CN101097407B - Tracing system, tracing material correction device and method, substrate manufacture method - Google Patents
Tracing system, tracing material correction device and method, substrate manufacture method Download PDFInfo
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- CN101097407B CN101097407B CN200710112531XA CN200710112531A CN101097407B CN 101097407 B CN101097407 B CN 101097407B CN 200710112531X A CN200710112531X A CN 200710112531XA CN 200710112531 A CN200710112531 A CN 200710112531A CN 101097407 B CN101097407 B CN 101097407B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
Abstract
A pattern tracing system is provided in the present invention, thereby correcting pattern tracing position properly corresponding to deformation of object being traced such as substrate, forming good precision tracing pattern. In a pattern tracing device using light-regulating component such as DMD, measuring positions of four aligning holes (M0 to M3) uses CCD. And then, under maintaining the distance ratio (m:n and M:N) calculated from a pair of sides (TA1, TA2) and a pair of sides (TB1, TB2), leading to pattern tracing data position coordinate that is pattern tracing corresponding to a pair of sides (TA1, TA2) and a pair of sides (TB1, TB2) of the deformed tetragon moving along X, Y direction.
Description
Technical field
The invention relates to a kind of with as the light shield (レ Network チ Le) of master or directly to the tracing device of the pattern that is formed circuit pattern etc. by the tracing body of printed base plate or silicon crystal etc.Particularly about revise the processing of tracing position corresponding to substrate deformation.
Background technology
Substrate etc. by the processing procedure of tracing body in, for the photosensitive material that has been coated with photoresistance etc. implemented by the tracing body handle for the tracing that forms pattern.The processing procedure that has passed through that video picture processing, etching or coating film treatment, photoresistance are peeled off etc. forms pattern on by the tracing body.For example, in use LCD, DMD, SLM light modulation assemblies such as (Spatial Light Modulators) are done in the tracing device of light modulation unit of two-dimensional arrangements, make irradiation area (to call the exposure area in the following text) that light modulation unit forms do the scanning of relativity for substrate, simultaneously corresponding to the tracing pattern with each light modulation assembly of set sequential control.
Owing to substrate itself is out of shape by factors such as thermal treatment, accumulations, be provided with and aim at the mark of adjusting usefulness, under the state of base plate deformation,, revise the tracing position of pattern according to the telltale mark that is measured.Particularly, with respect to a plate base with undersized tracing pattern be divided into a plurality of and the tracing situation under, tracing zone for each tracing pattern, be set in its four jiaos alignment marks that constitute rectangle, the skew of the centre of gravity place that base plate deformation causes and the rotation pitch angle in tracing zone etc. are calculated in the position of the alignment mark that measures according to actual amount.Then, according to the data correction tracing position (with reference to patent documentation 1,2) of calculating
Patent documentation 1 TOHKEMY 2005-300628 communique
Summary of the invention
Because the state of base plate deformation is inhomogenous, near the center in each tracing zone with and in addition, for example at boundary vicinity, the deformation state of substrate deformation direction, deflection etc. is different.Therefore, under the situation according to the tracing position of revising the data that respectively traces designs in this zone about the variation of the regional representational position (center etc.) of tracings such as centre of gravity place, tracing position about boundary vicinity is not corrected to suitable position, can't cooperate substrate deformation and forms pattern with high precision.
Tracing system of the present invention comprises: light source for suitably revise the tracing system of the position of tracing data corresponding to substrate deformation; At least one smooth modulation unit, it is corresponding to by the tracing body, and according to the tracing data that has based on the position coordinates of the coordinate system of defined, and modulation is from the illumination light of light source; Measuring equipment, it is under the state of body deformability that traced designs, can measure and be set in the position that pointer is used in above-mentioned four measurements by the tracing body, above-mentioned four measurements by the tracing body constitute the summit of a pair of first reference edge and the formed benchmark rectangle of a pair of second reference edge with pointer, wherein, above-mentioned a pair of first reference edge is pair of parallel limit in opposite directions, and above-mentioned a pair of second reference edge is that in opposite directions another is to parallel edges; Correcting device, it uses pointer as the summit with above-mentioned four measurements that measure, according to changing the distortion rectangle that the limit constituted corresponding to a pair of first change limit of above-mentioned a pair of first reference edge and corresponding to a pair of second of above-mentioned a pair of second reference edge, revise the position coordinates of tracing data, and produce the tracing data of revising; And tracing treating apparatus, it controls above-mentioned smooth modulation unit, make it form the tracing pattern according to revising the tracing data, wherein, the position coordinates of the above-mentioned tracing data of above-mentioned correcting device correction, make and to play distance till the correction position of the tracing data of above-mentioned a pair of second reference edge from the above-mentioned a pair of first change limit, make the distance that plays from the above-mentioned a pair of second change limit till the correction position of the tracing data of above-mentioned a pair of first reference edge simultaneously than being and playing distance till the reference position of the tracing data of above-mentioned a pair of first reference edge from above-mentioned a pair of second reference edge than identical than being and playing distance till the reference position of the tracing data of above-mentioned a pair of second reference edge from above-mentioned a pair of first reference edge than identical.For example revise the position coordinates have as the tracing data of the location coordinate information of vectorial data, and convert grating data etc. to and the processing that traces designs.Again, light modulation assembly can be a plurality of smooth modulation assemblies such as DMD, LCD and does the arrangement of two-dimentional systematicness and form.
