CN101030004A - Wiring structure for coupling chip - Google Patents
Wiring structure for coupling chip Download PDFInfo
- Publication number
- CN101030004A CN101030004A CN 200710101244 CN200710101244A CN101030004A CN 101030004 A CN101030004 A CN 101030004A CN 200710101244 CN200710101244 CN 200710101244 CN 200710101244 A CN200710101244 A CN 200710101244A CN 101030004 A CN101030004 A CN 101030004A
- Authority
- CN
- China
- Prior art keywords
- circuit
- conductive gasket
- distribution structure
- spacing
- offset portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
A wiring structure used on coupled chip consists of a unit including multiple circuit being set in parallel to each other and being extended towards the second direction, multiple conductive pad being set on said circuits separately. It is featured as arranging adjacent conductive pads in sequence on the first direction but alternatively to each other on the second direction, setting said multiple circuit in corresponding to its adjacent pads and arranging an offset unit being towards to the first direction far away from said conductive pad on multiple circuit.
Description
Technical field
The present invention relates to a kind of distribution structure, particularly under existing board precision, can guarantee to electrically conduct and then dwindle the distribution structure of chip size with chip in order to coupling chip.
Background technology
(Liquid Crystal Display LCD) has power saving, in light weight, low radiation and advantage such as portable, replaces traditional display gradually, becomes the main flow of monitor market because LCD.Wherein, except key parts and components such as backlight module, liquid crystal, colored filter, LCD is converted into control signal also by the distribution structure on integrated circuit (IC) chip and the panel with external signal, and then determines the bright dark of each pixel.
Known LCD 10 as shown in Figure 1, on glass substrate 11, be formed with distribution structure 13, and at the lower edge of glass substrate 11, be provided with integrated circuit (IC) chip 15 to electrically connect with distribution structure 13, the other end then is and flexible circuit board (Flexible Printed Circuit; FPC) 17 are connected.When using actually, external signal is sent to integrated circuit (IC) chip 15 via flexible circuit board 17, be converted into control signal after, bright dark via each pixel of distribution structure 13 decision.
At present integrated circuit (IC) chip 15 is incorporated in the known technology of glass substrate 11, modally is that glass flip chip engages (Chip on Glass; COG) technology, its integrated circuit (IC) chip 15 that will have projection (bump) directly is bonded on the distribution structure 13 of glass substrate 11.See also Fig. 1, Fig. 2 A and Fig. 2 B, wherein Fig. 2 A and Fig. 2 B are on the glass substrate 11 and the local enlarged diagram of the distribution structure 13 that is connected with integrated circuit (IC) chip 15.Distribution structure 13 includes a plurality of circuits 131 and conductive gasket (pad) 133, and conductive gasket 133 is corresponding with the position of the projection of integrated circuit (IC) chip 15.When integrated circuit (IC) chip 15 is overlying on distribution structure 13, the projection of integrated circuit (IC) chip 15 just can with the conductive gasket 133 corresponding joints of distribution structure 13, and then be the state of electrically conducting by conducting particles.
Yet in fact said structure faces some difficulties that wait to overcome.Please continue to consult Fig. 2 A and Fig. 2 B, Fig. 2 A is depicted as the conductive gasket design of known double cabling, and Fig. 2 B is depicted as the known three conductive gaskets designs of draining line.In the known technology, conductive gasket 133 is approximately consistent with the bump size of integrated circuit (IC) chip 15 usually, when in conjunction with the time, can expectedly projection accurately be contacted with on the conductive gasket 133.If the precision of board is not good, just may cause projection skew, when the projection skew cause and conductive gasket 133 between contact area diminish, will cause the quantity not sufficient that electrically conducts; More serious, projection contacts with adjacent lines 131 and causes short circuit and cause product failure.
