CN100573158C - A kind of advanced sandwich sub card test general carrier plate and method for making - Google Patents
A kind of advanced sandwich sub card test general carrier plate and method for making Download PDFInfo
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- CN100573158C CN100573158C CNB2007101247139A CN200710124713A CN100573158C CN 100573158 C CN100573158 C CN 100573158C CN B2007101247139 A CNB2007101247139 A CN B2007101247139A CN 200710124713 A CN200710124713 A CN 200710124713A CN 100573158 C CN100573158 C CN 100573158C
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Abstract
The invention discloses a kind of advanced sandwich sub card test general carrier plate and method for making, the functional part that its support plate is provided with the standard subcard socket that is used for fixing the advanced sandwich sub card of just inserting state and is used for advanced sandwich sub card is tested, also be provided with mirror image subcard socket on its support plate, this socket is used for fixing the anti-advanced sandwich sub card of inserting state; The method for making of its mirror image subcard socket: A. is provided with a subcard socket that is used for fixing advanced sandwich sub card on the support plate that advanced sandwich sub card test is used; B. revise the pin definitions of described subcard socket, each signal that described support plate is provided is sent in the anti-advanced sandwich sub card of inserting under the state by amended subcard socket respectively.The present invention can test the subcard reverse side, thereby has realized the comprehensive test to AMC subcard signal integrity.
Description
Technical field
The present invention relates to the field tests of the signal integrity of AMC (Advanced Mezzanine Card, advanced sandwich sub card) subcard and function etc., a kind of general carrier plate and method for making of the AMC of providing subcard mirror image groove bit test is provided.
Background technology
Now the frequency of communication system is more and more higher, and the requirement of circuit is also improved thereupon, and the correctness of high-frequency circuit and the stability of function not only depend on the correctness of circuit theory, also to a great extent by the signal integrity decision of high speed signal.So, to the test of present high-speed communication veneer, not only need to verify its function, also need signal integrity is carried out comprehensively and the investigation of blanket type, so that find possible problem, and find the method for solution.
Signal integrity SI (signal integrity) is defined as: transmission signals keeps the ability of time domain and frequency domain characteristic in the process of transmission.
Time domain (time domain) is to be the voltage of benchmark or the change procedure of electric current with time, can observe with oscillograph.It is generally used for finding out time-delay (delays), skew (skew), overshoot (overshoot), following dash (undershoot), ring (ringing/ring back), nonmonotonicity (non-monotonic), intersymbol interference (ISI) and the sequential etc. of pin to pin.Sequential mainly is to satisfy (T Time Created of receiving end device
SETUP) and retention time (T
HOLD), data can correctly and reliably be latched.
Frequency domain (frequency domain) is to be the process of the variation of the voltage of benchmark or electric current with the frequency, can observe with spectrum analyzer and oscillograph.
The transmission system of signal comprises the driving of signal, transmission path, three essential parts such as the reception of signal, i.e. source end, transmission course, receiving end.What we paid close attention to most is the integrality of signal in transmission course.To the most direct and effective instrument of measuring signal integrality is oscillograph.
Current high performance circuit board, most of veneers all are the highly dense plates of high speed, as the hardware testing personnel, be according to the defined project of signal integrity, and the high speed signal of veneer is carried out full test.This just needs to see whether meet the demands with high-speed oscilloscope observation signal waveform.But high speed signal can not all be drawn test point in place with all signals and test owing to constraint, the limitation of topological structure and the requirement of terminal test of cabling length; In addition, the power consumption of high-speed chip is generally very big, and on the high density veneer, because the needs of heat radiation, heat radiator usually covers large stretch of area, and this just brings very burden to the tester, usually needs to seek test point at pros and cons every now and then.
For the veneer of inserting subcard on support plate, the signal integrity of test subcard can only be tested on the one side that makes progress, and the signal integrity of test subcard is restricted; If the terminal that needs test signal is under chip, and this chip is in the one side that makes progress, and be common BGA encapsulation, can't test Signal Terminal so,, so the test of subcard is just felt simply helpless if add the big heat radiator of a slice.This brings new challenge greatly for the hardware testing personnel.This is one of this patent problem that will solve just.
ATCA (Advanced TeleCommunication Computing Architecture, advanced communication computing architecture) be the standard of PICMG (PCI Industrial Computer Manufactures Group, PCI industrial computer fabricator association) tissue issue.In November, 2002, it is the ATCA standard that PICMG has issued PICMG3.X, comprising AMC subcard standard.This standard main target is to use for carrier class provides standardized platform architecture, and satisfies many key properties that telecommunications is used, as aspect requirements such as reliability, maintainabilitys.
