CN100591198C - Light communication apparatus - Google Patents
Light communication apparatus Download PDFInfo
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- CN100591198C CN100591198C CN200810104181A CN200810104181A CN100591198C CN 100591198 C CN100591198 C CN 100591198C CN 200810104181 A CN200810104181 A CN 200810104181A CN 200810104181 A CN200810104181 A CN 200810104181A CN 100591198 C CN100591198 C CN 100591198C
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Abstract
The embodiment of the invention provides an optical transmission device, including a pcb, the pcb includes a top layer, a first insulation layer, a ground layer, a second insulation layer and a signallayer overlapped in turns, the surface of the top layer is provided with an optical module and a receiving chip which are electrically connected by difference signal transmission line, characterizedin that the ground layer includes a first ground block and a second ground block, an insulation block is provide between the first ground block and the second ground block, the first insulation layeris provided with a first via hole ensuring the top layer electrically connect with the first ground block and the second ground block respectively, the signal layer includes a first signal block and asecond signal block, a conductive block is provided between the first signal block and the second signal block, the second insulation layer is provided with a second via hole ensuring the conductiveblock electrically connect with the first ground block and the second ground block. The optical transmission device provided by the embodiment of the invention reduces the attenuation of high-frequency signal in the optical transmission device, improving the transmission quality of signal.
Description
Technical field
The present invention relates to optical transport technology, especially a kind of light transmitting device.
Background technology
In communication system, usually adopt the differential signal transmission high-speed serial signals, as shown in Figure 1, be the differential signal schematic diagram of prior art transmission, the amplitude of the differential signal that transmits in two differential signal transmission is identical, phase place is opposite, and the main track of definition is labeled as "+", the negative wire of definition is labeled as "-", wherein, abscissa express time (t), ordinate are represented voltage (V).
Light transmitting device at present commonly used comprise printed circuit board (print circuit board, hereinafter to be referred as: PCB) and optical module.Printed circuit board generally comprises dielectric layer, signal/plane layer.Wherein, signal/plane layer has conduction property, is made of copper usually.Dielectric layer is made of megohmite insulant, therefore, also is insulating barrier.On the top layer of printed circuit board (also being top layer), can place transmission line and some devices, for example: optical module, receiving chip etc.Transmission line is for connecting the interconnection line between the device that is provided with on the printed circuit board, and in existing communication system, the impedance that generally requires differential signal transmission is 100 ohm, otherwise signal can reflect.The impedance of differential signal transmission is mainly by W, S, H and dielectric material decision, wherein, W is the live width of differential signal transmission, and S is the edge distance of two differential signal transmission, H be differential signal transmission arrive ground wire (Ground, hereinafter to be referred as: GND) layer between distance.When W became big, impedance diminished; When H became big, it is big that impedance becomes; When S became big, it is big that impedance becomes, and S increases the interference free performance that can reduce differential signal simultaneously.
Along with the transmission rate of signal is more and more higher, the decay of signal on printed circuit board is also more and more severe.As shown in Figure 2, the schematic diagram of signal frequency and attenuation relation during for employing prior art light transmitting device, wherein, abscissa is represented signal frequency, ordinate is represented signal attenuation.This light transmitting device uses under the situation of 10,000,000,000 optical module interfaces, Transmission bit rate has reached 10 gigabit/sec (Gbit/S), and signal frequency has reached 5GHz, is 100 ohm in the impedance of top layer differential signal transmission, live width is 5 mils (mil), that is: 5 * 10
-3Inch, spacing is 6mil, when line length is 6000mil, decay on the printed circuit board has reached 5.5 decibels (dB), and along with the rising of frequency, decay also increases gradually, had a strong impact on signal transfer quality, correctly received and identification to the received signal thereby influenced receiving terminal.When signal frequency was 15GHz, the decay of signal was greater than 12dB.Wherein, the decay of high-frequency signal has two parts: a part is the loss on the transmission line, this loss is mainly due to due to the skin effect, under the effect of skin effect, electric current only is distributed in the surf zone near the transmission line of reference planes, and reference planes wherein are generally the plane of ground wire, also promptly: the GND plane, as shown in Figure 3, be the CURRENT DISTRIBUTION schematic diagram under the effect of prior art skin effect, this Fig. 3 shows the CURRENT DISTRIBUTION on the printed circuit board cross section.As shown in Figure 4, be the current direction schematic diagram under the effect of prior art skin effect, this Fig. 4 shows the CURRENT DISTRIBUTION on the printed circuit board section.As shown in Figure 4, electric current sends from transmitting terminal, and the process transmission line arrives the receiver of the transmission line other end, and then gets back to transmitting terminal through ground plane, forms a complete loop.By Fig. 3 and Fig. 4 as can be known, because the characteristic of high-frequency signal is to move ahead along the minimum path of inductance, electric current mainly is distributed in the transmission line near the surface of ground plane, and like this area of current loop is less, and corresponding inductance is also less.Another part is the dielectric loss in the printed circuit board, and this dielectric loss is that portion of energy enters insulating barrier because signal is uploaded sowing time at transmission line, thereby makes due to insulating barrier heating is consumed.
