CN100544542C - 防止静电放电的印刷电路板 - Google Patents

防止静电放电的印刷电路板 Download PDF

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CN100544542C
CN100544542C CNB2004100774193A CN200410077419A CN100544542C CN 100544542 C CN100544542 C CN 100544542C CN B2004100774193 A CNB2004100774193 A CN B2004100774193A CN 200410077419 A CN200410077419 A CN 200410077419A CN 100544542 C CN100544542 C CN 100544542C
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circuit board
printed circuit
pcb
hole
static discharge
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CN1787718A (zh
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王玉祥
王会章
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256Electrical insulation details, e.g. around high voltage areas
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0215Grounding of printed circuits by connection to external grounding means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257Overvoltage protection
    • H05K1/0259Electrostatic discharge [ESD] protection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10409Screws
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Elimination Of Static Electricity (AREA)

Abstract

一种防止静电放电的印刷电路板,其上装设有若干电子元件,所述印刷电路板设有若干通孔,其通过所述通孔固定于一电子装置内部,所述印刷电路板包括至少一接地层,所述接地层通过螺丝锁入所述通孔来实现对地连接,所述接地层分为一中心区以及一边缘区。该边缘区位于该印刷电路板板边的位置,包围上述中心区并与该中心区相互分离,该印刷电路板的电子元件分布在中心区相对应的位置的电路板上。所述中心区与边缘区之间存在一绝缘区,以防止中心区与边缘区的电性连接,该绝缘区穿过所述通孔,其宽度小于所述通孔的直径。

Description

防止静电放电的印刷电路板
【技术领域】
本发明涉及一种防止静电放电的印刷电路板,特别是一种无需增加额外材料即可防止静电放电的印刷电路板。
【背景技术】
静电放电(Electro-Static Discharge,ESD),是指两个具有不同静电电位的物体,由于直接接触或静电场感应引起两物体间的静电电荷转移,静电电场的能量达到一定程度后,击穿其间介质而进行放电的现象。电子产品在制造、生产、组装、运送、使用等过程中,受到静电放电伤害的机会很高。因此,静电放电防护设计技术为任何电子产品所必须的技术。尤其是电子装置中印刷电路板上常用的集成电路元器件,其静电敏感度高,加上目前电路的小型化趋势,其中所使用的元器件也趋于微小化,其耐压降低,耐静电冲击能力减弱,故由静电放电产生的静电电场和静电电流较易对电路板上的这些高密度元器件造成损害,严重时甚至会影响整个电子装置***的运行。
防止印刷电路板静电放电的常用手段之一是在设计电路板上的电路时,建立相应的保护电路。但由于设计保护电路时需要考虑元件的主要功能、元件制造制约及元件的安放位置等诸多复杂因素,而且更需使用额外的电子元件,并占用更多的电路板布线空间,故目前业界多倾向于采用直接改变印刷电路板结构的方法防止静电放电。如中国台湾专利申请第092206816号所说的一种防止静电放电之印刷电路板,其包括包含有一用以提供电流通过的导线层;一连接于该导线层的嵌入式导电组件,该嵌入式导电组件具有足以产生尖端放电之一尖端;一由导电材质所构成的与该尖端相邻的接地层,用以接收该尖端所释放出之电荷并且导入主地;一形成于该导线层以及该接地层之间的绝缘层,用以隔绝该导线层以及该接地层之间的电流;以及一形成于该绝缘层中的贯孔,用以容纳该嵌入式导电组件,且该嵌入式导电组件之尖端位于该绝缘层之该贯孔中,并且介于该导线层以及该接地层之间。在印刷电路板受到外来影响发生静电放电效应时,利用此结构将电流导入主地,防止电子元件遭到破坏。上述方法并未涉及所述嵌入式导电元件的在电路板上的装设位置,如装设位置不妥,可能会影响预期的效果,且该方法需要在电路板中增加一额外的绝缘层,会使制作成本提高。
【发明内容】
本发明所要解决的技术问题在于提供一种防止静电放电的印刷电路板,特别是一种无需增加额外材料即可防止静电放电的印刷电路板。
一种防止静电放电的印刷电路板,其上装设有若干电子元件,所述印刷电路板设有若干通孔,其通过所述通孔固定于一电子装置内部,所述印刷电路板包括至少一接地层,所述接地层通过螺丝锁入所述通孔来实现对地连接,所述接地层分为一中心区以及一边缘区。该边缘区位于该印刷电路板板边的位置,包围上述中心区并与该中心区相互分离,该印刷电路板的电子元件分布在中心区相对应的位置的电路板上。所述中心区与边缘区之间存在一绝缘区,以防止中心区与边缘区的电性连接,该绝缘区穿过所述通孔,所述绝缘区的宽度小于被所述绝缘区穿过的通孔的直径。
本发明与现有技术相比具有以下优点:通过改变印刷电路板自身结构来达到防止静电放电的目的,避免了使用额外的制作材料。
【附图说明】
下面参照附图结合实施例对本发明作进一步说明。
图1是现有四层印刷电路板的截面图。
图2是现有印刷电路板接地层结构及其上的电子元件分布的示意图。
图3是本发明印刷电路板接地层结构及其上的电子元件分布的示意图。
【具体实施方式】
请参阅图1及图2,为一目前常用的四层印刷电路板,其包括信号层11、13,电源层15及接地层17。在印刷电路板的电路设计及相关的布线中,印刷电路板上的电子元件21通过引脚、锡珠等方式连接至接地层17上,以实现电路中的对地(低电位)连接;而在印刷电路板的防EMI设计中,还需要通过接地层17来导走电路板上杂讯电流,已达到良好的防EMI效果。其中,上述接地层17的接地效果一般是由印刷电路板板上的通孔31来实现。所述通孔31的内壁涂有金属,可与接地层17电性连接,再借助金属螺丝穿过通孔31将印刷电路板连接在电子装置的壳体上,即可同时达到固定电路板与实现接地层17对地连接的目的。
在上述印刷电路板的制造、安装等过程中,经常会与人体产生接触。由于人体表面一般积累有一定数量的静电电荷,其会在与电路板的接触过程中通过静电放电进行释放。上述过程中,人体与电路板边缘接触的可能性较大,故通常情况下,放电会在人体与电路板边缘之间发生。基于静电放电中电流走向的原理,即电流总是会寻找路径最短且阻抗最低的路径来对地进行释放,所以电流会沿着印刷电路板向通孔31(接地点)传播。由于印刷电路板上电子元件21通常包括若干集成电路芯片,上述集成电路芯片一般在电路运作中起主要作用且其耐流耐压能力较低。电流在传播过程中就可能会流经这些芯片,从而对芯片造成损害。
请参阅图1及图3,本发明的印刷电路板50具有与普通印刷电路板相同的电路层结构,其上设有若干通孔81。由于印刷电路板在设计时总会将集成电路芯片等主要的电子元件83装设在非边缘的位置,而在板边留出一定的空间或装设一些非主要的电子元件。上述非主要电子元件的耐电流冲击能力一般较强,静电放电不会对其造成损害,为保护集成电路芯片等主要的电子元件83,本发明印刷电路板的接地层70即对应上述电子元件83的分布方式而设计,其包括一中心区72以及一边缘区74。该边缘区74位于该印刷电路板50板边的位置,包围上述中心区72并与该中心区72相互分离,该印刷电路板50的电子元件83分布在中心区72相对应的位置的电路板上。中心区72与边缘区74之间存在一绝缘区76,以防止中心区72与边缘区74的电性连接。该绝缘区76穿过通孔81,其宽度小于通孔81的直径,一般为5~10mil(0.127~0.254毫米)。
在将金属螺丝锁入通孔81后,该印刷电路板即可正常工作。此时,中心区72与边缘区74通过通孔81中的螺丝相互连接,使接地层70成为一导电整体并对地连接,可满足电路中电子元件83低电位连接及防EMI的要求。同时,也可在所述通孔81周围加入若干贯穿该电路板的卫星孔85,再借助若干零欧姆电容连接所述卫星孔85来加强其连接效果。当人体与电路板边缘的静电放电产生时,由于中心区72与边缘区74之间无电性连接,所以电流进行对地释放时只能直接流向通孔81,而无法绕过通孔81而损害电路板上的电子元件83。如此,即达到了保护电子元件83的目的。此外,本发明的设计构思也不仅限于一般的四层印刷电路板,还可应用于六层板等其它多层电路板结构,只需相应调整电路板接地层结构即可。

