CN100557368C - Heat-pipe radiator - Google Patents
Heat-pipe radiator Download PDFInfo
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- CN100557368C CN100557368C CNB2007101070514A CN200710107051A CN100557368C CN 100557368 C CN100557368 C CN 100557368C CN B2007101070514 A CNB2007101070514 A CN B2007101070514A CN 200710107051 A CN200710107051 A CN 200710107051A CN 100557368 C CN100557368 C CN 100557368C
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Abstract
The invention discloses a kind of heat-pipe radiator, comprise evaporator section and condensation segment, described evaporator section is divided into liquid storage district, top and bottom evaporating area, and described liquid storage district is connected by capillary wick with evaporating area; Be connected with spacer body in the described condensation segment that links to each other with evaporator section, described spacer body is divided into inside casing lower channel and inside casing upper channel with this condensation segment, and described inside casing upper channel is communicated with liquid storage district, described top, and described inside casing lower channel is communicated with described bottom evaporating area.Because heat-pipe radiator of the present invention inside has formed the passage that working medium flows, realized the circulation of working medium in the course of work, therefore using heat-pipe radiator of the present invention has solved board-like integrally-built vertical evaporating surface and has overcome the speed that gravity sucts liquid refrigerant evaporating surface by capillary wick, can not satisfy the requirement of big heat radiation power, by enlarging board-like integrally-built range of application, satisfied the radiating requirements of high power semiconductor component.
Description
Technical field
The present invention relates to technical field of electricity, concrete be particularly related to a kind of heat-pipe radiator.
Background technology
When using semiconductor element to make switch in the high-power rectifying device, in order to reduce the quantity of single bridge arm unit parallel connection, all trend towards using big semiconductor element, as the use for electric locomotive fairing by an original brachium pontis with six two inches IGCT series and parallels, a brachium pontis is till now only used five inches IGCTs.The heating power consumption of this single semiconductor element reaches thousands of watts, therefore, requires supporting radiator to have higher heat-sinking capability in limited space.The general at present heat-pipe radiator that uses is made up of circular heat pipe, radiating fin and substrate (fixedly heater element), because heat pipe is a kind of assembly structure with being connected of radiating fin and substrate, therefore can produce thermal contact resistance between heat pipe and substrate, heat pipe and the radiating fin, thermal resistance at radiator requires the smaller applications occasion, the influence of thermal contact resistance is bigger, be subjected to technogenic influence also bigger, radiating efficiency is restricted; In addition, when the arrangement by many circular heat pipes realizes the transmission of big thermal power, the local temperature rise that has heat pipe to arrange is little, and the position temperature rise between two heat pipes is big, the non-uniform temperature that causes substrate, and the inhomogeneous meeting of this temperature becomes big with the power increase, easily semiconductor element is produced adverse influence.
Adopt board-like integrally-built heat-pipe radiator can solve the deficiency of above-mentioned general heat-pipe radiator, the side view of existing plank frame heat-pipe radiator as shown in Figure 1, this heat-pipe radiator comprises the radiating fin 103 of evaporator section 101, condensation segment 102 and condensation segment, and the border circular areas of the evaporator section part among Fig. 1 is the zone at semiconductor heater element place.Evaporator section 101 is flat interior mount structure, is filled with liquid refrigerant at this inside casing inner bottom part, on the inner surface of this evaporator section 101 capillary wick is arranged, and these capillary wicks are up inhaled liquid refrigerant, thereby liquid refrigerant is distributed on the vertical inside casing surface.When the heater element heat release of outside, the liquid refrigerant heat absorption back phase transformation of capillary wick absorption becomes gaseous working medium, and these gaseous working mediums enter condensation segment 102 from condensation segment inlet 104.Condensation segment 102 also is flat interior mount structure, the outside of this inside casing is distributed with parallel equally spaced radiating fin 103, in the inside casing of condensation segment 102, after radiating fin 103 coolings, become liquid refrigerant from condensation segment inlet 104 gaseous working mediums that enter, these liquid refrigerants flow back to the interior frame bottom of evaporator section 101 again from condensation segment inlet 104, whole phase transition process then circulates.Owing to be connected as a single entity between table top that radiating fin 103, semiconductor heater element are placed and the inside casing, therefore there is not thermal contact resistance between them, flowing fast of gaseous working medium makes that the temperature difference between evaporator section 101 and the condensation segment 102 is less, play the effect of samming, and because the root temperature of each sheet radiating fin 103 of condensation segment 102 is all consistent and near the temperature of evaporator section 101, therefore improved radiating efficiency.