Before by the tracing body deformability, measure with pointer and be set on the body that traced designs and the summit of formation benchmark rectangle.In this, the benchmark rectangle constitutes by slightly being rectangle or slightly being foursquare rectangle, and expression is by in opposite directions pair of parallel limit (to call a pair of first reference edge in the following text) and another rectangle that parallel edges (to call a pair of second reference edge in the following text) is constituted.Measurement for example is imprinted on mark by on the tracing body with mark system, or forms the hole that measures usefulness on by the tracing body.Under the situation about handling that traces designs for example cutting apart a plurality of tracing patterns on the substrate, the zone of benchmark rectangle determines as the tracing zone of each tracing pattern.For easy coordinates computed, a pair of first and second reference edge system is parallel to first, second axle (X-axis, Y-axis) of the quadrature that is used to make coordinate system respectively, and sets four measurement pointers.
When by the tracing body deformability, from make the quadrangle (to call the distortion rectangle in the following text) of shape collapse as the complete rectangular shaped article on summit with pointer with four measurements that measured.Distortion rectangle system is by being constituted corresponding to an opposite side (to call a pair of first change limit in the following text) of a pair of first reference edge and a opposite side (to call a pair of second change limit in the following text) corresponding to a pair of second reference edge.
In the present invention, the correcting device tracing position correction that the position coordinates of data formulates that will trace designs is set position (correction position), and keep the distance counted from an opposite side than.In this, play distance till the correction position of the tracing data of a pair of second reference edge from a pair of first change limit than being and playing distance till the reference position of the tracing data of a pair of second reference edge from a pair of first reference edge, make the distance that plays from a pair of second change limit till the correction position of the tracing data of a pair of first reference edge simultaneously than being and playing distance till the reference position of the tracing data of a pair of first reference edge from a pair of second reference edge than identical than identical.For example, the benchmark rectangle is parallel under first, second the situation, the tracing position correction for the distance counted along first and second from an opposite side than identical.Owing to calculate the amount of movement of tracing position along the orthogonal limit of benchmark rectangle, calculate corresponding to becoming the locational by deformation direction, the deflection of tracing body of object in tracing, tracing position in the tracing zone is not to do correction with identical correction, can cooperate respectively to trace designs the position and correction is done in the position.
The present invention's tracing data correcting device comprises: a measuring equipment, measuring equipment, it is under the state of body deformability that traced designs, can measure and be set in the position that pointer is used in above-mentioned four measurements by the tracing body, above-mentioned four measurements by the tracing body constitute the summit of a pair of first reference edge and the formed benchmark rectangle of a pair of second reference edge with pointer, wherein, above-mentioned a pair of first reference edge is pair of parallel limit in opposite directions, and above-mentioned a pair of second reference edge is that in opposite directions another is to parallel edges; And correcting device, it uses pointer as the summit with above-mentioned four measurements that measure, according to changing the distortion rectangle that the limit constituted corresponding to a pair of first change limit of above-mentioned a pair of first reference edge and corresponding to a pair of second of above-mentioned a pair of second reference edge, revise the position coordinates of tracing data, and the tracing data is revised in generation, wherein, the position coordinates of the above-mentioned tracing data of above-mentioned correcting device correction, make and to play distance till the correction position of the tracing data of above-mentioned a pair of second reference edge from the above-mentioned a pair of first change limit, make the distance that plays from the above-mentioned a pair of second change limit till the correction position of the tracing data of above-mentioned a pair of first reference edge simultaneously than being and playing distance till the reference position of the tracing data of above-mentioned a pair of first reference edge from above-mentioned a pair of second reference edge than identical than being and playing distance till the reference position of the tracing data of above-mentioned a pair of second reference edge from above-mentioned a pair of first reference edge than identical.
