CN100522455C - Dry cleaning system using laser - Google Patents
Dry cleaning system using laser Download PDFInfo
- Publication number
- CN100522455C CN100522455C CNB2006100836729A CN200610083672A CN100522455C CN 100522455 C CN100522455 C CN 100522455C CN B2006100836729 A CNB2006100836729 A CN B2006100836729A CN 200610083672 A CN200610083672 A CN 200610083672A CN 100522455 C CN100522455 C CN 100522455C
- Authority
- CN
- China
- Prior art keywords
- mentioned
- laser beam
- laser
- dry cleaning
- cleaning system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005108 dry cleaning Methods 0.000 title claims abstract description 80
- 238000012360 testing method Methods 0.000 claims abstract description 113
- 238000004140 cleaning Methods 0.000 claims abstract description 44
- 239000004065 semiconductor Substances 0.000 claims abstract description 37
- 239000003344 environmental pollutant Substances 0.000 claims abstract description 33
- 231100000719 pollutant Toxicity 0.000 claims abstract description 33
- 230000005540 biological transmission Effects 0.000 claims abstract description 6
- 239000000428 dust Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 18
- 239000007789 gas Substances 0.000 claims description 15
- 239000000523 sample Substances 0.000 claims description 14
- 238000010521 absorption reaction Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 7
- 230000005484 gravity Effects 0.000 claims description 5
- 230000002787 reinforcement Effects 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 238000000746 purification Methods 0.000 description 14
- 238000005538 encapsulation Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000012856 packing Methods 0.000 description 6
- 239000002351 wastewater Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000013095 identification testing Methods 0.000 description 3
- 239000011805 ball Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000960 laser cooling Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 241000931526 Acer campestre Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 239000007799 cork Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 239000011806 microball Substances 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Cleaning In General (AREA)
Abstract
The invention relates to a dry cleaning system for removing pollutants from a cleaning object by using laser, and aims to provide a dry cleaning system for effectively removing pollutants from a cleaning object by using light energy-laser, in particular to remove pollutants on the surface of a contact part of a semiconductor test socket. According to the present invention, a dry cleaning system using laser light is composed of the following parts: a laser generating device: generating a laser beam; a laser beam transmission device: transmitting a laser beam generated from the laser generating device; a laser beam irradiation device: adjusting the form of the laser beam transmitted by the laser beam transmission device, and irradiating the adjusted laser beam to the cleaning object; a scanning device: the irradiation position of the laser beam irradiation device is adjusted.
Description
Technical field
The invention relates to dry cleaning system and the purification method thereof of utilizing laser, particularly about having suitable structure, be used to remove the pollutant of surperficial contact site of semiconductor test seat board or wafer sort dry cleaning system with probe card (probe card) surface contaminant.
Background technology
Semiconductor test is a kind of electrical test engineering, to judge each quality of semiconductor devices quality of making by packing engineering.In order once to test a large amount of semiconductor devices, our use test seat board, and the surface of above-mentioned test seat board is furnished with a large amount of test benches, thus test each device respectively.
See also shown in Figure 1ly, illustrate the test seat board 100 commonly used that is used for the semiconductor devices electrical test.The size of this test seat board 100 (length and width) is divided into burn-in board (Burn In Board) and Hi-fix board (Hi-Fix board) two big classes according to the testing engineering of semiconductor devices more than 500 * 500mm.
See also shown in Figure 1, the test seat board 100, especially Hi-fix board both sides be furnished with handle 104, for staff's delivery board is provided convenience.And, index hole (Index Hole) 105 is arranged on the above-mentioned test seat board 100, as the benchmark of making accurate plate, the ad-hoc location at plate 100 critically is processed to form above-mentioned index hole 105 usually.The center upper portion of above-mentioned plate 100 is furnished with substantive test seat 102a, 102b, and 102c, so that semiconductor test, the above-mentioned test bench 102a on plate 100,102b, 102c quantity can reach 64,128,256, can assemble 512 at most.
The test bench 102a of two-wire form, be mainly used to test introductory note outlet encapsulation (Small OutlinePackage, SOP), thin introductory note outlet encapsulation (Thin Small Outline Package, TSOP), introductory note outlet J-shaped encapsulation (Small OutlineJ-type Package, device such as SOJ), the lead frame of these semiconductor devices (lead frame) all presents the two-wire form.The test bench 102b of four line morphologies, be used for testing flat-four-side encapsulation (Quad Flat Package, QFP), (Quad Outline Package QOP) waits device, and the lead frame of these semiconductor devices presents four line morphologies in four sides lead-out wire encapsulation.The test bench 102c of the third grid arrangement form, be mainly used to test ball array encapsulation (the Ball Grid Array that gets most of the attention recently, BGA), micro-sphere array encapsulation (micro Ball GridArray, μ BGA), chip size packages (Chip Scale Package, CSP), plate level chip (BoardOn Chip, device such as BOC), these devices are the semiconductor devices form.
Utilize above-mentioned test bench 102a, 102b, the electrical test of the semiconductor devices that 102c carries out is the form according to semiconductor devices, device is contained in corresponding test bench 102a respectively, 102b, the state of 102c is implemented down.Countless devices in continual test process, itself and semiconductor devices and test bench 102a, 102b, the contact site of 102c is contaminated.
As mentioned above, if the contact site on socket surface is contaminated, contact resistance (contactresistance) can increase, and then when colory semiconductor devices tested, contact because of polluting bad, thereby be identified as electric bad.Finally, because the pollution of test bench surface contact site, vital output (Yield) can reduce in production process of semiconductor device.For the phenomenon that prevents that output from lowering, regularly clean the contact site on test bench surface, be a very important engineering.
Past, in order to purify the test bench surface contact site of semiconductor test seat board, perhaps wafer sort is used the probe card surface, the staff purifies test bench contact portion surface or probe card surface with soft brush, perhaps after the dependence test device unloaded test seat board or probe card, the method that adopts chemical wet to purify cleared the pollution off.
; cause the material that probe card or test seat board contact site pollute; by materials such as the tin of forming the wires of semiconductor device frame or lead; these materials continue engaged test seat board contact site in test process; and be attached at body surface tightly; so, utilize the effect of physical cleaning method of soft brush unsatisfactory.
If utilize another kind of purification method-chemical wet method of purification, must unload probe card or test seat board etc. from testing arrangement, so cumbersome.Moreover, utilize the chemical wet method of purification, can discharge a large amount of dirty waste water, cause environmental pollution, therefore, we also need to handle these dirty waste water.
Summary of the invention
A kind of purification method that we press for is, do not need to unload clean object from relevant apparatus, as be used for the probe card of the semiconductor devices on the testing wafer (wafer), and perhaps be used for the test seat board of test package etc., also can remove the method for the pollutant of cleaning object quickly and effectively.
The purpose of this invention is to provide a kind of dry cleaning device, above-mentioned dry cleaning device utilizes luminous energy-laser, removes pollutant, the especially pollutant on semiconductor test seat contact site surface of cleaning object effectively.