AMC (Advanced Mezzanine Card, advanced sandwich sub card), AMC subcard have definition of unified signal pin and unified structure, and the AMC subcard that makes things convenient for different manufacturers is mixed insertion mutually.The signal of AMC subcard definition mostly is a high speed signal, such as gigabit ethernet signal, SAS/SATA signal, PCI-Express signal; Chip on the subcard also is a high-speed high-performance; Be subjected to the restriction of AMC subcard structure, the layout of subcard is quite compact, and on the structure, the AMC subcard has unified structure, and the AMC subcard is plugged support plate, has one to face down, and can't test.This brings very big difficulty for the measuring signal integrality of high speed signal.When addressing this problem, often adopt the pcb board that hollows out AMC subcard below support plate and adopt the method for prolong socket to test the AMC pros and cons in the prior art.
The above-mentioned mode that hollows out AMC subcard below PCB is though the reverse side of the support plate test subcard that can overturn is done three main shortcomings: first like this, hollow out support plate PCB, bring difficulty for the placement-and-routing of support plate, if the test carrier plate more complicated, the wiring area may be not enough.Second, hollow out the PCB support plate, power supply and ground level have been cut apart, worsened the power supply integrality of support plate, and then influence the signal integrity and the EMI (Electro Magnetic Interference, electromagnetic interference (EMI)) of support plate high speed signal, EMC (Electro Magnetic Compatibility, electromagnetic compatibility) etc., this point is important by all means.The 3rd, hollow out support plate, brought inconvenience to test, in the time of test, need constantly counter-rotating veneer, reached the purpose of test pros and cons.In addition, hollow out the pcb board of AMC subcard below, when giving the fixing of subcard and counter-rotating support plate, subcard connector contact performance all will exert an influence.
Above-mentioned subcard prolong socket mode, be to be inserted on the AMC socket with an extension plate, the daughtercard interface signal is extended to the machine frame outside, an AMC socket is provided beyond machine frame, the AMC subcard inserts and prolongs the test of subcard socket, though this method also can be tested the subcard reverse side, be to use very inconveniently, inconvenient oscillograph test point is touched signal; Test extended line in addition the signal integrity of daughtercard interface signal is had a significant impact, be unfavorable for accurate test signal waveform.
Summary of the invention
The objective of the invention is to design a kind of AMC sub card test general carrier plate and preparation method thereof, the subcard socket of the AMC test of mirror image is provided on support plate, can test the pros and cons of subcard easily, and the signal integrity of the high speed signal on the various AMC subcards that define among the ATCA is comprehensively tested.The present invention by the following technical solutions.
The functional part that advanced sandwich sub card test general carrier plate of the present invention, described support plate are provided with the standard subcard socket that is used for fixing the advanced sandwich sub card of just inserting state and are used for advanced sandwich sub card is tested; Also be provided with mirror image subcard socket on the described support plate, this socket is used for fixing the anti-advanced sandwich sub card of inserting state.
Wherein, function pin is adaptive is connected for each of each jack of described mirror image subcard socket and the anti-advanced sandwich sub card of inserting state.
Wherein, each signal of providing of described support plate is sent in the anti-advanced sandwich sub card of inserting under the state by each pin of described mirror image subcard socket respectively.
Wherein, described mirror image subcard socket meets the subcard socket of advanced sandwich sub card standard definition, and comprises the pin signal implication that this standard contains.
Wherein, being in 89 of advanced sandwich sub card on the described mirror image subcard socket respectively all links to each other with managing electrical power with the jack of 82 pin positions.
The method for making of above-mentioned mirror image subcard socket, described method is carried out according to following steps:
A, a subcard socket that is used for fixing advanced sandwich sub card is set on the support plate that advanced sandwich sub card test is used;
The pin definitions of B, the described subcard socket of modification, each signal that described support plate is provided is sent in the anti-advanced sandwich sub card of inserting under the state by amended support plate subcard socket connected mode respectively.
Wherein, described method is further comprising the steps of: C, with 89 linking to each other with managing electrical power with the jack of 82 pin positions of being in advanced sandwich sub card on the described mirror image subcard socket respectively.
Wherein, described method is further comprising the steps of: D, provide the JTAG reset signal solder joint on support plate, when needs use subcard JTAG reset function, then on advanced sandwich sub card, disconnect being connected of JTAG reset signal and golden finger, be connected with short-circuit line between support plate and the described solder joint, realize the JTAG reset function.
