CN101038896A - A package for solid-state image sensing apparatus and a solid image sensing apparatus - Google Patents

A package for solid-state image sensing apparatus and a solid image sensing apparatus Download PDF

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Publication number
CN101038896A
CN101038896A CNA200710088607XA CN200710088607A CN101038896A CN 101038896 A CN101038896 A CN 101038896A CN A200710088607X A CNA200710088607X A CN A200710088607XA CN 200710088607 A CN200710088607 A CN 200710088607A CN 101038896 A CN101038896 A CN 101038896A
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CN
China
Prior art keywords
mentioned
solid
state imager
packaging part
package body
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Pending
Application number
CNA200710088607XA
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Chinese (zh)
Inventor
前田光男
松见泰夫
吉田拓治
井手淳一
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Toshiba Corp
Sumitomo Chemical Co Ltd
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Toshiba Corp
Sumitomo Chemical Co Ltd
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Application filed by Toshiba Corp, Sumitomo Chemical Co Ltd filed Critical Toshiba Corp
Publication of CN101038896A publication Critical patent/CN101038896A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

The invention provides a package part for accepting solid camera elements. External conductor part (2b1) includes bending part (2b10) which is dissymmetrical to the centreline (Z0), so that if end part (A) of the external conductor part (2b1) moves along the long edge direction (X) of package part main body (1a) with thermal expansion of wiring substrates (20), stress is concentrative on the bending part (2b10) to bend it a little. The stress transfer to the package part main body (1a) connecting to the external conductor part (2b1) is relaxed and reduced.

Description

Be used to accommodate the packaging part and the solid camera head of solid-state imager
Technical field
The present invention relates to be used to accommodate the packaging part and the solid camera head of solid-state imager.
Background technology
In the past, known have a solid camera head that contains solid-state imager in resinous packaging part.Such solid camera head for example is documented in the Patent Document 1 (spy opens flat 6-163950 communique).Extend a plurality of outer leads from solid camera head, these outer leads are fixed on the wiring substrate.
But under situation about solid-state imager being fixed on the wiring substrate, if the wiring substrate thermal expansion, then move the position of the terminal part of outer lead, via outer lead to the packaging part stress application.Particularly, on being fixed on long side direction both ends in the packaging part, at packaging part, the solid-state imager that aspect ratios such as linear transducer is higher is respectively equipped with under the situation of a plurality of outer leads, if the outer lead terminal part moves on the packaging part long side direction toward the outer side, then produce packaging part along the thickness direction bending, under the effect of stress at this moment, be fixed on the interior solid-state imager of the packaging part problem of warpage significantly.
Summary of the invention
The present invention makes in view of above-mentioned problem, and purpose provides a kind of packaging part and solid camera head of being used to accommodate solid-state imager that can be reduced in the stress that produces in the packaging part.
In order to solve above-mentioned problem, the relevant packaging part that is used to accommodate solid-state imager of the present invention is characterised in that to possess: the lead that has the resinous package body of recess and extend to the outside via the sidewall of package body in the recess; The outer lead portion of this lead has the asymmetrical joggling part of center line with respect to the length direction of this outer lead portion.
And then the packaging part that is used to accommodate solid-state imager preferably on the bottom surface of the recess of resinous package body, also possesses the island portion (chip carrier: die pad) that is used to solid-state imager is set and is provided with.The heat that this island portion can produce with the work of solid-state imager the time is suitably used to the purposes of outside heat radiation.
Because outer lead portion has with respect to the asymmetrical joggling part of center line, so if the terminal part of outer lead portion moves, then stress concentrates on this joggling part and crooked slightly.Thereby, relaxed transmission to the stress of the package body that is connected with outer lead portion, can be reduced in the stress that produces in the packaging part.In the portion of the island of conductivity, be fixed with solid-state imager, but owing to the stress in the packaging part has reduced, so also reduced to the stress of solid-state imager.
In addition, this joggling part preferably has: the 1st bend, to a side of center line to draw the mode bending of arc; The 2nd bend is connected on the 1st bend, to the opposite side of center line to draw the mode bending of arc.In the case, when the thermal expansion of wiring substrate, terminal part by outer lead portion moves to a direction, stress is on a bend, equally, when the thermal contraction of wiring substrate, mobile in the other direction by the terminal part of outer lead portion, stress relaxes so can carry out the higher stress of uniformity in wider temperature range on another bend.