Purpose of the present invention is specific as follows: clean object with the laser beam irradiation, particularly whole semiconductor test seat board is removed the pollutant of cleaning object surface according to above-mentioned laser beam comprehensively; Simultaneously, arrange like clockwork and clean object, thus the maximization purification efficiency; In addition, more effectively remove in the purification process or, cleaning the pollutants such as dust that object surface produces through after purifying; And, laser beam is become be more suitable for form and/or the energy density that the semiconductor test seat purifies, particularly utilize to be very beneficial for the laser enforcement dry cleaning that the semiconductor test seat purifies.
Know those skilled in the art person, can be in conjunction with the accompanying drawings and following most preferred embodiment, the purpose and the various advantage of outstanding more the invention described above.
In order to achieve the above object, dry cleaning system of the present invention is made up of following components: generating device of laser: produce laser beam; Laser beam transmitting device: transmit the laser beam that produces from above-mentioned generating device of laser; Laser beam irradiation device: adjust the laser beam form that transmits by above-mentioned laser beam transmitting device, and to cleaning the object irradiation laser beam through adjusting.
Dry cleaning system of the present invention can assemble scanning means, and above-mentioned scanning means moves above-mentioned laser beam irradiation device on above-mentioned clean object, thereby adjusts the laser beam irradiation position of above-mentioned laser beam irradiation device.
Dry cleaning system of the present invention can assemble the arrangement recognition device, so that discern the position of above-mentioned clean object.
Dry cleaning system of the present invention can assemble the laser beam screen, and above-mentioned laser beam screen is positioned at the bottom of above-mentioned laser beam irradiation device, prevents to shine the laser beam of cleaning object surface and leaks.
Dry cleaning system of the present invention can assemble dust arrester, and above-mentioned dust arrester is removed the pollutant of cleaning object surface with suction.
Dry cleaning system of the present invention can assemble air jet system, and above-mentioned air jet system penetrates gases at high pressure, to remove the pollutant of cleaning object surface.
Dry cleaning system of the present invention can assemble dust arrester and air jet system, and wherein, dust arrester is removed the pollutant of cleaning object surface with suction, and air jet system penetrates gases at high pressure, removes the pollutant of cleaning object surface with this.Wherein, above-mentioned dust arrester can capture the pollutant of being removed by above-mentioned air jet system.
Dry cleaning system of the present invention can assemble laser beam screen, dust arrester and air jet system.Wherein, the laser beam screen is positioned at the bottom of above-mentioned laser beam irradiation device, prevents to shine the laser beam of cleaning object surface and leaks; Dust arrester is removed the pollutant of cleaning object surface with suction; Air jet system penetrates gases at high pressure, to remove the pollutant of cleaning object surface.The dust collecting part of above-mentioned dust arrester and the gas of above-mentioned air jet system spray to be deployed in the inside of above-mentioned laser beam screen, and above-mentioned dust collecting part is at the inner pollutant of being removed by above-mentioned air jet system that captures of above-mentioned screen.
Dry cleaning system of the present invention can assemble lays the clean bench (stage) of cleaning object, and the bogey that possesses guider (guide), and above-mentioned bogey guides to above-mentioned clean bench the bottom of above-mentioned laser beam irradiation device.
Above-mentioned generating device of laser of the present invention, can use wavelength is the Nd:YAG laser of 1.06 μ m or 200-1100nm, can use the Nd:YAG laser of wavelength as the mediation of overfrequency (frequencyharmonic) of 532nm.In addition in the present invention, each pulse energy of above-mentioned laser beam can be 10mJ-2000mJ, and the pulse width of above-mentioned laser beam is 1-1000 nanosecond (nanosecond).
Above-mentioned laser beam transmitting device comprises: dispatch tube and at least one speculum that places in the above-mentioned dispatch tube.And above-mentioned laser beam transmitting device can and place a plurality of speculums in the above-mentioned dispatch tube to form by dispatch tube, and wherein, above-mentioned dispatch tube is to form a plurality of joints by a plurality of rotating shafts.
Above-mentioned laser beam irradiation device can be made up of laser beam enlarging section, laser beam form adjustment part and pack portion.Wherein, the laser beam that is transmitted by above-mentioned laser beam transmitting device is responsible for amplifying in the laser beam enlarging section; Laser beam form adjustment part makes the laser beam through amplifying become desired form; Pack portion carries out pack to the laser beam through adjustment, thereby is purified needed laser beam with enough energy densities.At this moment, above-mentioned laser beam enlarging section can be enlarged into 1.2-5.5 doubly with laser beam according to the combination of concave mirror and convex lens.Above-mentioned laser beam form adjustment part can comprise absorption mask (mask), and above-mentioned absorption mask makes laser beam penetrate with rectangular form, absorbs the residue laser beam simultaneously.Above-mentioned pack portion can comprise the cylindrical convex lens that can adjust up and down, by above-mentioned cylindrical convex lens laser beam is carried out pack, thereby adjusts the energy density of laser beam.
In addition, the present invention can assemble video display, and above-mentioned video display is contained on the above-mentioned scanning means, amplifies and show the clean object surface of purification front and back with high magnification.
Arrangement recognition device above-mentioned be responsible for to take is cleaned the ad-hoc location of object, to discern the position of above-mentioned clean object, better be, the index hole above the clean object of above-mentioned camera, and be datum mark with above-mentioned index hole.
In addition, above-mentioned bogey possesses the reinforcement that extends from clean bench towards ground, and the end of above-mentioned reinforcement can be furnished with wheel.
In the present invention, above-mentioned clean object can be semiconductor test seat board and top test bench contact portion thereof.
As mentioned above, dry cleaning device of the present invention utilizes laser, very rapidly removes the pollutant of cleaning object, can realize dry cleaning simultaneously, that is to say, in the process that clears the pollution off, does not produce secondary pollutions such as dirty waste water.
Dry cleaning device of the present invention especially is fit to the purification of semiconductor test seat board, because need not dismantle test bench, compare with original purification method of utilizing soft brush, improve the detergent power of test bench to a great extent, thereby improved testing efficiency, the producing cost of saving great number.
In addition, dry cleaning device of the present invention is compared with original chemical wet method of purification, does not need to dismantle test bench, very rapidly implement to purify, because it is simple to clean automation process, in the volume production engineerings such as making of semiconductor devices, has improved production efficiency to a great extent.
In addition, according to the present invention, the staff can make dry cleaning system easily near testing arrangement by the conveying device on the framework, and manages and keep in repair above-mentioned dry cleaning system like a cork.
Moreover according to the present invention, having only under the laser beam irradiation device state relative with clean object can illuminating laser beam, so, avoid the staff to be subjected to the injury of laser beam in advance.
Description of drawings
Fig. 1 is the skeleton diagram of general semiconductor test board shape.
Fig. 2 is according to one embodiment of present invention, and roughly diagram is used to dry-clean the dry cleaning system ideograph of semiconductor test seat.
Fig. 3 illustrates the main position of dry cleaning system among Fig. 2, is to cleaning the laser beam irradiation device ideograph of object illuminating laser beam.
