CN101000881A - Image sensor testing method and apparatus - Google Patents
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- CN101000881A CN101000881A CNA2007100016584A CN200710001658A CN101000881A CN 101000881 A CN101000881 A CN 101000881A CN A2007100016584 A CNA2007100016584 A CN A2007100016584A CN 200710001658 A CN200710001658 A CN 200710001658A CN 101000881 A CN101000881 A CN 101000881A
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
Abstract
Disclosed are an optical test apparatus, related test method and method of operation, and related probe card adapted to optically test an image sensor. An illumination source of the optical test apparatus provides an optical test signal to the image sensor through the probe card. The optical test signal has a property variably defined by a feedback loop formed between a reference image sensor associated with the probe card and a control unit connected between the reference image sensor and the illumination source.
Description
Technical field
The testing apparatus that embodiments of the invention relate in general to a kind of image sensor testing method and are associated.On concrete, embodiments of the invention relate to a kind of automatic test approach and a kind of testing apparatus that is associated that improved test uniformity (uniformity) is provided of imageing sensor.
Background technology
It is the semiconductor image sensor of feature that improved semiconductor fabrication has produced with little size, high-quality performance and low manufacturing cost.As a result, imageing sensor is used for the commercial device of broad variety now, described commercial device such as digital camera, video camera, printer, scanner and some cell phone.In overall operation, imageing sensor is converted to the relevant signal of telecommunication by the adaptive light energy (for example visible light) of catching with described light energy, subsequently the described signal of telecommunication is treated to the numerical data that can easily be stored, transmit and handle.The final result of this noticeable processing sequence is to produce view data, can use traditional obtainable Digital Media multi-formly visually to show or write down described view data with multiple.
The semiconductor image sensor of two kinds of types of using the most widely is charge-coupled device (CCD) and cmos image sensor (CIS).Ccd sensor totally provides the performance higher than CIS transducer.Ccd sensor is with less noise and higher device uniformity operation.But the CIS transducer is with lower power consumption and higher speed of service operation.The lower power consumption and the higher speed of service that are provided by the CIS transducer make that the CIS transducer is the selected imageing sensors of many portable electronic devices.That is, for by limited battery life they design and operating characteristic on a plurality of portable electronic devices of limiting, the power consumption of reduction is and acceptable compromise with respect to the rudimentary performance of the CIS transducer of ccd sensor.Cell phone with integral photographic machine is an example of such portable electronic device.
This current design preference that is associated with portable electronic device has been brought some difficulties in the border, loop of (constituent) imageing sensor that constitutes challenge.For example, suppose and exist the intrinsic weakness be associated with the CIS transducer (for example, strong noise and the low uniformity between the individual sensor operation), interior quality control and the test processes of long sequence of then making the needed manufacturing processing of CIS transducer becomes more and more important.
With use CCD or CIS technology irrelevant, most of imageing sensor manufacturer begin the quality control test on wafer scale, avoiding the cost of manufacturing fault image sensor element continuously, and reduce the possibility of production not function or substandard product.Term " wafer scale (wafer level) " refers to any manufacturing of carrying out and handles on the wafer substrates that comprises a plurality of other semiconductor image sensors, comprise test and quality control treatments (referring to Fig. 1).Individual devices by from wafer excision and packed or be connected to other main device parts before, carry out wafer level test.
Under the situation that the photoelectric converting function that is provided by imageing sensor is provided, not surprisingly, optic test (for example, the test that is associated with the rayed of imageing sensor) is the pith of whole quality control treatments.Carry out a large amount of optic tests at wafer scale.Such test directly relates to the quality of optical test equipment, concrete on, relate to the quality of the irradiation source in optical test equipment.In fact, the reliability of optical test equipment should always surpass the specification of tested imageing sensor.The result of this conclusion require in optical test equipment irradiation source its characteristic (for example, intensity, wavelength etc.) go up by accurately control, its on wafer be applied with highly evenly and very reliable.If the such quality in irradiation source then can not distinguished the performance difference between the individual image sensor that forms on the wafer.
The current traditional irradiation source that uses in the manufacturing of imageing sensor is by manual calibration according to time scheduled maintenance table (for example, every operation is 1000 to 2000 hours).Such method requires to interrupt manufacture process when testing equipment is safeguarded by off-line.And described manual calibration is handled owing to its intrinsic " human factor " (for example the difference in technical staff's training etc.) has qualitative difference.
In addition, need use a plurality of optic test platforms by a large amount of production capacity that the modern semiconductors manufacturing facility provides, each all has irradiation source.Ideally, the irradiation source that uses in every production line should produce identical product, thereby the test of the imageing sensor on many production lines is consistent.Unfortunately, almost never like this.Current regulation, each irradiation source are only with respect to " standard " irradiation source tested (perhaps comparing), and this is handled difference inherently on its result.
As one man provide difficulty even, the high-quality irradiation source to be caused by the following fact: the performance of all irradiation sources trends towards along with the time variation.As a result, irradiation source manufacturer to provide with " typical case " irradiation performance of process in time be the estimated performance profile (profile) of feature.These performance profile have proposed the voltage bias adjustment or the operating voltage offset of irradiation source during the different periods of its life span.But such performance profile and corresponding voltage compensation only are " on average " adjustment that the result with modeling limits explicitly.They accurately do not consider the actual performance of indivedual irradiation sources.
