CN100505984C

CN100505984C - Circuit board manufacturing method

Info

Publication number: CN100505984C
Application number: CNB2005101153359A
Authority: CN
Inventors: 杨伟雄; 江衍青; 白家华; 李楷锡
Original assignee: HUATONG COMPUTER CO Ltd
Current assignee: HUATONG COMPUTER CO Ltd
Priority date: 2005-11-14
Filing date: 2005-11-14
Publication date: 2009-06-24
Anticipated expiration: 2025-11-14
Also published as: CN1968572A

Abstract

The invention relates to a method for producing circuit board, which comprises that: arranging adhesive layer at the sides of up and low faces of one board; the middle of adhesive layer has hollow area, to contact the adhesive layer via one annular frame on the up and low faces; depositing multilayer circuit board main body on the up and low faces of base board; cutting off the part of adhesive layer that adhered with main body, to release the adhesive between main body and base board; separating the main body and base board. The invention can avoid dual-layer metal layer to adhere and separate the main body and base board, and avoid punching, therefore, it can reduce cost and improve yield.

Description

Method of manufacturing circuit board

Technical field

The present invention relates to a kind of method of manufacturing circuit board, refer in particular to a kind of escapable cost and improve the method for manufacturing circuit board of finished product rate.

Background technology

Because present electronic product volume is gradually towards the evolution of microminiaturization development trend, therefore traditional hard printing also can't meet the demand that the electron product circuit of small size is provided with completely, so circuit board or be referred to as circuit soft board and just be used in widely on the electronic product of small size.

Because the circuit board quality is comparatively soft, therefore in the circuit moulding, must arranges in pairs or groups and support the substrate of usefulness, according to the difference of forming method shaping circuit on substrate in regular turn.

Above-mentioned method of manufacturing circuit board, as the Taiwan application number is 92136864 the patent of invention application case of " making the method for circuit ", wherein disclose on the favourable core substrate that is used in hard and carry out the setting and the separation of multilayer body with two metal layers, but this patent case reality is when operation, owing on the core substrate two metal layers must be set, therefore can cause the raising on the cost, again owing to be easy to cause fold between the metal level, error when causing multilayer body lamination to be provided with produces, and, please referring to shown in Figure 2, above-mentioned double-level-metal layer is in contraposition, be to utilize the mode of registration holes to carry out, and for the setting of registration holes, must on core substrate and metal level, be drilled with registration holes again and need set up punching technology, therefore cause cost further to increase, in addition, when the double-level-metal layer carries out contraposition, be to utilize laser projection contraposition lamp to carry out the contraposition operation of metal level, but its contraposition effect still can't reach error in 1mm, again because contraposition inaccurate, on described metal level during lamination multilayer body, its circuit extremely is easy to generate the error displacement and causes scrapping of circuit board, the main cause that formation is scrapped is the uncovered place of metal level, the printed circuit board (PCB) of its top will be because of adhesion layer binds with following core substrate, cut when separating when carrying out printed circuit board (PCB) with core substrate, being very easy to cut to circuit partly causes scrapping, moreover, for back technology can be smoothly separated the printed circuit board (PCB) of top with core substrate, must waste unnecessary zone and go to contain the inaccurate problem of contraposition, and then can cause plate face utilance to descend and the waste of material, cause cost further to increase.

Summary of the invention

Because the variety of problems that the foregoing circuit plate is run into during fabrication, main purpose of the present invention is to provide a kind of method of manufacturing circuit board that can save cost and improve the finished product rate.

In order to reach the foregoing invention purpose, the present invention takes following technological means to be reached, and wherein the present invention includes following technology:

Mode with the contraposition of keeping to the side on the above and below of a substrate is provided with adhesion layer, and described adhesion layer central authorities are formed with hollow region, makes described adhesion layer stick together the place, above and below that is arranged on substrate with the structure of a ring-type framework;

Lamination has the multilayer circuit board body in regular turn in the substrate above and below that is provided with adhesion layer;

The position of adhesion layer and the bonding of multilayer circuit board body is cut removal, make to lose stickiness between multilayer circuit board body and the substrate;

The multilayer circuit board body is separated with substrate, finished the making of circuit board.