Fig. 4 will clean the bogey ideograph that object-semiconductor test board is carried to dry system.
Fig. 5 is the dry cleaning system ideograph that roughly illustrates another embodiment of the present invention.
Fig. 6 illustrates the main position of dry cleaning system among Fig. 5.
10: ICU 20,120: generating device of laser
30,130: laser beam transmitting device 40,140: laser beam irradiation device
50,150: scanning means 60: arrange recognition device
72: laser beam screen 74: dust arrester
76: air jet system 80: bogey
The specific embodiment
Below, explain most preferred embodiment of the present invention in conjunction with the accompanying drawings.In the embodiment accompanying drawing below, clean object includes but not limited to semiconductor test seat board and top test bench contact portion thereof, and wafer sort also can be used as clean object with probe card etc.
Seeing also shown in Figure 2ly, is roughly to illustrate the dry cleaning system ideograph of in one embodiment of the present of invention the semiconductor test bench being dry-cleaned.Fig. 3 illustrates the main position of dry cleaning system among Fig. 2, is the laser beam irradiation device ideograph of cleaning object with the laser beam irradiation.Fig. 4 will clean pack into the bogey ideograph of dry system of object-semiconductor test board.
See also shown in Figure 2ly, the dry cleaning system 1 of present embodiment comprises: generating device of laser 20, laser beam transmitting device 30, laser beam irradiation device 40 and scanning means 50 etc.And these devices 20,30,40,50 all are subjected to the control of intrasystem ICU 10.
In the present embodiment, generating device of laser 20 produces laser beam B, to remove clean object, especially tests the pollutant of the test bench 102 on the seat board 100.As the lasing light emitter that purifies test bench 102, Nd:YAG laser is more suitable, and each pulse energy of laser beam that is used to purify test bench 102 is to be advisable between the 10mJ-2000mJ.The pulse width of laser beam (pulse width) with between the 1-1000nanosecond for well, optical maser wavelength can be suitable for two kinds: one is that fundamental wavelength is 1.06 (=1064nm) wavelength, another is to be in harmonious proportion the 532nm wavelength that (frequency harmonic) produce by frequency in the Nd:YAG laser.
The effect of laser beam transmitting device 30 is to be sent to contaminated test bench 102 positions on the test board 100 by the laser beam B that generating device of laser 20 produces.From the laser beam that generating device of laser 20 produces, the initial reflection mirror 34 that is positioned at the porch in a plurality of speculums 34 by laser beam transmitting device 30 is introduced into laser beam transmitting device 30 inside.
In the present embodiment, laser beam transmitting device 30 forms joint prosthesis arm (articulated arm) form of being made up of a plurality of rotating shafts 35 and a plurality of speculum 34, all assembled speculum 34 near each rotating shaft 35, thereby according to the reflection of laser beam, but the teletransmission laser beam.At this moment, in order to ensure the sufficient free degree, can use generally by 7 rotating shafts 35 and 7 joint prosthesis arms that speculum 34 is formed, precision bearing also can be assembled in above-mentioned rotating shaft 35 inside.
Laser beam B by laser beam transmitting device 30 transmits is introduced in the laser beam irradiation device 40.The function of above-mentioned laser beam irradiation device 40 is by lowering or hoisting gear 47, along with Z-axle (or altitude axis) lifting, with laser beam irradiation test bench 102 surfaces, to utilize above-mentioned laser beam that test bench 102 surfaces are purified simultaneously.Above-mentioned lowering or hoisting gear 47 can be adjusted the height of laser beam irradiation device 40 automatically, when the height of test seat board changes, tackles this variation effectively.As shown in Figure 3, above-mentioned laser beam irradiation device 40 is made up of laser beam enlarging section 42, laser beam form adjustment part 44 and laser beam pack portion 46.At this moment, can all use above-mentioned three parts 42,44,46, but can a usefulness part wherein according to purposes.
Please consult shown in Figure 2ly again, laser beam irradiation device 40 is connected with scanning means 50, and laser beam irradiation device 40 moves to X-axle and Y-axle according to the driving of above-mentioned scanning means 50, can purify substantive test seat 102 on the test seat board 100 by this process.Specific as follows: above-mentioned scanning means 50 moves to X-axle and Y-axle with above-mentioned laser beam irradiation device 40 under the state of carrying laser beam irradiation device 40, and test seat board 100 is comprehensively scanned, and purifies all test benches 102 with this.At this moment, above-mentioned scanning means 50 is the structure of portal frame (Gantry) form, can be to drive by servomotor (Servo Motor).
Assembling video display 52 obtains the image on the test bench surface before and after purifying by above-mentioned video display 52 on the above-mentioned scanning means 50, and amplifies and show above-mentioned image with high magnification, so that the staff monitors the purge cases of clean object (or test bench).
In addition, the dry cleaning system 1 of present embodiment also comprises arranges recognition device 60, and above-mentioned arrangement recognition device utilizes camera and/or sensor etc., the tram of identification test seat board 100 on clean bench 82.In the present embodiment, by arranging recognition device 60 identification test seat boards 100 at clean bench (Cleaning Stage; 82) tram on, its effect are that with the ad-hoc location of camera test seat board 100, and the above-mentioned test seat board 100 of calculating when scanning means 50 scans, is its revisal positional value from the distance of reference position on ICU 10.As mentioned above, the ad-hoc location of the test seat board 100 that is recognized by camera, can be most of on test seat board 100 accurate index hole 105 (see figure 1)s that form.
In the present embodiment, the lowering or hoisting gear 47 of above-mentioned generating device of laser 20, scanning means 50, laser beam irradiation device 40, video display 52 and arrangement recognition device 60 all are subjected to the precision control of the ICU 10 in the dry cleaning system 1.
Below in conjunction with Fig. 3, above-mentioned laser beam irradiation device 40 is further described in detail.
In the present embodiment, laser beam irradiation device 40 comprises: laser beam enlarging section 42, laser beam form adjustment part 44 and laser beam pack portion 46.Laser beam enlarging section 42 comprises concave mirror 42a and convex lens 42b, is used for amplifying the size from the laser beam B of laser beam transmitting device 30 (see figure 2)s introducing, by the optical effect of concave and convex lenses, laser beam is amplified to about 1.2-5.5 times.The laser beam that is exaggerated makes scanning means carry out laser beam flying (scanning) rapidly, thereby realizes fast purification.
Laser beam form adjustment part 44 makes circular laser beam become rectangle, so that scanning means carries out accurate scanning.The general laser beam absorption mask 44a that possesses slot that uses only allows the center of circular laser beam penetrate the absorption mask, and remainder is absorbed mask 44a and sponges, thereby forms the rectangle laser beam.
Laser beam pack portion 46 uses convex lens 46a, purifies needed enough laser energy densities so that obtain test bench 102.Above-mentioned laser beam pack portion 46 utilizes convex lens 46a, and the rectangle laser beam that forms on the laser beam form adjustment part 44 is carried out pack, thereby obtains enough big or small laser beam energy density (J/cm
2).At this moment, above-mentioned convex lens 46a can use cylindrical convex lens (cylindrical convexlens), changes the position of above-mentioned convex lens 46a with this, adjusts the laser beam size that arrives test bench 102 surfaces, by this adjustment, adjusts the energy density of laser beam effectively.