In addition, the 1st bend and the 2nd bend preferably have with respect to a bit being point-symmetric relation on the above-mentioned center line.In the case, because the trend that is relaxed equably on every side of any on center line of stress is arranged, relax so can carry out the higher stress of uniformity.
In addition, above-mentioned joggling part also can have: the 1st line part, and outstanding point-blank to a side of center line; The 2nd line part is connected on the 1st line part, to center line one side turn back ground straight-line extension.In the case, stress can carry out stress and relax on the connecting portion of the 1st line part and the 2nd line part.
In addition, the width of above-mentioned joggling part is preferably narrower than the width of the terminal part of outer lead portion.In the case, because joggling part is thinner,, stress makes its bending so concentrating easily.If will be apart from the front end 10% of outer lead portion with interior as terminal part, then the width of joggling part is preferably narrower than the Breadth Maximum of the terminal part of this outer lead portion.
Outer lead portion is 390N/mm by hot strength preferably 2Above material constitutes.That is, externally under the situation that wire portion is made of such material, with respect to moving of the terminal part of outer lead portion, outer lead portion, particularly joggling part flexibly are out of shape, in addition, if original position is got back in the position of terminal part, then its shape is flexibly restored, and can carry out the sufficient elasticity distortion.
Such material is preferably the material that contains copper alloy.If contain copper alloy, then bring into play function fully as lead, and have sufficient elasticity with high conductivity.Copper alloy is preferably selected from the group of alloys that is made of phosphor bronze, brass, spedex and beryllium copper.These alloys are owing to having high tensile and elastic force, so also have sufficient elasticity.
In addition, outer lead portion preferably has: horizontal part, extend on the Width perpendicular to the long side direction of package body; Shoulder, from the end of horizontal part to the thickness direction warpage of package body and be connected on the joggling part.Externally wire portion has under the situation of horizontal part and shoulder, and the stress of joggling part is difficult for being delivered to package body, can suppress the warpage of package body.About solid state image device of the present invention: above-mentioned being used to accommodated the packaging part of solid-state imager and is located at solid-state imager in the packaging part that is used to accommodate solid-state imager, can be reduced in the amount of warpage that produces in the packaging part significantly, so misoperation that can suppression element.
According to the packaging part that is used to accommodate solid-state imager of the present invention, can be reduced in the stress that produces in the packaging part, thereby, can suppress to be arranged on the warpage of inner solid-state imager, can suppress to result from the deterioration in characteristics of this solid-state imager.
Description of drawings
Fig. 1 is the exploded perspective view of solid camera head 10 of packaging part 1 that is used to accommodate solid-state imager that possesses relevant the 1st execution mode.
Fig. 2 is that the II-II of solid camera head 10 shown in Figure 1 is to looking cutaway view.
Fig. 3 is the vertical view that constitutes the lead frame 2 of packaging part 1 shown in Figure 1.
Fig. 4 is the 2b of outer lead portion shown in Figure 3 1In one vertical view.
Fig. 5 is the exploded perspective view of solid camera head 10 of packaging part 1 that is used to accommodate solid-state imager that possesses relevant the 2nd execution mode.
Fig. 6 is that the VI-VI of solid camera head 10 shown in Figure 5 is to looking cutaway view.
Fig. 7 is the vertical view that constitutes the lead frame 2 of packaging part 1 shown in Figure 5.
Fig. 8 is the 2b of outer lead portion shown in Figure 7 1In one vertical view.
Fig. 9 be the expression temperature (℃) with the curve chart of the relation of the amount of warpage (μ m) of the thickness direction of solid-state imager 3.
Figure 10 be the expression temperature (℃) with the curve chart of the relation of the amount of warpage (μ m) of the thickness direction of solid-state imager 3.
Figure 11 is the part stereogram of the solid camera head that only shape of the 2a of island portion replaced from the shape of Fig. 3 or Fig. 7.
Figure 12 is the figure of method of measurement that is used for illustrating the amount of warpage of solid-state imager.
Figure 13 be the expression temperature (℃) with the curve chart of the relation of the amount of warpage (μ m) of the thickness direction of solid-state imager 3.
Embodiment
Below, the packaging part and the solid camera head that are used to accommodate solid-state imager of relevant execution mode described.In addition, use identical label for identical key element, the repetitive description thereof will be omitted.
Fig. 1 is the exploded perspective view of solid camera head 10 of packaging part 1 that is used to accommodate solid-state imager that possesses relevant the 1st execution mode.Fig. 2 is that the II-II of solid camera head 10 shown in Figure 1 is to looking cutaway view.
