CN101009970A - Multi-functional compound substrate structure - Google Patents
Multi-functional compound substrate structure Download PDFInfo
- Publication number
- CN101009970A CN101009970A CN 200610056738 CN200610056738A CN101009970A CN 101009970 A CN101009970 A CN 101009970A CN 200610056738 CN200610056738 CN 200610056738 CN 200610056738 A CN200610056738 A CN 200610056738A CN 101009970 A CN101009970 A CN 101009970A
- Authority
- CN
- China
- Prior art keywords
- substrate
- functional compound
- substrate structure
- compound substrate
- transmission line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The multifunctional composite base plate comprises: stacking a first base with high dielectric constant and a second base with both low dielectric constant and dielectric loss mutually on two surfaces of a third base; forming magnetic conductive areas on every base to prepare inductance assembly above, set the capacity on the first base and the system impedance signal transmission line on the second base. This invention reduces delay and reflection loss for HF high-speed signal.
Description
Technical field
The invention relates to a kind of multi-functional compound substrate structure, particularly can provide to make and bury passive component in various, and can effectively increase the resistance of inductance value, resistor assembly of Inductive component and capacitance component capacitance, dwindle the inner embedded component area, and make high frequency, high speed signal that shorter time of delay, littler loss and preferable reflection loss be arranged in transmission.
Background technology
Electronic product is under the trend of high function and high speed, therefore must be on semiconductor package part integrated various passive components (passive component), for example: resistor assembly (resistors), capacitance component (capacitors) and Inductive component (inductors) etc., with the electrical functionality of lifting or stable electronic product.
Traditionally, passive component is to be arranged on the surface of substrate of general printed circuit board (PCB) or semiconductor chip.Yet, along with electronic product towards high functionality and undersized development trend, laminated (lamination) technology of circuit board also just must possess characteristics such as thin thickness, multilayer number and high density.Therefore, for can be in limited substrate area, create bigger space and many merits property of hoisting module, often with dwindle or in bury passive component mode shorten circuit layout and reduce signal transmission distance, and then create more spaces and come the framework driving component and improve the black box performance, so just develop the board structure that is embedded with passive components such as resistor assembly, capacitance component, Inductive component in.
By assemblies such as embedded resistors assembly, capacitance component, Inductive components, when making circuit substrate, form various assembly on circuit substrate, thereby can improve the stability of circuit production, the number that reduces solder joint on the substrate and passive component, reliability etc.Moreover, also can dwindle the area of substrate manufacture, reduce the cost of manufacture of circuit, and then meet the substrate manufacture demand of following electronic product.For existing inner embedded component substrate framework, its framework is only considered single component or a certain specific function usually, has therefore limited the application of substrate inner embedded component widely.Yet, reach the optimization of the electrical characteristic of various assemblies, singly make probably difficulty with a kind of baseplate material and finish, in the prior art,, therefore only design associated components such as built-in capacity assembly mostly only at high-k material.Though, in the thick film ceramic processing procedure, the board structure design of comprehensive various materials is arranged, it can be filled different materials in different blocks and use to cooperate different assemblies, but not only can increase the processing procedure cost thus, use different materials for blockette, also can cause the trouble in the design, and the inaccuracy that increases processing procedure.
With reference to Fig. 1, conductive metal thin plate 110, dielectric thin plate 120 and conductive metal thin plate 112 change in regular turn mutually, to form a capacitive character board structure 100, as United States Patent (USP) the 5th, 155, shown in No. 655.With regard to this layer structure, only can make this board structure have the capacitive circuit function.Moreover, under this kind structure, when the material system of dielectric thin plate 120 adopts high-k material, the problem that causes cabling to be difficult for is produced, and if lamina rara externa is not when having particular design to increase the electrical characteristic of transmission line again, this layer structure is can't be extensively and effectively promote the usefulness of substrate.
With reference to Fig. 2, Fig. 2 is a kind of board structure of compound two kinds of special substances; Be with two kinds of special baseplate material co-sinterings, and the board structures 200 that formation low-loss low dielectric constant base board 210,212,214 and high-k substrate 220,222 change alternately mutually, it can be used for making built-in capacity assembly and low loss characteristic circuit, as United States Patent (USP) the 4th, shown in 882, No. 650.Though Da Fu improves and increases the function of many substrates, bury big Inductive component in still still can't realizing for the higher Inductive component of unit price, only can make to twine the lead mode.
Please refer to United States Patent (USP) the 6th, 429, No. 763, it uses magnetisable material to work as substrate, provides inductive circuit function to twine the lead mode again.Yet, only consider the lifting inductance characteristic at this, but ignored the coupling ghost effect of Inductive component therewith of other assembly.Therefore, effective Integrated Solution is not proposed at built-in capacity assembly and transmission line material.Moreover because whole laminar substrate all uses magnetisable material, therefore the magnetic field that is produced can't mask effectively.
Hence one can see that, and present board structure provides with the interior specific components of burying more, and therefore design and the application in order to improve various built-in assemblies provides a desirable multi-functional board structure to be still this field related personnel's an important development direction.
Summary of the invention
In view of above problem, main purpose of the present invention is to provide a kind of multi-functional compound substrate structure, to solve the disclosed problem of only considering single component or a certain specific function of prior art.
Therefore, for reaching above-mentioned purpose, the disclosed multi-functional compound substrate structure of the present invention includes first substrate, second substrate adjacent with first substrate and is positioned at the lip-deep magnetic conduction block of second substrate; Wherein, the dielectric constant of first substrate is higher than the dielectric constant of second substrate.
In addition, the dielectric loss of this second substrate can be smaller or equal to the dielectric loss of glass fibre.And the dielectric loss of second substrate can be lower than the dielectric loss of first substrate.
This magnetic conduction block can form by the surface coated magnetic material in second substrate, and it can make the Inductive component use in order to provide.That is to say, the making of adjustable inductance assembly can by lead twine or cabling on second substrate, and then magnetic materials for painting and coating thereon, to form the magnetic conduction block, therefore can be by increase the inductance value of Inductive component effectively by the magnetic conduction block, also can utilize second substrate of low-dielectric loss, reduce the loss of signal transmission.