Therefore, in known technology, can keep a suitable spacing between conductive gasket 133 and the adjacent lines 131, produce deviation when the chip bonding, contact with adjacent lines 131 and miss to avoid integrated circuit (IC) chip 15.With regard to the technology viewpoint, for minification, between the circuit 131 or the distance between the conductive gasket 133 the smaller the better, but if the skew tolerance when considering to cover crystalline substance, then conductive gasket 133 is the bigger the better with the spacing of adjacent lines 131, and these two indexs are conflicting usually, be difficult to accept or reject.On actual design is made, can according to board ability, supplied materials error, manufacturer voluntarily evaluation process stabilized reference wait and estimate the spacing that is kept between conductive gasket 133 and the circuit 131, this also will influence the design size of integrated circuit (IC) chip 15.
In existing processes, be subject to board stability and technological ability thereof, cause the area occupied of integrated circuit (IC) chip 15 excessive, and cause the viewing area to be compressed, this will be unfavorable for the product microminiaturization.If will adopt the less integrated circuit (IC) chip of size 15, then must adopt the more high-precision brilliant board that covers, increase manufacturing cost on the contrary.
In view of this, under existing board ability, it is industry problem anxious to be solved that a kind of distribution structure that meets technological standards is provided.
Summary of the invention
A purpose of the present invention is to provide a kind of distribution structure in order to coupling chip, is non-rectilinear with the circuit distribution design, and just circuit has Offset portion on the contiguous conductive gasket of correspondence position; Can increase the safe dose that causes covering brilliant displacement because of the board accuracy limitations whereby, under existing board ability, the easier technological standards that meets of the chip bonding of integrated circuit (IC) chip; In addition, also can avoid the projection of integrated circuit (IC) chip to contact and cause short circuit with circuit.
Another object of the present invention is to provide a kind of distribution structure,, further allow conductive gasket to increase because circuit adopts the design of part skew in order to coupling chip; So, can guarantee when chip bonding that the projection and the conductive gasket of integrated circuit (IC) chip electrically conduct, the minimal compression area can more effective utilization, and keeps effectively and electrically conduct.Just can get rid of in the known technology and to be inclined to the shortcoming that the size design of projection is bigger in order to increase bonding area.
Another purpose of the present invention is to provide a kind of distribution structure in order to coupling chip, because the size of projection can dwindle and can adjust its Aspect Ratio, so the area occupied of integrated circuit (IC) chip can dwindle, but also microminiaturization of chip volume; So, onesize wafer can cut out more multicore sheet, further reduces manufacturing cost.
For achieving the above object, the present invention discloses a kind of distribution structure in order to coupling chip, this distribution structure is arranged on the substrate of LCD, on substrate, define orthogonal in fact first direction and second direction, this distribution structure comprises at least one unit, described unit comprises: a plurality of circuits are parallel to each other in fact and extend towards second direction; And a plurality of conductive gaskets, be located at respectively on each described circuit, and each described adjacent conductive liner is towards this first direction layout and be misplaced in this second direction in regular turn; Wherein, each described a plurality of circuit is corresponding to its adjacent conductive liner, and have towards the Offset portion of this first direction away from this conductive gasket, this Offset portion comprises a main paragraph and two linkage sections, this main paragraph is parallel to this second direction in fact, and described linkage section is connected to the both ends of this main paragraph, and described linkage section and this main paragraph constitute in fact the angles greater than 90 degree.
Distribution structure of the present invention, wherein, each described conductive gasket has two and connects ends, is located at the both sides of this conductive gasket on this second direction respectively, and described two connect ends and be misplaced towards this first direction, and is connected with a circuit respectively.
Distribution structure of the present invention, wherein, described a plurality of conductive gaskets comprise one first conductive gasket, one second conductive gasket and one the 3rd conductive gasket; Described a plurality of circuit comprises one first circuit, one second circuit and a tertiary circuit, and described first conductive gasket, second conductive gasket and the 3rd conductive gasket are provided respectively.
Distribution structure of the present invention, wherein, described first circuit, second circuit and tertiary circuit be corresponding to its adjacent conductive liner, and have respectively towards this first direction away from one first Offset portion, second Offset portion and the 3rd Offset portion.