In purification process, get to test bench 102 surfaces by the laser beam that laser beam irradiation device 40 penetrates, cause scattering or reflection and expose.In order to suppress or to minimize this phenomenon, the dry cleaning system 1 of present embodiment also comprises laser beam screen 72.Above-mentioned laser beam screen 72 adopts the material that effectively absorbs laser beam to make, and forms circular or square chest form, and above-mentioned laser beam screen thing can be contained in the bottom of laser beam irradiation device 40.
The dry cleaning system 1 of present embodiment is made up of air jet system 76 and dust arrester 74, thereby effectively, for good and all remove the pollutant-dust that produces in the purification process, above-mentioned air jet system 76 comprises gas supply source 76a, gas flow controller 76b and the nozzle type gas injection 76c of portion.Wherein, the above-mentioned gas injection 76c of portion sprays the effluent air from gas supply source 76a process gas flow controller 74b to test seat board 100, thereby removes the pollutant on the test seat board 100.The effect of above-mentioned dust arrester 74 is, captures and the permanent pollutant of removing the dust state of removing from test seat board 100, and above-mentioned dust collecting part comprises: the dust collecting part 74b of absorption pollutant; Be connected to dust collecting part, the suction pump 74a of absorption pollutant.At this moment, above-mentioned dust collecting part 74b and the gas injection 76c of portion can pack in the above-mentioned laser beam screen 72.Above-mentioned screen 72, dust arrester 74 and air jet system 76, except have preventing laser and itself function such as clear the pollution off, prevent the dust pollution surrounding enviroment in addition, with the advantage of the optical system of protection laser beam irradiation device 40.
Seeing also shown in Figure 4ly below, specify clean object, can be to be further described in detail testing the bogey 80 that seat board 100 is aligned to cleaning positions exactly.
The size of general test seat board 100 weighs very greatly, and more than length and width 1m, weight reaches more than the 50kg.Therefore, we require a kind of bogey 80, with dry cleaning system 1 inside of test seat board 100 introducing present embodiments.As shown in Figure 4, if clean bench 82 is along with guider 84 skids off (Sliding) system 1 outside, the staff just catches handle 104 (see figure 1)s of test seat board 100, settles test seat board 100 on the clean bench 82 that skids off the system outside.Afterwards, clean bench 82 is pushed in the system again, when the test seat board 104 pack into (loading) safety cleaning positions, just utilize laser that test bench is cleaned.
Above-mentioned drawer type bearing method with the massive test seat board 100 safe cleaning fields of packing into easily, thereby is implemented stable cleaning project.How many test seat boards 100 of packing into like this has some site errors, the accurate position of the arrangement recognition device 60 identification test seat boards 100 in the system 1 of packing into this moment, and the calculating location error, when carrying out laser beam flying, with automatic compensating error in order to implement test bench to purify.And, in the time of will testing seat board 100 and put into slip clean bench 82,, prevent from simultaneously platform 80 sagging to take place because of the weight of test seat board 100 for the platform of packing into easily, can be equipped with the reinforcement 82a of wheel 82b in sliding stand 82 bottoms.
An embodiment according to the invention described above, do not need to dismantle test bench, utilize laser just can effectively and not produce any dirty waste water rapidly, remove the pollutant on the test bench contact portion surface that is contained on the semiconductor test seat board in the dry-cleaning mode, be applicable to the Computer-Assisted Design, Manufacture And Test engineering of practical semiconductor IC device simultaneously.
See also shown in Figure 5ly, roughly illustrate the dry cleaning system of another embodiment of the present invention, Fig. 6 amplifies and illustrates the part dry cleaning system.
See also shown in Figure 5, the dry cleaning system 100 of present embodiment also comprises: laser beam generating device 120, laser beam transmitting device 130, laser beam irradiation device 140 and laser beam flying device 150 etc., these devices 120,130,140,150 all are contained on the framework 110.
Specific as follows: that above-mentioned laser beam generating device 120 directly is contained on the framework 110, and connect successively under the state of laser beam transmitting device 130, laser beam irradiation device 140 and laser beam flying device 150, on framework 110, directly connect laser beam transmitting device 130, with this said apparatus 120,130,140,150 all pack in the framework 110, realize integrated.And, the bottom surface of said frame 110 assembling conveying device 180, the staff can freely carry said frame 110 like this, and freely the carrying of these frameworks 110, make above-mentioned each device 120,130,140,150 near or away from clean object, above-mentioned these devices 120,130,140,150th, generation under the state of framework 110 of packing into, transmission, irradiation and scanning laser beam.
Above-mentioned conveying device 180 can form wheel structure, delivery track structure or other structures, and according to most preferred embodiment of the present invention, above-mentioned conveying device 180 is used wheel, can be to use the wheel of diameter more than 50mm.At this moment, conveying device can be installed wheel and brake (brake), in order to avoid the dry cleaning system 100 of present embodiment optionally moves.And then on said frame 110, assemble handle 117, with the conveying of help with the dry cleaning system 100 of its formation one.
Above-mentioned laser beam generating device 120 is made up of following components: the laser oscillator 121 that produces laser beam; The electric supply installation 122 of high-tension electricity is provided to above-mentioned laser oscillator 121; The constant laser cooler 123 of keeping laser oscillator 121 temperature; Control the ICU 124 of electric supply installation 122, laser oscillator 121 and cooler 123 comprehensively.
Simultaneously, the upside fitting operation panel 112 of said frame 110 is so that staff's input parameter is carried out various cleaning commands.Though it is not shown in the accompanying drawing, but aforesaid operations panel 112 possesses a plurality of load buttons or input switch, in order to signal for above-mentioned ICU 124 and to form electrical connection, so that the staff imports the needed various signals of laser cleaning project on above-mentioned ICU 124.
And, the bottom assembling floor push 114 (foot switch) of said frame 110.In the present embodiment, above-mentioned floor push 114 is connected on the above-mentioned ICU 124, staff's irradiation switch (On-Off) of operating laser beam easily that just tramps with one's feet.That is to say that the staff is sent to the vibration order of laser beam on the above-mentioned ICU 124 more easily by floor push 114.
Above-mentioned laser cooler 123 adopts water-cooled, and its effect is that it is impaired because of the rising of laser temperature to avoid cleaning object.The dry cleaning system 100 of present embodiment, form the structure of carrying on the whole by conveying device 180, so above-mentioned laser cooler 123 can adopt inner loop refrigerant (particularly cooling water) is used for the circulating of laser cooling, rather than the refrigerant that will introduce from the outside is used for the laser cooling.
Laser beam transmitting device 130 is made into joint prosthesis arm (articulated arm) form, and above-mentioned joint prosthesis arm is made up of a plurality of rotating shafts 135 and speculum 134.At this moment, near the corresponding speculum of assembling each rotating shaft, according to the reflection of laser beam, can long-range transmission laser bundle.