By above-mentioned description to existing heat-pipe radiator as can be known, existing heat-pipe radiator is drawn onto whole evaporating surface by capillary wick with the liquid refrigerant of evaporating area bottom, though can realize phase-change heat-exchange efficiently, but because capillary wick need overcome gravity when upwards adsorbing and transmitting liquid refrigerant, therefore the speed of its transmission is limited, when heat radiation power strengthens, because the restriction of transfer rate can not in time replenish the liquid refrigerant that evaporates, the heat-pipe radiator of therefore existing plank frame only can satisfy the requirement of small-power heat radiation, and can't satisfy the radiating requirements of high power semiconductor component, thereby limited board-like integrally-built application.
Summary of the invention
The object of the present invention is to provide a kind of heat-pipe radiator, overcoming the heat radiation requirement that heat-pipe radiator of the prior art can't satisfy high power semiconductor component, thereby limited the problem that existing board-like overall structure heat-pipe radiator is used.
For solving the problems of the technologies described above, the invention provides following technical scheme:
A kind of heat-pipe radiator comprises evaporator section and condensation segment, and described evaporator section is divided into liquid storage district, top and bottom evaporating area, and described liquid storage district is connected by capillary wick with evaporating area;
Be connected with spacer body in the described condensation segment that links to each other with evaporator section, described spacer body is divided into inside casing lower channel and inside casing upper channel with this condensation segment, one end of described spacer body links to each other with the inside casing sidewall of described condensation segment, leave the space between another inside casing sidewall of the other end of described spacer body and described condensation segment, be communicated with described inside casing upper channel and inside casing lower channel, described inside casing upper channel is communicated with liquid storage district, described top, and described inside casing lower channel is communicated with described bottom evaporating area.
The structure of described evaporator section and condensation segment is flat inside casing.
The other end of described spacer body has projection, forms groove between described projection and this spacer body upper surface.
The upper surface of described spacer body tilts to liquid storage district, the top of described evaporator section.
Described inside casing lower channel is the horizontal channel parallel with the condensation segment lower frame body.
Described inside casing lower channel is the straight passage that tilts to described evaporator section.
Described inside casing lower channel is zigzag passage.
Charge into liquid refrigerant in the described evaporating area of described heat-pipe radiator thermal starting forward direction, described liquid refrigerant is apart from least two millimeters on this evaporating area top.
By above technical scheme provided by the invention as seen, heat-pipe radiator of the present invention comprises evaporator section and condensation segment, wherein evaporator section is divided into liquid storage district, top and bottom evaporating area, the liquid storage district is connected by capillary wick with evaporating area, this capillary wick can be with liquid refrigerant from top liquid storage district vertical distribution to the bottom evaporating area; Be connected with spacer body in the condensation segment that evaporator section links to each other, this spacer body is divided into inside casing lower channel and inside casing upper channel with this condensation segment, the inside casing upper channel is communicated with top liquid storage district, the inside casing lower channel is communicated with the bottom evaporating area, form the passage that working medium flows thus, in the process of this heat-pipe radiator work, realized the circulation of working medium.Heat-pipe radiator of the present invention has solved the speed that board-like integrally-built vertical evaporating surface is inhaled liquid refrigerant in the pervaporation face by capillary wick, can not satisfy the requirement of big heat radiation power, by enlarging board-like integrally-built range of application, satisfied the heat radiation requirement of high power semiconductor component.