Distribution structure of the present invention, wherein, this first circuit is corresponding to its second adjacent conductive gasket, and have away from one first Offset portion; This second circuit is corresponding to its first and the 3rd adjacent conductive gasket, and have away from second Offset portion; And this tertiary circuit is corresponding to its second adjacent conductive gasket, and have away from one the 3rd Offset portion.
Distribution structure of the present invention wherein, defines one first spacing between each described adjacent lines that is parallel to each other in fact, and each described conductive gasket is adjacent between the Offset portion of lead and defines one second spacing; Wherein the dimension scale of this second spacing and this first spacing is in fact between 0.5 to 1.3.
Distribution structure of the present invention wherein, defines one the 3rd spacing between each described adjacent Offset portion, and the dimension scale of the 3rd spacing and this first spacing is in fact between 0.4 to 0.5.
Distribution structure of the present invention, wherein, along having one the 4th spacing on this second direction, the dimension scale of the 4th spacing and this second spacing is in fact between 3 to 4 between each described adjacent conductive liner.
Distribution structure of the present invention, wherein, each described conductive gasket has along a lateral dimension of this first direction measurement and a longitudinal size of measuring along this second direction; The ratio of this longitudinal size and this lateral dimension is in fact between 2.88 to 6.63.
Distribution structure of the present invention, wherein, this angle is in fact between 90 degree are spent to 180.
Description of drawings
For above-mentioned purpose of the present invention, technical characterictic and advantage can be become apparent, hereinafter be elaborated, wherein with the preferred embodiment conjunction with figs.
Fig. 1 is the synoptic diagram of known LCD;
Fig. 2 A is the distribution structure synoptic diagram of known double cabling design;
Fig. 2 B known three drains the distribution structure synoptic diagram of line design;
Fig. 3 is the synoptic diagram of one embodiment of the present invention; And
Fig. 4 is the synoptic diagram of another preferred embodiment of the present invention.
Wherein, description of reference numerals is as follows:
10 LCD, 11 glass substrates
13 distribution structures, 131 circuits
133 conductive gaskets, 15 integrated circuit (IC) chip
17 flexible circuit boards, 20 distribution structures
42 second circuits, 43 tertiary circuits
51 first conductive gaskets, 52 second conductive gaskets
53 the 3rd conductive gasket 54a connect the end
54b connects end 61 first Offset portion
611 main paragraphs, 612 linkage sections
613 linkage sections, 62 second Offset portion
63 the 3rd Offset portion θ angles
D1 first space D 2 second spacings
D3 the 3rd space D 4 the 4th spacing
L1 lateral dimension L2 longitudinal size
X first direction Y second direction
Embodiment
As shown in Figure 3 the preferred embodiment according to the present invention, the present invention is arranged on the substrate of LCD in order to the distribution structure 20 of coupling chip, for convenience of description, orthogonal in fact first direction X of definable and second direction Y on substrate.Distribution structure 20 of the present invention comprises at least one unit 30, and this unit 30 comprises a plurality of circuits and a plurality of conductive gasket; In this embodiment, the projection area of described liner and integrated circuit (IC) chip can electrically conduct after the chip bonding about equally.
Particularly, a plurality of circuits comprise first circuit 41, second circuit 42 and tertiary circuit 43, and described circuit is parallel to each other in fact and extends towards second direction Y; A plurality of conductive gaskets then comprise first conductive gasket 51, second conductive gasket 52 and the 3rd conductive gasket 53, and it is arranged at respectively on first circuit 41, second circuit 42 and the tertiary circuit 43.With regard to the distribution of conductive gasket, first conductive gasket 51, second conductive gasket 52 and the 3rd conductive gasket 53 be towards first direction X layout in regular turn, and be misplaced at second direction Y, to form the three conductive gaskets designs of draining line, as shown in Figure 3.