The present invention is by being provided with the AMC subcard socket and the common socket of mirror image on the AMC test carrier plate, thereby realized the comprehensive test to AMC subcard signal integrity.And, compared with prior art, the present invention only increases a mirror image groove position on the basis of existing support plate, its convenient test, also need not reduce the wiring area of pcb board, can not influence performances such as the electromagnetic interference (EMI) of the signal integrity of support plate power supply and support plate high speed signal and support plate and electromagnetic compatibility yet, also can not have influence on the waveform sampling of test signal simultaneously.
Description of drawings
Fig. 1 is the johning knot composition of AMC subcard of the present invention on the AMC general carrier plate;
Fig. 2 contains the AMC subcard, AMC subcard socket (being the subcard connector) and AMC universal test support plate for the schematic cross-section on the AMC subcard insertion general carrier plate of the present invention among the figure.
Embodiment
Below will describe each preferred embodiment of the present invention in detail.
As shown in Figure 1, the invention provides a kind of test general carrier plate that is used to test the AMC subcard, this support plate provides the AMC subcard socket and the mirror image AMC subcard socket of standard, so that the pros and cons of test AMC subcard, this support plate also contains and is useful on other functional part that the AMC subcard is tested simultaneously, and these functional parts belong to the function that being used for of being equipped with on the existing test carrier plate test the AMC subcard.Among Fig. 1, what mirror image groove position was provided with is mirror image AMC subcard socket, and what the standard cell position was provided with is the AMC subcard socket of standard.
Standard A MC subcard socket meets the standard of PICMG3.X, when the AMC subcard is just inserting the AMC subcard socket of standard, supposes that one side up is called the TOP face, is called the BOTTOM face downwards and towards the one side of support plate, sees shown in Figure 2.Otherwise the AMC subcard is anti-when inserting mirror image subcard socket, and then TOP faces down, and BOTTOM is towards last, and can operate as normal.
The method of making mirror image AMC subcard socket is: at first, the subcard socket of a standard is set on the support plate that the AMC sub card test is used; Then, revise the pin definitions of described subcard socket, each signal that described support plate is provided is sent in the anti-advanced sandwich sub card of inserting under the state by amended subcard socket respectively.Make the AMC subcard socket connector of the standard of can not revising like this, also need not revise tested AMC subcard certainly.
For the method for attachment of above-mentioned image groove position is described, existing AMC subcard socket with 170 pins is an example, and the method for attachment of AMC signal on the concrete modification support plate is described.
Referring to table 1, provided the numbering and the definition of the standard A MC subcard golden finger that defines in the ATCA standard, certainly the jack of the AMC subcard socket of standard need the function pin be adaptive is connected with each of the AMC subcard of just inserting state, meets the standard of ATCA.
Table 1
| The golden finger numbering | 1 | 2 | 3 | 。。 | 82 | 83 | 84 | 85 |
| Implication | A1 | A2 | A3 | A82 | A83 | A84 | A85 | |
| The golden finger numbering | 170 | 169 | 168 | 。。 | 89 | 88 | 87 | 86 |
| Implication | A170 | A169 | A168 | A89 | A88 | A87 | A86 |
The pin signal definition of AMC on the support plate that defines in the ATCA standard that provides in the above-mentioned table 1, pin numbering from 1 to 170 is totally 170 pins, second row and fourth line are represented the pin implication of each pin numbering correspondence, in order to say something, the implication of supposing corresponding pin is that A1 is to A170, be that pin numbering is that 1 pin implication is A1, the signal implication of pin numbering 2 correspondences is A2, is A170 to numbering 170 implications by that analogy.
So, when mirror image AMC subcard socket is set, revised the signal implication of pin on the support plate, and do not revise the subcard socket connector, function pin is adaptive is connected for each of each jack that makes its mirror image subcard socket and the anti-AMC subcard of inserting state, and each signal of providing of support plate can be respectively each pin by mirror image subcard socket be sent in the anti-AMC subcard of inserting under the state.Golden finger definition rule as shown in table 2 below, that it has provided mirror image groove position has illustrated the distribution plan that concerns of the pin signal numbering of mirror image groove position on the support plate and implication.
Table 2
| The golden finger numbering | 1 | 2 | 3 | 。。 | 82 | 83 | 84 | 85 |
| Implication | A86 | A87 | A88 | 。。 | A167 | A168 | A169 | A170 |
| The golden finger numbering | 170 | 169 | 168 | 。。 | 89 | 88 | 87 | 86 |
| Implication | A85 | A84 | A83 | 。。 | A4 | A3 | A2 | A1 |
From above-mentioned table 2, can see, in order to realize mirror image groove position, pin definitions on support plate has been done adjustment, (BOTTOM faces up conversely can to guarantee the AMC subcard, TOP faces down) be inserted in mirror image groove position, each pin of AMC subcard also can be connected to signal correct on the support plate, guarantees operate as normal.