In addition, capacitance component can be made on first substrate of high-k, the high dielectric constant material that therefore whole layer can be provided is to make the built-in capacity assembly, to dwindle built-in capacity area.At this, can form a built-in capacity assembly by two metallic plates that intercouple being set respectively by two surfaces at first substrate.
And, signal transmission line can be arranged on second substrate of low-k and low-dielectric loss, and it is not adjacent with first substrate, to avoid structure discontinuity surface because of signal delay and signal transmission line, for example: the signal transmission line of process via (via) or nonsystematic impedance etc., the unmatched situation of interference that is caused and impedance.Thereby make high frequency, high speed signal that shorter time of delay, littler loss and preferable reflection loss be arranged in transmission.
Moreover, on the surface of each substrate, can directly be coated with impedance material, form resistor assembly, dwindle or the embedded resistors assembly to reach.
At this, can each substrate be mutually combined by the pressing technology.And, the smooth or consideration of heating power and stress aspect for pressing, before pressing, auxiliary material are (promptly slightly can to add (coating or pressing) in addition in substrate surface, the material different with substrate material, can be metal or nonmetal), to help metal and base plate bonding, or improve substrate heat force and stress characteristic.
Wherein, the built-in capacity assembly in structure, in bury Inductive component and the embedded resistors assembly all can be connected to outer field signal transmission line by guide hole.
The another kind of multi-functional compound substrate structure that the present invention discloses includes first substrate, second substrate adjacent with first substrate, and opposite side adjacent three substrate adjacent with second substrate with first substrate; Wherein, the dielectric constant of first substrate is higher than the dielectric constant of the 3rd substrate, and the dielectric constant of second substrate is lower than the dielectric constant of the 3rd substrate, and the dielectric loss of second substrate is lower than the dielectric loss of the 3rd substrate.
At this, can form the magnetic conduction block by in the surface coated magnetic material of second substrate and/or the 3rd substrate, it can make the Inductive component use in order to provide.That is to say, the making of Inductive component can by lead twine or cabling on second substrate, and then magnetic materials for painting and coating thereon, to be formed at the magnetic conduction block, therefore can increase the inductance value of Inductive component effectively by the magnetic conduction block, also can utilize second substrate of low-dielectric loss, reduce the loss of signal transmission.
In addition, capacitance component can be produced on first substrate of high-k, and the high dielectric constant material that therefore whole layer can be provided is to make the built-in capacity assembly, to dwindle built-in capacity area.In this, can two metallic plates that intercouple be set respectively by two surfaces at first substrate, form a built-in capacity assembly.
And, signal transmission line can be arranged on first substrate and/or second substrate and/or the 3rd substrate, on its not adjacent surface with first substrate, to avoid structure discontinuity surface because of signal delay and signal transmission line, for example: the signal transmission line of process via (via) or nonsystematic impedance etc., the unmatched situation of interference that is caused and impedance.Thereby make high frequency, high speed signal that shorter time of delay, littler loss and preferable reflection loss be arranged in transmission.
Moreover, on the surface of second substrate and/or the 3rd substrate, can directly be coated with impedance material, form resistor assembly, dwindle or the embedded resistors assembly to reach.
At this, can each substrate be mutually combined by the pressing technology.And, the smooth or consideration of heating power and stress aspect for pressing, before pressing, auxiliary material are (promptly slightly can to add (coating or pressing) in addition in substrate surface, the material different with substrate material, can be metal or nonmetal), to help metal and base plate bonding, or improve substrate heat force and stress characteristic.
Wherein, this 3rd substrate can be general printed circuit board (PCB), for example: FR4 substrate, FR5 substrate, ceramic substrate or film substrate etc.And, the built-in capacity assembly in structure, in bury Inductive component and the embedded resistors assembly all can be connected to outer field signal transmission line by guide hole.
The present invention also discloses a kind of multi-functional compound substrate structure, includes first substrate, second substrate adjacent with first substrate and is positioned at the signal transmission line of second substrate opposite side adjacent with first substrate; Wherein, the dielectric constant of first substrate is higher than the dielectric constant of second substrate.
And the dielectric loss of second substrate can be smaller or equal to the dielectric loss of glass fibre.Moreover the dielectric loss of second substrate can be lower than the dielectric loss of first substrate.
Because, signal transmission line is arranged on second substrate of low-k and low-dielectric loss, and it is not adjacent with first substrate, therefore can avoid structure discontinuity surface because of signal delay and signal transmission line, for example: the signal transmission line of process via (via) or nonsystematic impedance etc., the unmatched situation of interference that is caused and impedance.Thereby make high frequency, high speed signal that shorter time of delay, littler loss and preferable reflection loss be arranged in transmission.
At this, capacitance component can be made on first substrate of high-k, the high dielectric constant material that therefore whole layer can be provided is to make the built-in capacity assembly, to dwindle built-in capacity area.In this, can two metallic plates that intercouple be set respectively by two surfaces at first substrate, form a built-in capacity assembly.
Moreover, on the surface of second substrate, can directly be coated with impedance material, form resistor assembly, dwindle or the embedded resistors assembly to reach.
In addition, can form the magnetic conduction block by in the surface coated magnetic material of second substrate and/or the 3rd substrate, it can make the Inductive component use in order to provide.That is to say, the making of Inductive component can by lead twine or cabling on second substrate, and then magnetic materials for painting and coating thereon, to form the magnetic conduction block, therefore can increase the inductance value of Inductive component effectively by the magnetic conduction block, also can utilize second substrate of low-dielectric loss, reduce the loss of signal transmission.
At this, can each substrate be mutually combined by the pressing technology.And, the smooth or consideration of heating power and stress aspect for pressing, before pressing, auxiliary material are (promptly slightly can to add (coating or pressing) in addition at substrate surface, the material different with substrate material, can be metal or nonmetal), to help metal and base plate bonding, or improve substrate heat force and stress characteristic.
Wherein, the built-in capacity assembly in structure, in bury Inductive component and the embedded resistors assembly all can be connected to outer field signal transmission line by guide hole.Also can be electrically connected as for the metal routing on the similar face, to transmit signal.
Comprehensively above-mentioned, can shorten circuit layout effectively and reduce signal transmission distance, and dwindle effectively or in bury various passive components, come the framework driving component and improve the black box performance to create more spaces.
