CN100499980C - Radiation fin assembly and heat radiating device applied the same - Google Patents

Radiation fin assembly and heat radiating device applied the same Download PDF

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Publication number
CN100499980C
CN100499980C CN200610061361.2A CN200610061361A CN100499980C CN 100499980 C CN100499980 C CN 100499980C CN 200610061361 A CN200610061361 A CN 200610061361A CN 100499980 C CN100499980 C CN 100499980C
Authority
CN
China
Prior art keywords
radiating fin
sleeve
perforation
fin
combination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200610061361.2A
Other languages
Chinese (zh)
Other versions
CN101098604A (en
Inventor
周世文
陈俊吉
符猛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN200610061361.2A priority Critical patent/CN100499980C/en
Priority to US11/623,288 priority patent/US20080000619A1/en
Publication of CN101098604A publication Critical patent/CN101098604A/en
Application granted granted Critical
Publication of CN100499980C publication Critical patent/CN100499980C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention discloses a heat radiation fin combination and a relative heat radiator, wherein the combination comprises heat radiation fins with through holes and a muffle embedded in the through holes. Compared with prior art, the invention embeds a muffle in the through holes, the heat radiation fins are combined with heat pipe indirectly via the muffle, to resolve the defects of direct combination between the heat radiation fins and heat pipe.