See also shown in Figure 6ly, illustrate the laser beam irradiation device 140 of present embodiment, the same with original technology, above-mentioned laser beam irradiation device also is made up of laser beam enlarging section 142, laser beam form adjustment part 144 and laser beam pack portion 146.But laser beam irradiation device 140 forms right-angle structure, therefore, in order to change the direction of illumination of laser beam, has assembled speculum 146a on laser beam irradiation device 140 in the present embodiment.
The terminal assembly sensor 149 of laser beam irradiation device 140, the sensor 149 is sensed laser beam irradiation device 140 and any one relative bottom surface contact, and the 124 transmission induced signals of the ICU in Fig. 5, could outgoing laser beam B but only sense above-mentioned contact.
Under the effect of the sensor 149, removed the danger that the staff is caused that exposes of any irradiation of laser beam and laser beam.In the present embodiment, the sensor 149 is sensed the bottom surface, and sliding part 152 surfaces of promptly following laser beam flying device 150 contact with each other with laser beam irradiation device 140, and induced signal is sent on the ICU, only sense above-mentioned contact, laser beam could shine cleans object.The sensor 149 can be the proximity sensor that utilizes magnetic force, or utilizes the optical sensor of light, perhaps only can sense the gravity sensor of down direction according to gravity.
Laser beam flying device 150 is parts that laser beam is scanned, clean object-probe card or test bench thereby purify comprehensively, above-mentioned laser beam flying device is made up of the guiding anchor clamps 154 that the sliding part 152 that moves to the x-y axle, the above-mentioned sliding part 152 of guiding slide.At this moment, above-mentioned sliding part 152 is connected to the end of laser beam irradiation device 140, and above-mentioned guiding anchor clamps 154 then are contained in the arbitrary portions such as pedestal of test seat board.
According to most preferred embodiment of the present invention, the staff can be by manual operation of moving laser beam irradiation device 140 with hand and the method that makes sliding part 152 horizontal slips according to manual operation, the above-mentioned laser beam irradiation device 140 of horizontal feed, its throughput direction is the direction to the free scanning laser beam of two dimensional surface of x axle and y axle, at this moment, above-mentioned sliding part 152 is in the gathering sill slides within of guiding anchor clamps 154.
See also Fig. 5 and shown in Figure 6, utilize the cleaning project of the dry cleaning system 100 of present embodiment to be described as follows successively.At first, sliding part 152 anchor clamps 154 that will slidably lead are placed on clean object-test bench or the probe card, and the end with laser beam irradiation device 140 is fixed on the sliding part 152 then.Then, confirm the contact condition of laser beam irradiation device 140 and sliding part 152 according to the induction of sensor 149, if recognize above-mentioned contact, the staff then steps on floor push 114, cleans object with the laser beam irradiation, thereby implements cleaning project.At this moment, before the above-mentioned floor push 114 of operation, can purify needed various command by guidance panel 112 inputs.
Next, state before the cleaning project on the implementation, if dry cleaning system 100 is away from clean object, the staff just utilizes conveying device 180 that dry cleaning system 100 is delivered to can implement the position that laser purifies, and the staff utilizes brake to control the operation of whole dry cleaning system 100 afterwards.
Foregoing has just illustrated a most preferred embodiment of the present invention, and those skilled in the art should be understood that under the situation that does not change main points of the present invention, the present invention can modifications and changes.
Claims (30)
1, a kind of dry cleaning system that utilizes laser is characterized in that it comprises following components:
Produce the generating device of laser of laser beam;
Transmission is from the laser beam transmitting device of the laser beam of above-mentioned generating device of laser generation;
Adjusts the laser beam form that transmits by above-mentioned laser beam transmitting device, and shine the laser beam irradiation device of cleaning object, and this laser beam irradiation device is made up of following components with the laser beam of process adjustment:
Laser beam enlarging section: amplify the laser beam that transmits from above-mentioned laser beam transmitting device;
Laser beam form adjustment part: make the laser beam that amplifies through above-mentioned laser beam enlarging section become required form;
Pack portion: the laser beam through above-mentioned laser beam form adjustment part is carried out pack, thereby obtain cleaning the laser beam of needed enough energy densities.
2, the dry cleaning system that utilizes laser according to claim 1, it is characterized in that it comprises a scanning means more, above-mentioned scanning means moves laser beam irradiation device on above-mentioned clean object, to adjust the laser beam irradiation position of above-mentioned laser beam irradiation device.
3, the dry cleaning system that utilizes laser according to claim 1 is characterized in that it comprises an arrangement recognition device more, and above-mentioned arrangement recognition device is discerned the position of above-mentioned clean object.
4, the dry cleaning system that utilizes laser according to claim 1, it is characterized in that it comprises a laser beam screen more, above-mentioned laser beam screen is positioned at the bottom of above-mentioned laser beam irradiation device, prevents to shine the laser beam of cleaning object surface and leaks.
5, the dry cleaning system that utilizes laser according to claim 1 is characterized in that it comprises a dust arrester more, and above-mentioned dust arrester is removed the pollutant of cleaning object surface with suction.
6, the dry cleaning system that utilizes laser according to claim 1 is characterized in that it comprises an air jet system more, and above-mentioned air jet system penetrates gases at high pressure, to remove the pollutant of cleaning object surface.
7, the dry cleaning system that utilizes laser according to claim 1, it is characterized in that it comprises dust arrester and air jet system, wherein, dust arrester is removed the pollutant of cleaning object surface with suction, and air jet system penetrates gases at high pressure, remove the pollutant of cleaning object surface, the feature of above-mentioned dust arrester is to capture the pollutant of being removed by above-mentioned air jet system.
8, the dry cleaning system that utilizes laser according to claim 1, it comprises the laser beam screen, dust arrester and air jet system, wherein, the laser beam screen is positioned at the bottom of above-mentioned laser beam irradiation device, preventing to shine the laser beam of cleaning object surface exposes, dust arrester is removed the pollutant of cleaning object surface with suction, air jet system penetrates gases at high pressure, remove the pollutant of cleaning object surface, pack into the inside of above-mentioned laser beam screen of the gas injection portion that it is characterized in that the dust collecting part of above-mentioned dust arrester and above-mentioned air jet system, above-mentioned dust collecting part is at the inner pollutant of being removed by above-mentioned air jet system that captures of above-mentioned screen.
9, the dry cleaning system that utilizes laser according to claim 1, it is characterized in that it comprises a bogey more, above-mentioned bogey possesses lays clean bench and the guider of cleaning object, and above-mentioned guider guides the bottom of above-mentioned clean bench to above-mentioned laser beam irradiation device.
10, the dry cleaning system that utilizes laser according to claim 1 is characterized in that it is the Nd:YAG laser of 1.06 μ m that above-mentioned generating device of laser adopts wavelength.
11, the dry cleaning system that utilizes laser according to claim 1 is characterized in that it is the Nd:YAG laser of 200-1100nm and overfrequency mediation that above-mentioned generating device of laser adopts wavelength.
