CN100587938C - Basal plate carrying table and basal plate processing device - Google Patents
Basal plate carrying table and basal plate processing device Download PDFInfo
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- CN100587938C CN100587938C CN200710089462A CN200710089462A CN100587938C CN 100587938 C CN100587938 C CN 100587938C CN 200710089462 A CN200710089462 A CN 200710089462A CN 200710089462 A CN200710089462 A CN 200710089462A CN 100587938 C CN100587938 C CN 100587938C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Condensed Matter Physics & Semiconductors (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The invention provides a basal plate carrying table, which is difficult to generate uneven treatment at the corresponding position of the trough hole of the lifting pin of the loading bench body on performing plasma treatment of basal plate. On plasma treatment, the base plate loading bench (4) of loading base plate (G) comprises: loading bench body(4a), and lifting pin (30) for plumb inserting trough the loading bench body(4a) and supporting the base plate by the front end thereof to make the base plate lift. At least the front end of the lifting pin (30) is electroconductive, and the liftingpin (30) can retreat to retreating position in the loading bench body(4a) when plasma treatment, and protrude from the loading bench body to support the supporting position of the supporting base plate. The adjustment is performed at the retreating position to make the height position of the front end below the back of the base plate (G) by 70~130 mu m.
Description
Technical field
The present invention relates to carry out in the substrate board treatment of processing such as dry ecthing the substrate board treatment of the substrate-placing platform of mounting substrate and this substrate-placing platform of application in container handling at substrates such as the glass substrate of liquid crystal indicator flat-panel monitors such as (LCD) (FPD) being made usefulness, semiconductor wafers.
Background technology
For example, in FPD or semi-conductive manufacturing process, glass substrate or semiconductor wafer as processed substrate are carried out dry ecthing, sputter, CVD various processing such as (chemical vapor-phase growings).
Such processing is for example carried out under the state on the substrate-placing platform that substrate-placing is being arranged in the chamber.Substrate is undertaken by a plurality of lifter pin liftings that substrate-placing platform is had with respect to the loading and unloading of substrate-placing platform.That is, when mounting substrate,, the substrate that is positioned on the carrying arm is transferred on the pin, and lifter pin is descended making under the lifter pin state outstanding from the surface of mounting table body.In addition, when unloading carried base board, from the state of substrate-placing on the mounting table body, lifter pin is risen, thereby substrate is risen from the mounting table body surface, under this state, substrate is transferred to carrying arm.Such technology is a conventional techniques, and is for example open in patent documentation 1.
Be that the glass substrate trend that the FPD of representative uses maximizes with LCD, require to surpass such huge substrate of 2m on one side, to utilize lifter pin to support under the situation of such large substrate, as in the past during the periphery of supporting substrate, glass substrate can produce bending, might be able to not carry out loading and unloading accurately, therefore have to lifter pin also is set at the central portion of substrate to substrate.Therefore, the central portion at glass substrate also is provided with lifter pin.
, carry out at the glass substrate that FPD is used disposing pair of parallel plate electrode (upper and lower electrode) under the situation of Etaching device of plasma etching in chamber, substrate-placing platform works as lower electrode.In such lower electrode, be provided with under the situation of lifter pin at the central portion at glass substrate as described above, viewpoint from the inner evenness that improves etch processes, the pin that uses conductivity is as lifter pin, and to make itself and lower electrode be same potential, thereby guarantee the uniformity of etch processes.
[patent documentation 1] spy opens flat 11-340208 communique
Yet, insulating properties substrates such as glass substrate and quartz base plate are being carried out under the situation of the such plasma treatment of plasma etching, with be formed at substrate-placing platform in the corresponding part of inserting hole of lifter pin, the electromagnetic field in sheath (sheath) zone is inhomogeneous, distinguish that thus the etch-rate of position is different with other parts directly over the hole of lifter pin.This is the main cause that the result can produce etch residue etc.
Summary of the invention
The present invention In view of the foregoing makes, its objective is provides a kind of when substrate is carried out plasma treatment, is difficult to produce the plasma processing apparatus of handling uneven substrate-placing platform and having such substrate-placing platform in the position corresponding with the inserting hole of the lifter pin of mounting table body.