Juncture for clear open conductive gasket and circuit, with first conductive gasket 51 is example, first conductive gasket 51 can have two and connect end 54a, 54b, described two link portions are located at first both sides of conductive gasket 51 on second direction Y respectively, and described two connect end 54a, 54b is misplaced towards first direction X, and is connected with first circuit 41 respectively.Other conductive gasket of the present invention and circuit also can have similar structures, do not give unnecessary details in addition at this.
According to a preferred embodiment of the invention, each circuit is corresponding to its adjacent conductive liner, have towards first direction X away from Offset portion; As shown in Figure 3, first circuit 41, second circuit 42 and tertiary circuit 43 be corresponding to its adjacent conductive liner, and have respectively towards first direction X away from first Offset portion 61, second Offset portion 62 and the 3rd Offset portion 63.
With first Offset portion 61 is example, comprises a main paragraph 611 and two linkage sections 612,613, and main paragraph 611 is parallel to second direction Y in fact, and linkage section 612,613 is connected to the both ends of main paragraph 611; Clearer and more definite, linkage section 612,613 and main paragraph 611 can constitute an angle theta greater than 90 degree.With preferred embodiment, angle theta is between 90 degree are spent to 180.In other words, with regard to unit 30, first circuit 41 is corresponding to its second adjacent conductive gasket 52, and have away from first Offset portion 61; Second circuit 42 is corresponding to its first adjacent conductive gasket 51 and the 3rd conductive gasket 53, and have respectively away from second Offset portion 62; And tertiary circuit 43 is corresponding to its second adjacent conductive gasket 52, and have away from the 3rd Offset portion 63.
What must illustrate is; three row's cushion designs as shown in Figure 3, in fact the left and right sides of each circuit can have an adjacent conductive liner to exist usually respectively, can infer ground; corresponding to the conductive gasket of both sides, have respectively on each circuit towards first direction X away from two Offset portion.
In the present embodiment, after the circuit pack skew, obviously can increase the spacing of circuit and adjacent conductive liner, the crystalline substance that covers that causes for the board precision is offset, and will have preferable permission.
In the present embodiment, between each adjacent lines that is parallel to each other in fact, can define first space D 1; Each conductive gasket is adjacent between the Offset portion of lead, defines second space D 2; Between each adjacent Offset portion, define the 3rd space D 3; Between each adjacent conductive liner,, has the 4th space D 4 along on the second direction Y.According to preferred embodiment, for example, first space D 1 is about 10 microns, second space D 2 and is about 13 microns, the 3rd space D 3 and is about 4 microns, the 4th space D 4 and is about 40 microns; In other words, the dimension scale of second space D 2 and first space D 1 dimension scale that is about 1.3, the three space D 3 and first space D 1 dimension scale that is about 0.4, the four spacing and this second spacing is about 3.
In addition, can define conductive gasket and have a lateral dimension L1 along first direction X, and along the longitudinal size L2 of second direction Y.According to preferred embodiment, for example, lateral dimension L1 is about 19 microns, longitudinal size L2 and is about 126 microns; In other words, the ratio of longitudinal size L2 and lateral dimension L1 is about 6.63.
Another preferred embodiment of the present invention as shown in Figure 4, its primary structure and previous embodiment are similar, do not give unnecessary details in addition at this.In this embodiment, can be suitably the size of conductive gasket be strengthened, its advantage is, though when covering crystalline substance because the board precision causes the projection minor shifts, its still can with all effectively conductings of conductive gasket.In addition, because the area of conductive gasket greater than the projection area of integrated circuit (IC) chip, therefore can avoid known technology must consider in order to ensure electrically conducting the bigger shortcoming of projection design; But and the size of projection Flexible Design just, for example adjust the Aspect Ratio of projection and then the size on the reduction control integrated circuit chip second direction Y.
In this embodiment, first space D 1 is still kept about 10 microns, second space D 2 and is about 5 microns, the 3rd space D 3 and is about 5 microns, the 4th space D 4 and is about 20 microns; In other words, the dimension scale of second space D 2 and first space D 1 dimension scale that is about 0.5, the three space D 3 and first space D 1 dimension scale that is about 0.5, the four spacing and this second spacing is about 4.