According to prior art, as if the dielectric loss that will reduce in the printed circuit board, need to adopt special medium, for example: high frequency sheet material, that is: can reduce the sheet material of high-frequency loss, and use this special media will inevitably increase the cost of printed circuit board.
Summary of the invention
Embodiment of the invention technical problem to be solved is: reduce the decay of light transmitting device medium-high frequency signal, improve signal transfer quality.
For solving the problems of the technologies described above, a kind of light transmitting device that the embodiment of the invention provides, comprise printed circuit board, described printed circuit board comprises the folded successively top layer of establishing, first insulating barrier, ground plane, second insulating barrier and signals layer, the surface of described top layer is provided with optical module and the receiving chip that is electrically connected by differential signal transmission, it is characterized in that, described ground plane comprises the first ground wire piece and the second ground wire piece, be provided with collets between the first ground wire piece and the second ground wire piece, first insulating barrier is provided with first via hole that top layer is electrically connected with the first ground wire piece and the second ground wire piece respectively, described signals layer comprises first block and secondary signal piece, be provided with conducting block between first block and the secondary signal piece, described second insulating barrier is provided with described conducting block is electrically connected with the first ground wire piece, and second via hole that conducting block is electrically connected with the second ground wire piece.
In the light transmitting device that the embodiment of the invention provides, the ground plane middle part is provided with collets, like this, high-frequency signal can be along receiving chip, differential signal transmission, first via hole, the first ground wire piece, second via hole, conducting block, second via hole, the second ground wire piece, the current circuit transmission that first via hole and optical module form, compare with existing light transmitting device, increased the distance between differential signal transmission and the reference planes, when other condition is constant, can increase the transmission live width, thereby the current delivery area in the increase differential signal transmission, reduce the loss that differential signal transmission causes owing to skin effect, improve the transmission quality of high-frequency signal.
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Description of drawings
Fig. 1 is the differential signal schematic diagram of prior art transmission;
The schematic diagram of signal frequency and attenuation relation when Fig. 2 is employing prior art light transmitting device;
Fig. 3 is the CURRENT DISTRIBUTION schematic diagram under the effect of prior art skin effect;
Fig. 4 is the current direction schematic diagram under the effect of prior art skin effect;
Fig. 5 is a stepped construction schematic diagram of prior art printed circuit board;
Fig. 6 is the structural representation of light transmitting device embodiment of the present invention;
Fig. 7 for light transmitting device A-A of the present invention to profile;
Fig. 8 for light transmitting device B-B of the present invention to profile;
Fig. 9 is a vertical view of ground plane in the light transmitting device of the present invention;
Figure 10 is another vertical view of ground plane in the light transmitting device of the present invention;
The schematic diagram of high-frequency signal frequency and attenuation relation when Figure 11 is employing embodiment of the invention light transmitting device.
Description of reference numerals:
The 10-top layer 11-first insulating barrier 111-first via hole
The 12-ground plane 121-first ground wire piece 122-second ground wire piece
The 123-collets 13-second insulating barrier 131-second via hole
The 14-signals layer 141-first block 142-secondary signal piece
143-conducting block 20-differential signal transmission 21-optical module
The 22-receiving chip
Embodiment
Generally, use the printed circuit board in the light transmitting device of 10,000,000,000 optical modules to have at least more than 4 layers, as shown in Figure 5, a stepped construction schematic diagram for the prior art printed circuit board, wherein preceding 3 layers is respectively top (TOP) layer, ground plane and signal (L3) layer, be provided with first insulating barrier between top layer and the ground plane, be provided with second insulating barrier between ground plane and the signals layer.Wherein, top layer is the top layer of printed circuit board, is used to arrange transmission line and places the optical module that is used to carry out opto-electronic conversion, the devices such as receiving chip that are used to carry out data transmit-receive, and this top layer is a conductive articles, is generally copper product.Specifically can be a monoblock copper sheet, also can be only used for being welded on pad on the printed circuit board being positioned at devices such as transmission line on the top layer, optical module, receiving chip.Ground plane is the second layer of printed circuit board, is mainly used in distribution GND signal conductor material, and the GND signal conductor material that uses is mainly the plane copper sheet at present; Signals layer is the 3rd layer of printed circuit board, is mainly used in the layout transmission line, the power supply or the GND signal of the part that also can distribute.The transmission line of top layer and signals layer all will be with reference to ground plane.W is the live width of differential signal transmission, and S is the edge distance of two differential signal transmission, and H1 is the differential signal of transmission in the top layer transmission line and the distance between the ground plane, and H2 is the distance between ground plane and the signals layer.When W became big, impedance diminished; When H1 became big, it is big that impedance becomes; When S became big, it is big that impedance becomes.