Description of drawings
Fig. 1 is the sectional view of prior art board structure;
Fig. 2 is the sectional view of another prior art board structure;
Fig. 3 is the sectional view according to multi-functional compound substrate structure of the present invention;
Fig. 4 is the sectional view according to multi-functional compound substrate structure of the present invention;
Fig. 5 is the sectional view according to multi-functional compound substrate structure of the present invention;
Fig. 6 A is the sectional view according to multi-functional compound substrate structure of the present invention;
Fig. 6 B is the sectional view according to multi-functional compound substrate structure of the present invention;
Fig. 6 C is the sectional view according to multi-functional compound substrate structure of the present invention;
Fig. 7 A is the sectional view according to multi-functional compound substrate structure of the present invention;
Fig. 7 B is the sectional view according to multi-functional compound substrate structure of the present invention;
Fig. 8 A is the vertical view according to multi-functional compound substrate structure of the present invention;
Fig. 8 B is the vertical view according to multi-functional compound substrate structure of the present invention;
Fig. 8 C is the vertical view according to multi-functional compound substrate structure of the present invention;
Fig. 9 A is the sectional view according to multi-functional compound substrate structure of the present invention;
Fig. 9 B is the sectional view according to multi-functional compound substrate structure of the present invention;
Fig. 9 C is the sectional view according to multi-functional compound substrate structure of the present invention;
Fig. 9 D is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 10 A is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 10 B is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 10 C is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 10 D is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 10 E is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 11 is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 12 A is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 12 B is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 12 C is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 12 D is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 13 is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 14 A is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 14 B is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 14 C is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 14 D is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 15 A is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 15 B is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 15 C is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 15 D is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 15 E is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 15 F is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 15 G is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 16 A is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 16 B is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 16 C is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 16 D is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 16 E is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 16 F is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 17 A is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 17 B is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 17 C is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 17 D is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 18 A is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 18 B is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 18 C is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 18 D is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 18 E is the sectional view according to multi-functional compound substrate structure of the present invention;
Figure 19 is the sectional view according to multi-functional compound substrate structure of the present invention; And
Figure 20 is the sectional view according to multi-functional compound substrate structure of the present invention.
Wherein, Reference numeral:
The 100-board structure, 110,112 conductive metal thin plate
120-dielectric thin plate, the 200-board structure
210,212,214-low-loss low dielectric constant base board
220,222-high-k substrate
310-first substrate, 320-second substrate
330-the 3rd substrate, the 340-signal transmission line
The 342-metal routing, 350-built-in capacity assembly
352,354-metallic plate, the 360-guide hole
370-magnetic conduction block, the 372-Inductive component
The 380-resistor assembly, the 390-auxiliary material
Embodiment
Below enumerate specific embodiment describing content of the present invention in detail, and with diagram as aid illustration.The symbol of mentioning in the explanation is with reference to diagrammatical symbol.
With reference to Fig. 3, Fig. 3 is multi-functional compound substrate structure according to an embodiment of the invention, and it can be in order to the making of various passive components to be provided in providing; At this, form by first substrate 310 and 320 pressings of second substrate, wherein the dielectric constant of first substrate 310 is higher than the dielectric constant of second substrate 320.
Therefore wherein, the material of this second substrate 320 can be glass fibre, or is advanced low-k materials, and the material of first base 310 then can be the high dielectric constant material with respect to glass fibre, or with respect to the high dielectric constant material of advanced low-k materials.Moreover the dielectric loss of second substrate (loss tangent) is lower than the dielectric loss of first substrate, and promptly this second substrate can be low-k and low-dielectric loss material.
In addition, this high dielectric constant material can be dielectric constant and is higher than 4 material, is lower than 4 and low-k can be dielectric constant, and the low-dielectric loss material can be dielectric loss and is lower than 0.03 material.
At this, can be in first substrate with the built-in capacity establishment of component, and signal transmission line is arranged on second substrate.
As shown in Figure 4, can be on its not adjacent surface of second substrate 320 with first substrate 310 signalization transmission line 340.Signal transmission line can be according to there being the particular system impedance, for example: 50 ohm or 75 ohm or 28.5 ohm etc.Thus, can avoid structure discontinuity surface, for example: the signal transmission line of process via (via) or nonsystematic impedance etc., the unmatched situation of interference that is caused and impedance because of signal delay and signal transmission line.
And, can utilize first substrate to make capacitance component.At this, two metallic plates 352,354 that intercouple can be set respectively in two surfaces of first substrate 310, so that capacitive circuit function to be provided, promptly form a built-in capacity assembly 350, as shown in Figure 5.
Wherein, each metallic plate 352,354 can be respectively be electrical connected with signal transmission line 340 on second substrate 320 by the guide hole 360 that runs through substrate, as shown in Figure 6A.At this, guide hole can be types such as lead shape, penetration state or blind hole shape, but and its vertical substrate surface and run through substrate, but also out of plumb substrate surface and run through substrate.At this, can be by the coupling area of control metallic plate, adjust the dielectric constant of first substrate, or adjust the thickness of first substrate, form the capacitance component of various different capacitances.At this, because capacitance component is to form on first substrate, and first substrate is close to second substrate, thereby then do not need longly in order to the length that capacitance component is pulled out to the required guide hole of outer field signal transmission line, therefore can avoid inductive effect because of guide hole to increase stray inductance and reduce operating frequency.Moreover in the design of printed circuit board (PCB), the quantity of capacitance component is in the great majority, and then can need many areas when therefore using capacitance component mounted inside, can utilize the high dielectric constant material design of whole layer at this, uses so that more area to be provided.Thus, can provide a large amount of areas to make the built-in capacity assembly, using the space effectively, and then can dwindle the area of substrate manufacture, and reduce the cost of manufacture of circuit.
In addition, each metallic plate 352,354 also can be electrically connected respectively as for the metal routing on the similar face 342, to transmit signal, shown in Fig. 6 B; Also can be only wherein a metallic plate 354 be electrically connected as for the metal routing on the similar face 342, another metallic plate 352 then is electrical connected with signal transmission line 340 on second substrate 320 by the guide hole 360 that runs through substrate, to transmit signal, shown in Fig. 6 C.At this, guide hole can be types such as lead shape, penetration state or blind hole shape, but and its vertical substrate surface and run through substrate, but also out of plumb substrate surface and run through substrate.