The modification method of the present invention's tracing data, comprise the following steps: under the state of body deformability that traced designs, measurement is set in above-mentioned by the position of four measurements of tracing body with pointer, above-mentioned four measurements by the tracing body constitute the summit of a pair of first reference edge and the formed benchmark rectangle of a pair of second reference edge with pointer, wherein, above-mentioned a pair of first reference edge is pair of parallel limit in opposite directions, and above-mentioned a pair of second reference edge is that in opposite directions another is to parallel edges; And with above-mentioned four measurements of measuring with pointer as the summit, according to changing the distortion rectangle that the limit constituted corresponding to a pair of first change limit of above-mentioned a pair of first reference edge and corresponding to a pair of second of above-mentioned a pair of second reference edge, revise the position coordinates of tracing data, and the tracing data is revised in generation, wherein, the position coordinates of the above-mentioned tracing data of above-mentioned correcting device correction, make and to play distance till the correction position of the tracing data of above-mentioned a pair of second reference edge from the above-mentioned a pair of first change limit, make the distance that plays from the above-mentioned a pair of second change limit till the correction position of the tracing data of above-mentioned a pair of first reference edge simultaneously than being and playing distance till the reference position of the tracing data of above-mentioned a pair of first reference edge from above-mentioned a pair of second reference edge than identical than being and playing distance till the reference position of the tracing data of above-mentioned a pair of second reference edge from above-mentioned a pair of first reference edge than identical.
The manufacture method of the present invention's substrate comprises the following steps: 1) on the substrate of blank, be coated with photosensitive material; 2) for the substrate processing that traces designs after the coating; 3) carrying out video picture for the substrate after the tracing processing handles; 4) carry out etching or coating film treatment for the substrate after the video picture processing; 5) carry out the lift-off processing of photosensitive material for the substrate after etching or the coating film treatment; Wherein in tracing is handled, by above-mentioned tracing data modification method correction tracing data.
According to the present invention, suitably revise the tracing position corresponding to the distortion of the bodies that traced designs such as substrate, and can form the good tracing pattern of precision.
Description of drawings
Fig. 1 is the stereographic map of the signal of the tracing system of this enforcement kenel.
Fig. 2 is a synoptic diagram of being located at the exposing unit of tracing device.
Fig. 3 relatively moves for the expression exposing unit, promptly represents the figure that the exposure area scans.
Fig. 4 is the calcspar of exposure system.
Fig. 5 is the figure of the first half of the adjustment processing program of expression tracing position.
Fig. 6 is the latter half of figure of the adjustment processing program of expression tracing position.
The process flow diagram that Fig. 7 traces designs and handles.
Fig. 8 is mating holes after expression is set and the figure that measures the coordinate of mating holes.
Fig. 9 is the figure of the position of the revised tracing data of expression.
Label declaration
10～tracing device; 20～exposing unit; 22～DMD (light modulation unit); 30～tracing control part; 30A～control module; 32～system, control circuit; 34～DMD control part; 38～pedestal position control section; 40～alignment mark detection portion; 42～data calculation portion; 43～data buffer zone; SW～substrate (body is traced designs); EA～exposure area; Xij～little mirror; Yij～tiny area (exposure area); TA1, TA2～a pair of limit (a pair of first reference edge); TB1, TB2～a pair of limit (a pair of second reference edge); SA1, SA2～a pair of limit (a pair of first change limit); SB 1, SB2～a pair of limit (a pair of second change limit); Z0～benchmark rectangle; Z～quadrangle (distortion rectangle); AM1～AM4～measurement mating holes (measure and use pointer); PD～tracing position; PD '～correction position; X～X coordinate (first); Y～Y coordinate (second).
Embodiment
The graphic explanation the present invention's of following reference example.
Fig. 1 is the stereographic map of signal of the tracing system of this example.Fig. 2 is a synoptic diagram of being located at the exposing unit of tracing device.Fig. 3 relatively moves for expression exposure area EA's, i.e. the synoptic diagram of the scanning of exposure area EA.
Tracing system comprises tracing device 10.Tracing device 10 comprises gate columnar structure body 12 and base station 14 for the substrate SW irradiation light of the photosensitive material that the surface is coated with photoresistance etc. forms the device of circuit pattern.On base station 14, carrying the X-Y pedestal driving mechanism 19 of supporting X-Y pedestal 18, substrate SW is being set on X-Y pedestal 18.On gate columnar structure body 12, be provided with on the surface of substrate SW the exposing unit 20 that forms circuit pattern, cooperate moving of X-Y pedestal 18 and make exposing unit 20 actions.
Again, tracing system comprises the tracing control part 30 of the action of moving of control X-Y pedestal 18 and exposing unit 20.Tracing control part 30 is made of control module 30A, keyboard 30B and monitor 30C, and the operator sets conditions of exposure etc.Substrate SW is for example Silicon Wafer, film, glass substrate or shop copper multilayer board, implement pre-roasting handle and the space state after handling such as the coating of photoresistance under, be equipped on the X-Y pedestal 18.