All foregoings cause the unacceptable height difference on the performance quality of irradiation source.If there is not the reliable and clear optical reference signal (for example, having the even light energy of well controlled intensity) that limits, then can not accurately obtain the feature of the performance of the individual image sensor that on wafer, forms.The more important thing is, can understand well that semiconductor fabrication processing produces differentiated result (for example, the marginal portion of wafer is for the material layer characteristic of the core of wafer) on the surf zone of the wafer of being everlasting.Such manufacturing is handled difference and must be identified, quantize in earnest and Be Controlled, so that improve imageing sensor output.If the characteristic of the irradiation source in optical test equipment also changes, then may during the wafer scale optic test of imageing sensor, discern such processing difference hardly on the surface of wafer.
Summary of the invention
In one embodiment, the invention provides a kind of optical testing device, it is configured to testing image sensor, and comprises: irradiation source, it is by the adaptive optical test signal that produces, and described optical test signal has the character that limits explicitly with control signal with changing; Detecting card, it is sent to the selected imageing sensor that forms that is associated with described detecting card by adaptive with optical test signal on wafer by exposure aperture, described detecting card comprises the benchmark image transducer, described benchmark image transducer is placed near described exposure aperture, and is rung to producing optical feedback signal in described optical test signal by adaptive; Control unit, it is by the adaptive optical feedback signal that receives, and produces the Control and Feedback signal in response to optical feedback signal; And operating unit, it is received described Control and Feedback signal by adaptive, and produces control signal.
In another embodiment, the invention provides a kind of optical testing device, it is configured to testing image sensor, and comprise: irradiation source, it is provided optical test signal by detecting card to imageing sensor by adaptive, described optical test signal has the character that is limited by the feedback loop that forms with changing between benchmark image transducer that is associated with described detecting card and control unit, described control unit is connected between described benchmark image transducer and the irradiation source.
In another embodiment, the invention provides a kind of method of operating optical testing apparatus, described optical testing device is being tested a plurality of imageing sensors that form by adaptive on wafer on the wafer scale, described method comprises: control is by the adaptive operation that produces the irradiation source of optical test signal, and described optical test signal has the characteristic that limits explicitly with the contingency table fiducial value data of storing in memory; With the detecting card that the is associated with wafer character of detection optical test signal explicitly, and produce corresponding optical feedback signal; Described optical feedback signal is compared with at least one fiducial value in described contingency table; And in contingency table, rewrite at least one fiducial value in response to described comparison.
In another embodiment, the invention provides a kind of method of operating optical testing apparatus, described optical testing device is by the adaptive a plurality of imageing sensors that form on wafer of testing, and described method comprises: limit a plurality of fiducial values in memory; Use optical test signal, be radiated at selected imageing sensor in a plurality of transducers by detecting card, described optical test signal has and a plurality of fiducial values character of qualification explicitly with changing; Generation is corresponding to the value of feedback of the optical test signal of the selected imageing sensor of irradiation; Described value of feedback is compared with one of described a plurality of fiducial values to determine difference; When determining difference, in memory, limit at least one of described a plurality of fiducial values again, and with at least one fiducial value that limits again compensate for optical test signal explicitly; And with the optical test signal selected imageing sensor of optic test explicitly.
In another embodiment, the invention provides a kind of detecting card, it is by adaptive next for use in testing for a plurality of imageing sensors that form on the wafer, described detecting card comprises: exposure aperture, and it is sent to selected imageing sensor in a plurality of imageing sensors by adaptive with optical test signal; At least one benchmark image transducer is placed near described exposure aperture, so that side by side shine described at least one benchmark image transducer with optical test signal and selected imageing sensor.
Description of drawings
Referring to accompanying drawing several embodiment are described.Should be noted that various elements in the accompanying drawings are uninevitable proportionally drawn.In fact, for clear, can at random improve or reduce size.When being suitable for practicality, identical drawing reference numeral is represented components identical.
Fig. 1 illustrates the wafer that comprises a plurality of imageing sensors;
Fig. 2 is diagram according to one embodiment of the present of invention, by the adaptive schematic diagram that comes the exemplary testing apparatus of measuring semiconductor imageing sensor;
Fig. 3 has described by the first example probe card of the device of the adaptive Fig. 2 of being used for;
Fig. 4 has described by the second example probe card of the device of the adaptive Fig. 2 of being used for;
Fig. 5 has described by the exemplary checking list of the control of the irradiation source of the adaptive Fig. 2 of being used for;
Fig. 6 is the figure that illustrates according to the low light levels transfer function of the benchmark image transducer of one embodiment of the present of invention; And
Fig. 7 A and 7B are the flow charts of illustrative methods of operation of the optical testing device of general introduction Fig. 2.
Embodiment
In the following description, in order to illustrate rather than to limit, embodiments of the invention are presented to understand foundation of the present invention and use more up hill and dale.But, understand the disclosed one of ordinary skilled in the art of described theme and will understand that other embodiment of the present invention are possible.That is, the multiple modification of exemplary embodiment and to reconfigure be possible should be with its removal from the scope of appended claim.And, for the sake of simplicity, omitted the explanation of testing apparatus with the concrete known aspect of the method that is associated.
