CN100559595C - The BiFeO that is used for ferroelectric memory 3-based sandwich structural membrane and preparation method thereof - Google Patents

The BiFeO that is used for ferroelectric memory 3-based sandwich structural membrane and preparation method thereof Download PDF

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CN100559595C
CN100559595C CNB2008101583543A CN200810158354A CN100559595C CN 100559595 C CN100559595 C CN 100559595C CN B2008101583543 A CNB2008101583543 A CN B2008101583543A CN 200810158354 A CN200810158354 A CN 200810158354A CN 100559595 C CN100559595 C CN 100559595C
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film
ion
bifeo
preparation
sandwich structure
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CN101388395A (en
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胡广达
闫静
陈雪梅
杨长红
武卫兵
殷在梅
程玲
王金翠
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Jinan University
University of Jinan
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Abstract

The present invention relates to a kind of BiFeO that is used for ferroelectric memory 3-based sandwich structural membrane and preparation method thereof belongs to the microelectronics new material technology field.Described BiFeO 3The upper and lower top layer component of-based sandwich structural membrane is BiFe 1-xH xO 3, tetravalence and the tetravalence above high valence ion of H for mixing, the intermediate layer component is BiFe 1-xL xO 3, trivalent and the trivalent following ion of L for mixing; Its preparation method makes the top layer that precursor solution is deposited on different materials with spin-coating method for adopting chemical solution method combination annealing process layer by layer.The present invention is by adopting special sandwich structure, greatly reduce the leakage current of film, effectively reduce coercive field simultaneously, significantly improve the electric charge confining force, under 500 ℃~600 ℃ annealing temperature, obtained having low-leakage current, big residual polarization, low coercive field, well the ferroelectric thin film of electric charge confining force has good practical prospect in the ferroelectric memory in future.