On the SW substrate, owing to form the tracing pattern of four same sizes, be divided into four tracing zones, in four corners of each regional GR that traces designs, formation is done for the tracing position and is aimed at the mating holes AM that adjusts.On gate columnar structure body 12, the CCD13 that is used for detecting mating holes AM position is mounted to the direction towards substrate SW, detects mating holes AM according to moving of X-Y pedestal 18.For substrate SW, work up orthogonal X-Y coordinate, aim at adjustment according to the X-Y coordinate.In this, main scan direction is decided to be directions X, secondary scan direction is decided to be the Y direction.
As shown in Figure 2, exposing unit 20 comprises light source 21, DMD (Digital Micro-mirrorDevice) 22 and learns the illumination optical system 24, the image optics that are as exposure light is 26, configuration illumination optical system 24 between light source 21 and DMD22 is configured to picture optical system 26 between DMD22 and substrate SW.The light source 21 of other semiconductor lasers etc. radiates the light beam of certain intensity continuously, and the light of radiation is imported into illumination optical system 24.Illumination optical system 24 is to be made of diffuser plate 24A and collimation lens 24B, and light beam LB is shaped as all light beams of illumination DMD22 by illumination optical system 24.And, being not only DMD22 shown in Figure 2, a plurality of DMD are along main scan direction (directions X) configuration, the light beam that radiates from light source 22 is passed to each DMD via optical fiber (not icon).
DMD22 is the light modulation unit that little the small mirror of micron (μ m) grade becomes the configuration of array shape, and each small minute surface rotates change by the effect of electrostatic field.In the present embodiment, DMD22 is that M * N small minute surface is configured to the array shape and forms, below be with corresponding to assortment (i, little mirror of position j) with " Xij] (1≤i≤M, 1≤j≤N) expression.For example, constitute DMD22 by little mirror of 1024 * 768.
Little mirror Xij system with the second that will reflect towards the prime of the direction reflection of the plane of exposure SU of substrate SW and direction towards plane of exposure SU outside from the light beam LB of light source 21 one of them posture and locate the switching that postures according to controlling signal from control module 30A.Under the situation of little mirror Xij with the prime location, the light that reflects on little mirror Xij is guided to picture optical system 26.Schematically Biao Shi image optics is 26 to be to be made of two convex lens and mirror lens (not icon), is that 26 rayed is in the set zone of the plane of exposure SU that is formed with photoresist layer by image optics.
On the other hand, under the situation of little mirror Xij with the second location, the light that is reflected by little mirror Xij is directed to light absorption plate (not icon), and light is not irradiated on the plane of exposure SU.Below be the ON state with little mirror Xij at the state of prime support, be the OFF state with the state of second support.
Image optics is 26 multiplying power owing to be decided to be 1 times at this, and the size of the irradiation area Yij of one little mirror Xij (wide, height) is measure-alike with little mirror Xij's.Height corresponding to the secondary scan direction (Y direction) of little mirror Xij is represented with h, represents with l corresponding to the width of scan direction (directions X), and the irradiation area (to call tiny area in the following text) with size of l * h.Little mirror Xij is square (h=l), and again, with respect to the live width of pattern, the size of little mirror Xij is very small, and the length of a slice is decided to be several μ m～tens of μ m.
The size system of DMD22 decides according to the demonstration specification of televisor, main scan direction corresponding to DMD22 is a transverse direction, corresponding to secondary scan direction is longitudinal direction, width (transverse direction length) and height (longitudinal direction length) are to represent with " W ", " K " respectively, and the length breadth ratio of DMD22 is (horizontal vertical than W: as K) to be decided to be 3: 4.
Under the state that X-Y pedestal 18 stops, little all mirrors is under the situation of state of ON, on plane of exposure SU, irradiates and has both the area E A of sizing (is the exposure area to call this zone in the following text).Because image optics is 26 multiplying power is 1 times, the relation of D * R=K * W (=(M * h) * (N * 1)) is set up.
In DMD22, because little the indivedual independent control ON/OFF of mirror Xij system, all light of irradiation DMD22 becomes the light that light beam constituted of the light that is optionally reflected by each little mirror.As a result, on plane of exposure SU, on the arbitrary region Ew at EA place, exposure area, irradiation is corresponding to the light of all circuit patterns that are formed on this place.According to raster scans, X-Y pedestal 18 moves with set speed, and along with this moves, EA system in exposure area moves with set speed on plane of exposure SU along main scan direction (directions X), and circuit pattern system forms along main scan direction (directions X).
By so sequential control of exposure actions, substrate SW does moving of relativity with set speed, and the every forward travel distance d of exposure area EA (＜1) then carries out the action of exposure area repeatedly.Again, in exposure actions once, little the required time weak point of time ratio exposure area EA forward travel distance d that the mirror Be Controlled makes each little mirror ON state continuance.In this, exposure area EA forward travel distance Ld (little mirror maintains the ON state in＜d) time, exposure area EA move remaining distance during, each little mirror maintains the OFF state.