Embodiments of the invention provide a kind of optical testing device, have wherein incorporated the irradiation source of better quality into, and it provides the optical test signal (for example directional light) of the characteristic that has improved uniformity and accurately control.Embodiments of the invention provide the optical test method that is associated, and they more can carry out the individual image sensor that differentiation forms reliably on wafer.The height of the actual operation characteristic of a plurality of irradiation sources that the embodiments of the invention permission is being used in semiconductor manufacturing facility accurately and evenly limits.The using method that embodiments of the invention provide optical test equipment and have been associated, they do not require the operating characteristic of customary human intervention irradiation source in testing equipment with calibration and checking.As a result, the present invention provides improved manufacturing efficient with cost and the bigger testing reliability that reduces.
The term that in whole specification, uses " on " and D score, " on " and " under ", " vertically " and " laterally " and similarly the expression of relative position be intended to pass on information about the exemplary relative bearing between the two or more elements in the border, loop of embodiment.Therefore, these terms should be explained in the exemplary border, instruction loop as all similarity relations.For example, on only mutually upset is described to and under the relative bearing of two elements cause only reversing element on and under the similarity relation in orientation.The actual realization of theme invention may only only limit to the relative description of such element as described below.
Embodiments of the invention for example specifically are applied on wafer the test of the imageing sensor that forms (perhaps part forms).Fig. 1 shows the exemplary wafer 10 that comprises a plurality of imageing sensors 11.Wafer 10 can be a silicon wafer, such as in the manufacturing of traditional C CD or CIS transducer normally used those.
As shown in fig. 1, described a plurality of imageing sensors 11 can be disposed in as usually in a series of row and columns, to fill the available surface area of wafer 10 effectively.Each imageing sensor 11 totally includes active picture sensor (APS) array 11a and peripheral circuit region 11b.
Similarly, the layout of peripheral circuit region 11b and design will be according to using with the technology of enabling and different.But, will generally include as understand traditionally: various digital circuits, such as timing generator, row decoder, latch and column decoder etc.And peripheral circuit region 11b can also comprise various analog circuits, such as two samplers (CDS) that are associated and analog to digital converter (ADC).And peripheral circuit region 11b will generally include a plurality of electric contact piece (not shown), and they are connected imageing sensor 11 by adaptive with external circuit.Some such electric contact pieces have concrete application at test period, and are as described below.
Fig. 2 has described exemplary optics testing apparatus 100, and it is by the adaptive set at the wafer level test imageing sensor during the manufacturing of imageing sensor.In the diagram example of Fig. 2, optical testing device 100 comprises: detecting card 110, irradiation source 120, operating unit 130, control unit 140 and transducer 150.
Detecting card 110 comprises at least one exposure aperture (for example opening of fracture shape) 111 and at least one benchmark image transducer 112, and described at least one benchmark image transducer 112 is positioned on detecting card 110 upper surfaces near exposure aperture 111.In specific embodiment, benchmark image transducer 112 has identical with tested imageing sensor or similar configuration.As providing traditionally, detecting card 110 also comprises a plurality of electric probes 113, and they extend from its lower surface.Electric probe 113 is by the adaptive electric sheet that is connected to the individual image sensor that forms on the wafer 10 that is positioned under the detecting card 110.
Fig. 3 and 4 further illustrates by the adaptive independently embodiment that is used for the detecting card 110 of optical testing device 100.As shown in Figure 3, the exposure aperture 111 that is formed centrally in is arranged in irradiation area 125 with a benchmark image transducer 112.Irradiation area 125 be with the upper surface that projects the wafer 10 that is exposed on the selected imageing sensor by exposure aperture 111 from irradiation source 120 on optical test signal (for example directional light 124) limited zone on its size, shape and orientation explicitly.In this, exposure aperture 111 can be defined on its size, shape and orientation explicitly with the size of the imageing sensor that will test during given irradiating step and quantity, limited irradiation area 125 with by the characteristic (for example, the frequency of directional light 124, intensity etc.) of the optical test signal of irradiation source 120 projections.
Be similar to the use of traditional detecting card in many aspects according to the use of the detecting card 110 of one embodiment of the present of invention.For example, can use the electric probe 113 that extends from detecting card 110 to provide power and test signal to the input chip of the selected imageing sensor on wafer 10, and from receiving corresponding output signal with output chip that selected imageing sensor is associated.Therefore, as understand traditionally, detecting card 110 can be connected to external test or testboard (not shown), so that convenient test signal communication between selected imageing sensor and the testing equipment that is associated.In this, the output that is arranged in the benchmark image transducer 112 of detecting card 110 can be output to the testing equipment that is associated similarly by the connection that is provided by detecting card 110.In specific embodiments of the invention, this testing equipment that is associated comprises for example control unit 140 and transducer 150.
In Fig. 3, single benchmark image transducer 112 is positioned near the position at exposure aperture 111 centers and at irradiation area 125, and in Fig. 4, a plurality of benchmark image transducers 112 are disposed in around the exposure aperture 111.In some embodiments of the invention, Fu Jia benchmark image transducer 112 along and/or spatially be associated around exposure aperture 111 and providing, the feedback reference gradient.Compare with single datum mark, so a plurality of datum marks will be provided at the more detailed indication that is changed by space on the characteristic of the optical test signal of irradiation source 120 projections.
In the diagram example shown in Fig. 2, optical testing device 100 is arranged in irradiation source 120 on the detecting card 110.In this position, irradiation source 120 is provided directional light 124 to be used as optical test signal by adaptive well on the whole irradiation area 125 of detecting card 110 equably.In the graphic embodiment of institute, irradiation source 120 comprises: light source 121, aperture 122, a plurality of lens 123 and one or more optical filter 129.
