CN101026116A - Wafer detecting device and wafer detecting method - Google Patents
Wafer detecting device and wafer detecting method Download PDFInfo
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- CN101026116A CN101026116A CN 200610023984 CN200610023984A CN101026116A CN 101026116 A CN101026116 A CN 101026116A CN 200610023984 CN200610023984 CN 200610023984 CN 200610023984 A CN200610023984 A CN 200610023984A CN 101026116 A CN101026116 A CN 101026116A
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Abstract
This invention relates to a wafer test device including a main part and a support stand, in which, the main part includes a manipulator extracting wafers, a detector for testing wafers, a box containing wafers is placed on said supporting stand moving up and down along the vertical direction, when it rises to the top, the position of the detector is higher than the box top. This invention provides a test method including: setting a box with wafers on a supporting stand, rising the stand to the top position, regulating the position of the detector higher than that of the box top, lowering the stand to a position where the manipulator can catch the wafer to extract the wafer and move it under the detector to test the size and position of the wafer and put it to the box.
Description
Technical field
The present invention relates to the detection of semiconductor device, particularly a kind of wafer detection device and chip detection method.
Background technology
The making of very lagre scale integrated circuit (VLSIC) (VLS1) is to be substrate with the wafer that is made of semiconductor material, the semiconductor technology that cooperates tens of roads even roads up to a hundred is to form electronic component and the connection line with default layout designs on wafer, last cutting and the packaging technology utilized again is made into a plurality of chips (c hip) for use with the tube core (die) that forms.And for carrying out above-mentioned semiconductor technology, as technologies such as thin film deposition, photoetching, etching and grindings, wafer must constantly transmit in each equipment room, and is written in each equipment to carry out related process.For example United States Patent (USP) the 6th, 547, described a kind of wafer transmission equipment for No. 504 and be used for manufacturing process transferring wafer at chip.Usually, in the wafer transmission process, need to detect wafer size and position.Figure 1 shows that the detection wafer size in the existing transmission equipment and the wafer detection device 1 ' of position.This checkout gear 1 ' comprising: main part 10 ', can be according to action need and the brace table 11 ' of oscilaltion, the detector 13 ' that is positioned at the manipulator 12 ' on the main part and is positioned at the manipulator top.The box 3 ' that wafer 2 ' wherein is housed is placed on the brace table 11 ' of checkout gear, and along with brace table motion down in vertical direction together, so that manipulator 12 ' can flatly pick and place wafer 2 ' from wafer cassettes 3 '.Manipulator has the vacsorb unit, is used for chip sucking is got preposition, is beneficial to detector and detects.Detector has base portion and is arranged at detecting sensor on the base portion, is used to detect the size and the position of wafer.The supporting platform of existing this wafer detection device is when the extreme higher position, and the position of the detector of wafer detection device is lower than the position of the interior wafer topmost of wafer case on the brace table.
When wafer detection device detects beginning, at first, brace table drops to extreme lower position from the extreme higher position, manipulator stretches into level in the wafer cassettes, and utilize the vacsorb unit on it that wafer is held, be withdrawn into certain position then so that wafer can place detector under, detect the size and position of wafer at detector after, manipulator will turn an angle so that place microscopically to carry out visual inspection wafer.After the wafer visual inspection was finished, manipulator can rotate back into transferring of detector, and wafer is put back into position original in the wafer cassettes.After this, the brace table certain position that will rise is automatically drawn another wafer so that manipulator can level stretch into, thereby is made another wafer can repeat aforementioned testing process in the wafer cassettes.Brace table continues to rise, and repeats aforementioned detection step, all wafers in having detected wafer cassettes.At last, the highest position when brace table rises to initial work is convenient to the operator carries out other steps to wafer operation.
But, when manipulator is put back into the below of wafer from detector the process of box, all wafers can not be all be put back into wafer initial position in box exactly, wherein has the part wafer can depart from initial position in the horizontal direction, as shown in Figure 2.Its reason is, the moment that box is failed to put back at wafer to the attraction of wafer in the vacsorb unit on the manipulator is discharged fully, and residual attraction will make wafer less position of sucking-off from box it depart from initial position.In this case, rise in the process of extreme higher position at brace table, because the height of wafer detection device detector is lower, the danger (as shown in Figure 2) of clashing into mutually with detector may take place in the wafer that is offset the origin-location that is positioned at box top, thereby causes wafer damage.As everyone knows, prices are rather stiff for wafer, and the breakage of wafer will bring enormous economic loss to manufacturer.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of wafer that can prevent in testing process, to cause the wafer detection device and the chip detection method of damage, to solve the problem of damaging wafer in the wafer inspection process that existing wafer detection device exists.
