CN101060726B - 制作电容式麦克风元件的振膜的方法 - Google Patents
制作电容式麦克风元件的振膜的方法 Download PDFInfo
- Publication number
- CN101060726B CN101060726B CN2006100746686A CN200610074668A CN101060726B CN 101060726 B CN101060726 B CN 101060726B CN 2006100746686 A CN2006100746686 A CN 2006100746686A CN 200610074668 A CN200610074668 A CN 200610074668A CN 101060726 B CN101060726 B CN 101060726B
- Authority
- CN
- China
- Prior art keywords
- layer
- vibrating diaphragm
- silicon
- dielectric
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000012528 membrane Substances 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 29
- 239000010703 silicon Substances 0.000 claims abstract description 29
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000000059 patterning Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 27
- 238000000926 separation method Methods 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 14
- 238000005520 cutting process Methods 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 4
- 229920005591 polysilicon Polymers 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 2
- 238000011946 reduction process Methods 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 238000001259 photo etching Methods 0.000 description 4
- 238000013016 damping Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006100746686A CN101060726B (zh) | 2006-04-21 | 2006-04-21 | 制作电容式麦克风元件的振膜的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006100746686A CN101060726B (zh) | 2006-04-21 | 2006-04-21 | 制作电容式麦克风元件的振膜的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101060726A CN101060726A (zh) | 2007-10-24 |
CN101060726B true CN101060726B (zh) | 2011-10-12 |
Family
ID=38866555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100746686A Expired - Fee Related CN101060726B (zh) | 2006-04-21 | 2006-04-21 | 制作电容式麦克风元件的振膜的方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101060726B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2239961A1 (en) * | 2009-04-06 | 2010-10-13 | Nxp B.V. | Backplate for microphone |
CN102209287B (zh) * | 2010-03-29 | 2014-10-15 | 歌尔声学股份有限公司 | Mems麦克风芯片及其制造方法 |
CN102740204A (zh) * | 2011-04-08 | 2012-10-17 | 美律实业股份有限公司 | 具有立体振膜结构的微机电麦克风晶片及其制造方法 |
CN104507014B (zh) * | 2014-12-26 | 2018-08-28 | 上海集成电路研发中心有限公司 | 一种具有褶皱型振动膜的mems麦克风及其制造方法 |
CN107337174B (zh) * | 2017-06-27 | 2019-04-02 | 杭州电子科技大学 | 一种多晶硅振膜结构的制作方法 |
CN114430520B (zh) * | 2020-10-29 | 2024-07-09 | 富迪科技(南京)有限公司 | 微型扬声器的封装结构 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1310575A (zh) * | 1999-05-28 | 2001-08-29 | 德克萨斯仪器股份有限公司 | 扬声器 |
CN1582063A (zh) * | 2003-08-05 | 2005-02-16 | 美商楼氏电子有限公司 | 驻极体电容麦克风 |
CN1678134A (zh) * | 2004-03-30 | 2005-10-05 | Akg声学有限公司 | 麦克风的极化电压设定 |
-
2006
- 2006-04-21 CN CN2006100746686A patent/CN101060726B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1310575A (zh) * | 1999-05-28 | 2001-08-29 | 德克萨斯仪器股份有限公司 | 扬声器 |
CN1582063A (zh) * | 2003-08-05 | 2005-02-16 | 美商楼氏电子有限公司 | 驻极体电容麦克风 |
CN1678134A (zh) * | 2004-03-30 | 2005-10-05 | Akg声学有限公司 | 麦克风的极化电压设定 |
Also Published As
Publication number | Publication date |
---|---|
CN101060726A (zh) | 2007-10-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9266716B2 (en) | MEMS acoustic transducer with silicon nitride backplate and silicon sacrificial layer | |
US7329933B2 (en) | Silicon microphone with softly constrained diaphragm | |
EP1996507B1 (en) | Method for fabricating a mems microphone | |
KR100931575B1 (ko) | Mems를 이용한 압전 소자 마이크로 스피커 및 그 제조방법 | |
US8045734B2 (en) | Backplateless silicon microphone | |
CN101060726B (zh) | 制作电容式麦克风元件的振膜的方法 | |
CN104507014A (zh) | 一种具有褶皱型振动膜的mems麦克风及其制造方法 | |
CN101854578B (zh) | 一种基于硅硅键合工艺的微型麦克风制备方法 | |
CN101572850A (zh) | 在低温下制作的带应力释放膜的电容式麦克风及其制作方法 | |
JP2008517523A (ja) | シリコンマイクロホン | |
WO2014159552A1 (en) | Mems acoustic transducer with silicon nitride backplate and silicon sacrificial layer | |
CN111770422A (zh) | 级联微型麦克风及其制造方法 | |
CN110113703B (zh) | 一种mems结构的制备方法 | |
CN105530579A (zh) | 麦克风及其制造方法 | |
TWI448165B (zh) | 麥克風元件及其製造方法 | |
TWI305474B (en) | Method of fabricating a diaphragm of a capacitive microphone device | |
CN101355828A (zh) | 基于soi硅片的集成电路与电容式微硅麦克风的单片集成方法及芯片 | |
CN101064969B (zh) | 制作电容式麦克风元件的振膜的方法 | |
US20210314718A1 (en) | Process of fabricating lateral mode capacitive microphone including a capacitor plate with sandwich structure | |
US7585417B2 (en) | Method of fabricating a diaphragm of a capacitive microphone device | |
CN212435926U (zh) | 级联微型麦克风 | |
US20210058727A1 (en) | Process of fabricating lateral mode capacitive microphone | |
KR20040046544A (ko) | 음향 감지 소자의 제조방법 | |
CN108540910B (zh) | 麦克风及其制作方法 | |
KR101112120B1 (ko) | 멤스 마이크로폰 및 그 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: CHINA TAIWAN GELEIMENG CO., LTD. Free format text: FORMER OWNER: TOUCH MICRO-SYSTEM TECHNOLOGY CORP. Effective date: 20140520 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140520 Address after: Taiwan, Taipei, China three East Road, No. 170, 9 floor Patentee after: Chinese gredmann Taiwan Limited by Share Ltd Address before: China Taiwan Taoyuan County Patentee before: Touch Micro-System Technology Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111012 Termination date: 20150421 |
|
EXPY | Termination of patent right or utility model |