In order to address the above problem, a first aspect of the present invention provides a kind of substrate-placing platform, it is characterized in that for the substrate-placing platform of mounting substrate in the container handling of the plasma processing apparatus that substrate is carried out plasma treatment, comprising: the mounting table body; With vertical insert logical above-mentioned mounting table body, to be provided with respect to the outstanding mode free lifting ground that submerges, the surface of above-mentioned mounting table body, with its front end supporting substrate so that a plurality of lifter pins of substrate elevating, wherein, at least the leading section of above-mentioned lifter pin is a conductivity, and, when can being located at plasma treatment, keeps out of the way above-mentioned lifter pin to the intrinsic retreating position of above-mentioned mounting table, with the Support Position of giving prominence to from above-mentioned mounting table body with supporting substrate, when being positioned at above-mentioned retreating position, adjust, make the height and position of its front end be below apart from the back side 70～130 μ m of substrate.
In above-mentioned first aspect, preferred above-mentioned lifter pin and above-mentioned mounting table body are same potential.
A second aspect of the present invention provides a kind of substrate-placing platform, it is mounting substrate in the container handling of the plasma processing apparatus that substrate is carried out plasma treatment and the substrate-placing platform that works as lower electrode, it is characterized in that, comprising: the mounting table body; With vertical insert logical above-mentioned mounting table body, to be provided with respect to the outstanding mode free lifting ground that submerges, the surface of above-mentioned mounting table body, with its front end supporting substrate so that a plurality of lifter pins of substrate elevating, wherein, when can being located at plasma treatment, keeps out of the way above-mentioned lifter pin to the intrinsic retreating position of above-mentioned mounting table, with the Support Position of giving prominence to from above-mentioned mounting table body with supporting substrate, and second lifter pin more than 1 that comprises the central part of a plurality of first lifter pins of periphery of supporting substrate and supporting substrate, at least the leading section of above-mentioned second lifter pin is a conductivity, when above-mentioned second lifter pin is positioned at above-mentioned retreating position, adjust, make the height and position of its front end be below apart from the back side 70～130 μ m of substrate.
In above-mentioned second aspect, preferred above-mentioned second lifter pin and above-mentioned mounting table body are same potential.In addition, in above-mentioned second aspect, preferably also comprise the control part of the lifting of controlling above-mentioned first lifter pin and above-mentioned second lifter pin independently.
In the invention of above-mentioned first aspect or second aspect, be the insulating properties substrate, so effective especially by the substrate of mounting.In addition, in above-mentioned first aspect or second aspect, preferably also comprise the height and position adjusting mechanism of the height and position of adjusting above-mentioned lifter pin.In addition, can constitute: have a plurality of protuberances that are made of insulator on the surface of above-mentioned mounting table body, substrate is positioned on this protuberance.In addition, can constitute: supply with the High frequency power that plasma generates usefulness to above-mentioned mounting table body.In addition, can constitute: above-mentioned mounting table body is configured in the container handling by the dividing plate (spacer) that is made of insulating element, make and between the diapire of above-mentioned mounting table body and above-mentioned container handling, form the space, making above-mentioned space is air atmosphere, utilizes the bolt that connects above-mentioned space that above-mentioned mounting table body is fixed on the diapire of above-mentioned container handling.
A third aspect of the present invention provides a kind of substrate board treatment, and it is for carrying out the plasma processing apparatus of plasma treatment to substrate, and it comprises: the container handling of accommodating substrate; Be arranged in the above-mentioned container handling substrate-placing platform of mounting substrate; In above-mentioned container handling, supply with the processing gas supply mechanism of handling gas; To carrying out the exhaust gear of exhaust in the above-mentioned container handling; Generate mechanism with the plasma that in above-mentioned process chamber, generates the plasma of handling gas, it is characterized in that the aforesaid substrate mounting table has the structure of above-mentioned first aspect or second aspect.
In the above-mentioned third aspect, above-mentioned plasma generates mechanism and can comprise: the aforesaid substrate mounting table that works as lower electrode; The upper electrode that is oppositely arranged with substrate-placing platform; With the high frequency electric source that applies High frequency power to substrate-placing platform.
According to the present invention, substrate is carried out a plurality of lifter pins of having in the substrate-placing platform of plasma processing apparatus of plasma treatment, at least its leading section is a conductivity, when when it is located at plasma treatment, keeping out of the way to the intrinsic retreating position of above-mentioned mounting table, adjust, make the height and position of its front end be below apart from substrate back 70～130 μ m, therefore, the inhomogeneous of in sheath (sheath) zone of the part corresponding electromagnetic field can be eliminated, thereby uniform plasma treatment can be carried out with the hole of lifter pin.