Description of drawings
Fig. 1 is the side view of existing heat-pipe radiator;
Fig. 2 is the first embodiment side view of heat-pipe radiator of the present invention;
Fig. 3 is the first embodiment vertical view of heat-pipe radiator of the present invention;
Fig. 4 is the evaporator section cutaway view of heat-pipe radiator of the present invention;
Fig. 5 is the second embodiment side view of heat-pipe radiator of the present invention;
Fig. 6 is the 3rd embodiment side view of heat-pipe radiator of the present invention.
The specific embodiment
Core of the present invention is to provide a kind of heat-pipe radiator, and this heat-pipe radiator comprises evaporator section and condensation segment, and wherein evaporator section is divided into liquid storage district, top and bottom evaporating area, and the liquid storage district is connected by capillary wick with evaporating area; Be connected with spacer body in the condensation segment that evaporator section links to each other, this spacer body is divided into inside casing lower channel and inside casing upper channel with this condensation segment, the inside casing upper channel is communicated with top liquid storage district, the inside casing lower channel is communicated with the bottom evaporating area.
In order to make those skilled in the art person understand the present invention program better, and above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
First embodiment of the invention:
The first embodiment side view of plank frame heat-pipe radiator of the present invention as shown in Figure 2, the inside casing lower channel that the condensation segment spacer body shown in this embodiment is told is a horizontal channel.
This heat-pipe radiator comprises: evaporator section 210 and condensation segment 220, wherein the bottom of evaporator section 210 is that evaporating area 211, top are liquid storage district 212 and capillary wick 213, condensation segment 220 middle parts are spacer body 222, this spacer body 222 is divided into inside casing lower channel 221 and inside casing upper channel 223 with condensation segment 220, condensation segment 220 outside evenly distributed radiating fins 224, and condensation segment inlet 225 is communicated with evaporating area 211, and condensation segment exports 226 and is communicated with liquid storage district 212.
Right side evaporator section 210 is flat interior mount structure among Fig. 2, this flat inside casing is divided into upper and lower two parts, the evaporating area 211 of bottom covers cartridge element, the liquid storage district 212 storing liquid working medium on top, and evaporating area 211 and liquid storage district 212 link together by the sintering of capillary wick 213.The liquid refrigerant that capillary wick 213 can store top liquid storage district 212 sucks bottom evaporating area 211, stops the gaseous working medium of bottom evaporating area 211 to pass capillary wick simultaneously and enters liquid storage district, top 212.
The condensation segment 220 in left side also is flat interior mount structure, have in this flat inside casing one with the spacer body 222 of this inside casing right frame wall disjunctor, leave certain space between these spacer body 222 left part and the inside casing left frame wall, and these spacer body 222 left upper portion have a fritter projection, make formation groove in plane on this spacer body 222, this spacer body upper surface slightly tilts to the right, makes between itself and the horizontal plane and produces angle.This spacer body 222 is separated into inside casing lower channel 221 and inside casing upper channel 223 with condensation segment 220, inside casing lower channel 221 is the passage with horizontal direction parallel, and the outlet of the left side of this inside casing lower channel 221 is communicated with inside casing upper channel 223, wherein inside casing lower channel 221 links to each other with evaporating area 211, the port that condensation segment 220 frameworks are communicated with inside casing lower channel 221 and evaporating area 211 is condensation segment inlet 225, inside casing upper channel 223 is communicated with liquid storage district 212, and the port that condensation segment 220 frameworks are communicated with inside casing upper channel 223 and liquid storage district 212 is condensation segment outlet 226.