Along one scan the band SB finish scan after, X-Y pedestal 18 is at Y direction (secondary scan direction) displacement D, next scans band (with reference to Fig. 3) and relatively move.Exposure area EA is reciprocal and scan all scanning when being with, and scans to dispose.After scanning processing, implement video picture processing, etching or plated film, photoresistance lift-off processing etc., produce the substrate that is formed with circuit pattern.
Fig. 4 is the calcspar of tracing system.
The control module 30A of tracing control part 30 comprises system, control circuit 32, DMD control circuit 34, pedestal position control section 38, alignment mark test section 40, data calculation portion 42 and light source control portion 44.The system, control circuit 32 control tracing devices 10 that comprise CPU, RAM, ROM etc. are all, with controlling signal send to light from the light source control portion 44 that light source 21 is emitted, simultaneously for the controlling signal of DMD control part 34 outputs for the control exposure time series.DMD control part 34 is controlled DMD22 according to the tracing processing that is stored in advance among the ROM with program.
The circuit pattern data is a vectorial data (CAM data) and input to the data input part 41 of control module 30A from workstation (not icon), and memory is in belonging to the data buffer zone 43 of temporality internal memory.When pattern data was delivered to data calculation portion 42, vector data converted the grating data to corresponding to raster scans, and is delivered to DMD control part 34.The vector data is the location coordinate information with tracing pattern, has the position coordinates data according to the X-Y coordinate system.Raster data is one of them the binary data of ON/OFF of little mirror of expression, is expressed as the two-dimensional bitmap case of circuit pattern.
In DMD control part 34, grating data system cooperates the relative position of exposure area EA to read successively in set sequential.That is, according to the two-dimensional lattice data of reading with from the relative position information of the exposure area EA that position control section 38 is sent, export the controlling signal of little mirror ON/OFF of control to DMD22.Pedestal position control section 38 is the X-Y pedestal driving mechanism 19 that control possesses motor (not icon), controls the translational speed of X-Y pedestal 18 etc. by this.Again, pedestal position control section 38 is the relativity position of detection with respect to the X-Y pedestal 18 of exposure area EA.
The detection signal of the mating holes AM that reads from CCD13 is transported to alignment mark detection portion 40, detects the positional information of mating holes AM by this, and the positional information system of mating holes AM is delivered to data calculation portion 42 via data buffer zone 43.In data calculation portion 42, according to the positional information of mating holes AM, revise the position coordinates of vectorial data, produce the grating data according to revised vectorial data.
5th, 6 figure are the figure of the adjustment processing program of expression tracing position.
When forming mating holes AM in the regional GR of tracing at substrate SW, four mating holes AMO
1～AMO
4Be positioned, and constitute the summit of parallel rectangle Z0 (benchmark rectangle) along the X-Y coordinate system.In this, rectangle Z0 system represents with center line.
When the substrate SW that has been coated with photoresistance is placed in X-Y pedestal 18 and traces designs when handling, owing to reasons such as heat make substrate SW distortion, mating holes AMO
1～AMO
4Offset, in this, the mating holes (following weighing survey mating holes) after the distortion of seeing from the X-Y coordinate system is with symbol " AM
1～AM4 " expression, to measure mating holes AM1～AM
4Be represented by dotted lines as the tetragonal Z (distortion rectangle) that the summit constituted.
In this enforcement kenel, consider along the direction on each limit of rectangle Z0, promptly along the deflection of the substrate SW of directions X, Y direction, revise the position coordinates of tracing data.At first, according to the tetragonal Z after rectangle Z0 that is rectangle and the distortion, trapezoidal along two relative of limit formations.
Along the directions X of benchmark rectangle Z0 and by the straight line of parallel an opposite side TA1, TA2 with respectively by measuring mating holes AM
2, AM
3And measurement mating holes AM
1, AM
4And by being Q1, Q2, Q3, Q4 along the Y direction of benchmark rectangle Z0 and corresponding to the intersection point of the straight line of an opposite side SB1, the SB2 of parallel an opposite side TB1, TB2, having upper base on a parallel opposite side TA1, TA2, go to the bottom, is the trapezoidal SQ1 (representing with solid line) on summit and make with Q1, Q2, Q3, Q4.
Similarly, along the Y direction of benchmark rectangle Z0 and by the straight line of parallel an opposite side TB1, TB2 with respectively by measuring mating holes AM
1, AM
2And measurement mating holes AM
4, AM
3And by being R1, R2, R3, R4 along the directions X of benchmark rectangle Z0 and corresponding to the intersection point of the straight line of an opposite side SA1, the SA2 of parallel an opposite side TA1, TA2, having upper base on a parallel opposite side TB1, TB2, go to the bottom, is the trapezoidal SQ2 (representing with solid line) on summit and make with R1, R2, R3, R4.