In addition, because when plasma treatment, handle inhomogeneous what become problem is the central portion of substrate, so, as long as second aspect, second lifter pin more than 1 that is divided into the central part of a plurality of first lifter pins of periphery of supporting substrate and supporting substrate, and second lifter pin carried out aforesaid Height Adjustment, just can carry out uniform plasma treatment, can reduce the number of the lifter pin that carries out Height Adjustment, thereby alleviate the work of adjusting operation.
Description of drawings
Fig. 1 is that expression is provided with the sectional view as the plasma-etching apparatus of an example of processing unit as the pedestal of the substrate-placing platform of an embodiment of the invention.
Fig. 2 is the plane graph of configuration that is used for illustrating the lifter pin of pedestal.
Fig. 3 is that the sectional view of expression is amplified on the top of the pedestal when lifter pin is positioned at retreating position.
Fig. 4 amplifies the sectional view of expression with the part of height and position adjusting mechanism that comprises the lifter pin of pedestal.
Fig. 5 is that expression is used to make peripheral lifter pin and the central lifter pin schematic diagram of the mechanism of lifting independently.
The schematic diagram of the height and position of the lifter pin when Fig. 6 is the etch processes of representing in the past.
Fig. 7 is the figure of configuration that is illustrated in the central lifter pin of the device that the experiment that is used for showing effect of the present invention uses.
Symbol description
1 plasma-etching apparatus
2 chambers (container handling)
4 pedestals (substrate-placing platform)
4a base body (mounting table body)
5 base materials
The 5a protuberance
6 insulating elements
7 dividing plates (spacer) parts
11 shower nozzles (gas feed unit)
20 exhaust apparatus
25a high frequency electric source (plasma generation unit)
30 lifter pins
30a periphery lifter pin
30b central authorities lifter pin
35 lower pin
40 support components
44 bellowss
50 height and position adjusting mechanisms
The G glass substrate
Embodiment
Below, with reference to accompanying drawing, embodiments of the present invention are described.Fig. 1 is that expression is provided with the sectional view as the plasma-etching apparatus of an example of processing unit as the pedestal of the substrate-placing platform of an embodiment of the invention.This plasma Etaching device 1 for to FPD with the sectional view that glass substrate G carries out the device of predetermined processing, constitute capacitive coupling type parallel flat plasma-etching apparatus.At this, as FPD, but illustration LCD (LCD), light-emitting diode (LED) display, electroluminescence (Electro Luminescence; EL) display, fluorescent display tube (Vacuum Fluorescent Display; VFD), plasma display (PDP) etc.
This plasma Etaching device 1 has the aluminium chamber 2 that constitute, that be configured as the square tube shape of being handled (anodized) by for example surface through pellumina.
Bottom in this chamber 2 is provided with as being used for the pedestal 4 of mounting as the substrate-placing platform of the glass substrate G of processed substrate.This pedestal 4 comprises: base body 4a; Be used to carry out a plurality of lifter pins 30 of glass substrate G with respect to the loading and unloading of base body 4a.
The supply lines 23 that is used for supply high frequency electric power is connected with base body 4a.This supply lines 23 is from branching into supply lines 23a and 23b midway, and adaptation 24a is connected with supply lines 23a with the high frequency electric source 25a that plasma generates usefulness, and adaptation 24b is connected with supply lines 23b with the high frequency electric source 25b that bias voltage generates usefulness.The frequency that plasma generates the high frequency electric source 25a of usefulness is the scope of 10～100MHz, for example is 13.56MHz.The high frequency electric source 25b that bias voltage generates usefulness is used for ion is introduced base body 4a, and the frequency of 50kHz～10MHz scope that frequency of utilization is lower than the high frequency electric source 25a of plasma generation usefulness for example is 3.2MHz.
Above said base 4, with the pedestal 4 parallel shower nozzles 11 that work as upper electrode that relatively are provided with.Shower nozzle 11 is supported on the top of chamber 2, has inner space 12 in inside, and, on the face relative, be formed with a plurality of squit holes 13 that gas is handled in ejection with pedestal 4.This shower nozzle 11 is grounded, and constitutes the pair of parallel plate electrode with pedestal 4.
Be provided with gas introduction port 14 above the shower nozzle 11, handle gas supply pipe 15 and be connected, handle gas supply source 18 and be connected with this processing gas supply pipe 15 with mass flow controller 17 by valve 16 with this gas introduction port 14.Supply with the processing gas that etching is used from handling gas supply source 18.As handling gas, can use halogen is gas, O
2Normally used gas in this field such as gas, Ar gas.