Solid camera head 10 is fixed on the wiring substrate 20.The packaging part 1 that is used to accommodate solid-state imager has resinous package body 1a, and this package body 1a has recess 1a 1 Recess 1a at package body 1a 1The bottom surface be provided with the 2a of conductivity island portion (chip carrier), on the 2a of portion of conductivity island, be fixed with solid-state imager 3.Solid-state imager 3 is higher elements of aspect ratio of linear transducer etc.From recess 1a 1 Interior sidewall 1a via package body 1a 2Be extended with lead 2b to the outside.Lead 2b is by the 2b of outer lead portion 1And the 2b of inner lead portion 2Constitute.Solid-state imager 3 electrically is connected the 2b of inner lead portion via closing line 5 2On.
The recess of package body 1a (opening) 1a 1By transparent panel 4 sealing, incide in the solid-state imager 3 via the image of transparent panel 4 incidents, by the picture signal of the image after solid-state imager 3 light-to-current inversions successively via closing line 5, the 2b of inner lead portion 2, and the 2b of outer lead portion 1Pass to wiring substrate 20.
The aspect ratio that package body 1a has long side direction and a short side direction is the elongate in shape more than 3.Width perpendicular to the cross section of the long side direction of package body 1a narrows down gradually along with leaving from lead frame 2 in the inner space that is located at the back metal mould on the rear side of lead frame 2, shaping resin easily can be extracted from the back metal mould.The aspect ratio that solid-state imager 3 also has long side direction and a short side direction is the elongate in shape more than 3.If aspect ratio is more than 3 like this, then can find the reduction of amount of warpage of the present invention effectively, along with aspect ratio becomes higher and becomes remarkable.Sidewall 1a at package body 1a along long side direction 2On, preferably the long side direction along package body 1a is formed with a plurality of groove 1a 3(loss of weight portion).Like this, if having loss of weight portion, then the light-weighted viewpoint at package body 1a is preferred.In addition, if use the metal pattern of such loss of weight portion formation usefulness, the advantage of the resin flow in the time of then can guaranteeing ester moulding in addition.
On Width (Y-axis) side faces at both ends of the 2a of island portion, contact have along the long side direction (X-axis) of package body 1a extend, from recess 1a 1The bottom surface along upright a pair of projection (jetty portion) 1a that establishes of Z-direction 5, the moving of the Width of the restriction island 2a of portion.Projection 1a 5The side and the 2b of inner lead portion of inner lead portion side 2The end face of island portion side constitute the groove 1a that is clipped between them respectively 6A side and the part of another side.
Package body 1a forms by the injection moulding of resin, but in the case, and metal pattern is configured in the face side and the rear side of lead frame 2 (with reference to Fig. 3), and resin is injected in the space that is formed between surface metal mould and the back metal mould.The 2b of inner lead portion at package body 1a 2Under, along the long side direction of package body 1a and be provided with from the outer bottom of package body 1a and reach the 2b of inner lead portion 2The groove 1a at the back side 4This groove 1a 4Be when carrying out ester moulding, to push the inner lead 2b of portion with metal pattern from rear side 2Vestige.
Package body 1a has a pair of deep floor 1a along its long side direction (X-axis) 7In other words, at a pair of deep floor 1a 7Between be formed with reverse groove 1a 8
The 2b of outer lead portion of lead 2b 1Has joggling part 2b 10Lead 2b is respectively equipped with a plurality of on periphery position, the both ends of the long side direction of package body 1a.
Fig. 3 is the vertical view that expression constitutes the lead frame 2 of above-mentioned packaging part 1.
The a pair of island 2a of portion is located at respectively on the both ends of package body 1a.This a pair of island 2a of portion of cutting apart also can be integrated.From the Width two ends of the 2a of island portion along the Width of package body 1a continuously one be extended with the Width island 2a of pushing portion of portion 2, reach sidewall 1a 2Inside.In addition, from the long side direction two ends of the package body 1a of the 2a of island portion, along the long side direction of package body 1a continuously one be extended with the long side direction island 2a of pushing portion of portion 3, reach the sidewall 1a that extends along the short side direction (Y-axis) of package body 1a 9The inside of (with reference to Fig. 1).