As shown in Figure 6, about tracing position PD corresponding to the position coordinates of the data that traces designs arbitrarily of tracing in the regional GR, when the tracing position of directions X for from the position of the ratio m along an opposite side TB1 of the directions X of benchmark rectangle Z0, distance that TB2 is counted: n the time, the position PD ' x of the directions X of the tracing data after the distortion of substrate SW is set at an opposite side SB1 from tetragonal Z, distance that SB2 is counted than being the position of m: n.
Similarly, when the tracing position of Y direction for from the position of the ratio M along an opposite side TA1 of the directions X of benchmark rectangle Z0, distance that TA2 is counted: N the time, the position PD ' y of the directions X after the distortion of substrate SW is set at an opposite side SA1 from tetragonal Z, distance that SA2 is counted than being the position of M: N.
Then, according to position PD ' x, the position PD ' y of Y direction of the directions X of the tracing data of trying to achieve, the position PD ' behind the base plate deformation of tracing data (PD ' x, PD ' y) is set at correction position (with reference to Fig. 6).The correction position PD ' of tracing data decides on deformation direction, deflection along the substrate SW of directions X, Y direction.
The process flow diagram that Fig. 7 handles for tracing.Fig. 8 is the figure of expression mating holes of setting and the coordinate that measures mating holes.Fig. 9 is the figure of the position PP of the revised tracing data of expression.
In step S101, be sent to tracing system 30 from the vectorial data of the conduct tracing data of workstation etc., and temporarily be stored in the data buffer zone 43.In step S102, in alignment mark detection portion 40, detect the position coordinates of the mating holes that is measured.Then, in step S103,, carry out calculating shown below according to the position coordinates of the mating holes that is measured.
As shown in Figure 8, the position coordinates of benchmark mating holes before the distortion be H0 (xh0, yh0), H1 (xh1, yh1), H2 (xh2, yh2), H3 (xh3, yh3), the position coordinates of measurement mating holes after distortion is M0 (xm0, ym0), M1 (xm1, ym1), M2 (xm2, ym2), (xm3 is in the time of ym3) for M3, linking mating holes H3, the straight line of H0 and the intersection point " b03 " of Y coordinate is yh0, and linking mating holes H1, the straight line of H2 and the intersection point " b12 " on the Y coordinate is yh1.Again, linking mating holes H2, the straight line of H3 and the intersection point " b23 " of X coordinate is xh2, and linking mating holes H1, the straight line of H0 and the intersection point " b10 " on the X coordinate is xh1.
On the other hand, the slope A03 and the intersection points B 03 on the Y coordinate of straight line by measurement mating holes M3, M0 after the distortion is to try to achieve with following formula respectively.
A03＝(ym0-ym3)/(xm0-xm3) (1)
B03＝ym0-A03×xm0 (2)
Similarly, the slope A12 and the intersection points B 12 on the Y coordinate of the straight line by measuring mating holes M1, M2 are to try to achieve with following formula respectively.
A12＝(ym1-ym2)/(xm1-xm2) (3)
B12＝ym1-A12×xm1 (4)
And the slope A23 and the intersection points B 23 on the X coordinate of straight line by measurement mating holes M2, M3 after the distortion is to try to achieve with following formula respectively.But lying in this corresponding to the slope of X coordinate obtains.
A23＝(xm2-xm3)/(ym2-ym3) (5)
B10＝xm2-A23×ym2 (6)
Similarly, the slope A10 and the intersection points B 10 on the X coordinate of straight line by measurement mating holes M1, M0 after the distortion is to try to achieve with following formula respectively.
A10＝(xm1-xm0)/(ym1-ym0) (7)
B23＝xm1-A10×ym1 (8)
When implementation step S103, enter step S104.
In step S104, by computing shown below, and the position coordinates of correction tracing data, revised tracing data is to be stored in the data buffer zone 43.
The position coordinates of the tracing data before revising is that (x, y), the position coordinates of revised tracing data is PP (x ', y ') to P.Again, if by P (x, y) straight line that is parallel to X-axis and straight line by mating holes H2, H3 before being out of shape and the intersection point by mating holes H1, H0 are respectively Ph1 (xh1, y), Phr (xhr, y), by P (x, y) straight line that is parallel to Y-axis and straight line by mating holes M2, M3 before being out of shape and the intersection point by mating holes M1, M0 are respectively Pm1 (xm1, y), (xmr, y), the X coordinate x ' of revised tracing data tries to achieve with following formula Pmr.
x’＝(x-xh1)×xsc+xm1 (9)
At this
xh1＝b23 (10)
xhr＝b10 (11)
xm1＝A23×y+B23 (12)
xsc＝(xmr-xm1)/(xhr-xh1) (13)
And xsc is the ratio along benchmark rectangle with the distortion rectangle of the directions X of the position coordinates P of tracing data.