Be formed with blast pipe 19 in the bottom of above-mentioned chamber 2, exhaust apparatus 20 is connected with this blast pipe 19.Exhaust apparatus 20 comprises turbomolecular pump equal vacuum pump, can will be evacuated to the reduced atmosphere of regulation in the chamber 2 thus.In addition, the sidewall of chamber 2 is provided with substrate and moves into and take out of mouthfuls 21 and this substrate moved into take out of mouthful 21 gate valves that open and close 22, under the state that this gate valve 22 is opened, and adjacent load locking room (not shown) between conveyance substrate G.
Then, except Fig. 1,, the pedestal 4 as the substrate-placing platform of an embodiment of the invention is described also with reference to Fig. 2～4.Fig. 2 is the plane graph of configuration that is used for illustrating the lifter pin of pedestal 4, the sectional view of expression is amplified on the top of the pedestal 4 of Fig. 3 when lifter pin is positioned at retreating position, and Fig. 4 amplifies the sectional view of expression for the part of the height and position adjusting mechanism of the lifter pin that will comprise pedestal 4.
As mentioned above, this pedestal 4 comprises base body 4a and a plurality of lifter pin 30, and base body 4a comprises metal base material 5 and is arranged on the insulating element 6 of the periphery of base material 5.In addition, lifter pin 30 is made of conductive material, typically constitute by metal, as shown in Figure 2, be divided into the peripheral lifter pin 30a and the central lifter pin 30b of the periphery of support glass substrate G, the long limit of peripheral lifter pin 30a base body 4a is provided with 3, and minor face is provided with 2, add up to be provided with 10, central lifter pin 30b is provided with 3 at central portion.But the number of lifter pin is not limited thereto, and according to the size of processed substrate, best number is set suitably.
Shown in 1 figure, on the diapire 2a of chamber 2, be provided with the partition component 7 that constitutes by insulator in the mode corresponding with the periphery of base body 4a, base body 4a mounting is thereon.Seal airtightly between partition component 7 and the diapire 2a and between partition component 7 and the base body 4a, between base body 4a and diapire 2a, form the space 31 of air atmosphere.Utilize this space 31 to realize air insulation.In diapire 2a, be embedded with a plurality of insulating elements 32 that constitute by insulators such as potteries, utilize a plurality of bolts 33 in the through hole of vertical ground, the center setting be inserted in these a plurality of insulating elements 32 respectively, diapire 2a and base body 4a are fixed.By utilizing bolt 33 that diapire 2a and base body 4a are fixed like this, be retained as vacuum in the chamber 2, can prevent base body 4a bending.
On base body 4a, be on the surface of base material 5, be overshooting shape ground and be formed with a plurality of protuberance 5a that constitute by dielectric substance, these protuberances 5a is insulated the state that parts 6 surround around being in.The upper surface of the upper surface of insulating element 6 and protuberance 5a is an equal height, and under situation about glass substrate G being positioned on the base body 4a, it is in the upper surface state of contact with the upper surface and the protuberance 5a of insulating element 6.In addition, as shown in Figure 3, under protuberance 5a, be formed with by the thin dielectric layer 5b that constitutes with the same dielectric substance of protuberance 5a.
As shown in Figure 3, the leading section of lifter pin 30 is inserted and lead to the inserting hole 5c that is provided with in the base material 5 of base body 4a.Utilize not shown driving mechanism to carry out lifting, when plasma etching, as shown in Figure 3, be positioned at the retreating position of the base body 4a that submerges, when loading and unloading glass substrate G, be positioned at Support Position with the state support glass substrate G that gives prominence to upward from the surface of base body 4a.
During retreating position when lifter pin 30 is positioned at plasma etching, as shown in Figure 3, carry out Height Adjustment, make the height and position of its front end be position apart from the back side 70～130 μ m of glass substrate G.By carrying out Height Adjustment like this, in the time of can eliminating plasma etching, the electromagnetic field in the sheath zone of position is inhomogeneous directly over the inserting hole 5c.
In addition, as shown in Figure 4, insert in the lower pin 35 bottom of lifter pin 30, and this lower pin 35 is made of conductive material, typically is made of metal material, and the lower end of lower pin 35 is supported on the support component 40 by screw clamp.Lower pin 35 is extended to the below of chamber 2 by the inserting hole 2b on the diapire 2a that is arranged on chamber 2, and support component 40 is positioned at the outside of chamber 2.Support component 40 comprises electroconductive component 41 that constitutes top and the insulating element 42 that is arranged under it.Between the electroconductive component 41 and base body 4a of support component 40, be provided with the bellows 44 of the conductivity that is used to interdict vacuum atmosphere and air atmosphere.Therefore, lifter pin 30 is by bellows 44 and electroconductive component 41, and 4a is electrically connected with base body, and they are retained as same potential.