Claims (6)

1.一种防止静电放电的印刷电路板,其上装设有若干电子元件,所述印刷电路板设有若干通孔,其通过所述通孔固定于一电子装置内部,所述印刷电路板包括至少一接地层,所述接地层通过螺丝锁入所述通孔来实现对地连接,其特征在于:所述接地层分为一中心区以及一边缘区,所述中心区与边缘区之间存在一绝缘区,所述绝缘区穿过所述通孔中的至少一个,所述绝缘区的宽度小于被所述绝缘区穿过的通孔的直径。
2.如权利要求1所述的防止静电放电的印刷电路板,其特征在于:所述电子元件包括若干集成电路芯片,所述集成电路芯片分布在所述中心区对应位置的印刷电路板上。
3.如权利要求1所述的防止静电放电的印刷电路板,其特征在于:所述通孔周围还设有若干贯穿所述印刷电路板的卫星孔。
4.如权利要求1所述的防止静电放电的印刷电路板,其特征在于:所述绝缘区的宽度为5~10mil。
5.如权利要求1所述的防止静电放电的印刷电路板,其特征在于:所述印刷电路板为一四层印刷电路板。
6.如权利要求1所述的防止静电放电的印刷电路板,其特征在于:所述印刷电路板为一六层印刷电路板。
CNB2004100774193A 2004-12-09 2004-12-09 防止静电放电的印刷电路板 Expired - Fee Related CN100544542C (zh)

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US11/295,944 US20060124348A1 (en) 2004-12-09 2005-12-06 Printed circuit board with insulative area for electrostatic discharge damage prevention

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