Adhesion layer constitutes with the resin with stickiness.

Adhesion layer prints out the printing ink adhesion layer that central authorities have hollow region by the printing ink of tool stickiness with mode of printing on substrate.

In the contraposition mode of keeping to the side the adhesion layer with hollow region is set on substrate by above-mentioned, do not need to utilize the double-level-metal layer to reach sticking together of multilayer circuit board body and substrate and separate, more need on substrate, not carry out any punching operation, so can reduce material and operating cost, and improve the rate of finished products of product after making.

Description of drawings

Fig. 1 is a manufacture method schematic flow sheet of the present invention;

Fig. 2 is common metal layer location schematic diagram.

The main element symbol description:

10 substrates

11 adhesion layers

12 hollow region

20 multilayer circuit board bodies

21 copper metal layers

22 dielectric layers

Embodiment

Please referring to shown in Figure 1, method of manufacturing circuit board of the present invention includes following technology:

Mode with the contraposition of keeping to the side on the above and below of a substrate 10 is provided with adhesion layer 11, the position that the mode that these adhesion layer 11 central authorities use machining to cut will not need to bind is removed to be formed with hollow region 12, makes that described adhesion layer 11 is to stick together the place, above and below that is arranged on substrate 10 with the structure of a ring-type framework;

Lamination has the multilayer circuit board body 20 that at least respectively comprises layer of copper metal level 21, dielectric layer 22 and copper metal layer 21 in regular turn in substrate 10 above and below that are provided with adhesion layer 11;

Adhesion layer 11 and the position that multilayer circuit board body 20 binds are cut removal, make that the existence because of hollow region 12 loses stickiness between multilayer circuit board body 20 and the substrate 10;

Multilayer circuit board body 20 is separated with substrate 10, finished the making of circuit board.

Methods such as the mask that above-mentioned multilayer circuit board body 20 is carried out when moulding, development, etching are identical with general existing circuit board making mode, therefore omit its detailed description.

Because the present invention is provided with the adhesion layer 11 with hollow region 12 in the contraposition mode of keeping to the side on substrate 10, therefore do not need to utilize the double-level-metal layer to reach sticking together of multilayer circuit board body 20 and substrate 10 and separate, more need on substrate 10, not carry out any punching operation, so can reduce material and operating cost, and improve the rate of finished products of product after making.

The adhesion layer 11 of above-mentioned enforcement kenel is to constitute with the resin with stickiness, except that above-mentioned forming method, also can pass through the enough printing ink of stickiness, on substrate 10, print out the printing ink adhesion layer 11 that central authorities have hollow region 12 by mode of printing, afterwards again on substrate 10 with printing ink adhesion layer 11 in regular turn lamination multilayer circuit board body 20 is arranged, thus, just can be same with above-mentioned enforcement kenel, do not need to be provided with in addition in order to sticking together with multilayer circuit board body 20 and substrate 10, separatory metal level, so can reduce cost, again because above-mentioned two enforcement kenels all are to utilize the mode of the contraposition of keeping to the side that adhesion layer 11 is combined with substrate 10, therefore the problem that does not have potential difference produces, can be more accurate on substrate 10 the multilayer circuit board body 20 of the required circuit of forming device.

Above embodiment only is used to illustrate the present invention, but not is used to limit the present invention.

Claims

1, a kind of method of manufacturing circuit board is characterized in that including following technology:

Mode with the contraposition of keeping to the side on the above and below of a substrate is provided with adhesion layer, and these adhesion layer central authorities are formed with hollow region, makes that described adhesion layer is to stick together the place, above and below that is arranged on substrate with the structure of a ring-type framework;

2, method of manufacturing circuit board according to claim 1 is characterized in that: adhesion layer constitutes with the resin with stickiness.

3, method of manufacturing circuit board according to claim 1 is characterized in that: the printing ink of adhesion layer by the tool stickiness prints out the printing ink adhesion layer that central authorities have hollow region with mode of printing and forms on substrate.