Shown in Fig. 7 A, 7B, but magnetic materials for painting and coating on the surface of second substrate 320, to form magnetic conduction block 370, on the magnetic conduction block, to make Inductive component, with by increase the inductance value of Inductive component effectively by the magnetic conduction block, more can utilize second substrate 320 of low-dielectric loss, reduce conductor losses.At this, the making of Inductive component 372 can by lead twine or cabling on second substrate 320, and then magnetic materials for painting and coating thereon is to form magnetic conduction block 370.And this Inductive component 372 can be spirality Inductive component (spiral inductor) (shown in Fig. 8 A), winding type Inductive component (meander inductor) (shown in Fig. 8 B) or solenoid type Inductive component (solenoid inductor) (shown in Fig. 8 C) etc.Wherein, when being plane formula Inductive component (for example: spirality Inductive component, winding type Inductive component etc.), the shape in the inductor conductor loop that lead is wound in can be similar or be same as the shape of magnetic conduction block.
Wherein, the Inductive component 372 between interlayer buries Inductive component in promptly, also can be by the guide hole 360 that runs through substrate be electrical connected with signal transmission line 340 on second substrate 320, shown in Fig. 9 A, 9B.At this, guide hole can be types such as lead shape, penetration state or blind hole shape, but and its vertical substrate surface and run through substrate, but also out of plumb substrate surface and run through substrate.
In addition, Inductive component 372 also can be electrically connected respectively as for the metal routing on the similar face 342, to transmit signal, shown in Fig. 9 C, 9D.
And, shown in Figure 10 A, 10B, on the surface of second substrate 320, can directly be coated with impedance material, to form resistor assembly 380, dwindle or the embedded resistors assembly to reach, and then can shorten circuit layout and reduce signal transmission distance, come the framework driving component and improve the black box performance to create more spaces.
Wherein, the resistor assembly 380 between interlayer, i.e. embedded resistors assembly, it can be by the guide hole 360 that runs through substrate be electrical connected with signal transmission line 340 on second substrate 320, shown in Figure 10 C.At this, guide hole can be types such as lead shape, penetration state or blind hole shape, but and its vertical substrate surface and run through substrate, but also out of plumb substrate surface and run through substrate.
In addition, resistor assembly 380 also can be electrically connected respectively as for the metal routing on the similar face 342, to transmit signal, shown in Figure 10 D; Also an end of adjustable resistance assembly 380 is electrically connected as for the metal routing on the similar face 342, the other end of resistor assembly 380 then is to be electrical connected with signal transmission line 340 on second substrate 320 by the guide hole 360 that runs through substrate, to transmit signal, shown in Figure 10 E.At this, guide hole can be types such as lead shape, penetration state or blind hole shape, but and its vertical substrate surface and run through substrate, but also out of plumb substrate surface and run through substrate.
In addition, when first substrate was the low-dielectric loss material, assemblies such as signal transmission line, Inductive component and resistor assembly also can be arranged on first substrate according to aforesaid way.
In above-mentioned, though only describe one or both assemblies in multi-functional compound substrate structure according to the present invention, but in fact, can have resistor assembly according to multi-functional compound substrate structure of the present invention, capacitance component, wherein at least a of passive components such as Inductive component and signal transmission line, and each assembly also can have one or more, i.e. combination in any by said structure, formed can have resistor assembly according to multi-functional compound substrate structure of the present invention, capacitance component, wherein at least a of passive components such as Inductive component and signal transmission line, and each assembly also can have one or more.
In addition, on another surface of first substrate 310, promptly not adjacent with second substrate 320 surface can be provided with the 3rd substrate 330, to strengthen integrally-built intensity, as shown in figure 11; In other words, repeatedly form mutually in regular turn with the 3rd substrate 330 by first substrate 310, second substrate 320 at this, wherein this 3rd substrate 330 can be general printed circuit board (PCB) (for example: such as glass fibre substrate, ceramic substrate or the film substrate etc. of FR4 substrate, FR5 substrate etc.), and the dielectric constant of first substrate 310 is higher than the dielectric constant of the 3rd substrate 330, and the dielectric constant of second substrate 320 is lower than the dielectric constant of the 3rd substrate 330.
In addition, the dielectric loss of second substrate (loss tangent) can be lower than the dielectric loss of the 3rd substrate.
Shown in Figure 12 A, 12B, 12C, signal transmission line 340 can be arranged on its not adjacent with first substrate 310 surface of second substrate 320 and/or the 3rd substrate 330; In other words, a surface of second substrate 320 is adjacent with first substrate 310, then is provided with signal transmission line 340 on another surface of second substrate 320, shown in Figure 12 A, 12B; Moreover a surface of the 3rd substrate 330 is adjacent with first substrate 310, then can be provided with signal transmission line 340 on another surface of the 3rd substrate 330, shown in Figure 12 C, 12D.At this, signal transmission line can have the particular system impedance, for example: 50 ohm or 75 ohm or 28.5 ohm etc.Thus, can avoid structure discontinuity surface, for example: the signal transmission line of process via (via) or nonsystematic impedance etc., the unmatched situation of interference that is caused and impedance because of signal delay and signal transmission line.
At this, also can form two metallic plates 352,354 that intercouple in the both sides of first substrate 310, so that capacitive circuit function to be provided, promptly form a built-in capacity assembly 350, as shown in figure 13.And, guide hole 360 that can be by running through substrate respectively will and metallic plate 352,354 and signal transmission line 340 are electrical connected, shown in Figure 14 A, 14B.Wherein, guide hole can be types such as lead shape, penetration state or blind hole shape, but and its vertical substrate surface and run through substrate, but also out of plumb substrate surface and run through substrate.At this, can be by the coupling area of control metallic plate, adjust the dielectric constant of first substrate, or adjust the thickness of first substrate, form the capacitance component of various different capacitances.At this, because capacitance component is to form on first substrate, and first substrate is close to second substrate and the 3rd substrate, therefore then do not need longly in order to the length that capacitance component is pulled out to required via of outer field signal transmission line or lead, thereby can avoid inductive effect because of via or lead to increase stray inductance and reduce operating frequency.Therefore moreover in the design of printed circuit board (PCB), the quantity of capacitance component is in the great majority, and then can need many areas when using capacitance component mounted inside, at this and can utilize the high dielectric constant material design of whole layer, uses so that more area to be provided.