In printed circuit plate structure shown in Figure 5, if need be with single differential signal transmission impedance Control at 50 ohm, and in 100 ohm of the impedance Control of differential signal transmission, then the line width values of top layer transmission line should be between 4-6mil, in this live width scope, can reach the manufacturability and the better balance point of saving area of printed circuit board, but in this live width scope, because skin effect makes that the loss on the differential signal transmission is bigger.Why skin effect can cause loss of signal, is because the area of current delivery has reduced in the differential signal transmission cross section, wherein has only sub-fraction to have electric current to pass through, and sees also Fig. 3.Anyway increase the thickness of differential signal transmission, because skin effect, electric current only is distributed in the surf zone of close reference planes in the differential signal transmission, and the thickness that increases differential signal transmission can not reduce because the loss on the transmission line that skin effect causes.
In the light transmitting device that the embodiment of the invention provides, reduce to use the decay of the light transmitting device medium-high frequency signal of 10,000,000,000 optical modules by increasing distance between differential signal transmission and the reference planes, reduce the loss of high-frequency signal on transmission line, optimize the high-frequency signal transmission quality, effectively ensure correct reception and the identification of receiving terminal high-frequency signal.
As shown in Figure 6, be the structural representation of light transmitting device embodiment of the present invention, Fig. 7 be this light transmitting device A-A to profile, Fig. 8 be this light transmitting device B-B to profile.Please be simultaneously referring to Fig. 6-Fig. 8.The sectional view of the light transmitting device embodiment that the embodiment of the invention provides, comprise printed circuit board, it comprises the folded successively top layer of establishing 10, first insulating barrier 11, ground plane 12, second insulating barrier 13 and signals layer 14, the surface of first insulating barrier 11 is provided with the optical module 21 and receiving chip 22 that is electrically connected by differential signal transmission 20, ground plane 12 comprises the first ground wire piece 121 and the second ground wire piece 122, be provided with collets 123 between the first ground wire piece 121 and the second ground wire piece 122, first insulating barrier 11 is provided with first via hole 111 that top layer 10 is electrically connected with the first ground wire piece 121 and the second ground wire piece 122 respectively, signals layer 14 comprises first block 141 and secondary signal piece 142, being provided with conducting block 143, the second insulating barriers 13 between first block 141 and the secondary signal piece 142 is provided with conducting block 143 is electrically connected with the first ground wire piece 121, and second via hole 131 that conducting block 143 is electrically connected with the second ground wire piece 142.
The light transmitting device that the above embodiment of the present invention provides is compared with existing light transmitting device, be provided with collets at the ground plane middle part, in signals layer, be provided with conducting block, like this, high-frequency signal can be along receiving chip, differential signal transmission, first via hole, the first ground wire piece, second via hole, conducting block, second via hole, the second ground wire piece, the current circuit transmission that first via hole and optical module form, compare with existing light transmitting device, increased the distance between differential signal transmission and the reference planes, when other condition is constant, can increase the transmission live width, thereby the current delivery area in the increase differential signal transmission, reduce the loss that differential signal transmission causes owing to skin effect, improve the transmission quality of high-frequency signal.
In light transmitting device provided by the invention, collets 123 can be through holes, that is: the first ground wire piece 121 is not connected with the second ground wire piece 122, as shown in Figure 9, in this case, ground plane vertical view in the light transmitting device.
