CN101034710A - Method capable of adjusting sensing part lens deviation and its encapsulation structure - Google Patents
Method capable of adjusting sensing part lens deviation and its encapsulation structure Download PDFInfo
- Publication number
- CN101034710A CN101034710A CN 200610059454 CN200610059454A CN101034710A CN 101034710 A CN101034710 A CN 101034710A CN 200610059454 CN200610059454 CN 200610059454 CN 200610059454 A CN200610059454 A CN 200610059454A CN 101034710 A CN101034710 A CN 101034710A
- Authority
- CN
- China
- Prior art keywords
- sensitive chip
- translucent element
- metal connecting
- connecting line
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Lens Barrels (AREA)
Abstract
The invention supplies a adjustable feel measure component lens deviation method and its packaging structure. The packaging structure includes the load bearing foundation plate, sensitising chip and the translucidus component and the out frame which covered the component. The sensitising chip has the first linkage area, the load bearing foundation plate has the second linkage area, some metal connecting line separately linkages to the two linkages area. The metal connecting line includes crest line in the first linkage area from the self sensitizing chip, the top of crest line againsted the down surface of the translucidus component. This invention adjusts the altitude of the crest line through adjusting the length of metal connecting line, then adjust the relative position relations between translucidus component and sensitising chip, thus simple, fine adjust the angular deviation of lens whole relative sensitising chip including the translucidus component.
Description
Technical field
The present invention relates to a kind of method and encapsulating structure thereof of scalable sensing part lens deviation, relate in particular to a kind of method and encapsulating structure thereof of when the sensing element routing, regulating sensing part lens deviation.
Background technology
Along with popularizing rapidly of semiconductor image products such as digital camera, the technology of being located at the image sensing chip packaging structure in this type of semiconductor image product has also obtained fast development.
Usually, aforesaid image sensing chip packaging structure comprises from bottom to top bearing substrate, sensitive chip and the translucent element of laying and is coated on the sidewall of these element-external.Wherein, sensitive chip is fixed in the bearing substrate upper surface, and translucent element is covered on sensitive chip top, be connected by sidewall between translucent element and the bearing substrate neighboring, and then translucent element, bearing substrate and sidewall forms an accommodation space coated sensation optical chip.Protruding several metal connecting lines of the upper surface periphery of described sensitive chip electrically connect with bearing substrate, so that sensing signal is introduced in the bearing substrate.
Generally, in the manufacturing of aforesaid image sensing chip packaging structure,, need guarantee that camera lens of translucent element and so on and sensitive chip have accurate relative position each other and do not have angular deviation in order on described sensitive chip, to produce image accurately.Usually, require between translucent element and the sensitive chip parallel or have an accurate pre-determined tilt angle.
In above-mentioned existing Image Sensor encapsulating structure, for having accurate relative position between the camera lens of guaranteeing translucent element and so on and the sensitive chip, usually regulate the angular deviation that has between translucent element and the plane, sensitive chip place by the height of adjusting sidewall, in this kind Image Sensor encapsulating structure, the sidewall setting that is connected between translucent element and the bearing substrate neighboring has sandwich construction, and is affixed by multiple modes such as sintering, bondings between each layer structure.For accurately controlling this height with sidewall of sandwich construction, on the joint face between these sandwich constructions, the articulamentum of different in width, different-thickness, unlike material need be set, the height after each factor such as the area by control sidewall articulamentum, thickness is controlled sidewall and formed.Factors such as the temperature when the method needs accurately control sidewall formation, bonding area and connection material materials, consumption, the forming process complexity of control sidewall height.
Therefore, how to provide a kind of encapsulating structure that can easy, accurately regulate sensing part lens deviation then to become the problem that needs to be resolved hurrily.
Summary of the invention
One of the object of the invention provides a kind of encapsulating structure of scalable sensing part lens deviation, can realize easy, the accurate adjusting of the lens deviation of sensing element.
For achieving the above object, the encapsulating structure of scalable sensing part lens deviation of the present invention comprises: a bearing substrate, and the upper surface peripheral position is provided with second bonding region; One sensitive chip is fixed in the bearing substrate upper surface, and the peripheral position of sensitive chip upper surface is provided with first bonding region, the electrical some strip metal connecting lines of bonding between described first bonding region and second bonding region; One translucent element is covered on the sensitive chip top as the part of camera lens; And a framework, the bottom is fixedly arranged on the bearing substrate upper surface, is coated on sensitive chip and translucent element outside.It is characterized in that: each metal connecting line comprises to be replaced line and adjusts line, replacing line upwards protrudes out from first bonding region of sensitive chip, the top is also upwards replaced with the lower surface of described translucent element, adjust line and be tilted to down bending from the top of replacing line, the bottom and with the second bonding region bonding of described bearing substrate.