Herein, should be noted that the term " light " that uses should be broadly interpreted as the light energy that contains any reasonable wavelength or wave-length coverage in whole specification.Therefore, though visible light height correlation ground is as exemplary optics test signal in the border, loop of the commercial product in the present age, but the one of ordinary skilled in the art can recognize, can use the optical test signal that optionally comprises non-visible light (for example, infrared or near infrared light) in an embodiment of the present invention similarly.
With traditional understanding mode, the light that a plurality of lens 123 cooperations come collimation to be sent by light source 121.But before reaching a plurality of lens 123, the light of being launched is by aperture 122.The openings of sizes 122a of aperture 122 can be adjusted under the accurate control of operating unit 130.Therefore, can accurately control the intensity that illuminated source 120 projects the directional light 124 on the irradiation area 125 by changing aperture size 122a, to shine just at tested selected imageing sensor.
Combine with the strength variability that is provided by aperture 122, one or more optical filters 129 can be used for further adjusting emission light.For example, can use one or more optical filters to come to select input or select the specific optical wavelength of output from the light that sends by light source 121.Providing of optical filter 129 allows to use wideband light source 121, but the ability of using high wavelength particular optical test signal to shine imageing sensor also is provided.
Nominally operating unit 130 can have traditional design, if this traditional design by further adaptive (for example reconfiguring and/or reprogramming) to produce by the adaptive control signal of controlling the big or small 122a of aperture 122.In fact, many traditional optical testing devices comprise by the adaptive operating unit that produces the input voltage that is applied to light source 121.This input signal generally is a fixed voltage, and can be fed control in operating unit 130.But the present invention also considers following embodiment, and wherein, being operated the input signal that unit 130 is applied to light source 121 can change explicitly with feedback that is provided by control unit 140 and/or control signal.
Referring to the illustrated embodiment of Fig. 2, operating unit 130 can also not only be produced the input signal (for example fixing or variable input voltage) that is used to control light source 121 by adaptive, and produces by the adaptive control signal of controlling aperture size 122a.Various voltage-controlled aperture devices totally can be used for this purpose.And (again) that be used for the operating unit 130 of this purpose programmed or reconfigured and be considered in one of ordinary skilled in the art's ability.
In the graphic embodiment of institute, control unit 140 comprises that controller 141, luminous intensity are provided with device 142, compensator 143 and database 144.Controller 141 can be traditional processor, and it is used for the control of instrument and/or manufacturing equipment and uses by adaptive.Compensator 143 can be traditional numerical data or analog signal comparator circuit.It can be data register or data storage that luminous intensity is provided with device 142, is come the Memory Reference data by adaptive.If be configured to data storage, then luminous intensity is provided with device 142 can provide discretely with database 144, perhaps can be contained in the database 144.Database 144 can have easily any one by adaptive a plurality of traditional structures of storing one or more checking lists.Described contingency table can be used for a plurality of purposes, as following with as described in certain other details.
Continuation illustrates the illustrative methods of the operation of optical testing device 100 now referring to Fig. 2.When the wafer 10 that has formed or partly formed a plurality of imageing sensors on it was located with respect to optical testing device 100, described method began.In case be positioned in the test position under the detecting card 110, then selected imageing sensor is connected to electric probe 113, and the exposure aperture 111 by in detecting card 110 and optical exposure.By this way, can be with respect to the directional light 124 that provides from irradiation source 120 and the selected imageing sensor of follow-on test.Behind test one picture group image-position sensor, detecting card 110 and/or wafer 10 can be relocated to test another picture group image-position sensor.
During optic test, selected imageing sensor is in response to the test control signal that is provided by controller 141 (and/or other testing equipments) by electric probe 113, and in response to the directional light 124 by exposure aperture 111.Under these inputs, individual image sensor outputs test data signal to controller 141 (and/or other testing equipments).The operating characteristics of the individual image sensor that the indication that outputs test data is associated with test condition, the optical test signal that is provided by irradiation source 120 is provided described test condition.
Correct for the actual characteristic of the optical test signal that guarantees to provide by irradiation source 120, the benchmark image transducer 112 that is associated with detecting card 110 by transducer 150 to controller 141 output optical feedback signal.Described optical feedback signal (with the analog or digital form) can be voltage, electric current, frequency and/or indication benchmark image transducer 112 data value in response to optical test signal (for example directional light 124).
Before any actual test beginning of the imageing sensor on the wafer 10, control unit 140 initialization (perhaps receiving) are stored in a plurality of checking lists in the database 144 for example.Described checking list comprises reference data, and described reference data makes control unit 140 produce the Control and Feedback signal that is provided to the suitable test control signal of detecting card 110 and/or is provided to operating unit 130.
Fig. 5 has described exemplary checking list 500.As shown in Figure 5, checking list 500 comprises three columns certificates.Data value in first (the most left) row is indicated the expectation luminous intensity of optical test signal respectively.Data value indication in secondary series is applied to the input signal of light source 121.In the diagram example of Fig. 5, adopt fixedly input signal.Data value in the 3rd (the rightest) row is indicated the control signal that is applied to control and aperture size 122a respectively.By changing aperture size 122a, can accurately control the intensity of optical test signal.