For achieving the above object, a kind of checkout gear provided by the invention comprises main part and brace table, described main part comprises the manipulator of drawing wafer, the detector that detects wafer, the box that wafer is housed is placed on the described brace table, brace table can vertically move up and down, when described brace table moved to the extreme higher position, the position of described detector was higher than the end face of described box.
Correspondingly, the present invention also provides a kind of method that detects wafer, may further comprise the steps:
1) box that wafer will be housed places on the brace table;
2) brace table rises to the extreme higher position;
3) position of detector is adjusted to the position of the end face that is higher than described box;
4) brace table is dropped to the position that manipulator can be drawn wafer;
5) manipulator is drawn wafer and is moved to the below of checkout gear;
6) detector detects wafer size and position;
7) manipulator is put back into wafer in the wafer cassettes.
Owing to adopted technique scheme, compared with prior art, the present invention has the following advantages:
When the brace table of wafer detection device of the present invention moves to the extreme higher position, the position of described detector is higher than the end face of described box, therefore, after having detected all wafers, the wafer that has departed from the origin-location in the brace table uphill process can not strike detector, thereby avoids the wafer damage that may cause in the wafer inspection process.
Description of drawings
Fig. 1 is existing wafer detection device structural representation;
Fig. 2 departs from the wafer of origin-location and the schematic diagram that bump takes place detector in the existing wafer detection device;
Fig. 3 is the wafer detection device structural representation that is equiped with wafer of the present invention;
Fig. 4 is the flow chart of chip detection method of the present invention;
Fig. 5 is that brace table moves to the schematic diagram that manipulator can be drawn the position of wafer;
Fig. 6 is the schematic diagram that wafer departs from the origin-location;
Fig. 7 is that brace table continues to transport to the schematic diagram that manipulator can be drawn the position of other wafer;
Fig. 8 is the schematic diagram that brace table rises to the extreme higher position;
Fig. 9 is the operation principle schematic diagram that detector detects wafer.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is elaborated.
Wafer detection device of the present invention plays a part to detect wafer size and position in the transmission course of wafer.The present invention is by adjusting the position relation at wafer detection device detector and wafer cassettes top, make when the brace table of wafer detection device rises to the extreme higher position, the detector of wafer detection device is higher than the end face of wafer cassettes, avoids the wafer damage that may cause in the wafer inspection process.
Fig. 3 is the wafer detection device structural representation that is equiped with wafer of the present invention.As shown in Figure 3, wafer detection device 1 of the present invention comprise main part 10, be positioned at the detector 13 on the main part 10, the manipulator 12 that is positioned at detector 13 belows and the movable brace table 11 of vertical direction.Brace table 11 is provided with the platen 111 that the wafer cassettes 3 of wafer 2 is equipped with in carrying, platen 111 downsides connect longitudinally guiding body 112, guide way 112 is connected with lifting drive (not shown), travel switch (not shown) and control circuit (not shown), is used for moving up and down of automatic control console plate 111.Manipulator 12 is provided with vacsorb unit 121, is used for picking and placeing wafer 2 from wafer cassettes 3 levels, is beneficial to detector 13 and detects.Detector 13 has base portion 132 and is arranged at infrared detection sensing unit 131 on the base portion 132, is used to detect wafer size and position.Wafer cassettes 3 has a bottom surface 32 of matching with brace table 11, and end face 31 relative with aforementioned bottom surface 32, be formed with half cycle sidewall (not shown) and opening (not label) between bottom surface 32 and the end face 31, be formed with some conduits (not shown) on wafer cassettes 3 sidewalls, be used for wafer 2 is installed in it.When the brace table 111 of wafer detection device 1 of the present invention rises to the extreme higher position, detector 13 is higher than the end face 32 of wafer cassettes 3, the wafer that can effectively avoid having departed from the origin-location in the brace table uphill process strikes detector, thereby avoids the wafer damage that may cause in the wafer inspection process.
