CN100518969C - Low-temperature vacuum themal dissociation waste printed wiring board preprocessing method - Google Patents
Low-temperature vacuum themal dissociation waste printed wiring board preprocessing method Download PDFInfo
- Publication number
- CN100518969C CN100518969C CNB2006101131091A CN200610113109A CN100518969C CN 100518969 C CN100518969 C CN 100518969C CN B2006101131091 A CNB2006101131091 A CN B2006101131091A CN 200610113109 A CN200610113109 A CN 200610113109A CN 100518969 C CN100518969 C CN 100518969C
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- China
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- waste printed
- vacuum
- circuit board
- temperature
- printed circuit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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- Processing Of Solid Wastes (AREA)
Abstract
The invention discloses a predisposing method of low-temperature vacuum pyrolytic waste print circuit in the resource recycling technological domain, which comprises the following steps: placing waste print circuit board in the vacuum pyrolytic furnace, starting pyrolytic furnace to heat, starting vacuum pump, maintaining vacuum degree at 30-1000pa, stopping heating after the inner furnace temperature reaches 200-300 deg.c, insulating, cooling, grinding the waste print circuit board, sieving.
Description
Technical field
The present invention relates to the waste printed circuit board recovery and utilization technology, particularly a kind of method of utilizing low-temperature vacuum themal dissociation preliminary treatment waste printed circuit board belongs to resource recovery technology field.
Background technology
Printed substrate is the important component part in the various electric equipment products.Along with the fast development of electronics, IT industry, the output of printed substrate also increases sharply, and has also brought increasingly serious waste printed circuit plate problem thus.
There is the composition that can cause serious harm in a large number in the waste printed circuit board,, will causes environment and Health cost as not carrying out suitable disposal and handling such as brominated flame-retardant, each heavy metal species composition etc. to environment.But, consider that from the angle that resource reclaims waste printed circuit board also is very valuable resource, wherein contains the composition of recyclable utilizations such as a large amount of metals, plastics.So the recycling of carrying out waste printed circuit board is extremely important.
Current main waste printed circuit board recoverying and utilizing method according to the difference of separation principle, can be divided into chemical treatment, heat treatment and three classifications of physical mechanical treatment technology.Chemical method is often referred to hydrometallurgy, such as acid wash, corrosion method; Heat treatment method mainly contains pyrolysis, incineration and smelting method; The mechanical-physical method comprises fragmentation, sorting etc.The mechanical-physical method because have that cost is low, advantage such as small investment and environmental pollution are little, stronger adaptability is arranged, therefore obtained fast development in China, the technology that current China mechanical approach is handled discarded circuit board mainly contains three types of " wet crushing+waterpower separation by shaking table ", " dry milling+dry separation ", " dry millings+do wet mixing to close sorting ".
The thinking that mechanical approach is handled discarded circuit board is to adopt particularly effectively dissociating of metal and nonmetallic ingredient of broken (powder) broken each component of realization wiring board, utilize metal with nonmetal between the separating of differences of physical properties realization metal and old metal.Because the various materials in the wiring board particularly sufficient as far as possible monomer dissociation of metal are the prerequisites of high efficiency sorting, and the degree of dissociating and size appreciable impact assorting room and are reclaimed the quality of product, therefore, the broken committed step that just becomes mechanical approach.But,, make still to exist in the waste printed circuit board shattering process (1) to require height and equipment attrition serious to disintegrating apparatus because printed substrate is the composite with higher toughness; (2) crushing effect undesirable (rate of recovery, metal dissociation degree not high); (3) the energy consumption height, have secondary pollution problems.
Summary of the invention
The object of the present invention is to provide a kind of preconditioning technique of remarkable change waste printed circuit board physicochemical characteristics.Be used for the mechanical-physical treatment process and can reduce the broken difficulty of waste printed circuit board in the subsequent treatment, improve the metal degree of dissociation; The treatment process that is used for other waste printed circuit boards is to improve treatment effeciency.
A kind of low-temperature vacuum themal dissociation waste printed wiring board preprocessing method that the present invention proposes, it is characterized in that: described method adopts the vacuum and low temperature pyrolytic technique, avoids producing in the heat treatment process bioxin, and its concrete steps are:
(1) waste printed circuit board is placed in the vacuum pyrolysis stove, starts the pyrolysis oven heating, start vavuum pump simultaneously, keep the about 30-1000Pa of vacuum;
(2) treat that temperature rises to 200-300 degrees centigrade in the stove, stop heating, be incubated cooling after 5-30 minutes;
(3) treat that temperature is cooled to room temperature in the stove after, close vavuum pump, open pyrolysis oven and take out waste printed circuit board;
(4) with waste printed circuit board fragmentation, screening after the pyrolysis.
The present invention adopts the vacuum and low temperature pyrolysis, helps the generation of pyrolytic reaction under the vacuum condition, reduces the required activation energy of reaction, makes the temperature required reduction of pyrolysis, thereby reduces energy consumption; Simultaneously, can avoid waste printed circuit board in pyrolysis oven, to cause secondary pollution under the vacuum condition because oxidative phenomena takes place;
The present invention adopts temperature range to be 200-300 degrees centigrade, thereby avoids 300-500 degrees centigrade of the temperature ranges of generation of dioxin, thereby can not produce the bioxin problem in the heat treatment process.