In addition, each metallic plate 352,354 also can be electrically connected respectively as for the metal routing on the similar face 342, to transmit signal, shown in Figure 14 C; Also can be only wherein a metallic plate 354 be to be electrically connected as for the metal routing on the similar face 342, another metallic plate 352 then is to be electrical connected with signal transmission line 340 on second substrate 320 by the guide hole 360 that runs through substrate, to transmit signal, shown in Figure 14 D.At this, guide hole can be types such as lead shape, penetration state or blind hole shape, but and its vertical substrate surface and run through substrate, but also out of plumb substrate surface and run through substrate.
In addition, at the surface coated magnetic material of second substrate 320,, use to provide Inductive component to make, shown in Figure 15 A, 15B to form magnetic conduction block 370.Thus, can directly on the magnetic conduction block, make Inductive component, significantly to increase inductance value.Moreover, also can be coated with high magnetic capacity material on the surface of the 3rd substrate 330, to form magnetic conduction block 370, use to provide Inductive component to make, shown in Figure 15 C, 15D.At this, the making of Inductive component 372 can by lead twine or cabling on second substrate 320, and then magnetic materials for painting and coating thereon is to be formed on the magnetic conduction block 370 to form Inductive component 372, shown in Figure 15 E, 15F, 15G.。And this Inductive component can be spirality Inductive component, winding type Inductive component or sieve solenoid type Inductive component etc.Wherein, when being plane formula Inductive component (for example: spirality Inductive component, winding type Inductive component etc.), the shape in the inductor conductor loop that lead is wound in can be similar or be same as the shape of magnetic conduction block.
Wherein, the Inductive component between interlayer buries Inductive component in promptly, also can be by the guide hole 360 that runs through substrate be electrical connected with signal transmission line 340 on second substrate 320 or the 3rd substrate 330, shown in Figure 16 A, 16B, 16C, 16D.At this, guide hole can be types such as lead shape, penetration state or blind hole shape, but and its vertical substrate surface and run through substrate, but also out of plumb substrate surface and run through substrate.
In addition, Inductive component 372 also can be electrically connected respectively as for the metal routing on the similar face 342, to transmit signal, shown in Figure 16 E, 16F.
At this, impedance material then can be coated the surface of second substrate 320 and/or the 3rd substrate 330, to form resistor assembly 380, dwindles or the embedded resistors assembly to reach, shown in Figure 17 A, 17B, 17C, 17D.
Wherein, the resistor assembly between interlayer, i.e. embedded resistors assembly, it can be by the guide hole 360 that runs through substrate be electrical connected with signal transmission line 340 on second substrate 320/ or the 3rd substrate 330, shown in Figure 18 A, 18B, 18C.At this, guide hole can be types such as lead shape, penetration state or blind hole shape, but and its vertical substrate surface and run through substrate, but also out of plumb substrate surface and run through substrate.
In addition, resistor assembly 380 also can be electrically connected respectively as for the metal routing on the similar face 342, to transmit signal, shown in Figure 18 D; Also an end of adjustable resistance assembly 380 is electrically connected as for the metal routing on the similar face 342, the other end of resistor assembly 380 then is to be electrical connected with signal transmission line 340 on second substrate 320 by the guide hole 360 that runs through substrate, to transmit signal, shown in Figure 18 E.At this, guide hole can be types such as lead shape, penetration state or blind hole shape, but and its vertical substrate surface and run through substrate, but also out of plumb substrate surface and run through substrate.
In addition, when first substrate was the low-dielectric loss material, assemblies such as signal transmission line, Inductive component and resistor assembly also can be arranged on first substrate according to aforesaid way.
In above-mentioned, though only describe one or both assemblies at multi-functional compound substrate structure according to the present invention, but in fact, can have resistor assembly according to multi-functional compound substrate structure of the present invention, capacitance component, wherein at least a of passive components such as Inductive component and signal transmission line, and each assembly also can have one or more, i.e. combination in any by said structure, formed can have resistor assembly according to multi-functional compound substrate structure of the present invention, capacitance component, wherein at least a of passive components such as Inductive component and signal transmission line, and each assembly also can have one or more.
At this, though the substrate framework of passive components such as embedded resistors assembly, capacitance component, Inductive component only is described, but in fact, in like manner, according to multi-functional compound substrate structure of the present invention, also can be embedded in wherein in the functional unit (for example: filter, balance or nonbalance converter, coupler, antenna etc.) with many microwaves,, more can save many materials and assembly cost to dwindle whole substrate area.
Moreover, though at this multi-functional compound substrate structure of two layers and three layers only is described, yet in fact, can according to the present invention, matched combined the various embodiments described above arbitrarily are to provide the multi-functional compound substrate structure more than or four layers or four layers.For instance, with reference to Figure 19, have a plurality of first substrates 310 and a plurality of second substrate 320, it is the order with first substrate 310 and second substrate 320, and is interlaced stacking on two surfaces of the 3rd substrate 330.Wherein, the 3rd substrate 330 can be general printed circuit board (PCB) (for example: FR4 substrate, FR5 substrate, ceramic substrate or film substrate etc.), and the dielectric constant of first substrate 310 is higher than the dielectric constant of the 3rd substrate 330.At this, built-in capacity assembly 350 can be provided with two metallic plates 352,354 that intercouple owing to two surfaces of first substrate 310 respectively and form.Moreover, can be at the surface coated magnetic material of second substrate 320 and/or the 3rd substrate 330, to form magnetic conduction block 370, on the magnetic conduction block, to make Inductive component.And, can form resistor assembly 380 at the surface coated impedance material of second substrate 320 and/or the 3rd substrate 330.At this moment, signal transmission line 340 can be arranged on outermost layer, be the upper surface and the lower surface of whole multi-functional compound substrate structure, to avoid structure discontinuity surface because of signal delay and signal transmission line, for example: the signal transmission line of process via (via) or nonsystematic impedance etc., the unmatched situation of interference that is caused and impedance.