Lead frame 2 possesses housing 2c, is extended with a plurality of outer lead 2b of portion towards the inboard from the inboard of housing 2c 1, the long side direction island 2a of pushing portion of portion 3Behind ester moulding, by from housing 2c with the 2b of outer lead portion 1, the long side direction island 2a of pushing portion of portion 3Cut off and cut away, with the 2b of outer lead portion 1Along the thickness direction bending of package body 1a, finish packaging part shown in Figure 11.
Fig. 4 is the 2b of outer lead portion shown in Figure 3 1In one vertical view.
The 2b of outer lead portion 1Has joggling part 2b 10Joggling part 2b 10With respect to the 2b of outer lead portion 1The center line Z of length direction 0For asymmetric.Like this, because the 2b of outer lead portion 1Have with respect to center line Z 0Asymmetrical joggling part 2b 10So, if along with the thermal expansion of wiring substrate 20 2b of outer lead portion 1Terminal part A move along the length direction (X-direction) of package body 1a, then stress is concentrated in this joggling part 2b 10And make it crooked slightly.Thereby, relaxed to being connected with the 2b of outer lead portion 1The transmission of stress of package body 1a, can be reduced in the stress that produces in the packaging part.
In addition, joggling part 2b 10Width W 1 (=0.3mm) than the 2b of outer lead portion 1Terminal part A width W 2 (=0.46mm) narrow because joggling part 2b 10Thinner,, stress makes its bending so concentrating easily.
If referring again to Fig. 1,, then act on the 2b of outer lead portion of the positive direction side that is positioned at X-axis along the power Fs+ of the positive direction of X-axis if then wiring substrate 20 is along the long side direction X thermal expansion of package body 1a 1Terminal part A on, act on the 2b of outer lead portion of the negative direction side that is positioned at X-axis along the Fs-of X-axis negative direction 1Terminal part A on.In the case, the directions X center of solid-state imager 3 will be to the negative direction bending of Z axle, but by joggling part 2b 10Strain has suppressed the transmission to package body 1a of power Fs+, Fs-.In addition, at joggling part 2b 10On, also effect has from joggling part 2b 10The power that the A of terminad portion direction stretches.
In Fig. 4, joggling part 2b 10Have to center line Z 0A side with the 1st bend 2b of the mode bending of drawing arc 11, and be connected the 1st bend 2b 11Upward, to center line Z 0Opposite side with the 2nd bend 2b of the mode bending of drawing arc 12In the case, when the thermal expansion of wiring substrate 20, by the 2b of outer lead portion 1Terminal part A move to a direction, stress is at a bend (2b for example 11) on, same, when the thermal contraction of wiring substrate 20, by the 2b of outer lead portion 1Terminal part A to moving in the other direction, stress is at another bend (2b for example 12) on, so, can in the bigger temperature range of width, carry out the higher stress of uniformity and relax.
In addition, the 1st bend 2b 11With the 2nd bend 2b 12Have with respect to center line Z 0On 1 B be point-symmetric relation.In the case, because 1 B's on center line has the trend that relaxes stress equably on every side, relax so can carry out the higher stress of uniformity.In addition, corresponding to above-mentioned tensile force, the 2b of outer lead portion 1Also be difficult for respect to center line Z 0Carry out asymmetrical distortion, so further relaxed Stress Transfer to package body 1a.In addition, the 2b of outer lead portion 1At its base end part and joggling part 2b 10Between, have the tapering 2b that attenuates along with towards front end 13
At the 1st bend 2b 11The inboard arc than central point B1 by in the zone of central point B side, the minimum value θ 1 at the tangent line of this arc and angle that X-axis becomes, this arc than outer wire portion 2b of central point B1 1Base end part (tapering 2b 13) in the zone of side, the tangent line of this arc with the minimum value θ 2 at angle that X-axis becomes, in this zone, the 1st bend 2b 11The tangent line of arc in the outside be respectively θ 1=15 degree, θ 2=10 degree, θ 3=20 degree with the minimum value θ 3 at angle that X-axis becomes.These angles also can contain ± 20% error.
From the 1st bend 2b 11The arc in the outside be connected to the 2b of outer lead portion 1Base end part arc radius of curvature R 1, from the 1st bend 2b 11The arc of inboard be connected to the 2b of outer lead portion 1Radius of curvature R the 2, the 1st bend 2b of arc of base end part 11Radius of curvature R the 3, the 1st bend 2b of arc of inboard 11The radius of curvature R 4 of arc in the outside be respectively R1=0.05mm, R2=0.3mm, R3=0.4mm, R4=0.7mm.These radius of curvature also can contain ± 20% error.