Two of the object of the invention provides the method for the lens deviation of the aforesaid encapsulating structure of a kind of scalable, can regulate the lens deviation of sensing element easy, accurately.
For achieving the above object, the method for the aforesaid encapsulating structure lens deviation of scalable of the present invention comprises the steps:
A. sensitive chip is fixed in the upper surface of bearing substrate;
B. metal connecting line front end is bonded to first bonding region of sensitive chip upper surface;
C. survey the optical axis deviation degree on sensitive chip surface;
What d. translucent element is covered on described metal connecting line replaces line top, measure the optical axis deviation degree on translucent element surface, if there are deviation in the surface of translucent element and the surface of sensitive chip and are not in predetermined relative positions, then take off translucent element, regulate the length that is in the metal connecting line between first bonding region and second bonding region by second bonding region that the metal connecting line is bonded to bearing substrate, and then the height of replacing line of adjusting metal connecting line, thereby make the surface of translucent element and the surface of sensitive chip be in predetermined relative positions; And
E. frame set is loaded on the described substrate and makes this framework coat described translucent element and sensitive chip.
Three of the object of the invention provides the method for the lens deviation of the aforesaid encapsulating structure of a kind of scalable, can regulate the lens deviation of sensing element easy, accurately.
For achieving the above object, the method for the aforesaid encapsulating structure lens deviation of scalable of the present invention comprises the steps:
A. sensitive chip is fixed in the upper surface of bearing substrate;
B. metal connecting line front end is bonded to first bonding region of sensitive chip upper surface;
What c. translucent element is covered on described metal connecting line replaces line top;
D. survey the optical axis deviation degree on sensitive chip surface and translucent element surface respectively, if there are deviation in the surface of translucent element and the surface of sensitive chip and are not in predetermined relative positions, then take off translucent element, regulate the length that is in the metal connecting line between first bonding region and second bonding region by second bonding region that the metal connecting line is bonded to bearing substrate, and then the height of replacing line of adjusting metal connecting line, thereby make the surface of translucent element and the surface of sensitive chip be in predetermined relative positions; And
E. frame set is loaded on the described substrate and makes this framework coat described translucent element and sensitive chip.
As mentioned above, use the method and the encapsulating structure thereof of scalable sensing part lens deviation of the present invention, the length of metal connecting line between first and second bonding region when being bonded to the second bonding region bonding by control metal connecting line is regulated the height of replacing line of metal connecting line, thereby accurately regulate the deviation between translucent element and the sensitive chip surface, so realize the scalable sensing element the lens deviation encapsulating structure easy, regulate the mechanism of lens deviation accurately.
Description of drawings
The present invention is described in further detail below in conjunction with drawings and Examples.
Fig. 1 is the sectional view of the encapsulating structure of scalable sensing part lens deviation of the present invention.
Fig. 2 is for existing the sectional view of angular deviation between translucent element among Fig. 1 and the sensitive chip surface.
Fig. 3 A replaces line for metal connecting line among Fig. 1 and regulates preceding view.
Fig. 3 B replaces line for metal connecting line among Fig. 1 and regulates the back view.
Embodiment
By describing technology contents of the present invention, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1, the encapsulating structure 1 of scalable sensing part lens deviation of the present invention comprises bearing substrate 10, sensitive chip 20 and translucent element of laying 30 and the framework 40 that is coated on these element-external from bottom to top.
The top of sensitive chip 20 is aimed at and be covered on to translucent element 30 and the printing opacity imagery zone of the upper surface of sensitive chip 20.The line 211 of replacing by metal connecting line 21 between translucent element 30 and the sensitive chip 20 carries.This is replaced line 211 places and is coated with sticker 25 (representing with elliptical ring in the drawings).Translucent element 30 is by sticker 25 and replace line 211 and affixed with sensitive chip 20.