At this, can each substrate be mutually combined by the pressing technology, that is to say, the previous operations of each substrate (for example: the coating of the making of built-in capacity assembly, magnetic material and/or impedance material etc.) finish after, again according to the present invention with the pressing in regular turn of each substrate.And for pressing smoothly or the consideration of heating power and stress aspect, before pressing, auxiliary material 390 are (promptly slightly can to add (coating or pressing) in addition at substrate surface, the material different with substrate material, can be metal or nonmetal), to help metal and base plate bonding, or improve substrate heat force and stress characteristic, as shown in figure 20.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (76)
1. multi-functional compound substrate structure includes:
One first substrate;
One second substrate is adjacent with this first substrate; And
At least one magnetic conduction block is arranged on the surface of one of this first substrate and this second substrate;
Wherein, the dielectric constant of this first substrate is higher than the dielectric constant of this second substrate.
2. multi-functional compound substrate structure as claimed in claim 1 is characterized in that the dielectric loss of this second substrate is smaller or equal to the dielectric loss of glass fibre.
3. multi-functional compound substrate structure as claimed in claim 2 is characterized in that the dielectric loss of this second substrate is lower than the dielectric loss of this first substrate.
4. multi-functional compound substrate structure as claimed in claim 1 also includes:
At least one signal transmission line has the particular system impedance, is arranged on the surface of one of this first substrate and this second substrate.
5. multi-functional compound substrate structure as claimed in claim 4 is characterized in that, this signal transmission line is positioned at this second substrate opposite side adjacent with this first substrate.
6. as claim 1 or 4 described multi-functional compound substrate structures, also include:
At least one capacitance component is positioned on this first substrate.
7. multi-functional compound substrate structure as claimed in claim 6 also includes:
At least one guide hole electrically connects this capacitance component and this signal transmission line.
8. multi-functional compound substrate structure as claimed in claim 6 also includes:
At least one metal routing is electrical connected with this capacitance component respectively, and this metal routing that wherein is electrical connected and this capacitance component are positioned on the same surface of this first substrate.
9. multi-functional compound substrate structure as claimed in claim 6 is characterized in that, each this capacitance component includes:
Two metallic plates are divided into the relative both sides of this first substrate with intercoupling.
10. multi-functional compound substrate structure as claimed in claim 9 also includes:
At least one guide hole electrically connects this metallic plate and this signal transmission line.
11. multi-functional compound substrate structure as claimed in claim 9 also includes:
At least one metal routing is electrical connected with this metallic plate respectively, and this metal routing that wherein is electrical connected and this metallic plate are to be positioned on the same surface of this first substrate.
12. multi-functional compound substrate structure as claimed in claim 9 also includes:
At least one auxiliary material are positioned at the surface of this first substrate and wherein at least one of this second substrate.
13. multi-functional compound substrate structure as claimed in claim 6 also includes:
At least one auxiliary material are positioned at the surface of this first substrate and wherein at least one of this second substrate.
14. multi-functional compound substrate structure as claimed in claim 6 also includes:
At least one resistor assembly is arranged on the surface of one of this first substrate and this second substrate.
15. multi-functional compound substrate structure as claimed in claim 14 also includes:
At least one guide hole electrically connects this resistor assembly and this signal transmission line.
16. multi-functional compound substrate structure as claimed in claim 14 also includes:
At least one metal routing is electrical connected with this resistor assembly respectively, and this metal routing that wherein is electrical connected and this resistor assembly are to be positioned on the same surface of same substrate.
17. multi-functional compound substrate structure as claimed in claim 14 also includes:
At least one auxiliary material are positioned on the surface of this first substrate and wherein at least one of this second substrate.
18. multi-functional compound substrate structure as claimed in claim 14 also includes:
At least one Inductive component is positioned on this magnetic conduction block.
19. multi-functional compound substrate structure as claimed in claim 18 also includes:
At least one guide hole electrically connects this Inductive component and this signal transmission line.
20. multi-functional compound substrate structure as claimed in claim 18 also includes:
At least one metal routing is electrical connected with this Inductive component respectively, and this metal routing that wherein is electrical connected and this resistor assembly are to be positioned on the same surface of same substrate.
21. multi-functional compound substrate structure as claimed in claim 18 also includes:
At least one auxiliary material are positioned at the surface of this first substrate and wherein at least one of this second substrate.
22. multi-functional compound substrate structure as claimed in claim 4 also includes:
At least one resistor assembly is positioned on one of them the surface of this first substrate and this second substrate.
23. multi-functional compound substrate structure as claimed in claim 22 also includes:
At least one guide hole electrically connects this metallic plate and this signal transmission line.
24. multi-functional compound substrate structure as claimed in claim 22 also includes:
At least one metal routing is electrical connected with this metallic plate respectively, and this metal routing that wherein is electrical connected and this metallic plate are to be positioned on the same surface of this first substrate.
25., also include as claim 1 or 22 described multi-functional compound substrate structures:
At least one auxiliary material are positioned on the surface of this first substrate and wherein at least one of this second substrate.
26., also include as claim 1 or 22 described multi-functional compound substrate structures:
At least one Inductive component is positioned on this magnetic conduction block.
27. multi-functional compound substrate structure as claimed in claim 26 also includes:
At least one guide hole electrically connects this Inductive component and this signal transmission line.
28. multi-functional compound substrate structure as claimed in claim 26 also includes:
At least one metal routing is electrical connected with this Inductive component respectively, and this metal routing that wherein is electrical connected and this resistor assembly system are positioned on the same surface of same substrate.
29. multi-functional compound substrate structure as claimed in claim 26 also includes:
At least one auxiliary material are positioned on the surface of this first substrate and wherein at least one of this second substrate.
30. multi-functional compound substrate structure as claimed in claim 1 also includes:
At least one resistor assembly is arranged on the surface of one of this first substrate and this second substrate.
31. a multi-functional compound substrate structure includes:
One first substrate;
One second substrate is adjacent with this first substrate; And
One the 3rd substrate, the opposite side adjacent with this second substrate with this first substrate is adjacent;
Wherein, the dielectric constant of this first substrate is higher than the dielectric constant of the 3rd substrate; And the dielectric constant of this second substrate is lower than the dielectric constant of the 3rd substrate, and the dielectric loss of this second substrate is lower than the dielectric loss of the 3rd substrate.
32. multi-functional compound substrate structure as claimed in claim 31 also includes:
At least one signal transmission line has the particular system impedance, is positioned on the surface of this second substrate and wherein at least one of the 3rd substrate.