Description

The BiFeO that is used for ferroelectric memory 3-based sandwich structural membrane and preparation method thereof
Technical field
The present invention relates to a kind of BiFeO that is used for ferroelectric memory 3-based sandwich structural membrane and preparation method thereof belongs to the microelectronics new material technology field.
Background technology
BiFeO 3Material has simple perovskite structure, at room temperature have simultaneously two kinds structurally ordered be ferroelectric in order (T C~830 ℃) and G-sections magnetic order (T N~370 ℃), be to have one of ferroelectricity and ferromagnetic ferromagnetic electric material under the minority room temperature simultaneously.Recently, the researcher has proved BiFeO 3Have good ferroelectric properties, be hopeful to be applied in the ferroelectric memory device.But, the BiFeO that utilizes chemical solution method to prepare 3The material leakage current is higher, in addition, because BiFeO 3Very high (the T of the Curie point of film C~830 ℃), and preparation temperature very low (≤550 ℃), it is aging that this makes that in preparation process film just begins experience, thereby caused BiFeO 3Therefore the high coercive field of-base film and low electric charge confining force have limited the application of this material.Although researcher is taked the way at beta-position doping high valence ion (〉=4), can reduce coercive field to a certain extent, bad as technical process control, leakage current is very high usually, and the rectangle degree of electric hysteresis loop is relatively poor; Doping trivalent lanthanide series, when reducing leakage current and coercive field, residual polarization decreases; Trivalent ion such as Mn 3+And Cr 3+Doping, improving the residual polarization value, when reducing leakage current, also improved coercive field; Mixing altogether of divalence and quadrivalent ion is undoubtedly a kind of reduction leakage current, improve film electric charge confining force with the effective ways that reduce coercive field, but also can't reach the requirement of application at present.
Summary of the invention
For solving BiFeO 3The ferroelectric thin film leakage current is higher, coercive field is higher and easy problem such as aging, and the present invention aims to provide a kind of BiFeO that is used for ferroelectric memory 3-based sandwich structural membrane has obtained having high residual polarization, the ferroelectric thin film of low-leakage current, low coercive field, high electric charge confining force, has good practical prospect in the ferroelectric memory device in future.
The present invention also provides described BiFeO 3The preparation method of-based sandwich structural membrane.
The present invention is achieved by the following technical solutions:
The BiFeO that is used for ferroelectric memory of the present invention 3-based sandwich structural membrane, its special character is: upper and lower skin-material is the BiFeO of doping tetravalence and the above high valence ion of tetravalence 3Film, intermediate layer material are the following BiFeO of ion at a low price of doping trivalent and trivalent 3Film; The above high valence ion of described tetravalence and tetravalence is Ti 4+, Zr 4+, Hf 4+, V 5+, Ta 5+, Nb 5+, Mo 6+Or W 6+In a kind of; The following ion at a low price of described trivalent and trivalent is Mn 3+, Cr 3+, Zn 2+, Ni 2+, Cu 2+Or a kind of in the lanthanide ion.
The component of described upper and lower skin-material is BiFe 1-xH xO 3, wherein, x is the molar equivalent of dopant ion H, 0<x≤0.02, and H is Ti 4+, Zr 4+, Hf 4+, V 5+, Ta 5+, Nb 5+, Mo 6+Or W 6+In a kind of.
The component of described intermediate layer material is BiFe 1-xL xO 3, wherein, x is the molar equivalent of dopant ion L, and its scope is 0<x≤0.05, and L is Mn 3+, Cr 3+, Zn 2+, Ni 2+, Cu 2+Or a kind of in the lanthanide ion.
The thickness of described upper and lower skin-material is 10~50nm; The thickness of described intermediate layer material is 100~200nm.
When described intermediate layer material was divalent ion when dopant ion, its thickness is more excellent to be 100~150nm, and when dopant ion was trivalent ion, its thickness is more excellent to be 150~200nm.
The preparation method of sandwich structure film of the present invention, adopt following steps:
(1) preparation of upper and lower top layer and intermediate layer precursor solution: adopt chemical solution method, the raw material that take by weighing bismuth nitrate, ferric nitrate and contain doped chemical by stoichiometric proportion, be dissolved in the ethylene glycol, titanium, tantalum source are for preventing that hydrolysis should be earlier and the acetylacetone,2,4-pentanedione complexing, be mixed with precursor solution according to a conventional method, solution concentration is 0.05mol/L~0.15mol/L;
(2) preparation of thin-film material: adopt annealing process layer by layer, to descend the top layer precursor solution to be deposited on the backing material with spin-coating method, intermediate layer and upper epidermis precursor solution are deposited on separately the lower film successively, then material is placed on the hot plate and dries, the film of drying is placed quick anneal oven heat treatment, and heat treatment temperature is 500 ℃~600 ℃, and nitrogen atmosphere is adopted in annealing, repeat this step, film thickness meets the requirements up to the top layer;
(3) the sandwich structure film that will reach thickness requirement is annealed half an hour in 500 ℃~600 ℃ scopes under nitrogen atmosphere, obtains dense film.
Wherein, described backing material is preferably Pt/Ti/SiO 2/ Si, Pt/TiO 2/ SiO 2A kind of among/Si, LNO/Si or the ITO/Si.
The invention has the beneficial effects as follows: by adopting special sandwich structure, greatly reduce the leakage current of film, simultaneously, effectively reduced BiFeO 3The film coercive field, and obviously improved the electric charge confining force, obtained having big residual polarization, low-leakage current, low coercive field under 500 ℃~600 ℃ annealing temperature, well the ferroelectric thin film of electric charge confining force has good practical prospect in the ferroelectric memory in future.
Description of drawings
Fig. 1 is the sandwich structure schematic diagram of film of the present invention