12, the dry cleaning system that utilizes laser according to claim 1, each pulse energy that it is characterized in that above-mentioned laser beam is 10mJ-2000mJ, the pulse width of above-mentioned laser beam is the 1-1000 nanosecond.
13, the dry cleaning system that utilizes laser according to claim 1 is characterized in that above-mentioned laser beam transmitting device comprises dispatch tube and at least one speculum that is positioned at above-mentioned dispatch tube.
14, the dry cleaning system that utilizes laser according to claim 1 is characterized in that above-mentioned laser beam transmitting device is made up of dispatch tube and a plurality of speculums of being positioned at above-mentioned dispatch tube inside, and wherein dispatch tube forms a plurality of joints by a plurality of rotating shafts.
15, the dry cleaning system that utilizes laser according to claim 1 is characterized in that the combination of above-mentioned laser beam enlarging section according to concave mirror and convex lens, and laser beam is amplified 1.2-5.5 doubly.
16, the dry cleaning system that utilizes laser according to claim 15 is characterized in that above-mentioned laser beam form adjustment part comprises an absorption mask, and above-mentioned absorption mask only allows the part laser beam pass with required form, absorbs all the other laser beams simultaneously.
17, the dry cleaning system that utilizes laser according to claim 16 is characterized in that above-mentioned absorption mask makes laser beam pass with rectangular form.
18, the dry cleaning system that utilizes laser according to claim 16 is characterized in that above-mentioned pack portion comprises the cylindrical convex lens of adjusting height up and down, by above-mentioned cylindrical convex lens laser beam is carried out pack, thereby adjusts the energy density of laser beam.
19, the dry cleaning system that utilizes laser according to claim 2 is characterized in that it also comprises a video display, and above-mentioned video display is contained on the above-mentioned scanning means, amplifies the clean object surface that shows before and after purifying with high magnification.
20, the dry cleaning system that utilizes laser according to claim 3 is characterized in that above-mentioned arrangement recognition device is responsible for taking the ad-hoc location of cleaning object, to discern the position of above-mentioned clean object.
21, the dry cleaning system that utilizes laser according to claim 3, the camera that it is characterized in that above-mentioned arrangement recognition device are responsible for taking and are cleaned the index hole that forms on the object, and with this index hole as datum mark.
22, the dry cleaning system that utilizes laser according to claim 9 is characterized in that above-mentioned bogey possesses the reinforcement that extends from clean bench towards ground, and the end of above-mentioned reinforcement is furnished with wheel.
23,, it is characterized in that above-mentioned clean object is semiconductor test seat board or wafer sort probe card according to any one described dry cleaning system that utilizes laser of claim 1-22.
24, the dry cleaning system that utilizes laser according to claim 1, it is characterized in that it comprises above-mentioned generating device of laser, laser beam transmitting device, laser beam irradiation device at least, also comprise a framework, assembled conveying device on the said frame, made above-mentioned generating device of laser, laser beam transmitting device, laser beam irradiation device shift to clean object.
25, the dry cleaning system that utilizes laser according to claim 24 is characterized in that above-mentioned conveying device forms wheel structure or delivery track structure.
26, the dry cleaning system that utilizes laser according to claim 24 is characterized in that above-mentioned laser beam generating device comprises following components: the laser oscillator that produces laser beam; Connect the electric supply installation of power supply for above-mentioned laser oscillator; Be responsible for the controller of above-mentioned laser oscillator of control and electric supply installation.
27, the dry cleaning system that utilizes laser according to claim 26 is characterized in that above-mentioned laser beam generating device also comprises a cooler, and above-mentioned cooler cools off above-mentioned laser oscillator under the control of above-mentioned controller.
28, the dry cleaning system that utilizes laser according to claim 26 is characterized in that the said frame bottom also assembles a floor push, and above-mentioned floor push is stepped on operation according to staff's pin, opens and closes above-mentioned laser beam device.
29, the dry cleaning system that utilizes laser according to claim 1, it is characterized in that it also comprises a sensor, be disposed at the end of this laser beam irradiation device, and the sensor is sensed above-mentioned laser beam irradiation device and whether is contacted the part relative with this laser beam irradiation device.
30, the dry cleaning system that utilizes laser according to claim 1 is characterized in that it also comprises a gravity sensor, be disposed at the end of above-mentioned laser beam irradiation device, and above-mentioned gravity sensor is responded to the gravity of down direction all the time.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050048026 | 2005-06-03 | ||
KR1020050048026A KR100797787B1 (en) | 2005-06-03 | 2005-06-03 | Dry cleaning system using a laser |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1939643A CN1939643A (en) | 2007-04-04 |
CN100522455C true CN100522455C (en) | 2009-08-05 |
Family
ID=37730241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100836729A Expired - Fee Related CN100522455C (en) | 2005-06-03 | 2006-06-02 | Dry cleaning system using laser |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100797787B1 (en) |
CN (1) | CN100522455C (en) |
TW (1) | TWI311646B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI572863B (en) * | 2014-12-23 | 2017-03-01 | Imt有限公司 | Wafer test machine including laser cleaning function |
Families Citing this family (83)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100873332B1 (en) * | 2007-09-19 | 2008-12-10 | 세메스 주식회사 | Method and apparatus of cleaning a substrate |
KR100961469B1 (en) | 2008-05-06 | 2010-06-08 | 세메스 주식회사 | Apparatus and method of cleaning substrate |
JP5623786B2 (en) | 2009-05-22 | 2014-11-12 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | Thin film deposition equipment |
JP5620146B2 (en) | 2009-05-22 | 2014-11-05 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | Thin film deposition equipment |
US8882920B2 (en) | 2009-06-05 | 2014-11-11 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
US8882921B2 (en) | 2009-06-08 | 2014-11-11 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
