CN101090131B - 显示装置及其制造方法 - Google Patents
显示装置及其制造方法 Download PDFInfo
- Publication number
- CN101090131B CN101090131B CN2007101091224A CN200710109122A CN101090131B CN 101090131 B CN101090131 B CN 101090131B CN 2007101091224 A CN2007101091224 A CN 2007101091224A CN 200710109122 A CN200710109122 A CN 200710109122A CN 101090131 B CN101090131 B CN 101090131B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
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- 238000005516 engineering process Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 30
- 238000009413 insulation Methods 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 14
- 229910000906 Bronze Inorganic materials 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 12
- 239000010974 bronze Substances 0.000 claims description 12
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 12
- 239000010935 stainless steel Substances 0.000 claims description 12
- 229910001220 stainless steel Inorganic materials 0.000 claims description 12
- 229910001369 Brass Inorganic materials 0.000 claims description 10
- 239000010951 brass Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 7
- 229910017109 AlON Inorganic materials 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000005030 aluminium foil Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 6
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000007769 metal material Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 abstract description 14
- 238000007789 sealing Methods 0.000 abstract description 7
- 230000000994 depressogenic effect Effects 0.000 abstract 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 31
- 229910052760 oxygen Inorganic materials 0.000 description 31
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- 238000001764 infiltration Methods 0.000 description 8
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- 229920006254 polymer film Polymers 0.000 description 8
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- -1 acryloyl (acryl) Chemical group 0.000 description 1
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- 229920003023 plastic Polymers 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060053520 | 2006-06-14 | ||
KR10-2006-0053520 | 2006-06-14 | ||
KR1020060053520A KR100751453B1 (ko) | 2006-06-14 | 2006-06-14 | 표시장치와 이의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101090131A CN101090131A (zh) | 2007-12-19 |
CN101090131B true CN101090131B (zh) | 2012-01-04 |
Family
ID=38615135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101091224A Expired - Fee Related CN101090131B (zh) | 2006-06-14 | 2007-06-12 | 显示装置及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7986096B2 (zh) |
JP (1) | JP4960762B2 (zh) |
KR (1) | KR100751453B1 (zh) |
CN (1) | CN101090131B (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102084515A (zh) * | 2007-05-24 | 2011-06-01 | 皇家飞利浦电子股份有限公司 | 用于电子薄膜器件的封装 |
TW201002129A (en) * | 2008-02-20 | 2010-01-01 | Fuji Electric Holdings | Organic el display and manufacturing method thereof |
EP2434840A1 (en) * | 2008-04-22 | 2012-03-28 | Zeon Corporation | Organic electroluminescent light source |
KR101491156B1 (ko) * | 2008-10-30 | 2015-02-06 | 엘지디스플레이 주식회사 | 유기전계발광표시장치 |
US8766269B2 (en) * | 2009-07-02 | 2014-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, lighting device, and electronic device |
JP5765307B2 (ja) * | 2012-09-06 | 2015-08-19 | トヨタ自動車株式会社 | 燃料電池の製造方法 |
KR101967600B1 (ko) * | 2012-11-09 | 2019-04-10 | 엘지디스플레이 주식회사 | 플렉서블 유기전계발광소자 및 그 제조방법 |
JP2014170686A (ja) * | 2013-03-04 | 2014-09-18 | Toshiba Corp | 表示素子の製造方法、表示素子及び表示装置 |
US9627338B2 (en) * | 2013-03-06 | 2017-04-18 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming ultra high density embedded semiconductor die package |
KR102262598B1 (ko) * | 2014-09-03 | 2021-06-09 | 엘지디스플레이 주식회사 | 유기 발광 다이오드 표시 장치 및 이의 제조 방법 |
KR102351024B1 (ko) * | 2015-01-26 | 2022-01-13 | 엘지디스플레이 주식회사 | 유기발광 다이오드 표시장치 |
WO2016163367A1 (ja) * | 2015-04-09 | 2016-10-13 | シャープ株式会社 | El表示装置およびel表示装置の製造方法 |