Framework 40 comprises lower raft 41, middle part cover plate 43 and top cavity wall 45.Base plate 41 lower ends are fixedly arranged on bearing substrate 10 upper surfaces, and base plate 41 upper end levels inwardly protrude out and form cover plate 43, and cover plate 43 ends upwards protrude out and form cavity wall 45.Cover plate 43 lower edges and translucent element 30 upper limbs bonding one also are covered on sensitive chip 20 tops, make translucent element 30 and sensitive chip 20 be located in framework 40 inside.Framework 40 top cavity walls 45 form a light hole, are equipped with other camera lenses (figure does not show) except that translucent element 30 in the cavity wall 45.The optical axis of this type of camera lens is perpendicular to translucent element 30 surfaces.
See also Fig. 2, among the embodiment in the present invention, because of described camera lens is fixed in the cavity wall 45, obviously, the different angles between the plane at the plane at translucent element 30 places and sensitive chip 20 places can influence the optical characteristics of the encapsulating structure 1 of scalable sensing part lens deviation of the present invention.For example, when light arrives to sensitive chip 20 by translucent element 30, the different angles between above-mentioned two planes can make reflection of light that encapsulating structure is produced useful or destructive interference.In sectional view shown in Figure 2, the height of replacing line 211 that is positioned at the metal connecting line 21 of sensitive chip 20 1 sides is higher than the height of replacing line 211 that is positioned at sensitive chip 20 opposite sides.In actual applications, need to keep predetermined angle between parallel or this two plane between plane, translucent element 30 place and the plane, sensitive chip 20 place.The present invention provides control for the user and has selected to have between translucent element plane, 30 place and the plane, sensitive chip 20 place the technology and the ability of predetermined angular.
Fig. 3 A and Fig. 3 B adopt the bonding techniques of pompon weldering to adjust forward and backward view at the line 211 of replacing of metal connecting line 21 for the present invention.As the preferred embodiment of the present invention, bonding techniques adopts the bonding techniques of pompon weldering, in the bonding process of pompon weldering, the chopper 50 that the present invention uses wire bonder with metal connecting line 21 when the first bonding region A is connected to the second bonding region B, accurately regulate the height of replacing line 211 of metal connecting line 21 by the length of regulating metal connecting line 21, and then regulate be undertaken in the translucent element 30 of replacing line 211 tops of metal connecting line 21 with the sensitive chip 20 of replacing line 211 bottoms that is bonded to metal connecting line 21 between relative position relation, thereby adjust the angular deviation of the whole relative sensitive chip 20 of camera lens that comprises translucent element 30.
What Fig. 3 A illustrated metal connecting line 21 replaces line 211 in the state of the first bonding region A before adjusting, and the height that replace line 211 this moment is h1.Fig. 3 B shows the state of line 211 after the first bonding region A is regulating metal of replacing of metal connecting line 21, and the height that replace line 211 this moment is h2.By regulating forward and backward state h2＜h1 as can be known among the figure, the height that metal connecting line 21 is replaced line 211 is dragged down, and makes that the angle of inclination between translucent element plane, 30 place and the plane, sensitive chip 20 place is conditioned.Thereby it is relative position relation between scalable translucent element plane, 30 place and the plane, sensitive chip 20 place that the chopper 50 by wire bonder is regulated the height of replacing line 211, and then the adjusting of the lens deviation of realization sensing element of the present invention.In addition, the present invention's length that also can adopt other bonding techniques to regulate metal connecting line 21 between the first bonding region A and the second bonding region B, two place's bonding regions changes the height that metal connecting line 21 is replaced line 211.