In addition, the 2nd bend 2b 12Shape except radius of curvature R 1, the R2 of the part that is connected to terminal part are slightly different, with respect to central point B and the 1st bend 2b 11Be point symmetry, base end part and terminal part can be changed in the above description and read.
In addition, the 2b of outer lead portion 1Shape be the minute surface symmetry with respect to the center of the long side direction by package body 1a, perpendicular to the plane (YZ plane) of this long side direction, realized the symmetry of stress mitigation.
Fig. 5 is the exploded perspective view of solid camera head 10 of packaging part 1 that is used to accommodate solid-state imager that possesses relevant the 2nd execution mode.Fig. 6 is that the VI-VI of solid camera head 10 shown in Figure 5 is to looking cutaway view.
In this solid camera head 10, the 2b of outer lead portion only 1Shape with shown in Figure 1 different, other structures are identical.
The 2b of outer lead portion 1Have the horizontal part 2b of edge perpendicular to the Width Y extension of the long side direction X of package body 1a 14, with from horizontal part 2b 14End to the thickness direction warpage of package body 1a and be connected to joggling part 21b 10Shoulder 2b 8Wire portion 2b externally 1Has horizontal part 2b 14And shoulder 2b 8Situation under, joggling part 2b 10Stress be difficult for being delivered to package body 1a, can suppress the warpage of package body 1a.Horizontal part 2b 14Length be 0.8mm～8mm.In addition, this structure also can be applied to and adopt the joggling part 2b with above-mentioned bend 10The 2b of outer lead portion 1Structure in.
Fig. 7 is the vertical view that constitutes the lead frame 2 of packaging part 1 shown in Figure 5.
Lead frame 2 possesses housing 2c, is extended with a plurality of outer lead 2b of portion towards the inboard from the inboard of housing 2c 1, the long side direction island 2a of pushing portion of portion 3, but the 2b of outer lead portion only 1Shape with shown in Figure 3 different.Behind ester moulding, by from housing 2c with the 2b of outer lead portion 1, the long side direction island 2a of pushing portion of portion 3Cut off and cut away, with the 2b of outer lead portion 1Get above-mentioned horizontal part 2b 14The distance of (with reference to Fig. 6), along the bending of the thickness direction of package body 1a, finish packaging part shown in Figure 11.
Fig. 8 is the 2b of outer lead portion shown in Figure 7 1In one vertical view.
The 2b of outer lead portion 1Joggling part 2b 10Have to center line Z 0The 1st outstanding point-blank line part 2b of a side (right side among the figure) 15, and with the 1st line part 2b 15Connect, to center line Z 0Side is turned back and the 2nd line part 2b that extends point-blank 16In the case, stress is at the 1st line part 2b 15With the 2nd line part 2b 16Linking part C on, can carry out stress and relax.
The 1st line part 2b 15With the 2nd line part 2b 16Angulation θ 11 is 90 degree.Connect the 1st line part 2b 15The side and line part (the tapering 2b of warpage inboard 13) part radius of curvature R 11, connect the 1st line part 2b 15The side and line part (the tapering 2b in the warpage outside 13) radius of curvature R the 12, the 1st line part 2b of part 15With the 2nd line part 2b 16Radius of curvature R the 13, the 1st line part 2b of arc in the outside of connecting portion C 15With the 2nd line part 2b 16The radius of curvature R 14 of arc of inboard of connecting portion C be respectively R11=0.3mm, R12=0.1mm, R13=0.4mm, R14=0.1mm.These angles and radius of curvature also can contain ± 20% error.In addition, joggling part 2b 10Width W 1 (=0.3mm) than the 2b of outer lead portion 1Terminal part A width W 2 (=0.46mm) narrow because joggling part 2b 10Thinner,, stress makes its bending so concentrating easily.
Fig. 9 be the expression temperature (℃) with the curve chart of the relation of the amount of warpage (μ m) of the thickness direction of solid-state imager 3.The method of measurement of this amount of warpage is described with reference to Figure 12 here.With solid-state imager 3 quartering on long side direction, measure measurement point X respectively A, S 1, S 2, S 3, X BHeight (with reference to Figure 12 (a)).To link measurement point X AWith measurement point X BStraight line as datum line X P(with reference to Figure 12 (b)).If measurement point S 1, S 2, S 3With datum line X PDifference be displacement δ 1, δ 2, δ 3, establish the amount of warpage on the long side direction that displacement maximum among them is a solid-state imager 3.If solid-state imager 3 is protruding and crooked downwards, then displacement becomes negative value, if solid-state imager 3 is convex and crooked, then displacement becomes positive value.With above-mentioned amount of warpage as each measurement point S 1, S 2, S 3Displacement δ 1, δ 2, δ 3Maximum.In addition, the amount of warpage of establishing under the room temperature is 0 μ m, is plotted on the curve chart.