Similarly, if by P (x, y) straight line that is parallel to Y-axis and straight line by mating holes H3, H0 before being out of shape and the intersection point by mating holes H2, H1 are respectively Phd (x, yhd), Phh (x, yhu), by P (x, y) straight line that is parallel to Y-axis and straight line by mating holes M3, M0 before being out of shape and the intersection point by mating holes M2, M1 are respectively Pmd (x, ymd), (x, ymu), the Y coordinate y ' of revised tracing data tries to achieve with following formula Pmh.
y＝(y-yhd)ysc+ymd (14)
At this
yhd＝b03 (15)
yhu＝b12 (16)
ymd＝A03×x+B03 (17)
ymu＝A12×x+B12 (18)
ysc＝(ymu-ymd)/(xhu-xhd) (19)
And ysc is the ratio along benchmark rectangle with the distortion rectangle of the Y direction of the position coordinates P of tracing data.
The position correction system of the data that so trace designs implements each tracing data.Then, in step S105, produce the grating data according to revised vectorial data, and according to raster data control DMD22ON/OFF.
According to above enforcement kenel, in order to keep the distance counted from an opposite side TA1, TA2 and an opposite side TB1, the TB2 of benchmark rectangle Z0 than (m: n and M: N), an opposite side TA1 and TA2 and an opposite side TB1, TB2 for the tetragonal Z after the distortion, the position coordinates of tracing data, move along X, Y direction the position of promptly tracing designs.By this, can revise to the so-called deformation state of substrate deformation direction that cooperates this tracing position and deflection, the position system that respectively traces designs in tracing zone cooperates substrate deformation and does suitable correction.
Also can revise according to the data beyond the vectorial data.Again, applicable to the light modulation assembly of the so-called LCD beyond the DMD.Even also scan the tracing device of laser beam applicable to light modulation assembly with AOM etc.About the tracing device, be not limited to trace designs in the zone, outside the zone, also can.In the case, except the interior proportion by subtraction of counting from an opposite side, also can use external ratio.
Four mating holes are set from the vertex position skew of rectangle and also can.In the case, in formula (1)～(4), consider the X of the straight line of binding H1～H4, the slope of Y direction.Even for the rectangle that is not parallel to X, Y coordinate, correcting process also can with coordinate conversion.
Claims (7)
1. tracing system, this tracing system comprises:
Light source;
At least one smooth modulation unit, it is corresponding to by the tracing body, and according to the tracing data that has based on the position coordinates of the coordinate system of defined, and modulation is from the illumination light of light source;
Measuring equipment, it is under the state of body deformability that traced designs, can measure and be set in the position that pointer is used in above-mentioned four measurements by the tracing body, above-mentioned four measurements by the tracing body constitute the summit of a pair of first reference edge and the formed benchmark rectangle of a pair of second reference edge with pointer, wherein, above-mentioned a pair of first reference edge is pair of parallel limit in opposite directions, and above-mentioned a pair of second reference edge is that in opposite directions another is to parallel edges;
Correcting device, it uses pointer as the summit with above-mentioned four measurements that measure, according to changing the distortion rectangle that the limit constituted corresponding to a pair of first change limit of above-mentioned a pair of first reference edge and corresponding to a pair of second of above-mentioned a pair of second reference edge, revise the position coordinates of tracing data, and produce the tracing data of revising; And
The tracing treating apparatus, it controls above-mentioned smooth modulation unit, makes it form the tracing pattern according to revising the tracing data,
Wherein, the position coordinates of the above-mentioned tracing data of above-mentioned correcting device correction, make and to play distance till the correction position of the tracing data of above-mentioned a pair of second reference edge from the above-mentioned a pair of first change limit, make the distance that plays from the above-mentioned a pair of second change limit till the correction position of the tracing data of above-mentioned a pair of first reference edge simultaneously than being and playing distance till the reference position of the tracing data of above-mentioned a pair of first reference edge from above-mentioned a pair of second reference edge than identical than being and playing distance till the reference position of the tracing data of above-mentioned a pair of second reference edge from above-mentioned a pair of first reference edge than identical.
2. tracing system as claimed in claim 1, wherein, above-mentioned four measurements are configured to make above-mentioned a pair of first and second reference edge with pointer, and first, second is parallel with the above-mentioned coordinate system of regulation orthogonal respectively.
3. tracing system as claimed in claim 1, wherein, a plurality of smooth modulation assembly that above-mentioned smooth modulation unary system is arranged by the systematicness of two dimension is constituted.
4. tracing system as claimed in claim 1, wherein, above-mentioned tracing data is vectorial data.