See also Fig. 1, Fig. 3 A and Fig. 3 B.It is as follows to adopt the method for scalable sensing part lens deviation of the present invention to regulate the lens deviation process of sensing element:
Thereby a. fill the upper surface that filler is fixed in sensitive chip 20 bearing substrate 10 in the bottom of sensitive chip 20;
B. by wire bonder metal connecting line 21 front ends are bonded to the first bonding region A of sensitive chip 20 upper surfaces in known routing mode, and metal connecting line 21 protrudes out upwards to form and replaces line 211 in first bonding region A top;
C. in replacing coating sticker 25 on the line 211, sticker 25 can adopt ultraviolet hardening glue sticker (UV sticker) or hot-setting adhesive sticker, and line 211 and sticker 25 adhesions of replacing by metal connecting line 21 make translucent element 30 be covered on sensitive chip 20 tops;
D. use collimator (Auto Collimator) to measure the optical axis deviation degree on the surface of sensitive chip 20;
What e. translucent element 30 is covered on described metal connecting line 21 replaces line 211 tops, and the back is measured the optical axis deviation degree on the surface of translucent element 30 once more with collimator.If compared angular deviation with predetermined relative positions between the surface of the surface of translucent element 30 and sensitive chip 20, then take off translucent element 30, regulate the length that is in the metal connecting line 21 between the first bonding region A and the second bonding region B by the second bonding region B that metal connecting line 21 is bonded to bearing substrate 10, and then the height of replacing line 211 of adjusting metal connecting line 21, thereby regulate the angular deviation between translucent element plane, 30 place and the plane, sensitive chip 20 place, as the angular deviation of regulating between two planes, back still can not satisfy condition, re-adjustments then, be in predetermined relative positions to final adjusting translucent element plane, 30 place and plane, sensitive chip 20 place, for example be special angle between two plane parallel or two planes;
The sticker of replacing line 211 25 that f. will be coated on metal connecting line 21 solidifies, and framework 40 is assembled on the described substrate 10, be covered on translucent element 30 upper surfaces simultaneously, make framework 40 coat translucent element 30 and sensitive chip 20, again with known technology to finishing subsequently the encapsulation action, can reach thus the lens deviation of regulating sensing element and the encapsulating structure encapsulation of scalable sensing part lens deviation of the present invention being finished.
In said process, steps d also can be placed among the step e carries out, promptly when translucent element 30 be covered on described metal connecting line 21 replace line 211 tops after, survey the optical axis deviation degree on sensitive chip 20 surfaces and translucent element 30 surfaces respectively.
In above-mentioned steps c, sticker 25 can further closely be adhered translucent element 30 and sensitive chip 20 in the form of a ring, thereby in the inner confined spaces 23 that form of sticker 25, prevent thus foreign material such as outside dust enter sensitive chip 20 upper surface the printing opacity imagery zone and have influence on the image sensing effect of sensitive chip 20.Simultaneously, sticker 25 sidepieces also can have aperture (figure does not show), keep ring-type confined space 23 inside and outside air pressure balances when solidifying for sticker 25, for example, can offer two symmetrical holes in sticker 25 sidepieces.Thus, when sticker 25 solidified, the air bubble of ring-type confined space 23 inside can go out from confined space 23 diffusion inside.
In addition, when selecting material, bearing substrate 10 can be selected the made that the visible light penetrance is very low and mechanical strength is higher, as glass fibre or ceramic material etc.Framework 40 can adopt Merlon (Polycarbonate, be called for short PC) or liquid crystal polymer (Liquid Crystal Polymer, abbreviation LCP) material is made, its temperature expansion coefficient (Coefficient of Thermal Expansion, be called for short CTE) should be suitable with bearing substrate 10, the base plate 41 of framework 40 can reliably be connected with bearing substrate 10.Translucent element 30 can be made by the glass with optical characteristics and so on or other optical characteristics material, can be covered by light-sensitive material on it, also can be the lens of any adequate types.
The above; only be one of preferable feasible embodiment of the present invention; can not therefore promptly limit to interest field of the present invention; concerning being familiar with those of ordinary skill in the art; such as use technical scheme of the present invention and technical conceive to make other various corresponding changes and distortion, and all these changes and distortion all should belong within the protection range of claim of the present invention.
Claims (11)
1, a kind of encapsulating structure of scalable sensing part lens deviation comprises:
One bearing substrate, the upper surface peripheral position is provided with second bonding region;
One sensitive chip is fixed in the bearing substrate upper surface, and the peripheral position of sensitive chip upper surface is provided with first bonding region, the electrical some strip metal connecting lines of bonding between described first bonding region and second bonding region;
One translucent element is covered on the sensitive chip top as the part of camera lens; And
One framework, bottom are fixedly arranged on the bearing substrate upper surface, are coated on sensitive chip and translucent element outside;
It is characterized in that: each metal connecting line comprises to be replaced line and adjusts line, replacing line upwards protrudes out from first bonding region of sensitive chip, the top is also upwards replaced with the lower surface of described translucent element, adjust line and be tilted to down bending from the top of replacing line, the bottom and with the second bonding region bonding of described bearing substrate.