As shown in Figure 4, below support component 40, be provided with the height and position adjusting mechanism 50 (at Fig. 4, only the height and position adjusting mechanism 50 of Graphic Center's lifter pin 30b) of the height and position that is used for adjusting lifter pin 30.This height and position adjusting mechanism 50 comprises: with support component 40 cards latch for printed circuit 51 only; The guiding parts 52 that on above-below direction, latch for printed circuit 51 is led; Be arranged on the substrate parts 53 of the below of latch for printed circuit 51; With insertion below substrate parts 53, its front end contacts with latch for printed circuit 51 and a plurality of adjustment screws 54 of being provided with.This height and position adjusting mechanism 50 can carry out the height and position adjustment of lifter pin in air atmosphere.In addition, reference marks 56 metal wire (wire) for being used to lifter pin 30 is moved between retreating position and Support Position, this metal wire 56 is connected with not shown driving mechanism.By utilizing drive mechanism metal wire 56, make lifter pin 30, lower pin 35 and support component 40 lifting integratedly.The location of height and position adjusting mechanism 50 is by adjusting and carry out adjusting screw 54 under the state that support component 40 and latch for printed circuit 51 cards are ended.
In lifter pin 30, peripheral lifter pin 30a and central lifter pin 30b can independent-liftings.Promptly, as shown in Figure 5, peripheral lifter pin 30a utilizes driving mechanism 60a, carries out lifting by metal wire 56, support component 40 and lower pin in the lump, the lifter pin 30b of central authorities utilizes driving mechanism 60b, carries out lifting by metal wire 56, support component 40 and lower pin in the lump.These driving mechanisms 60a, 60b for example, can make the lifting of peripheral lifter pin 30a and central lifter pin 30b regularly stagger by controller 61 controls.
The processing action of the plasma-etching apparatus 1 that constitutes so then, is described.
In advance, utilize height and position adjusting mechanism 50 to carry out the position adjustment of the lifter pin 30 of retreating position.Specifically, utilize driving mechanism to make support component 40 become the state that ends with latch for printed circuit 51 cards, adjust adjusting screw 54, so that latch for printed circuit 51 liftings, use amesdial etc. to adjust, make the height and position of front end of lifter pin 30 be upper surface 70～130 μ m apart from the protuberance 5a of base body 4a.
Under the state of the position adjustment of having carried out lifter pin 30 like this, at first, utilize not shown carrying arm, will be as the glass substrate G of processed substrate, never illustrated load locking room is moved into by substrate and to be taken out of mouthfuls 21, moves in the chamber 2, and be positioned on the base body 4a, promptly be positioned on the lip-deep protuberance 5a and insulating element 6 that constitutes by dielectric substance that is formed at base body 4a.In this case, make lifter pin 30 outstanding upward, the glass substrate G on the carrying arm is transferred on the lifter pin 30 to be located at the Support Position.Then, lifter pin 30 is descended, glass substrate G is positioned on the base body 4a.The lifting of the lifter pin 30 of this moment is in proper order: when rising, peripheral lifter pin 30a is risen earlier, postpone a little, central lifter pin 30b is risen.On the other hand, when descending, central lifter pin 30b is descended, postpone a little, peripheral lifter pin 30a is descended.Be about 0.5～2sec the time of delay of this moment.Like this, by glass substrate G being lifted from periphery, for example, even under the situation that glass substrate G and base body 4a are close to, substrate G is separated with base body 4a, thereby can prevent that glass substrate G from breaking.In addition, when descending, begin glass substrate G is positioned on the base body 4a from central portion, therefore, can mounting glass substrate G, and can not make substrate G have useless stress etc., the central portion of glass substrate G is produced and base body 4a between gap etc.
Then, closing gate valve 22 utilizes exhaust apparatus 20 to be evacuated to the specified vacuum degree in the chamber 2.Then, open valve 16, utilize mass flow controller 17 to adjust flow on one side, to handle the inner space 12 that gas imports shower nozzle 11 from handling gas supply source 18 by handling gas supply pipe 15 and gas introduction port 14 on one side, spray to substrate G equably by squit hole 13 again, regulate air displacement on one side, on one side chamber 2 internal controls are made as authorized pressure.