In addition, the first ground wire piece 121 also can be connected with the second ground wire piece 122, as shown in figure 10, in this case, ground plane vertical view in the light transmitting device.Light transmitting device shown in Figure 6 is the structural representation of the specific embodiment that the first ground wire piece 121 is connected with the second ground wire piece 122.In this case, suppose: the length of differential signal transmission is L, distance between conducting block 143 and the differential signal transmission 21 is D, because the upper surface of first insulating barrier 11 can be provided with top layer, so this distance also is the distance between signals layer 14 and the top layer, first ground wire piece 121 in the ground plane 12 or the beeline between the second ground wire piece 122 and the differential signal transmission 21 are N, area S1=L * the D of the total loop of referential high frequency signal signals layer 14 then, the total loop area of referential high frequency signal ground plane 12 is S2=L * N, among this embodiment, collets 123 in differential signal transmission 21 live width directions enough big in the ground plane 12 apart from K, make D＜N, in this case, the area of referential high frequency signal signals layer 14 is just smaller, and the inductance of current circuit is also smaller.Because high-frequency signal is always along the transmission of the minimum path of total inductance, high-frequency signal is just with the conducting block 143 of reference signal layer 14.
Can being expressed as of the impedance of differential signal transmission
Wherein, C is the capacitance of unit length on the differential signal transmission,
Wherein, P is a constant, and E is the dielectric constant of differential signal transmission medium, and by dielectric material decision, D is the distance between differential signal transmission and the reference planes, M be between unit length differential signal transmission and the reference planes over against area.The light transmitting device that the above embodiment of the present invention provides has increased the distance D between differential signal transmission and the reference planes, makes that the electric capacity on the unit length has reduced, and has then increased the impedance on the differential signal transmission.Make difference transmission lines keep 100 ohm impedance, just need to increase between differential signal transmission and the reference planes over against area, that is: increase the width of differential signal transmission, this will increase the current delivery area in the differential signal transmission, thereby reduces differential signal transmission because the loss that skin effect causes.Particularly, when the impedance of difference transmission lines is 100 ohm, the live width of differential signal transmission can be increased to 4mil～25mil by 4 original～6mil, for example: 20mil, this will significantly reduce the loss of high-frequency signal on differential signal transmission.
Further, in order further to reduce the loss that differential signal transmission causes owing to skin effect, can also further increase the live width of differential signal transmission, also can adopt the distance D between alternate manner increase differential signal transmission and the reference planes, for example: the thickness that increases by first insulating barrier 11 and/or second insulating barrier 13.
In addition, in the light transmitting device of the embodiment of the invention, printed circuit board 1 can be for more than four layers, and top layer 10, ground plane 12 and signals layer 14 are respectively the ground floor, the second layer of printed circuit board 1 and the 3rd layer, the 4th layer can be random layer, is provided with insulating barrier between signals layer 14 and the 4th layer.If printed circuit board 1 is four layers, then the 4th layer is the bottom of printed circuit board 1.
In any one embodiment of the present invention, the top layer in the printed circuit board, first block 141 and/or secondary signal piece 142 can be copper products.The first ground wire piece 121, the second ground wire piece 122 and/or conducting block 143 can be ground signal conductor goods, particularly, can be copper products, or perhaps copper sheet.
In light transmitting device embodiment shown in Figure 6, only show three group of first via hole 111 and second via hole 131, in addition, first via hole 111 and second via hole 131 can be other the many arbitrarily groups more than two groups.And first via hole 111 and second via hole 131 can be for being wholely set, that is: the two is realized by same via hole.
The light transmitting device that the embodiment of the invention provides is particularly useful for the transmission of high-frequency signal, and as another embodiment of the present invention, the Transmission bit rate of above-mentioned optical module 21 can be more than or equal to 10Gbit/s.
As shown in figure 11, when adopting the light transmitting device that the embodiment of the invention provides, the schematic diagram of high-frequency signal frequency and attenuation relation, wherein, abscissa is represented signal frequency, ordinate is represented signal attenuation.In this light transmitting device embodiment, the optical transmission baud rate is 10Gbit/S, the impedance of differential signal transmission is 100 ohm, live width is 20mil, spacing is 6mil, and line length is 6000mil, compares with the light transmitting device that Fig. 2 adopts, the live width of the differential signal transmission that Fig. 7 adopts is 20mil, and other condition is identical.As shown in Figure 7, when the frequency of high-frequency signal was 5GHz, the decay on the PCB only was 3 several dB, has reduced about 2dB than Fig. 2 decay under equal conditions, reduces 36% approximately.
It should be noted last that: above embodiment is only in order to illustrating technical scheme of the present invention, but not the present invention is made restrictive sense.Although the present invention is had been described in detail with reference to above-mentioned preferred embodiment, those of ordinary skill in the art is to be understood that: it still can make amendment or be equal to replacement technical scheme of the present invention, and this modification or be equal to the spirit and scope that replacement does not break away from technical solution of the present invention.