33. multi-functional compound substrate structure as claimed in claim 32 is characterized in that, this signal transmission line is to be arranged at least one of this second substrate opposite side adjacent with this first substrate opposite side adjacent with this first substrate with the 3rd substrate.
34., also include as claim 31 or 32 described multi-functional compound substrate structures:
At least one magnetic conduction block, each this magnetic conduction block are one the surfaces that is arranged in this second substrate and the 3rd substrate.
35. multi-functional compound substrate structure as claimed in claim 34 also includes:
At least one Inductive component is positioned on this magnetic conduction block.
36. multi-functional compound substrate structure as claimed in claim 35 also includes:
At least one guide hole electrically connects this Inductive component and this signal transmission line.
37. multi-functional compound substrate structure as claimed in claim 35 also includes:
At least one metal routing is electrical connected with this Inductive component respectively, and this metal routing that wherein is electrical connected and this resistor assembly are to be positioned on the same surface of same substrate.
38. multi-functional compound substrate structure as claimed in claim 35 also includes:
At least one auxiliary material are positioned at the surface of this first substrate, this second substrate and wherein at least one of the 3rd substrate.
39. multi-functional compound substrate structure as claimed in claim 35 also includes:
At least one capacitance component is positioned on this first substrate.
40. multi-functional compound substrate structure as claimed in claim 39 also includes:
At least one guide hole electrically connects this capacitance component and this signal transmission line.
41. multi-functional compound substrate structure as claimed in claim 39 also includes:
At least one metal routing is electrical connected with this capacitance component respectively, and this metal routing that wherein is electrical connected and this capacitance component are to be positioned on the same surface of this first substrate.
42. multi-functional compound substrate structure as claimed in claim 39 also includes:
At least one auxiliary material are positioned at the surface of this first substrate, this second substrate and wherein at least one of the 3rd substrate.
43. multi-functional compound substrate structure as claimed in claim 39 is characterized in that, each this capacitance component includes:
Two metallic plates are divided into the relative both sides of this first substrate with intercoupling.
44. multi-functional compound substrate structure as claimed in claim 43 also includes:
At least one guide hole electrically connects this metallic plate and this signal transmission line.
45. multi-functional compound substrate structure as claimed in claim 43 also includes:
At least one metal routing is electrical connected with this metallic plate respectively, and this metal routing that wherein is electrical connected and this metallic plate are to be positioned on the same surface of this first substrate.
46. multi-functional compound substrate structure as claimed in claim 43 also includes:
At least one auxiliary material are positioned at the surface of this first substrate, this second substrate and wherein at least one of the 3rd substrate.
47. multi-functional compound substrate structure as claimed in claim 39 also includes:
At least one resistor assembly, each this resistor assembly are one the surfaces that is arranged in this second substrate and the 3rd substrate.
48. multi-functional compound substrate structure as claimed in claim 47 also includes:
At least one guide hole electrically connects this resistor assembly and this signal transmission line.
49. multi-functional compound substrate structure as claimed in claim 47 also includes:
At least one metal routing is electrical connected with this resistor assembly respectively, and this metal routing that wherein is electrical connected and this resistor assembly are to be positioned on the same surface of same substrate.
50. multi-functional compound substrate structure as claimed in claim 47 also includes:
At least one auxiliary material are positioned at the surface of this first substrate, this second substrate and wherein at least one of the 3rd substrate.
51. multi-functional compound substrate structure as claimed in claim 31 also includes:
At least one capacitance component is positioned on this first substrate.
52. multi-functional compound substrate structure as claimed in claim 51 is characterized in that, each this capacitance component includes:
Two metallic plates are divided into the relative both sides of this first substrate with intercoupling.
53. multi-functional compound substrate structure as claimed in claim 52 also includes:
At least one guide hole electrically connects this metallic plate and this signal transmission line.
54. multi-functional compound substrate structure as claimed in claim 52 also includes:
At least one metal routing is electrical connected with this metallic plate respectively, and this metal routing that wherein is electrical connected and this metallic plate are to be positioned on the same surface of this first substrate.
55. multi-functional compound substrate structure as claimed in claim 51 also includes:
At least one guide hole electrically connects this resistor assembly and this signal transmission line.
56. multi-functional compound substrate structure as claimed in claim 51 also includes:
At least one metal routing is electrical connected with this resistor assembly respectively, and this metal routing that wherein is electrical connected and this resistor assembly are to be positioned on the same surface of same substrate.
57., also include as claim 31 or 51 described multi-functional compound substrate structures:
At least one resistor assembly, each this resistor assembly are one the surfaces that is arranged in this second substrate and the 3rd substrate.
58. multi-functional compound substrate structure as claimed in claim 57 also includes:
At least one guide hole electrically connects this resistor assembly and this signal transmission line.
59. multi-functional compound substrate structure as claimed in claim 57 also includes:
At least one metal routing is electrical connected with this resistor assembly respectively, and this metal routing that wherein is electrical connected and this resistor assembly are to be positioned on the same surface of same substrate.
60. multi-functional compound substrate structure as claimed in claim 57 also includes:
At least one auxiliary material are positioned at the surface of this first substrate, this second substrate and wherein at least one of the 3rd substrate.
61., also include as claim 31,51 or 52 described multi-functional compound substrate structures:
At least one auxiliary material are positioned at the surface of this first substrate, this second substrate and wherein at least one of the 3rd substrate.
62. a multi-functional compound substrate structure includes:
One first substrate;
One second substrate is adjacent with this first substrate; And
At least one signal transmission line is positioned at this second substrate opposite side adjacent with this first substrate;
Wherein, the dielectric constant of this first substrate is higher than the dielectric constant of this second substrate.
63. multi-functional compound substrate structure as claimed in claim 62 is characterized in that, the dielectric loss of this second substrate is smaller or equal to the dielectric loss of glass fibre.
64., it is characterized in that the dielectric loss of this second substrate is lower than the dielectric loss of this first substrate as the described multi-functional compound substrate structure of claim 63.
65. multi-functional compound substrate structure as claimed in claim 62 is characterized in that, this signal transmission line has the particular system impedance.
66. multi-functional compound substrate structure as claimed in claim 62 also includes:
At least one capacitance component is positioned on this first substrate.