Under this state, pass through adaptation 24a from high frequency electric source 25a, apply the High frequency power that plasma generates usefulness to base body 4a, between as the pedestal 4 of lower electrode and shower nozzle 11, produce high-frequency electric field as upper electrode, generate the plasma of handling gas, utilize this plasma that glass substrate G is carried out etch processes.In addition, from high frequency electric source 25b,, apply the High frequency power that bias voltage generates usefulness to base body 4a by adaptation 24b.
When carrying out etch processes like this, in the past, as shown in Figure 6, the front position of lifter pin 30 was adjusted into the height roughly the same with the bottom surface of protuberance 5a.That is, because the height of protuberance 5a is to the maximum about 50 μ m, so the distance at the back side of the front end of lifter pin 30 and glass substrate G was below the 50 μ m in the past.But under this state, distinguish: the part corresponding with inserting hole 5c in the sheath zone above glass substrate G, it is inhomogeneous to generate an electromagnetic field.When the electromagnetic field that produces such sheath zone is inhomogeneous, the etch-rate of this part will be different with other parts, and the result can produce etch residue.Especially, in the insulated substrates such as glass substrate G of Shi Yonging, this trend is remarkable in the present embodiment.
Therefore, the inventor studies this point, and the result distinguishes that by adjusting the height and position of lifter pin 30, the electromagnetic field that can eliminate such sheath zone is inhomogeneous.Promptly, the sheath zone of the height article on plasma body of the front end of the lifter pin 30 of conductivity is influential, by making it highly for suitable height, the electromagnetic field size that can make position directly over the inserting hole 5c in sheath zone be same degree around it, thereby can carry out uniform etching.
If adjust, make the height and position of front end of lifter pin 30 be below apart from the back side 70～130 μ m of glass substrate G, perhaps, when the height of protuberance 5a is 50 μ m, make this height and position for the below of distance, then can suppress inhomogeneous by the inhomogeneous etching that causes of electromagnetic field as surface 20～80 μ m of the base body 4a of the bottom surface of protuberance 5a.When the height and position of the front end of lifter pin 30 during less than 70 μ m, directly over the inserting hole 5c of lifter pin 30 part than its peripheral part etching many, on the other hand, when this height and position surpasses 130 μ m, be difficult to etched on the contrary, part must be lacked than its peripheral part etching directly over the inserting hole 5c of lifter pin 30, all is difficult to carry out uniform etching.
In fact the Height Adjustment of such lifter pin will become the central lifter pin 30b particular importance of goods for the counterpart of anticipation glass substrate G.The position corresponding with peripheral lifter pin 30a can not become goods usually, therefore, for peripheral lifter pin 30a, not necessarily needs to carry out height and position adjustment as described above.Therefore, can be only carry out above-mentioned tight Height Adjustment like that, not carry out adjustment as described above, utilize easy method such as visual to carry out for peripheral lifter pin 30a to central lifter pin 30b.In this case, the number of the lifter pin that carries out Height Adjustment can be reduced, thereby the work of adjusting operation can be alleviated.
In addition, the prerequisite of the Height Adjustment of such lifter pin is that base body 4a can not produce distortion in fact.That is, when base body 4a can produce distortion, even carry out the position adjustment of lifter pin 30 accurately, the position of the front end of the back side of glass substrate G and lifter pin 30 also can change.The position adjustment of lifter pin 30 will become nonsensical.But glass substrate G maximizes, and accompanies therewith, base body 4a maximizes, and adopts air insulation to make air insulation between the diapire of base body 4a and chamber 2 as mentioned above, therefore, when vacuumizing in chamber 2, base body 4a is out of shape because of crooked easily.Therefore, in the present embodiment, diapire and the base body 4a with chamber 2 fixes with a plurality of bolts 33, the bending of base body 4a when preventing to vacuumize, thus carry out the location of lifter pin 30 effectively.
After carrying out etch processes like this, after stopping to apply High frequency power and stopping import to handle gas, the pressure in the chamber 2 are adjusted into the pressure of regulation from high frequency electric source 25, utilize lifter pin 30 to make glass substrate G rise to the Support Position.At this moment, as mentioned above, peripheral lifter pin 30a is risen, postpone a little, central lifter pin 30b is risen.Under this state, open gate valve 22, not shown carrying arm is inserted in the chamber 2, the glass substrate G that will be positioned on the lifter pin 30 is transferred on the carrying arm.Then, lifter pin 30 is descended.When this descends, central lifter pin 30b is descended, postpone a little, peripheral lifter pin is descended.On the other hand, be positioned in the glass substrate G on the carrying arm, move into by substrate and take out of mouth 21, in chamber 2, take out of to not shown load locking room.