Under the influence of the feedback loop that is provided by benchmark image transducer 112, control unit 140 and operating unit 130, irradiation source 120 can be by the control signal control that limits explicitly with particular value (perhaps value set) in contingency table 500.In one embodiment, selected control signal value and/or input signal values are provided as being provided to the part of the Control and Feedback signal of operating unit 130.
Other checking list can be provided, and they illustrate other testing standards or influence, such as service life of light source 121, border, loop working temperature etc.And, comprise that at light source 121 independent checking list can be established and be kept in the database 144 to control corresponding reflector in the configuration of a plurality of reflectors (the standard RGB independent diode of output for example is provided).
Turn back to Fig. 2 again, in case controller 141 has been visited suitable checking list, then control unit 140 can send the Control and Feedback signal of suitably determining to operating unit 130.In response, operating unit 130 can be controlled output by the optical test signal of irradiation source 120 in any amount of mode, described mode comprises aforesaid example (for example the selection of control input signals, control signal, filter etc.) and other modes, comprises the variable modulation, change operating temperature, mechanical damping control of input and control signal etc.Therefore, under the control of operating unit 130, irradiation source 120 is provided uniform optical test signal well-controlled, that have finitude by adaptive to detecting card 110 and selected imageing sensor.
When the directional light 124 that is provided by irradiation source 120 drops on benchmark image transducer 112 equably and just on tested selected imageing sensor the time, can obtain the real-time feedback about the actual nature of directional light 124.Unlike traditional optical testing device, the present invention the adaptive well actual strength that just is provided at the directional light 124 of tested imageing sensor of following the tracks of of graphic embodiment.Even under the very low level of optical test signal, this also is true.For example, traditional testing apparatus can not accurately be visited the optical test signal of the level that is lower than about 1 lumen (lux (lux)).As a result, traditionally, the equipment for customizing of costliness is used for the optic test platform, so that accurately visit character at low-level optical test signal.Need this extra verification step, because the low optical property of imageing sensor is important performance standard.
Fig. 6 describes the exemplary transfer function 600 of indicating by the benchmark image transducer 112 that is associated with detecting card 110.As shown in the figure, the scope of the luminous power of the input of from 0.0 to 1.0 lumen makes benchmark image transducer 112 (for example via transducer 150) produce the frequency signal with the scope 0.0 hertz and about 1500 hertz.(exist on the linearity of described exemplary transfer function 600 under the situation of slight defective, useful is, in certain embodiments, one or more feedback compensation tables are provided in database 144, compensating described linear discontinuities, because such defective can be so that the degradation of optical testing device 100).
However, by the definition of the low light level feedback as shown in Figure 6 that provides of graphic embodiment be significant.Very low strength level causes very thin output frequency to be distinguished, and this allows accurately to estimate in the irradiation source performance of low intensity level very.As a result, do not need special low light horizontal checkout equipment, and do not interrupt making output, so that determine the low light performance characteristics of (or checking) irradiation source.
Return Fig. 2 again, in case controller 141 receives optical feedback signal from benchmark image transducer 112, then it can using compensation device 143 with described optical feedback signal (perhaps from its data value that draws) with device 142 or database 144 are set in luminous intensity one or more fiducial values of storage compare.In this, compensator 143 can be based on the comparator (for example feedback adder circuit) of hardware or operate in software routines on the controller 141.
If it is consistent with the optical feedback signal that is received that the fiducial value of storage in the device 142 is set in luminous intensity, then therefore optical testing device 100 can carry out any amount of optic test for selected imageing sensor, has high confidence level in test result.Various interested tests can comprise whole susceptibility test, the responsive test of low light level, linear test, noise testing, not function test pixel etc.Can test the single image transducer, can test a plurality of transducers, perhaps under concrete condition, wafer 10 can repeatedly be reorientated to shine the imageing sensor of different rows in regular turn.
But,, then for example can reconfigure optical testing device 100 by the Control and Feedback signal that modification is provided to operating unit 130 if the fiducial value that storage is set in the device 142 in luminous intensity is different in essence with the optical feedback signal that is received.Reconfiguring like this can comprise one or more fiducial values that increasing or decreasing is stored in contingency table.
For example, if the optical feedback signal that is provided by benchmark image transducer 112 indication is than the actual optical test signal intensity (for example 1.9 lumens) of the expectation strength level (for example 2.0 lumens) little 5% of optical test signal, then control unit 140 can be adjusted at one or more suitable project in the corresponding contingency table to proofread and correct this difference.Therefore, being example, the checking list project corresponding to the control signal voltage of the expectation luminous intensity of 2.0 lumens can be brought up to 2.1V from 2.0V at the table 500 shown in Fig. 5.The Control and Feedback signal that is provided to operating unit 130 by control unit 140 will be provided this new contingency table project again.
By this way, can obtain real-time FEEDBACK CONTROL for the actual optical test signal that is provided to selected imageing sensor.Carried out above-mentioned explanation with respect to luminous intensity as an exemplary character of optical test signal.But any one of the optical test signal that is produced by irradiation source or a plurality of character are such as frequency, wavelength, polarity, phase place, modulation etc., Be Controlled and compensation similarly.
And the use of one or more stored contingency table only is a kind of exemplary instrumentation, by it, can provide one or more fiducial values (or reference signal) to be used for feedback control loop.In this, term " value " and " signal " can use when they relate to benchmark and feedback function interchangeably because the one of ordinary skilled in the art recognize can be from the signal value of drawing, and can be worth signal from one or more.