2, the encapsulating structure of scalable sensing part lens deviation as claimed in claim 1, it is characterized in that: replacing of described metal connecting line is coated with sticker on the line, this sticker is with translucent element and sensitive chip tight bond, and be formed between translucent element and the sensitive chip the inner confined space that forms of sticker in the form of a ring.
3, the encapsulating structure of scalable sensing part lens deviation as claimed in claim 2 is characterized in that: described sticker sidepiece has aperture.
4, the encapsulating structure of scalable sensing part lens deviation as claimed in claim 3 is characterized in that: described aperture lies in two symmetrical holes that the sticker sidepiece is offered.
5, the encapsulating structure of scalable sensing part lens deviation as claimed in claim 1, it is characterized in that: described framework comprises lower raft, middle part cover plate and top cavity wall, the base plate lower end is fixedly arranged on the bearing substrate upper surface, base plate upper end level inwardly protrudes out and forms described cover plate, cover panel end upwards protrudes out and forms described cavity wall, and cover plate lower edge and translucent element upper limb bonding one also are covered on the sensitive chip top.
6, a kind of method of scalable sensing part lens deviation, this method are that the lens deviation of encapsulating structure as claimed in claim 1 is regulated, and comprise the steps:
A. sensitive chip is fixed in the upper surface of bearing substrate;
B. metal connecting line front end is bonded to first bonding region of sensitive chip upper surface;
C. survey the optical axis deviation degree on sensitive chip surface;
What d. translucent element is covered on described metal connecting line replaces line top, measure the optical axis deviation degree on translucent element surface, if there are deviation in the surface of translucent element and the surface of sensitive chip and are not in predetermined relative positions, then take off translucent element, regulate the length that is in the metal connecting line between first bonding region and second bonding region by second bonding region that the metal connecting line is bonded to bearing substrate, and then the height of replacing line of adjusting metal connecting line, thereby make the surface of translucent element and the surface of sensitive chip be in predetermined relative positions; And
E. frame set is loaded on the described substrate and makes this framework coat described translucent element and sensitive chip.
7, the method for scalable sensing part lens deviation as claimed in claim 6 is characterized in that: adopt pompon weldering bonding during metal connecting line bonding, use the chopper of wire bonder that the metal connecting line is connected to second bonding region from first bonding region.
8, the method for scalable sensing part lens deviation as claimed in claim 6 is characterized in that: the surface of adjusting translucent element is surperficial parallel with sensitive chip.
9, the method for scalable sensing part lens deviation as claimed in claim 6 is characterized in that: regulate the surface of translucent element and the surface of sensitive chip and be required special angle.
10, the method for scalable sensing part lens deviation as claimed in claim 6, it is characterized in that: replacing of described metal connecting line is coated with sticker on the line, after this sticker solidifies with translucent element and sensitive chip tight bond, and be formed between translucent element and the sensitive chip the inner confined space that forms of sticker in the form of a ring.
11, a kind of method of scalable sensing part lens deviation, this method are that the lens deviation of encapsulating structure as claimed in claim 1 is regulated, and comprise the steps:
A. sensitive chip is fixed in the upper surface of bearing substrate;
B. metal connecting line front end is bonded to first bonding region of sensitive chip upper surface;
What c. translucent element is covered on described metal connecting line replaces line top;
D. survey the optical axis deviation degree on sensitive chip surface and translucent element surface respectively, if there are deviation in the surface of translucent element and the surface of sensitive chip and are not in predetermined relative positions, then take off translucent element, regulate the length that is in the metal connecting line between first bonding region and second bonding region by second bonding region that the metal connecting line is bonded to bearing substrate, and then the height of replacing line of adjusting metal connecting line, thereby make the surface of translucent element and the surface of sensitive chip be in predetermined relative positions; And