US9174250B2 (en) | 2009-06-09 | 2015-11-03 | Samsung Display Co., Ltd. | Method and apparatus for cleaning organic deposition materials |
US8802200B2 (en) | 2009-06-09 | 2014-08-12 | Samsung Display Co., Ltd. | Method and apparatus for cleaning organic deposition materials |
CN101574697B (en) * | 2009-06-15 | 2010-10-13 | 长春理工大学 | Portable all solid state dual wavelength laser cleaner |
KR101097311B1 (en) | 2009-06-24 | 2011-12-21 | 삼성모바일디스플레이주식회사 | Organic light emitting display apparatus and apparatus for thin layer deposition for manufacturing the same |
DE112010003736T5 (en) * | 2009-08-06 | 2013-02-28 | Applied Materials, Inc. | Scratches of transverse ISO lines, linking, and simplified laser and scanner controls |
KR101127578B1 (en) | 2009-08-24 | 2012-03-23 | 삼성모바일디스플레이주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
JP5676175B2 (en) | 2009-08-24 | 2015-02-25 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | Thin film deposition apparatus and organic light emitting display device manufacturing method using the same |
US8486737B2 (en) | 2009-08-25 | 2013-07-16 | Samsung Display Co., Ltd. | Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same |
JP5677785B2 (en) | 2009-08-27 | 2015-02-25 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | Thin film deposition apparatus and organic light emitting display device manufacturing method using the same |
US8696815B2 (en) | 2009-09-01 | 2014-04-15 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
US8876975B2 (en) | 2009-10-19 | 2014-11-04 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
KR101146982B1 (en) | 2009-11-20 | 2012-05-22 | 삼성모바일디스플레이주식회사 | Aapparatus for thin layer deposition and method of manufacturing organic light emitting display apparatus |
KR101084184B1 (en) | 2010-01-11 | 2011-11-17 | 삼성모바일디스플레이주식회사 | Apparatus for thin layer deposition |
KR101174875B1 (en) | 2010-01-14 | 2012-08-17 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
JP5471514B2 (en) * | 2010-01-28 | 2014-04-16 | ウシオ電機株式会社 | Light processing equipment |
KR101193186B1 (en) | 2010-02-01 | 2012-10-19 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
KR101156441B1 (en) | 2010-03-11 | 2012-06-18 | 삼성모바일디스플레이주식회사 | Apparatus for thin layer deposition |
US8894458B2 (en) | 2010-04-28 | 2014-11-25 | Samsung Display Co., Ltd. | Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method |
KR101135499B1 (en) * | 2010-05-28 | 2012-04-13 | 삼성에스디아이 주식회사 | Laser cleaning device of electrode tab for battery and laser cleaning method using the same |
KR101223723B1 (en) | 2010-07-07 | 2013-01-18 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
KR101673017B1 (en) | 2010-07-30 | 2016-11-07 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition and method for manufacturing of organic light emitting display apparatus using the same |
KR20120029166A (en) | 2010-09-16 | 2012-03-26 | 삼성모바일디스플레이주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
KR101678056B1 (en) | 2010-09-16 | 2016-11-22 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
KR101738531B1 (en) | 2010-10-22 | 2017-05-23 | 삼성디스플레이 주식회사 | Method for manufacturing of organic light emitting display apparatus, and organic light emitting display apparatus manufactured by the method |
KR101723506B1 (en) | 2010-10-22 | 2017-04-19 | 삼성디스플레이 주식회사 | Apparatus for organic layer deposition and method for manufacturing of organic light emitting display apparatus using the same |
KR20120045865A (en) | 2010-11-01 | 2012-05-09 | 삼성모바일디스플레이주식회사 | Apparatus for organic layer deposition |
KR20120065789A (en) | 2010-12-13 | 2012-06-21 | 삼성모바일디스플레이주식회사 | Apparatus for organic layer deposition |
KR101760897B1 (en) | 2011-01-12 | 2017-07-25 | 삼성디스플레이 주식회사 | Deposition source and apparatus for organic layer deposition having the same |
KR20120097893A (en) | 2011-02-25 | 2012-09-05 | 삼성전자주식회사 | Photomask cleaning apparatus and cleaning method of photomask using thereby |
KR101923174B1 (en) | 2011-05-11 | 2018-11-29 | 삼성디스플레이 주식회사 | ESC, apparatus for thin layer deposition therewith, and method for manufacturing of organic light emitting display apparatus using the same |
KR101857992B1 (en) | 2011-05-25 | 2018-05-16 | 삼성디스플레이 주식회사 | Patterning slit sheet assembly, apparatus for organic layer deposition, method for manufacturing organic light emitting display apparatus and organic light emitting display apparatus |
KR101840654B1 (en) | 2011-05-25 | 2018-03-22 | 삼성디스플레이 주식회사 | Apparatus for organic layer deposition and method for manufacturing of organic light emitting display apparatus using the same |
KR101852517B1 (en) | 2011-05-25 | 2018-04-27 | 삼성디스플레이 주식회사 | Apparatus for organic layer deposition and method for manufacturing of organic light emitting display apparatus using the same |
KR101857249B1 (en) | 2011-05-27 | 2018-05-14 | 삼성디스플레이 주식회사 | Patterning slit sheet assembly, apparatus for organic layer deposition, method for manufacturing organic light emitting display apparatus and organic light emitting display apparatus |
KR101826068B1 (en) | 2011-07-04 | 2018-02-07 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition |
KR20130004830A (en) | 2011-07-04 | 2013-01-14 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition and method for manufacturing of organic light emitting display apparatus using the same |
KR20130010730A (en) | 2011-07-19 | 2013-01-29 | 삼성디스플레이 주식회사 | Deposition source and deposition apparatus with the same |
KR20130015144A (en) | 2011-08-02 | 2013-02-13 | 삼성디스플레이 주식회사 | Deposition source, apparatus for organic layer deposition and method for manufacturing of organic light emitting display apparatus using the same |
KR20130069037A (en) | 2011-12-16 | 2013-06-26 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus |
KR102015872B1 (en) | 2012-06-22 | 2019-10-22 | 삼성디스플레이 주식회사 | Apparatus for organic layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
US9496524B2 (en) | 2012-07-10 | 2016-11-15 | Samsung Display Co., Ltd. | Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method |
KR101959974B1 (en) | 2012-07-10 | 2019-07-16 | 삼성디스플레이 주식회사 | Apparatus for organic layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
US10407821B2 (en) | 2012-07-10 | 2019-09-10 | Woodrow Scientific Ltd. | Methods and apparatus for laser cleaning |
US9461277B2 (en) | 2012-07-10 | 2016-10-04 | Samsung Display Co., Ltd. | Organic light emitting display apparatus |
EP2872687B1 (en) | 2012-07-10 | 2018-05-09 | Woodrow Scientific Limited | Methods and apparatus for laser cleaning of fabric materials |
KR102013315B1 (en) | 2012-07-10 | 2019-08-23 | 삼성디스플레이 주식회사 | Method for manufacturing of organic light emitting display apparatus and organic light emitting display apparatus manufactured by the method |
KR101632298B1 (en) | 2012-07-16 | 2016-06-22 | 삼성디스플레이 주식회사 | Flat panel display device and manufacturing method thereof |
KR102013318B1 (en) | 2012-09-20 | 2019-08-23 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus |
KR101994838B1 (en) | 2012-09-24 | 2019-10-01 | 삼성디스플레이 주식회사 | Apparatus for organic layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