During evaporator section topping up attitude working medium, guarantee that the liquid level of evaporator section bottom evaporating area maintains a certain distance from the evaporating area top, this distance is at least two millimeters, and this distance is got maximum under guaranteeing the prerequisite that capillary wick does not dry up in the start-up course usually.When thermal starting, be adsorbed with one deck liquid refrigerant on this a part of capillary wick that the evaporating area liquid level does not reach, the very fast phase transformation of these liquid refrigerants becomes gaseous working medium, the vapour pressure that gaseous working medium produces reduces the liquid level of evaporating area, because evaporating area is communicated with the inside casing lower channel of condensation segment, therefore the liquid refrigerant of evaporating area enters the inside casing lower channel from the condensation segment inlet, and owing to be communicated with between inside casing lower channel and the inside casing upper channel, therefore the liquid level of condensation segment rises thereupon, when surpassing the peak of spacer body left side projection, liquid refrigerant just flows in the groove of spacer body, because the spacer body groove has a down dip to the right, liquid refrigerant exports along the slope from condensation segment and flows into the evaporator section liquid storage district, realizes circulation.When the liquid level of evaporator section bottom evaporating area is lower than the condensation segment inlet in cyclic process, the gaseous working medium that phase transformation produces will flow to condensation segment along condensation segment inside casing lower channel, these gaseous working mediums are finished exothermic process because acting on of outside radiating fin is cooled to liquid refrigerant in the condensation segment.
Especially, when surpassing, the flowing velocity of gaseous working medium carries limit, the liquid refrigerant of inside casing lower channel can also be carried to the inside casing upper channel when promptly the heat radiation power of Chuan Diing is big and be stored in the groove of spacer body, the liquid refrigerant that the evaporating area bottom is not accumulated realizes that the heat-delivery surface of whole bottom evaporating area is in phase-change heat-exchange efficiently.And, because liquid refrigerant is delivered to evaporating area downwards from top liquid storage district, therefore under the double action of gravity and capillary wick, make that the transmission speed of liquid refrigerant is bigger, preferably resolve and transmit the problem that liquid refrigerant can't satisfy the high power semiconductor component radiating requirements in the prior art from the bottom up.
The first embodiment vertical view of plank frame heat-pipe radiator of the present invention as shown in Figure 3, the right side evaporator section 210 of this heat-pipe radiator and left side condensation segment 220 as seen from Figure 3, and the table top 230 placed of the cartridge element of evaporator section 210 exterior front.Evaporator section 210 and condensation segment 220 are interior closed-in construction, and be communicated with between the mount structures in evaporator section 210 inside casings and the condensation segment 220, the outside at condensation segment 220 inside casings is evenly distributed with radiating fin 224, when gaseous working medium enters in the condensation segment 220, make gaseous working medium cooling becoming liquid refrigerant, realize that the evaporator section 210 and the phase-change heat-exchange of condensation segment 220 circulate by radiating fin 224 heat radiations.
The cutaway view of evaporator section as shown in Figure 4 among first embodiment of plank frame heat-pipe radiator of the present invention: the flat interior mount structure of this evaporator section is divided into upper and lower two parts, its middle and lower part evaporating area 211 vertical distribution, the section shape of this evaporating area 211 is elongated rectangle, capillary wick 213 passes through sintered bond together with this evaporating area 211, the section shape approximate half-circular in liquid storage district, top 212, capillary wick 213 passes through sintered bond together with the lower surface in this liquid storage district 212.
Second embodiment of the invention:
The side view of plank frame heat-pipe radiator second embodiment of the present invention as shown in Figure 5, the passage of the inside casing lower channel that the condensation segment spacer body shown in this embodiment is told for tilting to the right.
This heat-pipe radiator comprises: evaporator section 510 and condensation segment 520, wherein the bottom of evaporator section 510 is that evaporating area 511, top are liquid storage district 512 and capillary wick 513, condensation segment 520 middle parts are spacer body 522, this spacer body 522 is divided into inside casing lower channel 521 and inside casing upper channel 523 with condensation segment 520, condensation segment 520 outside evenly distributed radiating fins 524, and condensation segment inlet 525 is communicated with evaporating area 511, and condensation segment exports 526 and is communicated with liquid storage district 512.