Claims (10)
1, a kind of light transmitting device, comprise printed circuit board, described printed circuit board comprises the folded successively top layer of establishing, first insulating barrier, ground plane, second insulating barrier and signals layer, the surface of described top layer is provided with optical module and the receiving chip that is electrically connected by differential signal transmission, it is characterized in that, described ground plane comprises the first ground wire piece and the second ground wire piece, be provided with collets between the first ground wire piece and the second ground wire piece, first insulating barrier is provided with first via hole that top layer is electrically connected with the first ground wire piece and the second ground wire piece respectively, described signals layer comprises first block and secondary signal piece, be provided with conducting block between first block and the secondary signal piece, described second insulating barrier is provided with described conducting block is electrically connected with the first ground wire piece, and second via hole that conducting block is electrically connected with the second ground wire piece.
2, light transmitting device according to claim 1 is characterized in that, described collets are through hole.
3, light transmitting device according to claim 1, it is characterized in that, the described first ground wire piece is connected with the described second ground wire piece, and the distance between described conducting block and the described differential signal transmission is less than the beeline between the described first ground wire piece or the second ground wire piece and the described differential signal transmission.
4, according to claim 1,2 or 3 described light transmitting devices, it is characterized in that, described printed circuit board is more than four layers, described top layer, described ground plane and described signals layer are respectively the ground floor, the second layer of described printed circuit board and the 3rd layer, are provided with the 3rd insulating barrier between the 4th layer of described signals layer and described printed circuit board.
According to claim 1,2 or 3 described light transmitting devices, it is characterized in that 5, any one in described first block and the described secondary signal piece or two are copper product;
In the described first ground wire piece, the described second ground wire piece and the described conducting block any one or a plurality of be ground signal conductor goods.
6, light transmitting device according to claim 5 is characterized in that, described ground signal conductor goods are copper product.
According to claim 1,2 or 3 described light transmitting devices, it is characterized in that 7, described first via hole and described second via hole are more than two groups.
8, according to claim 1,2 or 3 described light transmitting devices, it is characterized in that the Transmission bit rate of described optical module is more than or equal to 10G bps.
9, light transmitting device according to claim 8 is characterized in that, the impedance of described differential signal transmission is 100 ohm, and the live width of described differential signal transmission is 4 * 10
-3Inch～25 * 10
-3Inch.
10, light transmitting device according to claim 9 is characterized in that, the impedance of described differential signal transmission is 100 ohm, and the live width of described differential signal transmission is 20 * 10
-3Inch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810104181A CN100591198C (en) | 2008-04-16 | 2008-04-16 | Light communication apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810104181A CN100591198C (en) | 2008-04-16 | 2008-04-16 | Light communication apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101277593A CN101277593A (en) | 2008-10-01 |
| CN100591198C true CN100591198C (en) | 2010-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810104181A Active CN100591198C (en) | 2008-04-16 | 2008-04-16 | Light communication apparatus |
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| CN (1) | CN100591198C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102346222B (en) * | 2011-06-09 | 2013-09-18 | 迈普通信技术股份有限公司 | Device, system and method for testing output electrical signals of optical interfaces |
| CN111447724A (en) * | 2019-12-16 | 2020-07-24 | 瑞声科技(新加坡)有限公司 | Transmission line |
| CN113946019B (en) * | 2020-07-15 | 2022-11-29 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN111511097B (en) * | 2020-06-18 | 2020-12-29 | 深圳市欧博凯科技有限公司 | High-speed transmission optical module circuit board structure and manufacturing method thereof and crosstalk prevention method |
| CN115023026B (en) * | 2021-10-27 | 2023-04-14 | 荣耀终端有限公司 | Circuit board and electronic device |
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2008
- 2008-04-16 CN CN200810104181A patent/CN100591198C/en active Active
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| CN101277593A (en) | 2008-10-01 |
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Owner name: BEIJING Z-GOOD TECHNOLOGY SERVICE CO., LTD. Free format text: FORMER OWNER: BEIJING XINGWANG RUIJIE NETWORK TECHNOLOGIES CO., LTD. Effective date: 20140813 |
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Application publication date: 20081001 Assignee: Beijing Xingwang Ruijie Network Technologies Co., Ltd. Assignor: BEIJING ZHIGU TECHNOLOGY SERVICES CO., LTD. Contract record no.: 2014990000854 Denomination of invention: Three-D installed element, its mfg. method and optical transmission device Granted publication date: 20100217 License type: Common License Record date: 20141105 |
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