The experiment of the effect of the height and position adjustment of confirming lifter pin of the present invention then, is described.
At this, dispose rectangular amorphous silicon substrate, feasible covering is positioned at 3 central lifter pin 30b (No.1, No.2, No.3) of plan position approach shown in Figure 7, change the height and position (test 1～4) of pin front end, carry out etching (etching of amorphous silicon) under the following conditions, carry out the affirmation (visual) of pin vestige and the mensuration of etch step poor (step difference of position and pin periphery directly over the pin inserting hole).In Fig. 7, the white central lifter pin of circle expression, the black peripheral lifter pin of circle expression.Rectangular periphery is provided with most of glass substrate that is covered by silicon nitride film.In addition, the pin periphery is the position of leaving the about 30mm of central point of central lifter pin.
Etching condition
Pressure:＜6.7Pa
High frequency power
Plasma generates with high frequency (13.56MHz)=18kW
Bias voltage generates with high frequency (3.2MHz)=7.5kW
Etching gas
Cl
2/SF
6＝6000/427mL/min(sccm)
Etching period: 20sec
Show the result in table 1.In table 1, utilizing the metewand of the visual pin vestige evaluation of carrying out to be: A---the pin vestige is dark, can find out; B---the pin vestige is shallow, but can find out; C---almost cannot see from the surface, can find out some D from the back side a little: do not sell vestige.
As shown in table 1, be arranged in the test 1,2 of the position lower than the position of the distance glass substrate G back side 130 μ m at the height and position of the front end of central lifter pin, the pin vestige mostly is " B " that can find out on the surface greatly, is the little trend of etch depth of part directly over the lifter pin, and the result is insufficient.On the other hand, height and position estimating in 3 at the front end of lifter pin 30 for 50 μ m (with the roughly the same height in the bottom surface of protuberance 5a) littler apart from substrate back than 70 μ m, etched trend is opposite, the etch depth of part is big directly over the lifter pin, and pin vestige existence evaluation " A ", the result is also insufficient.Relative therewith, the back side that is arranged in apart from glass substrate G at the height and position of the front end of central lifter pin is the test 4 of 100 μ m of scope of the present invention, being evaluated as of pin vestige " C～D ", and for well, the etch step difference is little value to-1.3～0.9nm.Confirmed effect of the present invention thus.
The present invention is not limited to above-mentioned execution mode, can carry out various distortion.
For example, in the above-described embodiment, illustrated substrate-placing platform of the present invention is applied to apply the example as the pedestal of lower electrode in the capacitive coupling type parallel flat plasma-etching apparatus of RIE type of High frequency power to lower electrode, but be not limited thereto, also can be applied to other plasma processing apparatus such as ashing, CVD film forming, also can be the type to upper electrode supply high frequency electric power, and be not limited to the capacitive coupling type, also can be the inductance coupling high type.
In addition, in the above-described embodiment, make lifter pin 30 by bellows 44 and base body 4a conducting, making them is same potential, but lifter pin 30 also can be (floating) state that floats.
In addition, in the above-described embodiment, the FPD that the uses insulating properties example of glass substrate G as processed substrate being described, but being not limited thereto, also can be other substrate.
Claims (12)
1. substrate-placing platform, it is characterized in that for the substrate-placing platform of mounting substrate in the container handling of the plasma processing apparatus that substrate is carried out plasma treatment, comprising:
The mounting table body; With
Insert logical described mounting table body vertical, with respect to the outstanding mode free lifting ground setting of submerging in the surface of described mounting table body, with its front end supporting substrate so that a plurality of lifter pins of described substrate elevating,
At least the leading section of described lifter pin is a conductivity, and, when can being located at plasma treatment, keeps out of the way described lifter pin to the intrinsic retreating position of described mounting table with from the outstanding Support Position of described mounting table body with supporting substrate, when being positioned at described retreating position, adjust, make the height and position of its front end be below apart from the back side 70～130 μ m of substrate.
2. substrate-placing platform as claimed in claim 1 is characterized in that:
Described lifter pin and described mounting table body are same potential.