Fig. 7 A and 7B are the flow charts of illustrative methods of the operation of the exemplary optics testing apparatus 100 of general introduction.Described method of operation is applied to the wafer scale optic test of imageing sensor.With the intensity of the optical test signal that applied character as feedback controlled.
Referring to the flow chart of Fig. 7 A and illustrating of Fig. 2, described illustrative methods begins (S10) in supposing that the checking list that can be competent at has been prepared and has been stored in (S11) in the database 144.Described contingency table can be taked many forms (for example various data structures or data file), comprises the form at the checking list shown in Fig. 5 500 as example.
Then, according to one or more reference data values of in contingency table, storing, in optical testing device 100, limit and be provided with the optical test signal character (S12) of expectation.Described " setting " process can comprise: read fiducial value from memory, perhaps receive fiducial value from external source (for example managing the central computer system of manufacturing facility), be provided with to luminous intensity by controller 141 then and write the reference data value in the device 142.
The optical test signal character that use limits and is provided with in control unit 140 can provide the Control and Feedback signal to operating unit 1 30, and this operating unit 130 provides input signal and control signal to irradiation source 120 then.Under the influence of these " control " signals, irradiation source 120 irradiation benchmark image transducers 112 (S13).
Can use traditional technology (for example sampling) to obtain value of feedback then from optical feedback signal.In case obtain, then value of feedback compared with the fiducial value that for example in luminous intensity storage is set in the device 142.This relatively can be carried out to determine the potential difference (S15) between value of feedback and set fiducial value by controller 141 or compensator 143.Can in feedback loop, use this difference then or not have difference, to limit the further operation of optical testing device 100.
If determined differences in materials (difference that is higher than the threshold value that is limited), then can upgrade (for example in memory, rewriteeing) contingency table project (perhaps project set) (S21) according to determined difference.Then, according to the fiducial value of the renewal of storing in contingency table, the Control and Feedback signal of renewal can be defined and be applied to operating unit 130, so that adjust (perhaps compensation) optical test signal (S22) by irradiation source 120 outputs.After compensation, irradiation source 120 shines benchmark image transducer 112 (S13) once more, and described method of operation turns back to graphic main execution route in Fig. 7 A.
Can repeat the compensation feedback loop that provides by described illustrative methods, up to the character of having verified optical test signal.Merit attention, described compensation feedback loop can be repeated repeatedly explicitly with a plurality of character of optical test signal.That is,, can compensate some other character through compensation feedback loop for the second time for the first time through the compensation feedback loop intensity of compensate for optical test signal as required.
Return Fig. 7 A, if do not determine the differences in materials (S15) between value of feedback and the benchmark value of setting, then use described optical test signal to shine the selected tested imageing sensor (S16) of wanting, and carry out one or more optic tests (S17) explicitly with optical test signal.Therefore, carry out optic test,, and considered by the feedback mechanism that is provided because the actual nature of optical test signal (for example intensity) is known with very high confidence level.
According to the quantized result (S18) of optic test, other imageing sensor can be discarded as unacceptable (S20), perhaps other imageing sensor continues to carry out (S19) to encapsulation in making processing.
The flow chart of Fig. 7 B is similar to 7A's very much, shines imageing sensor except not carrying out the checking loop of returning by shining benchmark image transducer (S13) once more and drawing the value of feedback (S14) of the optical feedback signal that is compensated once more of step.But, when the difference of determining between value of feedback and benchmark setting (S15), carry out compensation process (S21 and S22), then irradiation and testing image sensor (S16 and S17).This alternative method of operating optical testing apparatus 100 more effective slightly (being the cost less time), but uncertain slightly on its result, because before optical test signal is actually used in test, after compensation, do not verify optical test signal.
Can use therein such as the programmable device of computer based system or programmable logic and realize among the various embodiment of above-mentioned device feature and/or method, should be understood that and to use various programming languages such as " C ", " C++ ", " FORTRAN ", " Pascal ", " VHDL " etc. known or later exploitation to realize above-mentioned apparatus and method.
Therefore, various mediums, such as magnetic computer disks, CD, electronic memory etc., can be prepared and comprise following information, described information is by the adaptive normal controller spare that guides such as computer, with realized above-mentioned function and/or some or all of method in combination by the adaptive device that throws the optical test signal that can be competent at.In case program and data that the visit of such normal controller spare comprises on described medium, then it can carry out above-mentioned function and/or some or all of method step.
For example, if the computer disks that comprises such as proper procedures such as source file, file destination, executable file and data message is provided to computer, then described computer can receive described information, suitably dispose itself, and carry out the above-mentioned many functions that belong to control unit 140 and operating unit 130, and be implemented in the method for summarizing in above-mentioned diagram and the flow chart.In this, the function of operating unit 130 and control unit 140 can be contained in common hardware/software platform.
Many feature and advantage of the present invention are apparent from above-mentioned explanation.Be intended to appended claim and contain all such feature and advantage that fall within the scope of the present invention.And, because those skilled in the art can easily carry out multiple modification and change, therefore do not expect to limit the invention to the precision architecture and the operation of institute's diagram and explanation.But modification that all are such and equivalents fall into scope of the present invention.
The application requires the priority of the korean patent application of submitting on January 9th, 2006 2006-0002296 number and the korean patent application of submitting on March 9th, 2006 2006-0022314 number, and it discloses and is included in this by integral body by reference.