Along with the rising of temperature, the long side direction middle position of solid-state imager 3 is to-Z direction displacement.A *(not having horizontal part, ≈ 0mm) is the data of solid camera head that adopt the outer lead portion of the type that does not have joggling part in the past, B *Be the data of solid camera head that adopt the outer lead portion (not having horizontal part, ≈ 0mm) of type shown in Figure 8, C *Be the data of the solid camera head of the outer lead portion that adopts type shown in Figure 4 (have horizontal part (=1mm)).
In addition, the material of lead frame is the system TAMAC194 of Mitsubishi Corporation shindo.TAMAC194 be contain that Cu:97 (weight %) is above, Fe:2.1～2.6 (weight %), P:0.015～0.15 (weight %), Zn:0.05～0.20 (weight %), the following material of Pb:0.03 (weight %).
Though in data, there are some discrete according to product, have in employing under the situation of outer lead portion of joggling part, to compare with product in the past, displacement diminishes with respect to the variation of variations in temperature.In 20 ℃～100 ℃ temperature range, under the situation of the outer lead portion that adopts type shown in Figure 8, displacement is below the 15 μ m, and under the situation of the outer lead portion that adopts type shown in Figure 4, displacement is below the 13 μ m.In addition, in this curve chart, displacement (μ m) in having represented to heat up and the displacement (μ m) in the cooling are that the data of which kind of state are represented by (intensification) in the curve chart and (cooling).
Figure 10 be the expression temperature (℃) with the curve chart of the relation of the amount of warpage (μ m) of the thickness direction of solid-state imager 3.In addition, the method for measurement of amount of warpage as mentioned above.
E *Be the data of the solid camera head of the outer lead portion that adopts type shown in Figure 8 (have horizontal part (=1mm)), B *Be the data of solid camera head that adopt the outer lead portion (no horizontal part, ≈ 0mm) of type shown in Figure 8.
In addition, the material of lead frame is the system TAMAC194 of Mitsubishi Corporation shindo.
Though there are some discrete in data according to product, (under the situation of=1mm) outer lead portion, compare with the situation that does not adopt it, displacement diminishes with respect to the variation of variations in temperature to have horizontal part in employing.In 20 ℃～100 ℃ temperature range, shown in Figure 6 have horizontal part (under the situation of=1mm) outer lead portion, displacement is below the 12 μ m adopting.In addition, in this curve chart, displacement (μ m) in having represented to heat up and the displacement (μ m) in the cooling are that the data of which kind of state are represented by (intensification) in the curve chart and (cooling).
Figure 13 be the expression temperature (℃) with the curve chart of the relation of the amount of warpage (μ m) of the thickness direction of solid-state imager 3.In addition, the method for measurement of amount of warpage as mentioned above.
F *Use the data of the solid camera head of clear peak metal industry Co., Ltd. system " C5210 " (phosphor bronze) as the lead frame material." C5210 " contains Sn:7～9 (weight %), P:0.03～0.35 (weight %), following, the material below the Pb:0.05 (weight %), below the Zn:0.20 (weight %), more than the Cu+Sn+P:99.7 (weight %) of Fe:0.10 (weight %).
G *Use the data of the solid camera head of Japanese ガ イ シ system " 7 alloy " (beryllium copper) as the lead frame material." 7 alloy " is to contain Be:0.2～0.4 (weight %), Ni+Co:1.8～2.5 (weight %), following, the material more than the Cu+Be+Ni+Co+Al:99.0 (weight %) of Al:0.6 (weight %).
In addition, F *And G *All adopt except in the outer lead portion of type shown in Figure 8, changing to R11=0.8mm, R12=0.5mm, the outer lead portion identical shaped with Fig. 8 beyond the R13=0.8mm, R14=0.5mm (horizontal part=1mm).
Have in employing under the situation of outer lead portion of joggling part, compared with the past, displacement diminishes with respect to the variation of variations in temperature.In 20 ℃～100 ℃ temperature range, use phosphor bronze as the situation of lead frame material under (data F *) displacement is below the 8 μ m, use beryllium copper as the situation of lead frame material under (data G *) displacement is below the 13 μ m.Each above-mentioned raw material also can comprise ± 10% error.