3. substrate-placing platform, it is characterized in that for mounting substrate in the container handling of the plasma processing apparatus that substrate is carried out plasma treatment and the substrate-placing platform that works as lower electrode, comprising:
The mounting table body; With
Insert logical described mounting table body vertical, with respect to the outstanding mode free lifting ground setting of submerging in the surface of described mounting table body, with its front end supporting substrate so that a plurality of lifter pins of described substrate elevating,
When can being located at plasma treatment, keeps out of the way described lifter pin to the intrinsic retreating position of described mounting table with from the outstanding Support Position of described mounting table body with supporting substrate, and second lifter pin more than 1 that comprises the central part of a plurality of first lifter pins of periphery of supporting substrate and supporting substrate
At least the leading section of described second lifter pin is a conductivity, when described second lifter pin is positioned at described retreating position, adjusts, and makes the height and position of its front end be the below apart from the back side 70～130 μ m of substrate.
4. substrate-placing platform as claimed in claim 3 is characterized in that:
Described second lifter pin and described mounting table body are same potential.
5. as claim 3 or 4 described substrate-placing platforms, it is characterized in that:
The control part that also comprises the lifting of controlling described first lifter pin and described second lifter pin independently.
6. as claim 1 or 3 described substrate-placing platforms, it is characterized in that:
By the substrate of mounting is the substrate of insulating properties.
7. as claim 1 or 3 described substrate-placing platforms, it is characterized in that:
The height and position adjusting mechanism that also comprises the height and position of adjusting described lifter pin.
8. as claim 1 or 3 described substrate-placing platforms, it is characterized in that:
Have a plurality of protuberances that are made of insulator on the surface of described mounting table body, substrate is positioned on this protuberance.
9. as claim 1 or 3 described substrate-placing platforms, it is characterized in that:
Supply with the High frequency power that plasma generates usefulness to described mounting table body.
10. as claim 1 or 3 described substrate-placing platforms, it is characterized in that:
Described mounting table body is configured in the container handling by the dividing plate that is made of insulating element, make and between the diapire of described mounting table body and described container handling, form the space, making described space is air atmosphere, utilizes the bolt that connects described space that described mounting table body is fixed on the diapire of described container handling.
11. a substrate board treatment, it is for carrying out the plasma processing apparatus of plasma treatment to substrate, and it comprises:
Accommodate the container handling of substrate;
Be arranged in the described container handling substrate-placing platform of mounting substrate;
In described container handling, supply with the processing gas supply mechanism of handling gas;
To carrying out the exhaust gear of exhaust in the described container handling; With
The plasma that generates the plasma of handling gas in described process chamber generates mechanism,
It is characterized in that: described substrate-placing platform has in the claim 1～8 each structure.
12. substrate board treatment as claimed in claim 11 is characterized in that:
Described plasma generates mechanism and comprises: the described substrate-placing platform that works as lower electrode; The upper electrode that is oppositely arranged with substrate-placing platform; With the high frequency electric source that applies High frequency power to substrate-placing platform.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2006096799 | 2006-03-31 | ||
| JP2006096799A JP4597894B2 (en) | 2006-03-31 | 2006-03-31 | Substrate mounting table and substrate processing apparatus |
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| CN2009102534464A Division CN101707186B (en) | 2006-03-31 | 2007-03-23 | Substrate placing stage and substrate processing apparatus |
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| CN101047143A CN101047143A (en) | 2007-10-03 |
| CN100587938C true CN100587938C (en) | 2010-02-03 |
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| CN200710089462A Active CN100587938C (en) | 2006-03-31 | 2007-03-23 | Basal plate carrying table and basal plate processing device |
| CN2009102534464A Active CN101707186B (en) | 2006-03-31 | 2007-03-23 | Substrate placing stage and substrate processing apparatus |
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| JP (1) | JP4597894B2 (en) |
| KR (2) | KR100887459B1 (en) |
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- 2007-03-23 CN CN2009102534464A patent/CN101707186B/en active Active
- 2007-03-23 KR KR1020070028843A patent/KR100887459B1/en active IP Right Grant
- 2007-03-30 TW TW096111318A patent/TWI427733B/en active
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107527837A (en) * | 2016-06-17 | 2017-12-29 | 东京毅力科创株式会社 | The maintaining method of substrate board treatment, maintenance utensil and substrate board treatment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070098556A (en) | 2007-10-05 |
| JP4597894B2 (en) | 2010-12-15 |
| KR20080114647A (en) | 2008-12-31 |
| TW200805556A (en) | 2008-01-16 |
| CN101707186A (en) | 2010-05-12 |
| CN101707186B (en) | 2012-02-29 |
| TWI427733B (en) | 2014-02-21 |
| JP2007273685A (en) | 2007-10-18 |
| KR100887459B1 (en) | 2009-03-10 |
| CN101047143A (en) | 2007-10-03 |
| KR100952525B1 (en) | 2010-04-12 |
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