Right side evaporator section 510 is flat interior mount structure among Fig. 5, this flat inside casing is divided into upper and lower two parts, the evaporating area 511 of bottom covers cartridge element, the liquid storage district 512 storing liquid working medium on top, and evaporating area 511 and liquid storage district 512 link together by capillary wick 513 sintering.The liquid refrigerant that capillary wick 513 can store top liquid storage district 512 sucks bottom evaporating area 511, stops the gaseous working medium of bottom evaporating area 511 to pass capillary wick simultaneously and enters liquid storage district 512.
The condensation segment 520 in left side also is flat interior mount structure, have in this flat inside casing one with the spacer body 522 of this inside casing right frame wall disjunctor, leave certain space between these spacer body 522 left part and the inside casing left frame wall, and these spacer body 522 left upper portion have a fritter projection, make formation groove in plane on this spacer body 522, this spacer body upper surface slightly tilts to the right, makes between itself and the horizontal plane and produces angle.This spacer body 522 is separated into inside casing lower channel 521 and inside casing upper channel 523 with condensation segment 520, inside casing lower channel 521 is the iso-cross-section passage that tilts to the right, and the outlet of the left side of this inside casing lower channel 521 is communicated with inside casing upper channel 523, the form of this lower channel is compared with the horizontal lower channel in the embodiment of the invention one, the flow resistance of working medium is littler, is convenient to working medium and circulates fast in passage.Wherein inside casing lower channel 521 links to each other with evaporating area 511, the port that condensation segment 520 frameworks are communicated with inside casing lower channel 521 and evaporating area 511 is condensation segment inlet 525, inside casing upper channel 523 is communicated with liquid storage district 512, and the port that condensation segment 520 frameworks are communicated with inside casing upper channel 523 and liquid storage district 512 is condensation segment outlet 526.
When pouring liquid refrigerant in the radiator, these liquid refrigerants are full of evaporating area and inside casing lower channel, leave an amount of distance between evaporating area top and the capillary wick, this distance is at least two millimeters, and this distance is got maximum under guaranteeing the prerequisite that capillary wick does not dry up in the start-up course usually.Because the inside casing subregion of evaporator section and condensation segment has formed the peripheral passage of liquid refrigerant and gaseous working medium, by capillary wick liquid refrigerant is distributed to whole vertical bottom evaporating area constantly from top liquid storage district, thereby realizes the efficient phase-change heat-exchange process of high power semi-conductor components and parts.
Concrete, the heat that outside high power semiconductor component produces when starting working passes in the inside casing of bottom evaporating area by evaporator section outside table top, part more than the evaporating area liquid level, part liquid refrigerant is adsorbed on the capillary wick, the rapid phase transformation of this part liquid refrigerant produces gaseous working medium, gaseous working medium has increased the air pressure in the evaporating area of bottom, liquid refrigerant liquid level under the effect of vapour pressure in the evaporating area descends, liquid refrigerant in the evaporating area flows into the inside casing lower channel of condensation segment from the porch of condensation segment, liquid level in the inside casing lower channel rises thereupon, when rising to peak above spacer body left side projection, liquid level just flows in the groove of this spacer body, owing to divide the groove of this spacer to have a down dip to the right, just outlet flows into the liquid storage district, top of evaporator section liquid refrigerant along the slope from condensation segment, the liquid refrigerant that flows in the liquid storage district is drawn into the bottom evaporating area by capillary wick, replenish the liquid refrigerant that has flashed to gaseous state in the evaporating area, finish the start-up course of heat-pipe radiator.
After finishing the start-up course of phase-change heat-exchange, when the liquid level in the evaporating area is lower than the condensation segment inlet, gaseous working medium just flows into the lower channel of condensation segment inside casing from the condensation segment inlet, the gaseous working medium that is full of condensation segment is externally under the effect of radiating fin, be condensed into liquid refrigerant after the cooling heat release, these liquid refrigerants flow into evaporator section from the condensation segment outlet in the groove of spacer body liquid storage district, top has realized the phase transformation cyclic process of working medium.Further, suitably adjust the cross-sectional area of inside casing lower channel, can regulate the flowing velocity of gaseous working medium in this inside casing lower channel, the liquid refrigerant that accumulates in the condensation segment bottom is carried in the inside casing upper channel, guarantee that evaporating area is in phase-change heat-exchange efficiently fully, but not boiling heat transfer.