In addition, according to preferred embodiment, lateral dimension L1 is about 34 microns, longitudinal size L2 and is about 98 microns; In other words, the ratio of longitudinal size L2 and lateral dimension L1 is about 2.88.What must illustrate is that open only being used for of above-mentioned size demonstrates, and is not in order to restriction the present invention.
By above-mentioned open, the present invention utilizes feasible the covering in the brilliant technology of stitch seam leans out line to have higher tolerance for the board ability, and projection relatively is difficult for and other circuit false touch.In addition, because stitch seam leans out line can strengthen pad size simultaneously, and adjust the distribution of projection, and then the size of integrated circuit (IC) chip is dwindled, reach the effect that reduces manufacturing cost.
The above embodiments only are used for exemplifying embodiments of the invention, and explain technical characterictic of the present invention, are not to be used for limiting protection scope of the present invention.Any people who is familiar with this technology can unlabored change or the variation of equivalence all belong to protection scope of the present invention, protection scope of the present invention should be as the criterion with the scope of appended claims.
Claims (10)
1, a kind of distribution structure in order to coupling chip, this distribution structure is arranged on the substrate, defines an orthogonal in fact first direction and a second direction on this substrate, and this distribution structure comprises at least one unit, and described unit comprises:
A plurality of circuits are parallel to each other in fact and extend towards this second direction; And
A plurality of conductive gaskets are located at respectively on each described circuit, and each described adjacent conductive liner is towards this first direction layout and be misplaced in this second direction in regular turn;
Wherein each described a plurality of circuit is corresponding to its adjacent conductive liner, and have towards the Offset portion of this first direction away from this conductive gasket, this Offset portion comprises a main paragraph and two linkage sections, this main paragraph is parallel to this second direction in fact, and described linkage section is connected to the both ends of this main paragraph; And described linkage section and this main paragraph constitute one in fact greater than 90 angles of spending.
2. distribution structure as claimed in claim 1, wherein, each described conductive gasket has two and connects ends, is located at the both sides of this conductive gasket on this second direction respectively, and described two connect ends and be misplaced towards this first direction, and is connected with a circuit respectively.
3. distribution structure as claimed in claim 1, wherein, described a plurality of conductive gaskets comprise one first conductive gasket, one second conductive gasket and one the 3rd conductive gasket; Described a plurality of circuit comprises one first circuit, one second circuit and a tertiary circuit, and described first conductive gasket, second conductive gasket and the 3rd conductive gasket are provided respectively.
4. distribution structure as claimed in claim 3, wherein, described first circuit, second circuit and tertiary circuit be corresponding to its adjacent conductive liner, and have respectively towards this first direction away from one first Offset portion, second Offset portion and the 3rd Offset portion.
5. distribution structure as claimed in claim 3, wherein, this first circuit is corresponding to its second adjacent conductive gasket, and have away from one first Offset portion; This second circuit is corresponding to its first and the 3rd adjacent conductive gasket, and have away from second Offset portion; And this tertiary circuit is corresponding to its second adjacent conductive gasket, and have away from one the 3rd Offset portion.
6. distribution structure as claimed in claim 2 wherein, defines one first spacing between each described adjacent lines that is parallel to each other in fact, and each described conductive gasket is adjacent between the Offset portion of lead and defines one second spacing; Wherein the dimension scale of this second spacing and this first spacing is in fact between 0.5 to 1.3.
7. distribution structure as claimed in claim 6 wherein, defines one the 3rd spacing between each described adjacent Offset portion, and the dimension scale of the 3rd spacing and this first spacing is in fact between 0.4 to 0.5.
8. distribution structure as claimed in claim 7, wherein, along having one the 4th spacing on this second direction, the dimension scale of the 4th spacing and this second spacing is in fact between 3 to 4 between each described adjacent conductive liner.