Then, material is described.
The above-mentioned 2b of outer lead portion 1Be 390N/mm preferably by hot strength 2Above material constitutes.Wire portion 2b externally 1Under the situation about being made of such material, outer lead portion, particularly joggling part are corresponding to the 2b of outer lead portion 1Moving of terminal part A and distortion flexibly, in addition, if original position is got back in the position of terminal part, then its shape is flexibly restored, and can carry out the sufficient elasticity distortion.
As such material, preferably contain copper alloy.If contain copper alloy, then bring into play function as lead fully, and have sufficient elasticity with high conductivity.
Copper alloy is preferably phosphor bronze (be principal component with copper, contain the alloy of tin 3.5～9.0%, phosphorus 0.03～0.035%), brass (be with copper principal component (59.0～71.5%) with alloy zinc), spedex (by copper 54.0～75.0%, nickel more than 5.0%, manganese 0～0.50%, alloy that all the other constitute for zinc), beryllium copper (having added the alloy of the precipitation hardening type of beryllium 0.2～2.2% and a spot of cobalt and nickel in copper) etc., can adopt them.These alloys have high tensile and elasticity.
In addition, the resin as constituting package body 1a can list thermosetting resin, thermoplastic resin.As such thermosetting resin, can phenolic resin, urea resin, melamine resin, diallyl phthalate, epoxy resin, polyurethane resin, polyimide resin and unsaturated polyester resin etc. be shown example, preferably use phenolic resin, epoxy resin.In addition, as thermoplastic resin, can polystyrene resin be shown example, third rare resin, polycarbonate resin, mylar, polyamide, polyacetal resin, polyphenylene ether resins, fluororesin, poly-inferior benzene sulphur resin, polysulfone resin, polyarylate resin, polyetherimide resin, polyethersulfone resin, polyether ketone resin, liquid crystal polymer, polyamide-imide resin, polyimide resin etc., preferably use mylar, polyamide, poly-inferior benzene sulphur resin, liquid crystal polymer, from flowability, thermal endurance, the viewpoint that rigidity is good is most preferably used liquid crystal polymer.These resins both can use separately, also can be used as polymer alloy and used a plurality of simultaneously.
In addition, in this resin, preferably fill at least a following packing material.As filler, can glass fibre be shown example, the glass fibre of chopping, bead, hollow glass ball, glass powder, mica, talcum, clay, silica, aluminium oxide, potassium titanate, wollastonite, calcium carbonate, magnesium carbonate, sodium sulphate, calcium sulfate, barium sulfate, calcium sulfite, aluminium hydroxide, magnesium hydroxide, calcium hydroxide, calcium silicates, silica sand, quartzite, quartzy, titanium oxide, zinc oxide, iron oxide, graphite, molybdenum, asbestos, the sial fiber, alumina fibre, gypsum fiber, carbon fiber, carbon black, white carbon, diatomite, bentonite, sericite, white sand, the inorganic filler of graphite etc., potassium titanate crystal whisker, alumina whisker, aluminium borate whisker, silicon carbide whisker, the metal whisker of silicon nitride crystal whisker etc. or nonmetal whisker class etc.
Then, the variation of the shape of island portion is carried out some explanations.
Figure 11 is the part stereogram of the solid camera head that only shape of the 2a of island portion replaced with the shape of Fig. 3 or Fig. 7.In above-mentioned example, the 2a of island portion has a pair of on the long side direction two ends, and they are splits, but in this example, the 2a of island portion is an one.From the 2a of this island portion, be extended with along the long side direction of package body 1a along Width and only leave distance X 0The a pair of Width island 2a of pushing portion of portion 2That is the 2a of pushing portion of Width island portion, 2Width from the Width two ends of the 2a of island portion along package body 1a extends continuously integratedly, reaches sidewall 1a 2Inside in.
This leaves distance X 0Middle position J consistent with the middle position of the long side direction of package body 1a.The 2a of island portion has pair of slits (notch) 2a in the long side direction both sides of middle position J 4A slit 2a 4Extend another slit 2a towards the other end from an end of Width 4Extend towards an end from the other end of Width.Each slit 2a 4Length be more than 1/2, below 6/7 of width of the 2a of island portion.