CN105374946B (zh) * | 2015-11-18 | 2017-07-04 | 上海天马微电子有限公司 | 一种柔性显示装置及其制备方法 |
KR102517446B1 (ko) * | 2015-12-02 | 2023-04-04 | 엘지디스플레이 주식회사 | 표시장치 및 그 제조방법 |
DE102016108195A1 (de) * | 2016-05-03 | 2017-11-09 | Osram Oled Gmbh | Verfahren zum herstellen eines organischen optoelektronischen bauelements und organisches optoelektronisches bauelement |
CN108963103B (zh) | 2018-06-28 | 2020-07-10 | 武汉华星光电半导体显示技术有限公司 | Oled显示面板 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1527115A (zh) * | 2002-12-31 | 2004-09-08 | ���ǵ�����ʽ���� | 薄膜晶体管及其电子器件和制造方法 |
CN1578546A (zh) * | 2003-06-27 | 2005-02-09 | 株式会社半导体能源研究所 | 显示器件及其制作方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5811177A (en) | 1995-11-30 | 1998-09-22 | Motorola, Inc. | Passivation of electroluminescent organic devices |
JPH09204981A (ja) * | 1996-01-26 | 1997-08-05 | Nippon Steel Chem Co Ltd | 有機el素子 |
TW495812B (en) * | 2000-03-06 | 2002-07-21 | Semiconductor Energy Lab | Thin film forming device, method of forming a thin film, and self-light-emitting device |
KR100370921B1 (ko) | 2000-12-07 | 2003-02-05 | 주식회사 엘리아테크 | 이중 경화공정에 의한 유기 전계 발광 표시패널 및 그제조방법 |
KR100500607B1 (ko) | 2001-11-21 | 2005-07-11 | 주식회사 비스톰 | 전계발광소자의 봉지용 접착성 필름 및 이를 이용한봉지방법 |
KR100462469B1 (ko) | 2002-04-17 | 2004-12-17 | 한국전자통신연구원 | 접착식 유기-무기 복합막을 갖춘 엔캡슐레이션 박막과이를 포함하는 유기 전기발광 소자 |
KR20030096518A (ko) | 2002-06-12 | 2003-12-31 | 주식회사 엘리아테크 | 유기 이엘 패널 및 그의 패키징 방법 |
JP3884351B2 (ja) * | 2002-08-26 | 2007-02-21 | 株式会社 日立ディスプレイズ | 画像表示装置およびその製造方法 |
JP2004171806A (ja) | 2002-11-18 | 2004-06-17 | Toppan Printing Co Ltd | 有機エレクトロルミネッセンス素子 |
JP4520226B2 (ja) * | 2003-06-27 | 2010-08-04 | 株式会社半導体エネルギー研究所 | 表示装置及び表示装置の作製方法 |
JP4479381B2 (ja) * | 2003-09-24 | 2010-06-09 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
KR101061730B1 (ko) * | 2003-11-28 | 2011-09-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 그 제조 방법 |
JP4689249B2 (ja) * | 2003-11-28 | 2011-05-25 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
WO2005052893A1 (en) * | 2003-11-28 | 2005-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing display device |
US7084045B2 (en) * | 2003-12-12 | 2006-08-01 | Seminconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
JP4776949B2 (ja) * | 2004-03-16 | 2011-09-21 | 株式会社半導体エネルギー研究所 | 発光装置 |
JP2005293946A (ja) * | 2004-03-31 | 2005-10-20 | Sanyo Electric Co Ltd | 有機el表示装置 |
TWI367686B (en) * | 2004-04-07 | 2012-07-01 | Semiconductor Energy Lab | Light emitting device, electronic device, and television device |
JP2005302401A (ja) | 2004-04-08 | 2005-10-27 | Three Bond Co Ltd | 有機el素子封止材 |
KR101424784B1 (ko) * | 2006-01-10 | 2014-07-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 및 그의 제조방법 |
-
2006
- 2006-06-14 KR KR1020060053520A patent/KR100751453B1/ko active IP Right Grant
-
2007
- 2007-05-09 JP JP2007124986A patent/JP4960762B2/ja active Active
- 2007-05-24 US US11/753,213 patent/US7986096B2/en not_active Expired - Fee Related
- 2007-06-12 CN CN2007101091224A patent/CN101090131B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1527115A (zh) * | 2002-12-31 | 2004-09-08 | ���ǵ�����ʽ���� | 薄膜晶体管及其电子器件和制造方法 |
CN1578546A (zh) * | 2003-06-27 | 2005-02-09 | 株式会社半导体能源研究所 | 显示器件及其制作方法 |
Non-Patent Citations (4)
Title |
---|
JP特开2000-68047A 2000.03.03 |
JP特开2003-59646A 2003.02.28 |
JP特开2005-302401A 2005.10.27 |
JP特开2006-32088A 2006.02.02 |
Also Published As
Publication number | Publication date |
---|---|
CN101090131A (zh) | 2007-12-19 |
KR100751453B1 (ko) | 2007-08-23 |
JP2007335403A (ja) | 2007-12-27 |
JP4960762B2 (ja) | 2012-06-27 |
US7986096B2 (en) | 2011-07-26 |
US20070291215A1 (en) | 2007-12-20 |
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG ELECTRONICS CO., LTD. Effective date: 20121224 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121224 Address after: South Korea Gyeonggi Do Yongin Patentee after: Samsung Display Co.,Ltd. Address before: Gyeonggi Do Lingtong District South Korea Suwon Mei Tan 3 hole 416 Patentee before: Samsung Electronics Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120104 Termination date: 20210612 |