Fig. 4 is the flow chart of chip detection method of the present invention.The wafer that has departed from the origin-location in the brace table uphill process strikes detector, and chip detection method of the present invention may further comprise the steps: the box that wafer at first will be housed places (S101) on the brace table; Then brace table is risen to extreme higher position (S102); Then the position of detector is adjusted to the position (S103) of the end face that is higher than described box; In following step, brace table is dropped to manipulator can draw the position of wafer (S104); Manipulator is drawn wafer and is moved to the below (S105) of checkout gear; Detector detects behind wafer size and the position (S106); Manipulator is put back into (S107) in the wafer cassettes with wafer.
Specify chip detection method of the present invention below in conjunction with Fig. 5 to Fig. 8.In step S101 and S102, the wafer cassettes 3 that wafer 2 is housed is carried on the platen 111 of brace table 11, brace table 11 rises to highest position automatically according to the instruction of lifting drive.In step S103, the end face 31 that is higher than wafer cassettes 3 is adjusted in the position of detector 13, as shown in Figure 3.In step S104, brace table 11 is according to the instruction of lifting drive, drops to first wafer 21 that manipulator 12 just in time can level picks and places adjacent wafer box 3 end faces 31 from the extreme higher position, as shown in Figure 5.In step S105 and S106, manipulator 12 inserts into the inner from the opening level of wafer cassettes 3, and place the bottom surface (not shown) (one side that circuit is not arranged) of first wafer that closes on wafer cassettes end face 31 (not label) to be got, vacsorb unit 121 on the manipulator 12 is thereon attached with first chip sucking, subsequently, manipulator 12 be withdrawn into so that first wafer can place detector 13 under, after 13 pairs first wafers of detector carry out size and position probing, manipulator 12 will rotate a certain angle, so that being placed under the microscope (not shown), first wafer 21 carries out visual inspection, so that wafer is carried out last quality audit, detector utilizes the infrared sensing unit that wafer is carried out size and position probing then.In step S107, manipulator 12 is put back into wafer 2 in the process of wafer cassettes 3, all wafers 2 can both be put back into wafer 2 initial position in wafer cassettes 3 exactly, wherein there is part wafer 2 can depart from initial position in the horizontal direction, as shown in Figure 6, first wafer stretches out from the opening part level of wafer cassettes 3.Its reason is discharged the moment that the attraction of the 121 pairs of wafers 2 in vacsorb unit on the manipulator 12 fails to put back at wafer 2 wafer cassettes 3 fully, its residual attraction may make wafer 2 less position of sucking-off from wafer cassettes 3 it depart from initial position.
In the wafer inspection process, if also have other wafers to be detected, brace table 11 rises to the position that manipulator 12 can continue to draw described other wafer with motion, and continues step 5-7, as shown in Figure 7.Behind all wafers in having detected wafer cassettes, brace table will rise to the extreme higher position, to carry out other operations.
Fig. 8 is the schematic diagram that brace table rises to the extreme higher position.As shown in Figure 8, the position of detector 13 is higher than the end face 31 of wafer cassettes 3.Therefore can know the whole uphill process at brace table by inference, the wafer in the wafer cassettes can not strike detector, even first wafer departs from original position, also can not strike detector, thereby has prevented that effectively wafer is damaged in the testing process.