In this example, from a Width island 2a of pushing portion of portion 2Center line to the distance X of middle position J 1Equal from another Width island 2a of pushing portion of portion 2Center line to the distance X of middle position J 2At slit 2a 4Inside in do not have potting resin, the periphery the 2a of island portion can easily be out of shape.In other words, at slit 2a 4Inside in be filled with gas.In addition, slit 2a 4Deep constitute the metal fatigue that the extending stress band when having suppressed because of distortion comes by curved surface.
As described above, according to the packaging part 1 that is used to accommodate solid-state imager of above-mentioned execution mode, because the 2b of outer lead portion 1Has joggling part 2b 10So, can be reduced in the stress that produces in the packaging part.

Claims (11)

1, a kind of packaging part that is used to accommodate solid-state imager is characterized in that,
Possess: the lead that has the resinous package body of recess and extend to the outside via the sidewall of package body in the above-mentioned recess;
The outer lead portion of above-mentioned lead has the asymmetrical joggling part of center line with respect to the length direction of this outer lead portion.
2, the packaging part that is used to accommodate solid-state imager as claimed in claim 1 is characterized in that, on the bottom surface of the above-mentioned recess of resinous above-mentioned package body, also possesses the island portion that is used to solid-state imager is set and is provided with.
3, the packaging part that is used to accommodate solid-state imager as claimed in claim 1 is characterized in that, above-mentioned joggling part has:
The 1st bend, to a side of above-mentioned center line to draw the mode bending of arc;
The 2nd bend is connected on above-mentioned the 1st bend, to the opposite side of above-mentioned center line to draw the mode bending of arc.
4, the packaging part that is used to accommodate solid-state imager as claimed in claim 3 is characterized in that, above-mentioned the 1st bend and above-mentioned the 2nd bend have with respect to a bit being point-symmetric relation on the above-mentioned center line.
5, the packaging part that is used to accommodate solid-state imager as claimed in claim 1 is characterized in that, above-mentioned joggling part has:
The 1st line part, outstanding point-blank to a side of above-mentioned center line;
The 2nd line part is connected on above-mentioned the 1st line part, to above-mentioned center line one side turn back ground straight-line extension.
6, the packaging part that is used to accommodate solid-state imager as claimed in claim 1 is characterized in that, the width of above-mentioned joggling part is narrower than the width of the terminal part of said external wire portion.
7, the packaging part that is used to accommodate solid-state imager as claimed in claim 1 is characterized in that, the said external wire portion is 390N/mm by hot strength 2Above material constitutes.
8, the packaging part that is used to accommodate solid-state imager as claimed in claim 7 is characterized in that, above-mentioned material is made of the material that contains copper alloy.
9, the packaging part that is used to accommodate solid-state imager as claimed in claim 8 is characterized in that, above-mentioned copper alloy is to select from the group of alloys that is made of phosphor bronze, brass, spedex and beryllium copper.
10, the packaging part that is used to accommodate solid-state imager as claimed in claim 1 is characterized in that, the said external wire portion has:
Horizontal part extends on the Width perpendicular to the long side direction of above-mentioned package body;
Shoulder, from the end of above-mentioned horizontal part to the thickness direction warpage of above-mentioned package body and be connected on the above-mentioned joggling part.
11, a kind of solid camera head is characterized in that, possesses:
The described packaging part that is used to accommodate solid-state imager of claim 1;
Be located at the above-mentioned interior solid-state imager of packaging part that is used to accommodate solid-state imager.
CNA200710088607XA 2006-03-17 2007-03-16 A package for solid-state image sensing apparatus and a solid image sensing apparatus Pending CN101038896A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006075354 2006-03-17
JP2006075354 2006-03-17

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CN101038896A true CN101038896A (en) 2007-09-19

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CN (1) CN101038896A (en)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106601701A (en) * 2017-01-19 2017-04-26 贵州煜立电子科技有限公司 Stereoscopic packaging method and structure for high-power two-end surface leading foot electronic component

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103824827B (en) 2012-11-16 2017-02-08 台达电子企业管理（上海）有限公司 Packaging module, packaging terminal and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106601701A (en) * 2017-01-19 2017-04-26 贵州煜立电子科技有限公司 Stereoscopic packaging method and structure for high-power two-end surface leading foot electronic component
CN106601701B (en) * 2017-01-19 2023-03-28 贵州煜立电子科技有限公司 Three-dimensional packaging method and structure of high-power electronic component with two end surface lead-out pins

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TW200742055A (en) 2007-11-01

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Application publication date: 20070919