Third embodiment of the invention:
The side view of the 3rd embodiment of plank frame heat-pipe radiator of the present invention as shown in Figure 6, the inside casing lower channel that the condensation segment spacer body shown in this embodiment is told is zigzag passage.
This heat-pipe radiator comprises: evaporator section 610 and condensation segment 620, wherein the bottom of evaporator section 610 is that evaporating area 611, top are liquid storage district 612 and capillary wick 613, condensation segment 620 middle parts are spacer body 622, this spacer body 622 is divided into inside casing lower channel 621 and inside casing upper channel 623 with condensation segment 620, condensation segment 620 outside evenly distributed radiating fins 624, and condensation segment inlet 625 is communicated with evaporating area 611, and condensation segment exports 626 and is communicated with liquid storage district 612.
Right side evaporator section 610 is flat interior mount structure among Fig. 6, this flat inside casing is divided into upper and lower two parts, the evaporating area 611 of bottom covers cartridge element, the liquid storage district 612 storing liquid working medium on top, and evaporating area 611 and liquid storage district 612 link together by capillary wick 613.The liquid refrigerant that capillary wick 613 can store top liquid storage district 612 sucks bottom evaporating area 611, stops the gaseous working medium of bottom evaporating area 611 to pass capillary wick simultaneously and enters liquid storage district 612.
The condensation segment 620 in left side also is flat interior mount structure, have in this flat inside casing one with the spacer body 622 of this inside casing right frame wall disjunctor, leave certain space between these spacer body 622 left part and the inside casing left frame wall, and these spacer body 622 left upper portion have a fritter projection, make formation groove in plane on this spacer body 622, this spacer body upper surface slightly tilts to the right, makes between itself and the horizontal plane and produces angle.This spacer body 622 is separated into inside casing lower channel 621 and inside casing upper channel 623 with condensation segment 620, inside casing lower channel 621 is the zigzag passage of iso-cross-section, and the outlet of the left side of this inside casing lower channel 621 is communicated with inside casing upper channel 623, the form of this lower channel is compared with the straight ramp way among the embodiment two with the embodiment of the invention one horizontal channel, owing to the overall length of in limited space, having extended the inside casing lower channel, therefore can increase the radiating efficiency of condensation segment 620.Wherein inside casing lower channel 621 links to each other with evaporating area 611, the port that condensation segment 620 frameworks are communicated with inside casing lower channel 621 and evaporating area 611 is condensation segment inlet 625, inside casing upper channel 623 is communicated with liquid storage district 612, and the port that condensation segment 620 frameworks are communicated with inside casing upper channel 623 and liquid storage district 612 is condensation segment outlet 626.
The flat inside casing subregion of evaporator section and condensation segment has formed the peripheral passage of liquid refrigerant and gaseous working medium, evaporator section is drawn into the whole vertical evaporating surface of bottom evaporating area by the capillary wick that is sintered into one with receptacle material constantly with liquid refrigerant from top liquid storage district, this capillary wick stops that also gaseous working medium enters the liquid storage district simultaneously; The left side condensation segment is divided into upper and lower two parts by spacer body, both formed the passage that connects evaporator section top evaporating area and bottom liquid storage district, the groove shapes of spacer body also can store the liquid refrigerant of capacity, and the spacer body upper surface that passes through to tilt to the right is to top liquid storage district delivering liquid working medium.During startup, utilize the pressure of the gaseous working medium on evaporating area top constantly to increase, the peak that surpasses spacer body left side projection flows in the groove of spacer body thereby the liquid level that makes condensation segment constantly rises, and importing liquid storage district, evaporator section top, by capillary wick liquid refrigerant is sucked the bottom evaporating area, liquid level until evaporating area is lower than the condensation segment inlet, gaseous working medium enters condensation segment along the inside casing lower channel, and exothermic phase liquefy working medium is collected from condensation segment outlet inflow liquid storage district, the circulation of realization phase-change heat-exchange through the spacer body groove.