The BiFeO that Fig. 2 obtains for embodiment 1 3The electric hysteresis loop collection of illustrative plates of-based sandwich structure.
The BiFeO that Fig. 3 obtains for embodiment 1 3The retention performance of-based sandwich structure.
Embodiment
The invention will be further described below in conjunction with specific embodiment.
Embodiment 1
The BiFeO that is used for ferroelectric memory of present embodiment 3-based sandwich structural membrane, its upper and lower skin-material is BiFe 0.98Ti 0.02O 3Film, intermediate layer material are BiFe 0.98Zn 0.02O 3
The preparation method of above-mentioned sandwich structure film is:
(1) taking by weighing mol ratio respectively is 1.02: 0.98: 0.02 bismuth nitrate, ferric nitrate and butyl titanate, with 40ml ethylene glycol dissolving bismuth nitrate and ferric nitrate, be configured to solution A, get with the isopyknic acetylacetone,2,4-pentanedione of butyl titanate and form complex solution B, after solution A and B stirred 40 minutes respectively, mixed preparing concentration was the BiFe of 0.10mol/L 0.98Ti 0.02O 3Precursor solution; The bismuth nitrate, ferric nitrate and the zinc nitrate that took by weighing mol ratio respectively and be 1.02: 0.98: 0.02 are dissolved in the 40ml ethylene glycol, are mixed with the BiFe that concentration is 0.10mol/L according to a conventional method 0.98Zn 0.02O 3Precursor solution;
(2) adopt spin-coating method will descend the precursor solution on top layer to be deposited on backing material Pt/Ti/SiO 2On/the Si, material is placed on the hot plate dries then, the film of drying is placed quick anneal oven heat treatment, heat treatment temperature is 550 ℃, and nitrogen atmosphere is adopted in annealing, repeats this step, reaches 35nm up to thickness; The precursor solution of intermediate layer material is deposited on following table layer film surface, then material is placed on hot plate oven dry, the film of drying is placed quick anneal oven heat treatment, heat treatment temperature is 550 ℃, nitrogen atmosphere is adopted in annealing, repeats this step, reaches 100nm up to this layer film thickness; The upper epidermis film preparation method and following table layer film identical, making film thickness is 35nm.
The sandwich structure film that will reach thickness requirement is annealed half an hour, is obtained dense film for 550 ℃ under nitrogen atmosphere.
Embodiment 2
The BiFeO that is used for ferroelectric memory of present embodiment 3-based sandwich structural membrane, its upper and lower skin-material is BiFe 0.98Zr 0.02O 3Film, intermediate layer material are BiFe 0.97La 0.03O 3
The preparation method of above-mentioned sandwich structure film is:
(1) taking by weighing mol ratio respectively is 1.02: 0.98: 0.02 bismuth nitrate, ferric nitrate and zirconium iso-propoxide, with 40ml ethylene glycol dissolving bismuth nitrate and ferric nitrate, is mixed with the BiFe that concentration is 0.10mol/L 0.98Zr 0.02O 3Precursor solution; The bismuth nitrate, ferric nitrate and the lanthanum nitrate that took by weighing mol ratio respectively and be 1.02: 0.97: 0.03 are dissolved in the 40ml ethylene glycol, are mixed with the BiFe that concentration is 0.10mol/L according to a conventional method 0.97La 0.03O 3Precursor solution;
(2) employing deposits precursor solution successively with embodiment 1 identical method, and the precursor solution on following top layer is deposited on the backing material LNO/Si, and heat treatment temperature is 600 ℃, and the top layer film thickness is 45nm about making, and middle table layer film thickness is 150nm.The sandwich structure film that will reach thickness requirement is annealed half an hour, is obtained dense film for 600 ℃ under nitrogen atmosphere.
Embodiment 3
The BiFeO that is used for ferroelectric memory of present embodiment 3-based sandwich structural membrane, its upper and lower skin-material is BiFe 0.99Ta 0.01O 3Film, intermediate layer material are BiFe 0.95Mn 0.05O 3
The preparation method of above-mentioned sandwich structure film is:
(1) taking by weighing mol ratio respectively is 1.02: 0.99: 0.01 bismuth nitrate, ferric nitrate and ethanol tantalum, with 40ml ethylene glycol dissolving bismuth nitrate and ferric nitrate, be configured to solution A, get with the isopyknic acetylacetone,2,4-pentanedione of ethanol tantalum and form complex solution B, after solution A and B stirred 40 minutes respectively, mixed preparing concentration was the BiFe of 0.05mol/L 0.99Ta 0.01O 3Precursor solution; The bismuth nitrate, ferric nitrate and the manganese nitrate that took by weighing mol ratio respectively and be 1.02: 0.95: 0.05 are dissolved in the 40ml ethylene glycol, are mixed with the BiFe of 0.15mol/L 0.95Mn 0.05O 3The film precursor solution.
(2) step of preparation thin-film material is with embodiment 1, and heat treatment temperature is 520 ℃, and the top layer film thickness is 25nm about making, and intermediate layer film thickness is 180nm.
The sandwich structure film that will reach thickness requirement is annealed half an hour, is obtained dense film for 580 ℃ under nitrogen atmosphere.
Embodiment 4
The BiFeO that is used for ferroelectric memory of present embodiment 3-based sandwich structural membrane, its upper and lower skin-material is BiFe 0.97Mo 0.03O 3Film, intermediate layer material are BiFe 0.95Mn 0.05O 3
The preparation method of above-mentioned sandwich structure film is:
(1) taking by weighing mol ratio respectively is 1.02: 0.97: 0.03 bismuth nitrate, ferric nitrate and nitric acid molybdenum, with 40ml ethylene glycol dissolving bismuth nitrate and ferric nitrate, is mixed with the BiFe that concentration is 0.10mol/L 0.97Mo 0.03O 3Precursor solution; The bismuth nitrate, ferric nitrate and the manganese nitrate that took by weighing mol ratio respectively and be 1.02: 0.95: 0.05 are dissolved in the 40ml ethylene glycol, are mixed with the BiFe of 0.10mol/L 0.95Mn 0.05O 3The film precursor solution.
(2) step of preparation thin-film material is with embodiment 1, and heat treatment temperature is 560 ℃, and the top layer film thickness is 15nm about making, and intermediate layer film thickness is 200nm.
The sandwich structure film that will reach thickness requirement is annealed half an hour, is obtained dense film for 550 ℃ under nitrogen atmosphere.