Above is the AMC subcard of A+ or B+ type, promptly has the transform method of the AMC socket of 170 useful signals.For golden finger is the AMC subcard (the AMC subcard of A or category-B type) of single face, and the mirror image groove position connector of support plate is just passable according to the signal that the method for attachment in the table 2 connects on the support plate, only numbers from 1 to 85.
From as can be seen last, above-mentioned image subcard socket meets the subcard socket of AMC subcard standard definition, and comprises the pin signal implication that this standard contains, and is used for the test of overturning of AMC subcard.
For two-sided AMC subcard, except connecting, need to solve a problem according to the method for attachment on the table 2.Because on the AMC socket connector, not all golden finger all has one to one, and pin is connected on the support plate, but per two earth signals (GND) that pros and cons is relative on the golden finger are short circuits in connector inside, be connected to support plate by a pin, the contact pin of these short circuits has 28 pairs, such as pin1 and (referring to the AMC connector structure parts of AMC among the PICMG3.X) such as pin170 short circuit, pin7 and pin164 short circuits, when according to table 2, when revising on the support plate pin definitions, need to revise the implication of these two signal pins.
In addition, in the AMC of standard pin definitions, be in the managing electrical power and the TRST# (being reset signal) that is in 167pin of 4pin (being numbered 4 pin), on mirror image groove position, be in the position of pin89 and pin82 respectively, these two pins are short circuits on the AMC connector.Because managing electrical power (pin4) is to the power supply of AMC subcard, it is essential; Reset and be input to the signal of AMC subcard and TRST# (being reset signal) is a jtag test, low level is effective.Because the JTAG signal of AMC subcard is a space signal, (totally 85 pins) do not provide the JTAG signal in the single face golden finger, and often provide the JTAG debugging interface on the AMC subcard, and this signal can not be connected into the AMC subcard on the support plate.So when mirror image groove position is set, also need pin89 and pin82 are linked to be managing electrical power, thereby just do not influence AMC subcard operate as normal, just with 89 linking to each other with managing electrical power of being in the AMC subcard on the mirror image subcard socket respectively with the jack of 82 pin positions.And on support plate, provide the TRST# signal solder joint, in case in the time of must using the JTAG reset function of AMC subcard, then can on the AMC subcard, disconnect being connected of TRST# signal and golden finger, be connected with short-circuit line between support plate and the solder joint, realize the JTAG reset function, the AMC subcard is counter this invalidating signal when being inserted on the mirror image groove position.
In a word, what should be noted that when using general carrier plate of the present invention has 2 points, and the first, for the AMC subcard of inserting on the mirror image groove position, only support the AMC subcard instead to insert, do not support AMC just slotting.The second, hot plug is not supported in mirror image AMC subcard groove position, because revised pin definitions, the Chief Signal Boatswain hour hand does not satisfy the semaphore request of hot plug definition.
In the present invention, AMC universal test support plate provides AMC subcard hardware components and cooperates corresponding software, and the various buses of AMC subcard are all worked together, with the various signals of convenient test.It can provide the test of following signal or function.
(1) support plate provides IPMC function, and managing electrical power on the AMC subcard and quiet charged source provide the I2C bus communication of AMC subcard and IPMC according to the electric sequence work of AMC subcard standard definition.Concrete is, the AMC support plate need comprise an intelligent peripheral Management Controller (IPMC), be used to monitor the electronics control key and the hot plug of its duty and management ATCA cabinet, it also is in charge of the hot plug, electronic keying of AMC subcard and the state and the ruuning situation of AMC subcard is reported to ATCA shelf management device.This function can realize by the corresponding function in the support plate of prior art.
(2) support plate provides the test of multiple signal type, guarantees that various buses can move.For example: communication of Base face gigabit Ethernet and exchange are provided; The exchange of Fabric face gigabit Ethernet is provided; The connecting circuit of PCI-E signal can be provided; SAS hard disk function and corresponding SAS circuit are provided; Provide other differential lines, as E1 or clock signal circuit; The test function of active and standby signal is provided; The functions such as sintering of support plate to the EPLD/FPGA of AMC subcard is provided.These test functions also are that support plate must be equipped with in the prior art, so when corresponding test function parts are set on general carrier plate of the present invention, can realize with reference to correlation technique of the prior art.