9. distribution structure as claimed in claim 2, wherein, each described conductive gasket has along a lateral dimension of this first direction measurement and a longitudinal size of measuring along this second direction; The ratio of this longitudinal size and this lateral dimension is in fact between 2.88 to 6.63.
10. distribution structure as claimed in claim 1, wherein, this angle is in fact between 90 degree are spent to 180.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101012449A CN100468178C (en) | 2007-04-24 | 2007-04-24 | Wiring structure for coupling chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101012449A CN100468178C (en) | 2007-04-24 | 2007-04-24 | Wiring structure for coupling chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101030004A true CN101030004A (en) | 2007-09-05 |
| CN100468178C CN100468178C (en) | 2009-03-11 |
Family
ID=38715437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007101012449A Active CN100468178C (en) | 2007-04-24 | 2007-04-24 | Wiring structure for coupling chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100468178C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102314009A (en) * | 2011-09-09 | 2012-01-11 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| CN102540510A (en) * | 2011-10-12 | 2012-07-04 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| CN105974703A (en) * | 2016-07-13 | 2016-09-28 | 武汉华星光电技术有限公司 | Liquid crystal display panel |
| CN106385763A (en) * | 2016-09-30 | 2017-02-08 | 昆山工研院新型平板显示技术中心有限公司 | Flexible printed circuit board, displayer and manufacturing method of flexible printed circuit board |
-
2007
- 2007-04-24 CN CNB2007101012449A patent/CN100468178C/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102314009A (en) * | 2011-09-09 | 2012-01-11 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| CN102540510A (en) * | 2011-10-12 | 2012-07-04 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| CN105974703A (en) * | 2016-07-13 | 2016-09-28 | 武汉华星光电技术有限公司 | Liquid crystal display panel |
| CN106385763A (en) * | 2016-09-30 | 2017-02-08 | 昆山工研院新型平板显示技术中心有限公司 | Flexible printed circuit board, displayer and manufacturing method of flexible printed circuit board |
| CN106385763B (en) * | 2016-09-30 | 2018-11-20 | 昆山工研院新型平板显示技术中心有限公司 | The production method of flexible printed circuit board, display and flexible printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100468178C (en) | 2009-03-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11132079B2 (en) | Sensor device and sensor-equipped display device including detection electrode | |
| US9952735B2 (en) | Sensor-equipped display device | |
| US9459744B2 (en) | Touch panel substrate and display device | |
| JP6325085B2 (en) | Display panel and display device | |
| CN102749747B (en) | Touch display panel and manufacturing method thereof | |
| CN102402323B (en) | Flat panel display with integrated touch screen panel | |
| KR101719897B1 (en) | Display device with sensor and sensor device | |
| US9542053B2 (en) | Touch screen, touch panel, display, and electronic apparatus | |
| CN111651087B (en) | Display panel and display device | |
| CN1510486A (en) | Single unit liquid crystal displaying device touch board and manufacturing method thereof | |
| CN1940677A (en) | Liquid crystal device and electronic apparatus | |
| CN101750780A (en) | Liquid crystal panel and liquid crystal display device | |
| EP3477448A1 (en) | Touch panel, and display device | |
| CN1194253C (en) | Electro-optical device and electronic equipment | |
| CN101030004A (en) | Wiring structure for coupling chip | |
| CN1177247C (en) | Liquid crystal display device with EGIP | |
| CN112634777A (en) | Display device | |
| US20240019728A1 (en) | Detecting device and display device | |
| US11803284B2 (en) | Detecting device and display device | |
| US20080186293A1 (en) | Display device including wiring board | |
| CN1510480A (en) | Manufacturing method for liquid-crystal displaying device integrating touch board | |
| US9575374B2 (en) | Liquid crystal display device and method of manufacturing the same | |
| WO2023226750A1 (en) | Display panel and binding method therefor, and display device | |
| CN1932591A (en) | Liquid crystal display device and thin film transistor base plate thereof | |
| CN1955792A (en) | Liquid crystal display panel and wire layout thereon |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |