CN1008786B - The manufacture method of printed substrate - Google Patents
The manufacture method of printed substrateInfo
- Publication number
- CN1008786B CN1008786B CN 88101436 CN88101436A CN1008786B CN 1008786 B CN1008786 B CN 1008786B CN 88101436 CN88101436 CN 88101436 CN 88101436 A CN88101436 A CN 88101436A CN 1008786 B CN1008786 B CN 1008786B
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- Prior art keywords
- metal
- base plate
- chemical
- deposition
- chemical deposition
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Disclosure of the Invention produce the method for printed substrate with electroplating thicknessing.Its characteristics are, are depositing the metal level bar and after through-hole wall had deposited metal, the chemical deposition metal level bar of base plate one or both sides all was communicated with the through hole of chemical deposition metal with chemical deposition at backplate surface; One side with the base plate of metal in the chemical deposition combines with a conducting surface then, places as negative electrode and electroplates cotton, and the chemical deposition metal level bar of base plate another side is electroplated thickening.
Description
The present invention relates to produce the process of printed substrate.More particularly, the present invention relates to earlier on the insulating base surface, according to designed wiring board pattern, in the position that needs conducting metal, with conductive metal film on the no electrochemistry plated deposition, and then with electric plating method depositing metal layers on said conductive film, to produce the method for printed substrate.
So far, the most of printed substrate in the electronics industry all is the insulation board of hot pressing complex metal layer, through corrosion treatment, removes the method for part metals by pattern and manufactures.It is considered herein that the major defect of this method has, the utilance of metal is low; Base plate is yielding after eroding the part metals layer; Need macro-corrosion solution, so environmental impact is comparatively serious; Metallic conductor on the printed substrate can only be a kind of metal generally, is difficult to compound another kind of metal again; Metal during intensification on the wiring board is covering undercapacity, and easily heat disengaging during the weldering knot particularly through welding several times, is very easy to come off; In addition, can't cover metal, therefore cause the dry joint at element legs place easily at the hole of inserting element inwall.
In some nonmetallic materials, promptly on the insulating material, for example can plate on the plastics, directly adopt the method depositing metal layers of no electrochemistry plating, be known technology, and extensive use already.
But, up to now, industrially do not adopt direct plated metal method to produce printed substrate.The inventor thinks that this mainly is owing to also have following problems not to be resolved for a long time always.At first, the technology cost of electroless deposition metal is higher, and is if adopt the method for chemical plating to produce printed substrate fully, also uneconomical economically.Secondly, with regard to chemical plating itself, wanting only just to deposit the metal level that thicker, that the border is neat, as to be suitable as wiring board conduction slice uses with chemical plating, is inconvenient.This is because with electroless plating method plated metal slice the time, along with the carrying out of deposition reaction, during the enlarged in thickness of metal slice, its width also strengthens.Also, do not have to select with chemical plating the prior art of plated metal, therefore also need to solve this technical problem in view of the various insulating material of making wiring board in traditional being used to.At last, also has a very important problem, the pattern of the circuit of industrial actual needs is very complicated, often just need tens on the bar printing wiring board, very cause the disjunct each other conductive metal layer bar of hundreds of bar, with the method for no electrochemistry plating how could be in the position that needs deposition by design plated metal exactly, also be the technical issues that need to address; Can be reduced volume, need very thin metal level bar sometimes on the wiring board, need the distance between the conductive metal layer bar very near sometimes, satisfy the requirement of electric property aspect with the metal level bar of the method for chemical plating deposition, also be to need the problem that solves; After above-mentioned these problems all solve, also need to solve and how could continue the problem of plated metal with on the printed substrate that electric plating method is very complicated at figure, the conductive metal layer bar is not connected again each other.
Through studying for a long period of time, the inventor finds, adopts specific processing step just can solve above-mentioned all problems fully.Thereby can be used in the method for direct conductive metal deposition on the insulating base, manufacture printed substrate.Produce printed substrate in this way, cost is low; Save metal material; Wiring board can not be out of shape in the course of processing; The metal conductive strips border is neat, metal conducting layer combines with insulating base firmly, can not break away from when welding; The metallic copper of electroplating deposition, or silver, surperficial solderability is good, and can improve the soldering reliability between element and the printed wire at the hole of inserting element inwall plated metal; Owing to adopted the galvanoplastic plated metal, therefore can deposit any metal in the conducting metal appearance, this is to being used for HF link and itself with regard to having the printed substrate that patches a little very big benefit being arranged; In addition, the discharging waste liquid amount of this method is little, has reduced the influence to environment.
Therefore, first purpose of the present invention provides and adopts conventional chemical to plate used solution, first chemical deposition on insulating base, and then electroplating deposition conducting metal, the process of producing printed substrate.This process can be divided into two major parts, and its step separately is as follows.First is earlier with the insulating base surface coarsening of selecting for use; Accomplishing fluently need be at the through hole of inwall plated metal by design; With the conventional sensitizing solution that uses in the chemical plating, just reducing solution soaks; On the position that does not need plated metal on the base plate, apply protective finish; Activated solution with conventional in the chemical plating has just contained the catalytic action metal ion solution, soaks; At last it is placed chemical plating solution, up to the metal that has deposited desired thickness.Second portion, will be superimposed by a base plate and a conducting surface that first one step process is crossed, though be not communicated with mutually between the metal level bar of chemical deposition on each face of base plate, but metal level by the through-hole wall deposition, arbitrary metal level bar on each face is communicated with the metal that the aperture of another side deposits on every side, therefore after one side was superimposed with conducting surface, any plated metal on the another side also just all had been communicated with conducting surface; Again superimposed conducting surface and base plate are placed electroplating bath, as negative electrode, plated metal just can be continued in the energising back on the metal of the side that does not contact with conducting surface.
Second purpose of the present invention provides, and manufactures on the insulating base of wiring board in any commonly used being fit to, with chemical plating and the direct plated metal of electric plating method, to produce the method for printed substrate.
The 3rd purpose of the present invention provides, and electrically-conducting metal surface is coated with the production method of the printed substrate of other kind metal.
The 4th purpose of the present invention provides, and deposited the production method of the printed substrate of metal in the circuit board on the inwall in the hole of welding again behind the inserting element.
The 5th purpose of the present invention provides, and is fit to the production method of the printed substrate of pegging graft with complete machine.
The 6th purpose of the present invention provides, and applying or deposited on the insulating base of conductive materials by the detail of design of wiring board, continues plated metal on conductive materials with electric plating method, to produce the method for printed substrate.
In this specification and the appended claims, the meaning of used term is as mentioned below.
" printed substrate " is meant that insulating material is a base plate, a lot of bars are gone up on its surface compound conductive devices of disconnected conductiving metal strip each other.It is widely used for computer, electronic instrument, and television set, solid integrated circuit, and in the various electronic circuit product.
The meaning of " coating " speech is meant any method of using, certain material that can be attached to base plate is applied on the base plate, for example certain coating is printed on the base plate by detail of design with silk screen printing or offset printing, spray printing coating on base plate perhaps is coated with full photoactive coating earlier at backplate surface and is photo-etched into methods such as required pattern again.
" alligatoring " instigates insulating material surface roughening, just removes the surface-brightening film and handles." mechanical alligatoring " refers to make surface coarsening with the friction or the method for impacting, as abrasive lapping, with shaggy object pressure rolling etc." chemical roughen " refers to use the chemical reagent coarse surface.
" open-work " refers to that inserting element leg on the base plate penetrates the hole of printed substrate.
" sensitization processing " refers to any processing that makes backplate surface have reproducibility, as soaking with reducing solution." activation processing " refers to the mass treatment backplate surface that catalytic action is arranged, for example with the surface after the argentiferous ion solution processing sensitization.
" conducting surface " refers to the conducting surface of any material.As the wire side that fine wire is woven into, film conducting surface etc.
" protective layer " refers to general commonly used can cover coated position, and it is not contacted with liquid.For example, the coating of using in the etch, printing ink etc.
Hereinafter be described in detail the present invention.
Industrial, require printed substrate fire-retardant, the solderability of conductive layer is good, especially at the hole inwall of need insertion element welding, wishes also to deposit easy weldering metal, can reduce the dry joint rate greatly like this.Require conducting metal to combine with base plate firmly in addition, can heat not break away from during welding.Use method of the present invention, can produce the printed substrate that satisfies above-mentioned requirements fully.In concrete enforcement, should preferentially select for use fire-retardant, the base plate of good insulation preformance, as epoxy resin board phenolic resins plate, polyamide board etc. should be pointed out that method of the present invention almost can implement on any known insulating sheet material, never be limited to above-mentioned different materials.
Behind the selected base plate, at first punching, every hole inwall needs the hole of plated metal all will accomplish fluently in advance.And every strip metal conductive layer that will deposit will surround one at least and penetrate base plate, and inwall is wanted the hole of plated metal, and the position in hole should be very accurate, therefore preferably uses the mould punching.
Then, surperficial shiny film layer is removed on the surface of alligatoring base plate.Alligatoring is all wanted on the double-sided wiring board two sides, and the single face wiring board also is that the two sides alligatoring is better.Certainly also alligatoring one side only all, but around the aperture of another side, carry out roughening treatment.If the degree of roughness of the backplate surface of selecting for use is suitable, can certainly not carry out roughening treatment, in addition, also can punch after the first alligatoring.In general, the hole inwall does not need alligatoring.Certainly, some insulating material is arranged also, do not need alligatoring.
The method of alligatoring is a lot, should at first select solvent alligatoring and chemical roughen method for use.For the material that is difficult to these two kinds of method alligatoring, can only use mechanical roughening method.After wishing alligatoring, concave-convex surface change to be wanted greatly, and the distance between concavo-convex is little, and alligatoring is just wanted carefully, and is close.Therefore, during the abrasion alligatoring, should select finer abrasive for use.After the alligatoring, backplate surface be cleaned up.
As long as can make backplate surface that reproducibility is arranged, any known sensitization processing method all can be used in the method for the invention.From considering economically, better with the Bivalent Tin sensitization.For making all fully sensitizations of concave-convex surface place, can in Bivalent Tin solution, add the sensitization auxiliary agent, the composition that wherein mainly works is a surfactant.It is the simplest method for sensitizing that base plate after the alligatoring is put into directly that sensitized solution dips.After base plate took out from sensitizing solution, the available water rinsing was to remove the surfactant that is not adsorbed onto on the base plate.Should select the easiest surfactant that is adsorbed for use according to baseboard material.
After base plate after the alligatoring dried up, can be armor coated.The method that applies is a lot, as can printing, but spray printing.Also can all apply photosensitive composition photoetching again.As long as the design of pressing printed substrate will not need the guarded by location of plated metal firmly to get final product on the base plate.Being coated with the material that is covered with should be to later activation processing and the not influence of chemical plating solutions employed.Material commonly used is a printing ink, can with screen printing technique printing ink be printed on the base plate simply.The definition of printing has determined the definition of wiring board, also with regard to the spacing of conducting metal on base plate and the width of conductiving metal strip.When making single side printed wiring board, should be noted that at the base plate another side and want the aperture of plated metal should stay next little garden on every side at each inwall, not armor coated, to deposit metal, the conductive junction point during as plating at these places, little gardens later on.But certain contact Any shape is as long as be communicated with metal on the inwall of hole.
Identical in the plating of activation processing and traditional chemical.But during owing to chemical plating, need not deposit too thick metal, in other words, the purpose of chemical plating only is to provide necessary conductive metal film when electroplating.Therefore, as long as chemistry is plated to the continuous metal film.Like this, for economy, just there is no need to make too dense precious metal ion activating solution.Silver ion is more satisfactory activation effective ingredient.Sometimes also can save the activation processing step, perhaps activation processing and chemical plating are finished simultaneously.
After the activation processing, can soak chemical plating.Do not have electrochemical deposition at non-metal material surface, extensive use need not to be described in detail herein again.The chemical plating fluid of any routine is all in the method for the invention available, but for economy, first-selected is chemical bronze plating liquid.Slightly have any different with the conventional chemical plating, this step of the present invention does not need to deposit too thick metal level, but wishes that the metal of deposition is careful evenly, forms the continuous conduction film, therefore, can select the lower chemical plating fluid of concentration for use.
In addition, before activation processing, base plate has applied protective layer according to detail of design, and therefore, activation processing and chemical plating all only work in the position that does not have to apply.So the base plate after the chemical plating has been the wiring board that has the conducting metal of required pattern just, just the thickness low LCL of conductive metal layer is not suitable for actual needs.Also be appreciated that, at this moment, also deposited metal, and the metal on the inwall of hole is connected one by one with the metal on base plate two sides at previously described hole inwall.
On the section of border, printing coated protective layer is difficulty relatively around the base plate.Can on section, not apply at coating step yet.On printed substrate, also need the through hole of no metal on the inwall sometimes.Therefore, can or immerse before electroplating before the chemical plating fluid, adopt the die-cut method of mould to cut away the limit of base plate and go out the open-work that inwall does not need plated metal.Certainly this step also can in the end be carried out, but can slightly increase cost like this.
One plane electric conductor is flattened on the base plate that chemical plating has been crossed, the metal that has deposited on the base plate directly contacts with planar conductor, like this, by giving the metal on the hole inwall of accomplishing fluently earlier, just the metal with any chemical deposition on the base plate is communicated with planar conductor.Put into electroplating bath when the base plate that will make up like this and planar conductor, during as negative electrode, on any chemical deposition metal film of base plate another side, all can continue electrodeposit metals, up to required thickness.Obtain at last, the hole inwall also electro-deposition the wiring board of metal.Planar conductor is attached to another side.Electroplate once more, just can obtain double-sided wiring board.
Certainly, can any metal of plating with plating step.For example, can first copper facing, the surface is silver-plated more then, can be fit to the wiring board that high frequency uses.In the situation that wiring board need be plugged on the complete machine, also can design plugging position in the circuit board, at electroplating work procedure, wear-resisting grafting metal on plugging position is electroplated.
Because the metal of chemical deposition and insulating material surface are that machinery is compound, therefore as long as the concavo-convex degree on insulating material surface is suitable, alligatoring just suitable, can both be with the method plated metal of chemical plating on nearly all common insulating material, that is to say, can both be as the base plate of producing printed substrate by method of the present invention.And plated metal and bottom plate combined intensity are enough to satisfy the requirement of using as wiring board.Compare with the lamination copperclad plate, significantly benefit is that the internal stress between depositing metal layers and base plate is little, still keeps higher binding strength in welding temperature.
In processing step of the present invention, armor coated, promptly print the step of protective layer and must after sensitization is handled, carry out.This be because, if printing before sensitization is handled then on the protective layer that does not need plated metal, also may deposit metal, the result, clear at the bonding jumper obscure boundary that the position that needs plated metal deposits, even cause short circuit.Certainly, printing the protective layer step sometimes also can carry out after activation processing.
In view of the expense of electroplating deposition metal well below chemical plating, therefore, should be as far as possible the amount of electroless deposition metal be controlled to minimum.As long as it is the film that is enough to conduct electricity in the chemical deposition just should stop chemical plating, and thicken depositing metal layers with galvanoplastic, the most economical so.In addition, the metal boundary of electroplating deposition is neat, surface-brightening, and solderability is good, and is therefore in the metal that is deposited, big more with the ratio of electroplating deposition, and the easy more width true-to-size plated metal bar that obtains is worthwhile more economically.
From the narration of front as can be seen, in the technical process of production printed substrate of the present invention, make the metal conducting one by one that deposits on the base plate two sides by the metal that is deposited on the through-hole wall, and then with a conducting surface and the one side of base plate superimposed make on the another side all each other each plated metal bar that do not communicate all with the conducting surface conducting, electroplate, this is one of important technology feature of the present invention again.Therefore, have required conduction pattern on any one side that adopts earlier other technology to make insulating base, and by open-work and another side conducting, the re-plating plated metal with the method for production wiring board all within the scope of the present invention.Example with practical value is that when bus was thick in the circuit board, the method for available first printing conductive glue re-plating was produced wiring board.Conduction problem during plating can solve with being full of conducting resinl in the open-work or being used in the method for inserting electric conductor in all holes that need conduct electricity from the back side in advance.To some insulating material, can find the very strong conducting resinl of adhesion strength, because the cost of printing conductive glue is very low, therefore,, be worth adopting for the not high wiring board of quality requirement.
Provide following embodiment to be intended to further specify method of the present invention, certainly do not have the present invention to be only limited to this meaning.
Embodiment 1
0.2 centimetre of epoxy laminate of 30 cm x, 10 cm x, promptly general printed substrate base plate, with No. zero sand paper intersect destroy the surface-brightening film after, with 1.8 millimeters drill bits, 2.5 millimeters drill bits are beaten a lot of open-works with 3 centimetres spacing onboard.Dry after plate cleaned up.
Prepare every liter and contain 2 gram sodium alkyl sulfonates, 30 milliliter 36% hydrochloric acid and 25 gram SnCl
22H
2The sensitizing solution of O.Base plate after will drying then soaked 1 minute in this room temperature sensitizing solution, took out the back and used rinsed with deionized water, dried again.
On the base plate after the sensitization, dip in the printing ink of color printing plastic film with the pen of drawing and scribble.All scribble on the plate two sides, a simulate press wiring board stays 0.5 millimeter, and 1 millimeter, 2 millimeters and the wide fillet of 5 millimeter are not coated with, and the garden ring that stays about 5 mm dias around the aperture is not coated with.Every the fillet that stays all links to each other with the garden ring that is not coated with around the hole at least.To be coated with full printing ink between the fillet.On the another side, just stay the garden ring around the aperture and be not coated with.
After drying, place the activating solution of room temperature to soak 1 minute the base plate after scribbling.Contain 2 gram AgNO in every liter of activating solution
3, 150 milliliter 95% ethanol and be enough to make the last fully transparent ammoniacal liquor of solution.After from activating solution, taking out base plate, can see that the part of inking does not darken.After the rinsing, place chemical plating fluid to soak.
Contain 30 gram Na in the chemical plating fluid
2The EDTA(sodium ethylene diamine tetracetate), 10 gram CuSO
47H
2O, 0.2 gram dodecyl sodium sulfate, 15 milliliter 35% the formaldehyde that just adds before 10 gram NaOH and the use.Soaked 45 minutes under the room temperature, take out the back as seen, all do not deposited one deck copper film in the position of inking, comprise that the inwall of open-work has also deposited copper film at all.Measure with avometer 10 Ohmic resistance shelves, the resistance between every copper layer fillet that links to each other by the garden ring of copper on the open-work inwall and another side encircles with little garden is zero.
Use the thinnest commercially available sift flour screen cloth as conducting surface, the screen cloth of 30 centimetres of 10 cm x is overlapping with the one side that is not coated with around the aperture just, the online soft rubber pad that covers one deck 3 millimeters thick, cover the plastic plate of one 3 millimeters thick on the rubber slab again, plastic plate and base plate are clamped, the negative pole of storage battery is received in wiring from the screen cloth.Anode links to each other with some copper plates, folder after copper plate and the chemical plating is gone up the base plate of conducting surface and is put into a container together, and copper sulphate electroplate liquid and copper brightener are arranged in the container.Switch on after 15 minutes, as seen all deposited the thicker bright copper of one deck above the copper film fillet with electroless deposition earlier, and also deposit upward bright copper on the inwall of hole at all.
Embodiment 2
Phenolic sheet with 0.2 centimetre of 10 cm x, 30 cm x is made base plate, repeats the experiment of example 1.But, this time be that the two-sided printed substrate of simulation is scribbled, all stay 0.5 millimeter on the base plate two sides exactly, 1 millimeter, 2 millimeters and the wide fillet of 5 millimeter do not apply.All stay little garden ring around the aperture on two sides and be not coated with, and the garden ring is communicated with fillet.
During plating earlier on the one side in office the sheet copper of superimposed 50 micron thickness as conducting surface; After having plated one side, copper coin is laminated on the another side, plates the one side of original superimposed copper coin again.The result obtains the simulate press wiring board that bright copper is all electroplated on the two sides, and any flat copper on every passes through all also that inwall copper layer is communicated with the copper layer bar of another side.
Embodiment 3
The polyfluortetraethylene plate of 0.2 centimetre of about 5 cm x, 10 cm x has been used in experiment.Method and the step same have been taked with example 1.Also obtained copper combine with base plate must be more firm fritter analog line plate.
Embodiment 4
By the pattern among the standard GB 4588.1-4588.2-84, on epoxy laminate, adopt the step same with example 2, made a two-sided simulation wiring board.Except manual not too rule of scribbling, all meet the requirements.
Embodiment 5
By the pattern among the standard GB 4588.1-4588.2-84, on phenolic sheet, adopt with the same step of example 1 and made a single face analog line plate.Except manual not too rule of scribbling with have several bars that do not surround open-work do not electroplate, all meet the requirements.
Claims (4)
1, on general insulating material base plate, earlier with no electrochemistry plating, the re-plating conductive metal deposition, the method for producing printed substrate comprises the steps:
(1) with chemical reagent or mechanical means alligatoring backplate surface;
(2) according to the design of wiring board, on base plate, beat the through hole that inwall needs plated metal;
(3) sensitizing solution that the base plate that has openning hole is placed the conventional chemical plating use carries out sensitization and handles;
(4), on the backplate surface that sensitization was handled, do not need the position of plated metal armor coated according to the design of wiring board;
(5) armor coated base plate is placed conventional chemical successively
Carry out activation processing and chemical deposition in activating solution that uses and the chemical plating fluid, there not being armor coated position plated metal, after chemical deposition, on the wiring board any metal level bar all with the through hole electric connection;
It is characterized in that:
(6) will be in the chemical deposition one side of the base plate of metal superimposed with a conducting surface, place electroplating bath as cloudy plate, energising continues the electroplating deposition metal on the metal level bar of any chemical deposition of base plate another side.
2, method according to claim 1, but it is characterized in that used backplate surface is the material of direct chemical deposition, and save the alligatoring step.
3, method according to claim 1 is characterized in that said armor coated step carried out before chemical deposition metal after the activation processing.
4, method according to claim 1, it is characterized in that only accomplishing fluently the through hole that needs the inwall plated metal by design with mould in punch out step, and immediately following one more after the activation processing or after being right after chemical deposition with the mould side cut with beat the step that inwall does not need the hole of plated metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 88101436 CN1008786B (en) | 1988-03-23 | 1988-03-23 | The manufacture method of printed substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 88101436 CN1008786B (en) | 1988-03-23 | 1988-03-23 | The manufacture method of printed substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1035930A CN1035930A (en) | 1989-09-27 |
| CN1008786B true CN1008786B (en) | 1990-07-11 |
Family
ID=4831748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 88101436 Expired CN1008786B (en) | 1988-03-23 | 1988-03-23 | The manufacture method of printed substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1008786B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101476124B (en) * | 2008-11-24 | 2012-07-04 | 番禺得意精密电子工业有限公司 | Film coating method and structure of insulation material |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102400192A (en) * | 2011-11-10 | 2012-04-04 | 深南电路有限公司 | Method for electroplating gold to circuit boards |
| CN104681907B (en) * | 2015-02-09 | 2017-11-21 | 中国电子科技集团公司第二十三研究所 | Overall teflon insulation electroplate outer conductor radio-frequency cable and processing method |
| CN114828417A (en) * | 2022-04-22 | 2022-07-29 | 深圳运嘉科技有限公司 | Coarsening process for mold forming, three-dimensional circuit and electronic equipment |
-
1988
- 1988-03-23 CN CN 88101436 patent/CN1008786B/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101476124B (en) * | 2008-11-24 | 2012-07-04 | 番禺得意精密电子工业有限公司 | Film coating method and structure of insulation material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1035930A (en) | 1989-09-27 |
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