E. frame set is loaded on the described substrate and makes this framework coat described translucent element and sensitive chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100594541A CN100461437C (en) | 2006-03-07 | 2006-03-07 | Method capable of adjusting sensing part lens deviation and its encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100594541A CN100461437C (en) | 2006-03-07 | 2006-03-07 | Method capable of adjusting sensing part lens deviation and its encapsulation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101034710A true CN101034710A (en) | 2007-09-12 |
| CN100461437C CN100461437C (en) | 2009-02-11 |
Family
ID=38731136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100594541A Expired - Fee Related CN100461437C (en) | 2006-03-07 | 2006-03-07 | Method capable of adjusting sensing part lens deviation and its encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100461437C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104519241A (en) * | 2013-09-29 | 2015-04-15 | 联想(北京)有限公司 | Data acquisition method and electronic equipment |
| CN108933151A (en) * | 2018-07-26 | 2018-12-04 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and packaging method of image sensing chip |
| CN109212868A (en) * | 2017-06-29 | 2019-01-15 | 致伸科技股份有限公司 | Multi-lens camera module and preparation method thereof |
| CN109495673A (en) * | 2017-09-11 | 2019-03-19 | 宁波舜宇光电信息有限公司 | Camera module and its assemble method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5962810A (en) * | 1997-09-09 | 1999-10-05 | Amkor Technology, Inc. | Integrated circuit package employing a transparent encapsulant |
| US20050009239A1 (en) * | 2003-07-07 | 2005-01-13 | Wolff Larry Lee | Optoelectronic packaging with embedded window |
| CN100362666C (en) * | 2004-03-24 | 2008-01-16 | 宏齐科技股份有限公司 | Packaging structure of optical sensing chip and producing method thereof |
| TWM267483U (en) * | 2004-07-16 | 2005-06-11 | Kingpak Tech Inc | Image sensor module |
-
2006
- 2006-03-07 CN CNB2006100594541A patent/CN100461437C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104519241A (en) * | 2013-09-29 | 2015-04-15 | 联想(北京)有限公司 | Data acquisition method and electronic equipment |
| US9832377B2 (en) | 2013-09-29 | 2017-11-28 | Lenovo (Beijing) Co., Ltd. | Data acquiring method and electronic device thereof |
| CN109212868A (en) * | 2017-06-29 | 2019-01-15 | 致伸科技股份有限公司 | Multi-lens camera module and preparation method thereof |
| CN109212868B (en) * | 2017-06-29 | 2021-03-09 | 致伸科技股份有限公司 | Multi-lens camera module and manufacturing method thereof |
| CN109495673A (en) * | 2017-09-11 | 2019-03-19 | 宁波舜宇光电信息有限公司 | Camera module and its assemble method |
| CN109495673B (en) * | 2017-09-11 | 2020-09-25 | 宁波舜宇光电信息有限公司 | Camera module and assembling method thereof |
| CN108933151A (en) * | 2018-07-26 | 2018-12-04 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and packaging method of image sensing chip |
| CN108933151B (en) * | 2018-07-26 | 2024-02-13 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method of image sensing chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100461437C (en) | 2009-02-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208367291U (en) | Optical lens and camera module | |
| CN208432778U (en) | Optical lens and camera module | |
| CN100561280C (en) | Camera module and manufacture method thereof | |
| CN206892433U (en) | Camera lens and camera module | |
| US8310772B2 (en) | Method and arrangement for reducing thermal effects in compact adjustable optical lenses | |
| US8882304B2 (en) | Illuminating device and packaging method thereof | |
| CN101034710A (en) | Method capable of adjusting sensing part lens deviation and its encapsulation structure | |
| US8792179B2 (en) | Laminated micromirror package | |
| CN104428642A (en) | Fabry-perot interferometer and method for producing same | |
| CN101924115A (en) | Solid-state image pickup device | |
| CN208297798U (en) | optical lens and camera module | |
| CN216901121U (en) | Superlens-based detector array | |
| CN114185155B (en) | Multi-group lens, camera module and electronic equipment | |
| CN103975436A (en) | Method for manufacturing passive optical components, and devices comprising the same | |
| EP2930561A1 (en) | Screen for reflective projector | |
| WO2018076702A1 (en) | Display panel and manufacturing method therefor, and display device | |
| CN108717224A (en) | Optical lens assemble method and the optical lens assembled with this method, camera module | |
| CN101241920A (en) | Optical device and method of manufacturing the same | |
| US11494014B2 (en) | Touch panel, touch display device, and fabrication method thereof | |
| CN110611039A (en) | Manufacturing method of flexible OLED display device and flexible OLED display device | |
| CN108153030A (en) | A kind of 3D display device | |
| CN208569149U (en) | Optical lens, camera module | |
| CN106164715B (en) | Optical device with deformable film | |
| CN110780491B (en) | Display panel, manufacturing method thereof and electronic device | |
| CN215417332U (en) | Optical film and LED display module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090211 Termination date: 20120307 |