5. tracing data correcting device, this tracing data correcting device comprises:
Measuring equipment, it is under the state of body deformability that traced designs, can measure and be set in the position that pointer is used in above-mentioned four measurements by the tracing body, above-mentioned four measurements by the tracing body constitute the summit of a pair of first reference edge and the formed benchmark rectangle of a pair of second reference edge with pointer, wherein, above-mentioned a pair of first reference edge is pair of parallel limit in opposite directions, and above-mentioned a pair of second reference edge is that in opposite directions another is to parallel edges; And
Correcting device, it uses pointer as the summit with above-mentioned four measurements that measure, according to changing the distortion rectangle that the limit constituted corresponding to a pair of first change limit of above-mentioned a pair of first reference edge and corresponding to a pair of second of above-mentioned a pair of second reference edge, revise the position coordinates of tracing data, and the tracing data is revised in generation
Wherein, the position coordinates of the above-mentioned tracing data of above-mentioned correcting device correction, make and to play distance till the correction position of the tracing data of above-mentioned a pair of second reference edge from the above-mentioned a pair of first change limit, make the distance that plays from the above-mentioned a pair of second change limit till the correction position of the tracing data of above-mentioned a pair of first reference edge simultaneously than being and playing distance till the reference position of the tracing data of above-mentioned a pair of first reference edge from above-mentioned a pair of second reference edge than identical than being and playing distance till the reference position of the tracing data of above-mentioned a pair of second reference edge from above-mentioned a pair of first reference edge than identical.
6. the modification method of the data that traces designs, this modification method comprises the following steps:
Under by the state of tracing body deformability, measurement is set in above-mentioned by the position of four measurements of tracing body with pointer, above-mentioned four measurements by the tracing body constitute the summit of a pair of first reference edge and the formed benchmark rectangle of a pair of second reference edge with pointer, wherein, above-mentioned a pair of first reference edge is pair of parallel limit in opposite directions, and above-mentioned a pair of second reference edge is that in opposite directions another is to parallel edges; And
Use pointer as the summit with above-mentioned four measurements that measure, according to changing the distortion rectangle that the limit constituted corresponding to a pair of first change limit of above-mentioned a pair of first reference edge and corresponding to a pair of second of above-mentioned a pair of second reference edge, revise the position coordinates of tracing data, and the tracing data is revised in generation
Wherein, the position coordinates of the above-mentioned tracing data of above-mentioned correcting device correction, make and to play distance till the correction position of the tracing data of above-mentioned a pair of second reference edge from the above-mentioned a pair of first change limit, make the distance that plays from the above-mentioned a pair of second change limit till the correction position of the tracing data of above-mentioned a pair of first reference edge simultaneously than being and playing distance till the reference position of the tracing data of above-mentioned a pair of first reference edge from above-mentioned a pair of second reference edge than identical than being and playing distance till the reference position of the tracing data of above-mentioned a pair of second reference edge from above-mentioned a pair of first reference edge than identical.
7. the manufacture method of a substrate, this manufacture method comprises the following steps:
1) on the substrate of blank, is coated with photosensitive material;
2) for the substrate processing that traces designs after the coating;
3) carrying out video picture for the substrate after the tracing processing handles;
4) carry out etching or coating film treatment for the substrate after the video picture processing; And
5) carry out the lift-off processing of photosensitive material for the substrate after etching or the coating film treatment,
Wherein, in tracing is handled, by the described tracing data modification method correction tracing data of claim 6.
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| JP2012008243A (en) * | 2010-06-23 | 2012-01-12 | Hitachi High-Technologies Corp | Exposure device and exposure method, display panel board manufacturing apparatus, and display panel board manufacturing method |
| KR101137446B1 (en) * | 2010-07-22 | 2012-04-20 | 주식회사 이오테크닉스 | method for real-time correction of digital lithographic pattern and apparatus thereof |
| JP5496041B2 (en) | 2010-09-30 | 2014-05-21 | 大日本スクリーン製造株式会社 | Displacement calculation method, drawing data correction method, drawing method, and drawing apparatus |
| JP5731864B2 (en) * | 2011-03-18 | 2015-06-10 | 株式会社Ｓｃｒｅｅｎホールディングス | Drawing data correction device and drawing device |
| JP2012220559A (en) * | 2011-04-05 | 2012-11-12 | Nikon Corp | Exposure method, exposure device, and device manufacturing method |
| JP2015184315A (en) * | 2014-03-20 | 2015-10-22 | 株式会社Ｓｃｒｅｅｎホールディングス | Data correction device, drawing device, data correction method, and drawing method |
| CN106773547B (en) * | 2017-01-13 | 2019-07-12 | 西安电子科技大学 | It is a kind of based on the full-automatic maskless lithography method calibrated automatically |
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| CN1300097A (en) * | 1999-12-10 | 2001-06-20 | 日本电气株式会社 | Electronic-beam exposing method |
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