The operation principle that detector of the present invention detects wafer as shown in Figure 9, after manipulator 12 places the below of detector 13 with wafer 2, the infrared detection sensing unit 131 on the base portion 132 of detector 13 will be launched Infrared.When the Infrared of launching when first pair of infrared detection sensing unit 1311 at base portion 132 two ends detects the edge of wafer 2, represent that this wafer is 8 cun wafers, show that simultaneously this wafer 2 position on manipulator 12 do not depart from, and just placing detector 13 under.If the Infrared that the first pair of infrared sensing unit 1311 launched does not detect wafer 2, but shown then that by the two ends that first pair of infrared detection sensing unit, 1,311 second pair of adjacent infrared detection sensing unit 1312 detect wafer this wafer is 6 cun wafers, also proved the also not skew of position of these the 6 cun wafers on the manipulator simultaneously.Do not have in 2 positions of the wafer on the manipulator 12 under the situation of skew, manipulator 12 promptly can be placed into wafer 2 correct disposal place of microscopically according to the checkout gear 1 normal operation process of setting.But, if one in the every pair of infrared detection sensing unit 1311 or 1312 is detected wafer 2, and another infrared detection sensing unit 1311 or 1312 does not detect wafer 2, and then wafer 2 positions on the proof manipulator 12 this moment have been offset normal position.Detector 3 can send to wafer detection device 1 with this wafer position offset information, wafer detection device 1 will send instruction to manipulator 12, when manipulator 12 is put into the microscopically visual inspection with this wafer 2, manipulator 12 can be regulated the position of wafer 2 at microscopically automatically according to the instruction of wafer detection device 1, with guarantee wafer 2 can accurately place microscopical under.If in testing process, all infrared rays that infrared detection sensing unit 131 sends all do not detect wafer 2, then show does not have wafer 2 to exist at all on this manipulator 12, wafer detection device 1 can be noted the conduit position of not installing wafer 2 in the wafer cassettes 3, after this, brace table 11 can be according to the instruction of lifting drive, the position of rising automatically, manipulator 12 will continue to draw other wafer, just enter the visual inspection program after detector 13 detects wafer 2 on the manipulator 12.
Wafer detection device among the present invention utilizes Infrared to carry out wafer inspection, so can not influence the detection effect of wafer detection device after improve the position of detector.In addition, the inventor after the result has confirmed that also the position of the detector of wafer detection device of the present invention is improved, does not produce any influence to detecting effect through experimental implementation repeatedly when having avoided wafer damage.
The invention is not restricted to above-mentioned execution mode.The state of starting working of brace table and power cut-off state can be in same positions among the present invention.In addition; wafer inspection order of the present invention can begin from the wafer near the wafer cassettes bottom surface to detect towards the direction of wafer cassettes end face; it also can be other any order; after as long as the wafer detection device testing finishes; the position of detector is all dropped in protection scope of the present invention on the end face of wafer cassettes.
Claims (11)
1. wafer detection device, comprise main part and brace table, described main part comprises the manipulator of drawing wafer, the detector that detects wafer, the box that wafer is housed is placed on the described brace table, brace table can vertically move up and down, it is characterized in that: when described brace table moved to the extreme higher position, the position of described detector was higher than the end face of described box.
2. wafer detection device as claimed in claim 1 is characterized in that: described manipulator is positioned at the below of detector.
3. wafer detection device as claimed in claim 2 is characterized in that: have the vacsorb unit on the described manipulator, be used for picking and placeing the wafer of box.
4. wafer detection device as claimed in claim 2 is characterized in that: described detector comprises base portion and the detection sensing unit that is arranged on the base portion.
5. wafer detection device as claimed in claim 4 is characterized in that: described detection sensing unit is the infrared detection sensing unit.
6. chip detection method may further comprise the steps:
1) box that wafer will be housed places on the brace table;
2) brace table rises to the extreme higher position;
3) position of detector is adjusted to the position of the end face that is higher than described box;
4) brace table is dropped to the position that manipulator can be drawn wafer;
5) manipulator is drawn wafer and is moved to the below of checkout gear;
6) detector detects wafer size and position;
7) manipulator is put back into wafer in the wafer cassettes.
7. chip detection method as claimed in claim 6 is characterized in that: if also have other wafers to be detected, then brace table moves to the position that manipulator can continue to draw other wafer, and continues step 5-7.
8. chip detection method as claimed in claim 6 is characterized in that: described manipulator is positioned at the below of detector.
9. chip detection method as claimed in claim 6 is characterized in that: have the vacsorb unit on the described manipulator, be used for picking and placeing the wafer of box.
10. chip detection method as claimed in claim 6 is characterized in that: described detector comprises base portion, and is arranged on the detection sensing unit on the base portion.
