsorptivity pad of fixed polished element in addition, and it may further comprise the steps.
At first, with reference to figure 4, form a top layer 22 on a release liners 30, the inside on described top layer 22 does not have the hole structure.Described top layer 22 has a surface 221.The macromolecular elastomer (for example PU, acryl resin or other resin) of the material on described top layer 22 for not foaming, it has the thickness of homogeneous.Preferably, described top layer 22 is formed on the described release liners 30 with coating method.
Then, with reference to figure 5, form a ground 21 on described top layer 22, described ground 21 has a first surface 211 and a second surface 212.The material of described in the present embodiment ground 21 is the PU of high solid composition (High Solid), and its inside has the hole 213 of a plurality of continous ways or discontinuous formula, and its thickness can be greater than 0.5mm.Yet be understandable that the material of described ground 21 also can be acryl resin or other resin.The material on described top layer 22 can be identical or different with the material of described ground 21.Preferably, described ground 21 is formed on the described top layer 22 with coating method.Therefore, compared with conventional wet process, described ground 21 of the present invention can also keep thickness even at the thickness of described ground 21 during greater than 0.5mm.
Then, with described ground 21 and 22 about times of oven dry of described top layer.Afterwards, remove described release liners 30.
At last, with reference to figure 6, after described ground 21 and described top layer 22 turned over turnback, utilize a high energy laser 40 on the surface 221 on described top layer 22, to form a plurality of through holes 222, preferably, described high energy laser 40 further forms a plurality of potholes 214 in described ground 21, to form an adsorptivity pad 2 (identical with Fig. 3).
Preferably, described top layer 22 can also be done water-proofing treatment again, to increase the life-span of described adsorptivity pad 2.
The foregoing description only is explanation principle of the present invention and its effect, and unrestricted the present invention, so the those skilled in the art makes amendment to the foregoing description and changes and still do not break away from spirit of the present invention.Interest field of the present invention should be listed as appended claims.
Claims (15)
1. the adsorptivity pad of a fixed polished element comprises:
One ground has a surface; With
One top layer is positioned on the surface of described ground, and the inside on described top layer does not have the hole structure, and a plurality of through holes of described top layer tool.
2. adsorptivity pad as claimed in claim 1, the inside of wherein said ground has a plurality of holes.
3. adsorptivity pad as claimed in claim 2, the described hole of wherein said ground are continous way.
4. adsorptivity pad as claimed in claim 2, the described hole of wherein said ground are discontinuous formula.
5. adsorptivity pad as claimed in claim 1, the material of wherein said ground are resin, and its thickness is greater than 0.5mm.
6. adsorptivity pad as claimed in claim 1, the macromolecular elastomer of the material on wherein said top layer for not foaming, and its thickness is less than the thickness of described ground.
7. adsorptivity pad as claimed in claim 1, wherein said ground further has a plurality of potholes, is arranged at the relative position of described through hole, to be communicated with described through hole.
8. the manufacture method of the adsorptivity pad of a fixed polished element may further comprise the steps:
(a) form a top layer on a release liners, the inside on described top layer does not have the hole structure;
(b) form a ground on described top layer;
(c) oven dry;
(d) remove described release liners; With
(e) utilize a high energy laser to form a plurality of through holes on described top layer, described through hole runs through described top layer.
9. method as claimed in claim 8, the inside of wherein said ground has a plurality of holes.
10. method as claimed in claim 9, the described hole of wherein said ground are continous way.
11. method as claimed in claim 9, the described hole of wherein said ground are discontinuous formula.
12. method as claimed in claim 8, the top layer is formed on the described release liners with coating method described in the wherein said step (a).
13. method as claimed in claim 8, ground is formed on the described top layer with coating method described in the wherein said step (b).
14. method as claimed in claim 8, high energy laser further forms a plurality of potholes in described ground described in the wherein said step (e).
15. method as claimed in claim 8 comprises that further one does the step of water-proofing treatment in described top layer layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100901747A CN101100044A (en) | 2006-07-03 | 2006-07-03 | Adsorptive pad of fixed polished delay element and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100901747A CN101100044A (en) | 2006-07-03 | 2006-07-03 | Adsorptive pad of fixed polished delay element and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101100044A true CN101100044A (en) | 2008-01-09 |
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ID=39034576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100901747A Pending CN101100044A (en) | 2006-07-03 | 2006-07-03 | Adsorptive pad of fixed polished delay element and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101100044A (en) |
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2006
- 2006-07-03 CN CNA2006100901747A patent/CN101100044A/en active Pending
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080109 |