In sum, the present invention is by being provided with the AMC subcard socket and the common socket of mirror image on the AMC test carrier plate, and the AMC subcard inserts common socket, faces up, and can test the front signal; The AMC subcard is inserted on the mirror image socket, and one side downward in the regular troughs position makes progress in mirror image groove position, can test the subcard reverse side, thereby realize the comprehensive test to AMC subcard signal integrity.
And the present invention has kept the test function of the various signals of realizing the definition of all kinds AMC subcard on the universal test plate.Since the AMC standard definition unified subcard socket and pin signal implication, various connections that may signaling interfaces are provided on the support plate that the AMC sub card test is used, make it to guarantee various types of AMC subcards are inserted in can both operate as normal on the universal test support plate.
In a word, the present invention has reached the effect of the two-sided test of AMC subcard, can test the signal integrity of nearly all signal on the AMC subcard, can test multiple AMC subcard with a cover general carrier plate, improved test coverage, for producing and the debugging subcard has been saved time and cost, will reduce greatly to develop, test and frock personnel's workload.The present invention is applied to the signal testing of AMC subcard in the ATCA communication system, the present invention has realized AMC sub card test support plate, change support plate two AMC subcard sockets are provided, the AMC subcard socket that socket is a standard, another is a mirror image AMC socket, the mirror image socket provides AMC subcard upset test, so that test subcard reverse side signal; Two sockets can satisfy various types of AMC subcard pro and con and insert test, make it to be tested fully the signal on the subcard.The present invention satisfies the ATCA and the AMC international standard of PICMG tissue definition, therefore can satisfy the test needs of the AMC subcard of different manufacturers production.
Illustrating of above-mentioned each concrete steps is comparatively concrete, can not therefore think the restriction to scope of patent protection of the present invention, and scope of patent protection of the present invention should be as the criterion with claims.
Claims (8)
1, the functional part that a kind of advanced sandwich sub card test general carrier plate, described support plate are provided with the standard subcard socket that is used for fixing the advanced sandwich sub card of just inserting state and are used for advanced sandwich sub card is tested; It is characterized in that,
Also be provided with mirror image subcard socket on the described support plate, this socket is used for fixing the anti-advanced sandwich sub card of inserting state.
2, general carrier plate according to claim 1 is characterized in that, function pin is adaptive is connected for each of each jack of described mirror image subcard socket and the anti-advanced sandwich sub card of inserting state.
3, general carrier plate according to claim 1 is characterized in that, each signal that described support plate provides is sent in the anti-advanced sandwich sub card of inserting under the state by each pin of described mirror image subcard socket respectively.
4, general carrier plate according to claim 1 is characterized in that, described mirror image subcard socket meets the subcard socket of advanced sandwich sub card standard definition, and comprises the pin signal implication that this standard contains.
5, general carrier plate according to claim 1 is characterized in that, is in 89 of the anti-advanced sandwich sub card of inserting state on the described mirror image subcard socket respectively and all links to each other with managing electrical power with the jack of 82 pin positions.
6, the method for making of the described mirror image subcard of claim 1 socket is characterized in that, described method is carried out according to following steps:
A, a subcard socket that is used for fixing advanced sandwich sub card is set on the support plate that advanced sandwich sub card test is used;
The pin definitions of B, the described subcard socket of modification, each signal that described support plate is provided is sent in the anti-advanced sandwich sub card of inserting under the state by amended support plate subcard socket connected mode respectively.
7, method according to claim 6 is characterized in that, described method is further comprising the steps of:
C, with 89 linking to each other with managing electrical power of being in the anti-advanced sandwich sub card of inserting state on the described mirror image subcard socket respectively with the jack of 82 pin positions.
8, method according to claim 7 is characterized in that, described method is further comprising the steps of:
D, on support plate, provide the JTAG reset signal solder joint, when needs use subcard JTAG reset function, then on advanced sandwich sub card, disconnect being connected of JTAG reset signal and golden finger, be connected realization JTAG reset function with short-circuit line between support plate and the described solder joint.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2007101247139A CN100573158C (en) | 2007-11-14 | 2007-11-14 | A kind of advanced sandwich sub card test general carrier plate and method for making |
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| CNB2007101247139A CN100573158C (en) | 2007-11-14 | 2007-11-14 | A kind of advanced sandwich sub card test general carrier plate and method for making |
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| CN100573158C true CN100573158C (en) | 2009-12-23 |
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| CN109633309B (en) * | 2018-12-14 | 2021-10-08 | 深圳市银河风云网络***股份有限公司 | Electromagnetic interference recognition device and method and intelligent door lock |
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