11. chip detection method as claimed in claim 6 is characterized in that: the detector in the described step 6 utilizes Infrared that wafer is carried out size and position probing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100239840A CN100449724C (en) | 2006-02-20 | 2006-02-20 | Wafer detecting device and wafer detecting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100239840A CN100449724C (en) | 2006-02-20 | 2006-02-20 | Wafer detecting device and wafer detecting method |
Publications (2)
| Publication Number | Publication Date |
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| CN101026116A true CN101026116A (en) | 2007-08-29 |
| CN100449724C CN100449724C (en) | 2009-01-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2006100239840A Expired - Fee Related CN100449724C (en) | 2006-02-20 | 2006-02-20 | Wafer detecting device and wafer detecting method |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101459099B (en) * | 2007-12-13 | 2010-11-10 | 中芯国际集成电路制造(上海)有限公司 | Wafer kit, monitoring system and method for semi-conductor production process |
| CN103219267A (en) * | 2013-04-10 | 2013-07-24 | 南京农业大学 | Automatic conveying system for wafer testing |
| CN103252707A (en) * | 2013-05-07 | 2013-08-21 | 上海华力微电子有限公司 | Bearing device and method for carrying out wafer transferring by means of device |
| WO2014201699A1 (en) * | 2013-06-18 | 2014-12-24 | 深圳市华星光电技术有限公司 | Glass panel stacking system and stacking method |
| CN104701199A (en) * | 2015-03-20 | 2015-06-10 | 北京中电科电子装备有限公司 | Flip chip bonding equipment |
| US9255896B2 (en) | 2013-06-18 | 2016-02-09 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Glass panel stocking system and stocking method |
| CN107860416A (en) * | 2017-11-07 | 2018-03-30 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of method and system for detecting wafer laying state |
| CN113257705A (en) * | 2021-06-29 | 2021-08-13 | 西安奕斯伟硅片技术有限公司 | Method, device and equipment for detecting wafer abnormity and computer storage medium |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05136218A (en) * | 1991-02-19 | 1993-06-01 | Tokyo Electron Yamanashi Kk | Inspection device |
| JP3825232B2 (en) * | 2000-07-28 | 2006-09-27 | 株式会社 Ｓｅｎ−Ｓｈｉ・アクセリス カンパニー | Wafer transfer system and transfer method thereof |
| KR20040009243A (en) * | 2002-07-23 | 2004-01-31 | 삼성전자주식회사 | cassette loader equipment of semiconductor device manufacturing equipment |
| KR20040013530A (en) * | 2002-08-07 | 2004-02-14 | 삼성전자주식회사 | cassette loader equipment of semiconductor device manufacturing equipment |
-
2006
- 2006-02-20 CN CNB2006100239840A patent/CN100449724C/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101459099B (en) * | 2007-12-13 | 2010-11-10 | 中芯国际集成电路制造(上海)有限公司 | Wafer kit, monitoring system and method for semi-conductor production process |
| CN103219267A (en) * | 2013-04-10 | 2013-07-24 | 南京农业大学 | Automatic conveying system for wafer testing |
| CN103252707A (en) * | 2013-05-07 | 2013-08-21 | 上海华力微电子有限公司 | Bearing device and method for carrying out wafer transferring by means of device |
| CN103252707B (en) * | 2013-05-07 | 2015-08-26 | 上海华力微电子有限公司 | Bogey and utilize this device to carry out the method for wafer transfer |
| WO2014201699A1 (en) * | 2013-06-18 | 2014-12-24 | 深圳市华星光电技术有限公司 | Glass panel stacking system and stacking method |
| US9255896B2 (en) | 2013-06-18 | 2016-02-09 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Glass panel stocking system and stocking method |
| CN104701199A (en) * | 2015-03-20 | 2015-06-10 | 北京中电科电子装备有限公司 | Flip chip bonding equipment |
| CN104701199B (en) * | 2015-03-20 | 2018-03-13 | 北京中电科电子装备有限公司 | A kind of flip-chip bonding apparatus |
| CN107860416A (en) * | 2017-11-07 | 2018-03-30 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of method and system for detecting wafer laying state |
| CN113257705A (en) * | 2021-06-29 | 2021-08-13 | 西安奕斯伟硅片技术有限公司 | Method, device and equipment for detecting wafer abnormity and computer storage medium |
| CN113257705B (en) * | 2021-06-29 | 2021-10-29 | 西安奕斯伟硅片技术有限公司 | Method, device and equipment for detecting wafer abnormity and computer storage medium |
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| CN100449724C (en) | 2009-01-07 |
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Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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