Claims (37)
1. an optical testing device is configured to testing image sensor, comprising:
Irradiation source, by the adaptive optical test signal that produces, described optical test signal has the character that limits explicitly with control signal with changing;
Detecting card, by the adaptive selected imageing sensor that makes optical test signal be sent to by exposure aperture and form on the wafer that is associated with described detecting card, described detecting card comprises the benchmark image transducer, it is provided with near described exposure aperture, and is produced optical feedback signal by adaptive in response to described optical test signal;
Control unit is received this optical feedback signal by adaptive, and produces the Control and Feedback signal in response to optical feedback signal; And
Operating unit is received described Control and Feedback signal by adaptive, and produces control signal.
2. according to the testing apparatus of claim 1, wherein, described detecting card also comprises electric probe, and it is by the adaptive electric sheet that is associated with selected imageing sensor that connects, with convenient to/from selected imageing sensor communications test control and data signal under test.
3. according to the testing apparatus of claim 1, wherein, described benchmark image transducer comprises a plurality of benchmark image transducers, and it is provided with near exposure aperture.
4. according to the testing apparatus of claim 1, wherein, described irradiation source comprises:
Light source is by adaptive next luminous;
Aperture is by the adaptive light that optionally passes through;
Wherein, described control signal is by the adaptive size that changes aperture, so that the intensity of optical test signal changes along with the size of aperture.
5. according to the testing apparatus of claim 4, wherein, described control signal comprises control signal that is applied to aperture and the input signal that is applied to light source.
6. according to the testing apparatus of claim 5, wherein, described input signal is a fixed voltage.
7. according to the testing apparatus of claim 5, wherein, described input signal is a variable voltage, by the adaptive intensity of further controlling light source.
8. according to the testing apparatus of claim 4, wherein, described irradiation source also comprises a plurality of lens, by the adaptive light that comes collimation to be passed through by aperture, so that described optical test signal comprises directional light.
9. according to the testing apparatus of claim 4, wherein, described irradiation source also comprises a plurality of optical filters, by the adaptive light that is sent by light source that filters.
10. according to the testing apparatus of claim 1, wherein, described control unit comprises database, and by the adaptive contingency table of storing, described contingency table comprises a plurality of fiducial values, and each fiducial value is corresponding to the change in the qualitative qualification of optical test signal.
11. according to the testing apparatus of claim 10, wherein, the character of described optical test signal comprises at least one of intensity, frequency, wavelength, polarity and modulation.
12. according to the testing apparatus of claim 10, wherein, described control unit also comprises:
Controller is by the adaptive database that visits; And
Compensator by adaptive next comparison in response to value of feedback that draws from optical feedback signal and fiducial value, and produces feedback control signal.
13. according to the testing apparatus of claim 12, wherein, described compensator comprises digital comparator, analog comparator or one of the software routines moved on described controller.
14. the testing apparatus according to claim 1 also comprises:
Transducer is received the simulated optical feedback signal by adaptive from the benchmark image transducer, described simulated optical feedback signal is converted to the digit optical feedback signal, and provides the digit optical feedback signal to control unit.
15. an optical testing device is configured to testing image sensor, comprising:
Irradiation source, provided optical test signal by detecting card to imageing sensor by adaptive, described optical test signal has the character that is limited by the feedback loop that forms with changing between benchmark image transducer that is associated with described detecting card and control unit, described control unit is connected between described benchmark image transducer and this irradiation source.
16. according to the testing apparatus of claim 15, wherein, described benchmark image transducer is produced optical feedback signal by adaptive in response to optical test signal, and wherein, described control unit comprises:
Controller is by the adaptive next feedback control signal that produces in response to optical feedback signal; And
Operating unit is produced control signal by adaptive in response to described feedback control signal, and wherein, described control signal is applied to irradiation source, to change the character of described optical test signal.
17. according to the testing apparatus of claim 16, wherein, the character of described optical test signal is intensity.
18. the method for the imageing sensor that a test forms on wafer, wherein, described wafer is associated with detecting card, with convenient to/from described imageing sensor communications test control and data signal under test, and test described imageing sensor explicitly with optical test signal, wherein, described method comprises:
The benchmark image transducer that uses described optical test signal to be radiated to be provided with on the detecting card; And
Change the character of described optical test signal in response to the optical feedback signal that produces by the benchmark image transducer.
19. according to the method for claim 18, wherein, the character of described optical test signal is intensity, and described method also comprises:
Optical feedback signal is compared with fiducial value, and according to the described control signal that relatively produces; And
Apply described control signal to the irradiation source that produces described optical test signal.
20. the method according to claim 19 also comprises:
The contingency table of Memory Reference value in memory;
From contingency table selection reference value, and produce control signal explicitly with selected fiducial value.
21. the method according to claim 20 also comprises:
In response to the comparison of optical feedback signal and described fiducial value, and in contingency table, rewrite fiducial value.
22. the method for an operating optical testing apparatus, described optical testing device is being tested a plurality of imageing sensors that form by adaptive on wafer on the wafer scale, and described method comprises:
Control is by the adaptive operation that produces the irradiation source of optical test signal, and described optical test signal has the character that limits explicitly with the contingency table fiducial value data of storing in memory;
With the detecting card that the is associated with wafer character of detection optical test signal explicitly, and produce corresponding optical feedback signal;
Described optical feedback signal is compared with at least one fiducial value in described contingency table, and in contingency table, rewrite at least one fiducial value in response to described comparison.