Claims (7)

1. BiFeO who is used for ferroelectric memory 3-based sandwich structural membrane is characterized in that: upper and lower skin-material is the BiFeO of doping tetravalence and the above high valence ion of tetravalence 3Film, intermediate layer material are the following BiFeO of ion at a low price of doping trivalent and trivalent 3Film; The above high valence ion of described tetravalence and tetravalence is Ti 4+, Zr 4+, Hf 4+, V 5+, Ta 5+, Nb 5+, Mo 6+Or W 6+In a kind of; The following ion at a low price of described trivalent and trivalent is Mn 3+, Cr 3+, Zn 2+, Ni 2+, Cu 2+Or a kind of in the lanthanide ion.
2. sandwich structure film according to claim 1 is characterized in that: the component of described upper and lower skin-material is BiFe 1-xH xO 3, wherein, x is the molar equivalent of dopant ion H, 0<x≤0.02, and H is Ti 4+, Zr 4+, Hf 4+, V 5+, Ta 5+, Nb 5+, Mo 6+Or W 6+In a kind of.
3. sandwich structure film according to claim 1 is characterized in that: the component of described intermediate layer material is BiFe 1-xL xO 3, wherein, x is the molar equivalent of dopant ion L, and its scope is 0<x≤0.05, and L is Mn 3+, Cr 3+, Zn 2+, Ni 2+, Cu 2+Or a kind of in the lanthanide ion.
4. according to claim 1,2 or 3 described sandwich structure films, it is characterized in that: the thickness of described upper and lower skin-material is 10~50nm; The thickness of described intermediate layer material is 100~200nm.
5. sandwich structure film according to claim 4 is characterized in that: when described intermediate layer material was divalent ion when dopant ion, its thickness was 100~150nm, and when dopant ion was trivalent ion, its thickness was 150~200nm.
6. the preparation method of the described sandwich structure film of claim 1 is characterized in that adopting following steps:
(1) preparation of upper and lower top layer and intermediate layer precursor solution: adopt chemical solution method, the raw material that take by weighing bismuth nitrate, ferric nitrate and contain doped chemical by stoichiometric proportion, be dissolved in the ethylene glycol, titanium, tantalum source are for preventing that hydrolysis should be earlier and the acetylacetone,2,4-pentanedione complexing, be mixed with precursor solution according to a conventional method, solution concentration is 0.05mol/L~0.15mol/L;
(2) preparation of thin-film material: adopt annealing process layer by layer, to descend the top layer precursor solution to be deposited on the backing material with spin-coating method, intermediate layer and upper epidermis precursor solution are deposited on separately the lower film successively, then material is placed on the hot plate and dries, the film of drying is placed quick anneal oven heat treatment, and heat treatment temperature is 500 ℃~600 ℃, and nitrogen atmosphere is adopted in annealing, repeat this step, meet the requirements up to film thickness;
(3) the sandwich structure film that will reach thickness requirement is annealed half an hour in 500 ℃~600 ℃ scopes under nitrogen atmosphere, obtains dense film.
7. the preparation method of sandwich structure film according to claim 6 is characterized in that: described backing material is Pt/Ti/SiO 2/ Si, Pt/TiO 2/ SiO 2A kind of among/Si, LNO/Si or the ITO/Si.
CNB2008101583543A 2008-10-31 2008-10-31 The BiFeO that is used for ferroelectric memory 3-based sandwich structural membrane and preparation method thereof Expired - Fee Related CN100559595C (en)

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CN103601250B (en) * 2013-11-04 2015-06-24 陕西科技大学 Layer-by-layer alternatively doped low-leakage-current BiFeO3 film and preparation method thereof
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