KR20140050994A (en) | 2012-10-22 | 2014-04-30 | 삼성디스플레이 주식회사 | Organic light emitting display apparatus and method for manufacturing the same |
KR102052069B1 (en) | 2012-11-09 | 2019-12-05 | 삼성디스플레이 주식회사 | Apparatus for organic layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
KR102075525B1 (en) | 2013-03-20 | 2020-02-11 | 삼성디스플레이 주식회사 | Deposition apparatus for organic layer, method for manufacturing organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method |
KR20140118551A (en) | 2013-03-29 | 2014-10-08 | 삼성디스플레이 주식회사 | Deposition apparatus, method for manufacturing organic light emitting display apparatus and organic light emitting display apparatus |
KR102037376B1 (en) | 2013-04-18 | 2019-10-29 | 삼성디스플레이 주식회사 | Patterning slit sheet, deposition apparatus comprising the same, method for manufacturing organic light emitting display apparatus using the same, organic light emitting display apparatus manufacture by the method |
KR102081284B1 (en) | 2013-04-18 | 2020-02-26 | 삼성디스플레이 주식회사 | Deposition apparatus, method for manufacturing organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the same |
KR101446433B1 (en) * | 2013-05-24 | 2014-10-06 | 주식회사 아이엠티 | Apparatus and method for dry cleaning of wafer backside using laser beam |
KR102107104B1 (en) | 2013-06-17 | 2020-05-07 | 삼성디스플레이 주식회사 | Apparatus for organic layer deposition, and method for manufacturing of organic light emitting display apparatus using the same |
KR102108361B1 (en) | 2013-06-24 | 2020-05-11 | 삼성디스플레이 주식회사 | Apparatus for monitoring deposition rate, apparatus for organic layer deposition using the same, method for monitoring deposition rate, and method for manufacturing of organic light emitting display apparatus using the same |
DE102013114706B4 (en) * | 2013-12-20 | 2017-02-16 | Sandvik Surface Solutions Division Of Sandvik Materials Technology Deutschland Gmbh | Cleaning of press plates or rotating press belts |
KR102162797B1 (en) | 2013-12-23 | 2020-10-08 | 삼성디스플레이 주식회사 | Method for manufacturing of organic light emitting display apparatus |
WO2015133689A1 (en) * | 2014-03-06 | 2015-09-11 | 주식회사 아이엠티 | Device and method for cleaning backside or edge of wafer |
CN104526158B (en) * | 2014-11-29 | 2016-05-04 | 宁波江东思犒技术服务有限公司 | For the laser cleaner of annular magnetic steel |
TWI573651B (en) * | 2015-03-06 | 2017-03-11 | Giga Solution Technology Co Ltd | Conductive plastic recycling method |
CN105215007A (en) * | 2015-09-28 | 2016-01-06 | 中国科学院半导体研究所 | The light path system of body surface pollutant cleaning |
KR102460433B1 (en) * | 2015-11-30 | 2022-10-27 | 재단법인 포항산업과학연구원 | Apparatus for cleaning part of deposition device |
KR102476687B1 (en) * | 2015-11-30 | 2022-12-09 | 재단법인 포항산업과학연구원 | Apparatus and method for cleaning surface of material |
KR101865594B1 (en) | 2016-08-11 | 2018-06-08 | (주)성현 테크놀로지 | apparatus and method for cleaning parts of semiconductor equipment |
CN106345752B (en) * | 2016-08-22 | 2018-08-07 | 沧州致胜机器人科技有限公司 | A kind of double four-rotor helicopter photovoltaic laser wiping board systems |
TWI651136B (en) * | 2017-06-14 | 2019-02-21 | 財團法人工業技術研究院 | Laser cleaning device and method |
TWI686256B (en) | 2018-04-13 | 2020-03-01 | 財團法人工業技術研究院 | Laser cleaning apparatus and method |
KR102104874B1 (en) * | 2018-10-05 | 2020-04-27 | 대보산업(주) | Laser Surface Processing Method and Surface Processing Device of Circular Bar Using High Speed Vibration Laser Scanner |
CN110773518B (en) * | 2019-11-06 | 2021-01-22 | 哈尔滨工业大学 | Laser cleaning real-time monitoring device and method |
KR102166122B1 (en) | 2020-04-13 | 2020-10-15 | 케이알건설 주식회사 | Method for removal a rust or paint of meterial |
KR102432964B1 (en) | 2020-11-16 | 2022-08-18 | (주)티티에스 | Restoration apparatus of parts surfice |
KR20220167158A (en) * | 2021-06-11 | 2022-12-20 | (주)테크윙 | Apparatus for cleaning socket and method for cleaning socket |
CN115892924A (en) * | 2022-11-23 | 2023-04-04 | 湖北中烟工业有限责任公司 | Laser belt cleaning device suitable for filament cutter copper bar chain |
CN115841969B (en) * | 2022-12-12 | 2023-09-08 | 江苏宜兴德融科技有限公司 | Laser passivation equipment and passivation method for semiconductor device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200264546Y1 (en) * | 2001-09-28 | 2002-02-19 | 이수용 | A safety helmet |
KR100433174B1 (en) * | 2003-10-23 | 2004-05-28 | 주식회사 아이엠티 | Apparatus and method for dry cleaning of injection nozzle using a laser |
-
2005
- 2005-06-03 KR KR1020050048026A patent/KR100797787B1/en active IP Right Grant
-
2006
- 2006-06-01 TW TW095119342A patent/TWI311646B/en active
- 2006-06-02 CN CNB2006100836729A patent/CN100522455C/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI572863B (en) * | 2014-12-23 | 2017-03-01 | Imt有限公司 | Wafer test machine including laser cleaning function |
Also Published As
Publication number | Publication date |
---|---|
KR100797787B1 (en) | 2008-01-24 |
TWI311646B (en) | 2009-07-01 |
KR20060126267A (en) | 2006-12-07 |
CN1939643A (en) | 2007-04-04 |
TW200700728A (en) | 2007-01-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100522455C (en) | Dry cleaning system using laser | |
TW451364B (en) | Method and apparatus for removing a plastic resin encapsulant from an encapsulated integrated circuit | |
KR20010030380A (en) | Mechanism and method for controlling the focal point position of uv light and apparatus and method for inspection | |
US7473321B2 (en) | Laser treatment apparatus | |
JP2009512230A (en) | Method and apparatus utilizing optical criteria | |
CN109822350A (en) | Multistation intelligently assembles detection device | |
KR101877432B1 (en) | Method of auto focusing and auto cleaning Needles of a Probe Card | |
CN103857269A (en) | Management system | |
KR101326022B1 (en) | Automatic rework apparatus for bga, smd | |
CN112871725A (en) | Automatic test marking system and method for semiconductor laser | |
KR102081594B1 (en) | X-ray inspection apparatus | |
WO2016104942A1 (en) | Wafer inspection equipment having laser cleaning function | |
CN115863197A (en) | Bonded wafer bubble detection device and sorting system | |
KR100708230B1 (en) | Mobile dry cleaning apparatus | |
KR100639402B1 (en) | Method and apparatus for dry cleaning of image sensor using a laser | |
CN206010383U (en) | A kind of automation integrated equipment for processing inlet manifold | |
CN109332216A (en) | COB optical assembly automatic test machine | |
CN219598439U (en) | Laser coding equipment for chip process data tracing | |
CN218481432U (en) | High-precision detection device for surface defects of optical element | |
CN219085934U (en) | Wafer needle tester | |
CN219121315U (en) | CCD-based mobile phone camera size visual detection device | |
CN219245374U (en) | Trigger device and system for chip defect detection | |
CN217954279U (en) | Two-sided high-speed AOI detects machine | |
CN220962127U (en) | Dust removing equipment for photomask | |
CN214953135U (en) | Lithium cell word double-sided detection device and system based on visual detection |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090805 Termination date: 20110602 |