By above embodiment as seen, heat-pipe radiator of the present invention comprises evaporator section and condensation segment, and wherein evaporator section is divided into liquid storage district, top and bottom evaporating area, and the liquid storage district is connected by capillary wick with evaporating area; Be connected with spacer body in the condensation segment that evaporator section links to each other, this spacer body is divided into inside casing lower channel and inside casing upper channel with this condensation segment, the inside casing upper channel is communicated with top liquid storage district, and the inside casing lower channel is communicated with the bottom evaporating area, has formed the passage that working medium flows thus.Use heat-pipe radiator of the present invention and solved the speed that board-like integrally-built vertical evaporating surface is inhaled liquid refrigerant in the pervaporation face by capillary wick, can not satisfy the requirement of big heat radiation power, by enlarging board-like integrally-built range of application, satisfied the heat radiation requirement of high power semiconductor component.
Though described the present invention by embodiment, those of ordinary skills know, the present invention has many distortion and variation and do not break away from spirit of the present invention, wish that appended claim comprises these distortion and variation and do not break away from spirit of the present invention.
Claims (8)
1, a kind of heat-pipe radiator comprises evaporator section and condensation segment, it is characterized in that, described evaporator section is divided into liquid storage district, top and bottom evaporating area, and described liquid storage district is connected by capillary wick with evaporating area;
Be connected with spacer body in the described condensation segment that links to each other with evaporator section, described spacer body is divided into inside casing lower channel and inside casing upper channel with this condensation segment, one end of described spacer body links to each other with the inside casing sidewall of described condensation segment, leave the space between another inside casing sidewall of the other end of described spacer body and described condensation segment, be communicated with described inside casing upper channel and inside casing lower channel, described inside casing upper channel is communicated with liquid storage district, described top, and described inside casing lower channel is communicated with described bottom evaporating area.
2, heat-pipe radiator according to claim 1 is characterized in that, the structure of described evaporator section and condensation segment is flat inside casing.
3, heat-pipe radiator according to claim 1 is characterized in that, the other end of described spacer body has projection, forms groove between described projection and this spacer body upper surface.
4, heat-pipe radiator according to claim 3 is characterized in that, the upper surface of described spacer body tilts to liquid storage district, the top of described evaporator section.
5, heat-pipe radiator according to claim 1 is characterized in that, described inside casing lower channel is the horizontal channel parallel with the condensation segment lower frame body.
6, heat-pipe radiator according to claim 1 is characterized in that, described inside casing lower channel is the straight passage that tilts to described evaporator section.
7, heat-pipe radiator according to claim 1 is characterized in that, described inside casing lower channel is zigzag passage.
8, heat-pipe radiator according to claim 1 is characterized in that, charges into liquid refrigerant in the described evaporating area of described heat-pipe radiator thermal starting forward direction, and described liquid refrigerant is apart from least two millimeters on this evaporating area top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101070514A CN100557368C (en) | 2007-05-17 | 2007-05-17 | Heat-pipe radiator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101070514A CN100557368C (en) | 2007-05-17 | 2007-05-17 | Heat-pipe radiator |
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| CN101307997A CN101307997A (en) | 2008-11-19 |
| CN100557368C true CN100557368C (en) | 2009-11-04 |
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| CNB2007101070514A Expired - Fee Related CN100557368C (en) | 2007-05-17 | 2007-05-17 | Heat-pipe radiator |
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| CN109906025B (en) * | 2019-04-24 | 2024-02-20 | 常州恒创热管理有限公司 | U-shaped temperature equalization plate and radiator |
| CN117249498A (en) * | 2022-06-10 | 2023-12-19 | 青岛海尔空调电子有限公司 | Radiator and air conditioner outdoor unit |
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