23., wherein, detect the character of described optical test signal by the benchmark image transducer that has an essence similar configuration with described a plurality of imageing sensors according to the method for claim 22; And
Wherein, described benchmark image transducer is disposed on the detecting card, so that described optical test signal shines selected one of described benchmark image transducer and described a plurality of imageing sensors simultaneously.
24. the method according to claim 22 also comprises:
After in checking list, rewriteeing described at least one fiducial value, with optical test signal described a plurality of imageing sensors of optic test explicitly.
25. according to the method for claim 22, wherein, the control operation of described irradiation source comprises:
Produce control signal explicitly with at least one fiducial value in contingency table; And
Apply control signal to the light source in irradiation source, to change the character of ground control optical test signal.
26. the method for an operating optical testing apparatus, described optical testing device is by the adaptive a plurality of imageing sensors that form on wafer of testing, and described method comprises:
In memory, limit a plurality of fiducial values;
Use optical test signal to shine selected imageing sensor in these a plurality of transducers by detecting card, described optical test signal has the character that limits explicitly with a plurality of fiducial values with changing;
Generation is corresponding to the value of feedback of the optical test signal of the selected imageing sensor of irradiation;
Described value of feedback is compared with one of described a plurality of fiducial values, to determine difference;
After determining difference, in memory, limit at least one of described a plurality of fiducial values again, and the fiducial value that at least one limits again with this compensate for optical test signal explicitly; And
With the optical test signal selected imageing sensor of optic test explicitly.
27. according to the method for claim 26, wherein, the selected imageing sensor of optic test follows closely after the compensate for optical test signal.
28. according to the method for claim 26, wherein, before the selected imageing sensor of optic test, described method also comprises:
Produce the value of feedback of renewal explicitly with the optical test signal of this compensation, and at least one of the value of feedback that will upgrade and described a plurality of fiducial values compare, to determine difference; And then
Only determining when the value of feedback of this renewal and described a plurality of fiducial values described do not have difference between at least one the selected imageing sensor of optic test.
29., wherein, produce value of feedback and comprise according to the method for claim 26:
In the benchmark image transducer that is associated with detecting card, receive optical test signal; And
Draw described value of feedback from described optical feedback signal.
30. according to the method for claim 29, wherein, described character is intensity, and described method also comprises:
Produce control signal explicitly with at least one of described a plurality of fiducial values, and described control signal is applied to irradiation source, described irradiation source is produced optical test signal by adaptive with the intensity that changes with control signal.
31. program, be configured to control the operation of optical testing device, described optical testing device is configured to test a plurality of imageing sensors that are positioned on the wafer explicitly with optical test signal, described optical test signal is passed in selected imageing sensor in described a plurality of transducer by the detecting card that is associated with described wafer, described program with controller that described optical testing device is associated on can carry out, to realize a kind of method, described method comprises:
Control is by the adaptive operation that produces the irradiation source of optical test signal, and described optical test signal has the character that limits explicitly with the fiducial value of storing in memory, and described memory is associated with described controller;
With the detecting card character of detection optical test signal explicitly, and produce corresponding optical feedback signal;
Described optical feedback signal is compared with fiducial value, and limit described fiducial value again in response to described comparison.
32., wherein, detect the character of described optical test signal by the benchmark image transducer that has an essence similar configuration with described a plurality of imageing sensors according to the method for claim 31; And
Wherein, described benchmark image transducer is disposed on the detecting card, so that described optical test signal shines described benchmark image transducer and selected imageing sensor simultaneously.
33. the method according to claim 32 also comprises:
Behind qualified association table again, with optical test signal described a plurality of imageing sensors of optic test explicitly.
34. according to the method for claim 32, wherein, the control operation of irradiation source comprises:
Produce control signal explicitly with fiducial value;
Apply control signal to the light source in irradiation source, to change the character of ground control optical test signal;
Control irradiation device is to project optical test signal simultaneously on benchmark image transducer and the selected imageing sensor;
In the benchmark image transducer, produce optical feedback signal.
35. a detecting card, by adaptive next for use in testing for a plurality of imageing sensors that form on the wafer, described detecting card comprises:
Exposure aperture is sent to selected imageing sensor in these a plurality of imageing sensors by adaptive with optical test signal;
At least one benchmark image transducer is provided with near described exposure aperture, so that side by side shine described at least one benchmark image transducer with optical test signal and selected imageing sensor.
36. the detecting card according to claim 35 also comprises:
A plurality of electric probes extend from detecting card, and by the adaptive electric sheet that is associated with selected imageing sensor that connects.
37. detecting card according to claim 35, wherein, described at least one benchmark image transducer comprises a plurality of benchmark image transducers that spatially separate, described benchmark image transducer is disposed in around the exposure aperture, so that each of described a plurality of benchmark image transducers and selected imageing sensor are simultaneously with described optical test signal irradiation.
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| US11/486,106 US7408365B2 (en) | 2006-01-09 | 2006-07-14 | Image sensor testing method and apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW200731444A (en) | 2007-08-16 |
| JP2007208253A (en) | 2007-08-16 |
| TWI333254B (en) | 2010-11-11 |
| US20070159190A1 (en) | 2007-07-12 |
| KR20070074429A (en) | 2007-07-12 |
| KR100805834B1 (en) | 2008-02-21 |
| CN101000881B (en) | 2010-09-29 |
| US7408365B2 (en) | 2008-08-05 |
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