67., it is characterized in that each this capacitance component includes as the described multi-functional compound substrate structure of claim 66:
Two metallic plates are divided into the relative both sides of this first substrate with intercoupling.
68., also include as the described multi-functional compound substrate structure of claim 67:
At least one guide hole electrically connects this metallic plate and this signal transmission line.
69., also include as the described multi-functional compound substrate structure of claim 67:
At least one metal routing is electrical connected with this metallic plate respectively, and this metal routing that wherein is electrical connected and this metallic plate are to be positioned on the same surface of this first substrate.
70., also include as the described multi-functional compound substrate structure of claim 66:
At least one guide hole electrically connects this capacitance component and this signal transmission line.
71., also include as the described multi-functional compound substrate structure of claim 66:
At least one metal routing is electrical connected with this capacitance component respectively, and this metal routing that wherein is electrical connected and this capacitance component are to be positioned on the same surface of this first substrate.
72., also include as claim 62 or 66 described multi-functional compound substrate structures:
At least one resistor assembly is formed on the surface of this second substrate in the mode that is coated with impedance material.
73., also include as the described multi-functional compound substrate structure of claim 72:
At least one guide hole electrically connects this resistor assembly and this signal transmission line.
74., also include as the described multi-functional compound substrate structure of claim 72:
At least one metal routing is electrical connected with this resistor assembly respectively, and this metal routing that wherein is electrical connected and this resistor assembly are to be positioned on the same surface of same substrate.
75., also include as the described multi-functional compound substrate structure of claim 72:
At least one auxiliary material are positioned at the surface of this first substrate and wherein at least one of this second substrate.
76., also include as claim 62,66 or 67 described multi-functional compound substrate structures:
At least one auxiliary material are positioned at the surface of this first substrate and wherein at least one of this second substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610056738 CN101009970A (en) | 2006-01-24 | 2006-03-06 | Multi-functional compound substrate structure |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610002219 | 2006-01-24 | ||
| CN200610002219.0 | 2006-01-24 | ||
| CN 200610056738 CN101009970A (en) | 2006-01-24 | 2006-03-06 | Multi-functional compound substrate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101009970A true CN101009970A (en) | 2007-08-01 |
Family
ID=38698000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610056738 Pending CN101009970A (en) | 2006-01-24 | 2006-03-06 | Multi-functional compound substrate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101009970A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428034A (en) * | 2015-12-09 | 2016-03-23 | 浙江师范大学 | Bottom layer embedded type micron-sized three-dimensional thin-film inductor and manufacturing method thereof |
| CN105722303A (en) * | 2014-12-04 | 2016-06-29 | 中山台光电子材料有限公司 | Multilayer printed circuit board |
| CN107683032A (en) * | 2017-08-31 | 2018-02-09 | 江苏普诺威电子股份有限公司 | Two-sided etching burying capacitance circuit board manufacture craft |
| US10389241B2 (en) | 2016-02-05 | 2019-08-20 | Delta Electronics (Shanghai) Co., Ltd | Power supply converter and method for manufacturing the same |
| CN113555337A (en) * | 2021-05-27 | 2021-10-26 | 日月光半导体制造股份有限公司 | Semiconductor substrate structure and forming method thereof |
-
2006
- 2006-03-06 CN CN 200610056738 patent/CN101009970A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105722303A (en) * | 2014-12-04 | 2016-06-29 | 中山台光电子材料有限公司 | Multilayer printed circuit board |
| CN105722303B (en) * | 2014-12-04 | 2019-01-25 | 中山台光电子材料有限公司 | Multilayer board |
| CN105428034A (en) * | 2015-12-09 | 2016-03-23 | 浙江师范大学 | Bottom layer embedded type micron-sized three-dimensional thin-film inductor and manufacturing method thereof |
| US10389241B2 (en) | 2016-02-05 | 2019-08-20 | Delta Electronics (Shanghai) Co., Ltd | Power supply converter and method for manufacturing the same |
| CN107683032A (en) * | 2017-08-31 | 2018-02-09 | 江苏普诺威电子股份有限公司 | Two-sided etching burying capacitance circuit board manufacture craft |
| CN113555337A (en) * | 2021-05-27 | 2021-10-26 | 日月光半导体制造股份有限公司 | Semiconductor substrate structure and forming method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7515435B2 (en) | Multi-functional composite substrate structure | |
| CN100431394C (en) | Substrate with composite medium and multilayer substrate made by the same | |
| US20140306793A1 (en) | High Q, Miniaturized LCP-Based Passive Components | |
| US20080180878A1 (en) | Package structure with embedded capacitor, fabricating process thereof and applications of the same | |
| US10342125B2 (en) | Multilayer substrate | |
| JP2007250818A (en) | Circuit board | |
| JP6458904B2 (en) | Passive element array and printed wiring board | |
| CN101009970A (en) | Multi-functional compound substrate structure | |
| CA2574208A1 (en) | Improved multi-layer integrated rf/if circuit board | |
| CA2574211A1 (en) | Improved multi-layer integrated rf/if circuit board | |
| CN107333383A (en) | Printed circuit board | |
| KR102029499B1 (en) | Composite electronic component and board for mounting the same | |
| US7529103B2 (en) | Multi-layered printed circuit board embedded with filter | |
| CN105142329A (en) | Multi-layer circuit board riveting structure, and suspended line circuit constituted by same, and realization method for suspended line circuit | |
| WO2014157031A1 (en) | High-frequency transmission line and electronic device | |
| JP4363947B2 (en) | Multilayer wiring circuit board and method for manufacturing the same | |
| CN112533358A (en) | High-frequency microwave multilayer circuit board and high-frequency microwave assembly | |
| US20040028888A1 (en) | Three dimensional multilayer RF module having air cavities and method fabricating same | |
| KR100716156B1 (en) | Ultra-Wideband Band pass filter using Low temperature co-fired ceramic | |
| CN103378386A (en) | Diplexer | |
| US20040211954A1 (en) | Compositive laminate substrate with inorganic substrate and organic substrate | |
| CN106341097B (en) | Common mode filter and circuit structure | |
| CN113966085B (en) | Circuit board and manufacturing method thereof | |
| CN219046291U (en) | Packaging substrate for duplexer and duplexer | |
| CN113727510B (en) | Method for manufacturing circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20070801 |