The specific embodiment
Below in conjunction with embodiment technical scheme of the present invention is described further:
The technical method that the present invention proposes specifically comprises:
1, waste printed circuit board is placed in the vacuum pyrolysis stove, starts the pyrolysis oven heating; Start vavuum pump simultaneously, keep the about 30-1000Pa of vacuum;
2, treat that temperature rises to 200-300 degrees centigrade in the stove, stop heating, be incubated cooling after 5-30 minutes;
3, treat that temperature is cooled to room temperature in the stove after, close vavuum pump, open pyrolysis oven and take out waste printed circuit board;
4, with waste printed circuit board fragmentation, screening after the pyrolysis.
Embodiment 1
1, waste printed circuit board is placed in the vacuum pyrolysis stove, starts the pyrolysis oven heating; Start vavuum pump simultaneously, keep the about 100Pa of vacuum;
2, treat that temperature rises to 275 degrees centigrade in the stove, stop heating, be incubated 10 minutes;
3, treat in the stove that temperature is cooled to (after about 4 hours) after the room temperature, close vavuum pump, open pyrolysis oven and take out discarded circuit board.
4, utilize angle cut disintegrating machine to preliminary treatment after the waste printed circuit board sample carry out fragmentation, adopt the 2mm screen cloth;
5, broken back product is put into electronic vibrating sieving machine and is sieved, and the screening product carries out degree of dissociation to be observed.
6, result: total metal degree of dissociation 100%
Embodiment 2
1, waste printed circuit board is placed in the vacuum pyrolysis stove, starts the pyrolysis oven heating; Start vavuum pump simultaneously, keep vacuum and be lower than 1000Pa;
2, treat that temperature rises to 250 degrees centigrade in the stove, stop heating, be incubated 20 minutes;
3, treat in the stove that temperature is cooled to (after about 4 hours) after the room temperature, close vavuum pump, open pyrolysis oven and take out discarded circuit board.
4, utilize angle cut disintegrating machine to preliminary treatment after the waste printed circuit board sample carry out fragmentation, adopt the 2mm screen cloth;
5, broken back product is put into electronic vibrating sieving machine and is sieved, and the screening product carries out degree of dissociation to be observed.
6, result: total metal degree of dissociation 100%
Claims (1)
1, a kind of low-temperature vacuum themal dissociation waste printed wiring board preprocessing method is characterized in that: described method adopts the vacuum and low temperature pyrolytic technique, avoids producing in the heat treatment process bioxin, and its concrete steps are:
(1) waste printed circuit board is placed in the vacuum pyrolysis stove, starts the pyrolysis oven heating, start vavuum pump simultaneously, keep vacuum 30-1000Pa;
(2) treat that temperature rises to 200-300 degrees centigrade in the stove, stop heating, be incubated cooling after 5-30 minutes;
(3) treat that temperature is cooled to room temperature in the stove after, close vavuum pump, open pyrolysis oven and take out waste printed circuit board;
(4) with waste printed circuit board fragmentation, screening after the pyrolysis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101131091A CN100518969C (en) | 2006-09-15 | 2006-09-15 | Low-temperature vacuum themal dissociation waste printed wiring board preprocessing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101131091A CN100518969C (en) | 2006-09-15 | 2006-09-15 | Low-temperature vacuum themal dissociation waste printed wiring board preprocessing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1919482A CN1919482A (en) | 2007-02-28 |
| CN100518969C true CN100518969C (en) | 2009-07-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101131091A Expired - Fee Related CN100518969C (en) | 2006-09-15 | 2006-09-15 | Low-temperature vacuum themal dissociation waste printed wiring board preprocessing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN100518969C (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101992203B (en) * | 2010-11-02 | 2013-04-03 | 广东工业大学 | Vacuum pyrolysis test device of wasted electronic circuit board |
| CN102151689B (en) * | 2010-12-07 | 2014-04-16 | 清华大学 | Laminate composite scrap thermal modification treatment equipment and method |
| CN102172600B (en) * | 2011-03-14 | 2013-04-17 | 广东工业大学 | Comprehensive recovery method for vacuum pyrolysis oil using wastes like waste circuit boards |
| CN104096704A (en) * | 2013-04-03 | 2014-10-15 | 中国科学院生态环境研究中心 | Enrichment method for palladium in waste circuit board |
| WO2015032019A1 (en) * | 2013-09-03 | 2015-03-12 | Linde Aktiengesellschaft | Cryo-smashing of waste pcb |
| CN110434159A (en) * | 2019-08-26 | 2019-11-12 | 华南理工大学 | A method of quickly recycling copper foil in waste and old copper-clad plate |
| CN110925780B (en) * | 2019-12-13 | 2022-05-03 | 北京工业大学 | Two segmentation steel strips vacuum pyrolysis devices of waste line board |
-
2006
- 2006-09-15 CN CNB2006101131091A patent/CN100518969C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN1919482A (en) | 2007-02-28 |
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| C14 | Grant of patent or utility model | ||
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| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Suzhou TES-AMM Electronic Waste Processing Technology Co., Ltd. Assignor: Tsinghua University Contract record no.: 2012320000175 Denomination of invention: Low-temperature vacuum themal dissociation waste printed wiring board preprocessing method Granted publication date: 20090729 License type: Exclusive License Open date: 20070228 Record date: 20120307 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090729 Termination date: 20180915 |
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| CF01 | Termination of patent right due to non-payment of annual fee |