Description

Radiating fin makes up and uses the heat abstractor of this radiating fin combination
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of radiating fin makes up and uses the heat abstractor of this radiating fin combination.
Background technology
The high power electronic element needs heat abstractor to dispel the heat in running, existing heat abstractor generally includes the radiating fin of parallel interval arrangement and is placed through heat pipe in the radiating fin, with by the high thermal conductivity of heat pipe with the heat transferred radiating fin that electronic component produces, by radiating fin heat is dispersed in the surrounding air.
Radiating fin directly combines with heat pipe usually, but both are directly in conjunction with existing some shortcomings.For example, when heat pipe is that copper material is made, and radiating fin is when adopting aluminium material to make based on the consideration of cost and weight, because the welding performance of aluminium is relatively poor, both are when welding, need earlier aluminium matter fin to be carried out the nickel plating surface treatment, and this surface treatment procedure has increased the production cycle, has improved production cost.
Summary of the invention
In view of this, be necessary to provide a kind of improved radiating fin to make up and use the heat abstractor of this radiating fin combination.
A kind of radiating fin combination, comprise the radiating fin that has perforation and be embedded at sleeve in the described perforation, described sleeve comprises a tubular body and a flange that goes out from this tubular body ora terminalis radial expansion, described tubular body is embedded in the described perforation, and described flange is close to a side of described radiating fin.
A kind of heat abstractor, comprise radiating fin combination and heat pipe, the combination of described radiating fin comprises the radiating fin that has perforation and is embedded at sleeve in the described perforation, described heat pipe is placed through in the described sleeve, described sleeve comprises a tubular body and a flange that goes out from this tubular body ora terminalis radial expansion, described tubular body is embedded in the described perforation, and described flange is close to a side of described radiating fin.
The present invention compared with prior art owing to set sleeve in the perforation of radiating fin, radiating fin combines with heat pipe indirectly by sleeve, can solve the some shortcomings that radiating fin and heat pipe directly combine.For example, in the perforation of aluminium matter fin, set copper sleeve,, thereby need not aluminium matter fin is carried out the nickel plating surface treatment by sleeve and heat pipe welding.
The invention will be further described below in conjunction with the drawings and specific embodiments.
Description of drawings
Fig. 1 is the constitutional diagram of the radiating fin combination in the one embodiment of the invention.
Fig. 2 is the exploded view of radiating fin combination shown in Figure 1.
Fig. 3 be among Fig. 1 III-III to cutaway view.
Fig. 4 is a structural representation of using the heat abstractor of radiating fin combination shown in Figure 1.
Embodiment
Fig. 1 to Fig. 3 shows an embodiment of radiating fin combination 1 of the present invention, this radiating fin combination 1 can cooperate formation one heat abstractor (as shown in Figure 4) with heat pipe 2, it comprises and has perforation 13 radiating fin 10 and be embedded at sleeve 20 in this perforation 13, but perforation 23 heating tubes 2 of sleeve 20 place.
Radiating fin 10 (for example adopts the good material of heat conductivility, aluminium) make, it comprises that one is flat fin body 11 substantially, fin body 11 respectively is formed with a perforation 13 near the both side edges place, and the shape of perforation 13 can be arbitrary shapes such as circle, ellipse according to the cross sectional shape of heat pipe 2.One side of fin body 11 protrudes out a ring edge 15 around perforation 13, and ring edge 15 can increase the contact area of fin body 11 and sleeve 20 on the one hand, can improve the bond strength of fin body 11 and sleeve 20 on the other hand.
The material that sleeve 20 can adopt heat conductivility and/or welding performance to be better than radiating fin 10 is made (for example, copper or silver), and it comprises a tubular body 25 and a flange 21 that goes out from the 25 ora terminalis radial expansions of tubular body.Tubular body 25 overall dimensions 13 adapt with perforation, so that it is when being embedded in the perforation 13, its outside wall surface closely is matched with the inner edge of perforation 13.The flange 21 of sleeve 20 closely fits in the side of fin body 11, is used to increase the contact area of sleeve 20 and fin body 11, thereby improves thermal conductivity between the two.Preferably, can fill an amount of heat-conducting glue between flange 21 and the fin body 11, with further raising thermal conductivity therebetween.Sleeve 20 can be by easily realizing towards modes such as riveting or interference fit and the combining closely of radiating fin 10, and the radiating fin 10 that has a sleeve 20 is simplified (for example, aluminium matter radiating fin need not nickel plating) with combining also of heat pipe, and guarantee heat transfer efficiency.
In radiating fin combination 1, sleeve 20 adopts modes such as interference fit or riveted joint to be incorporated on the radiating fin 10, and can adopt and make towards the method for machinings such as riveting, for example, it can adopt following steps to make: (1) provides first sheet material and second sheet material, and first sheet material is aluminium matter, be used for as the raw material of making radiating fin 10, second sheet material is copper or silver, is used for as the raw material of making sleeve 20, and the size of second sheet material can be much smaller than first sheet material; (2) second sheet material is positioned over the precalculated position of the first sheet material side, and carry out piercing and flanging along the method vertical with first sheet material over against second sheet material, the flange (body 25 of corresponding sleeve 20) of second sheet material closely is embedded in the perforation (annular distance 13 of corresponding radiating fin 10) of first sheet material, first sheet material and second sheet material closely are riveted together, promptly finish the manufacturing of radiating fin combination 1.
Fig. 4 shows the heat abstractor that has radiating fin combination 1, this heat abstractor can be used for distributing the heat that electronic component such as computer cpu produces, it comprises some radiating fin combination 1 and two heat pipes 2 that are arranged in parallel, the heat unit of heat pipe 2 is arranged in the sleeve 20 of radiating fin combination 1, and welds together with sleeve 20.This heat abstractor in the course of the work, the endothermic section of heat pipe 2 absorbs heat from electronic component, and from heat unit with heat transferred to sleeve 20, by sleeve 20 heat is conducted to radiating fin 10, by radiating fin 10 heat is dispersed in the surrounding air again and goes, thereby realized cooling electronic component.Follow according to needs, this heat abstractor can also add other elements such as substrate and fan; The quantity of heat pipe 2 can be one or more, and its shape can take the shape of the letter U or S shape etc.

Claims (13)

1. radiating fin combination, comprise that a radiating fin and that has perforation is embedded at the interior sleeve of perforation of this radiating fin, described sleeve comprises a tubular body, this tubular body is embedded in the described perforation, it is characterized in that: described sleeve also comprises a flange that goes out from described tubular body ora terminalis radial expansion, and this flange is close to a side of described radiating fin.
2. radiating fin combination as claimed in claim 1, it is characterized in that: the opposite side of described radiating fin protrudes out a ring edge around described perforation, and the internal face of this ring edge is close to the outside wall surface of described tubular body.
3. radiating fin combination as claimed in claim 1 or 2 is characterized in that: described sleeve and riveted joint of described radiating fin or interference fit.
4. radiating fin combination as claimed in claim 3 is characterized in that: described radiating fin adopts aluminium to make, and described sleeve adopts copper or silver to make.
5. radiating fin combination as claimed in claim 1 or 2, it is characterized in that: the material that described sleeve adopts heat conductivility and/or welding performance to be better than described fin body is made.
6. radiating fin combination as claimed in claim 5 is characterized in that: described radiating fin adopts aluminium to make, and described sleeve adopts copper or silver to make.
7. radiating fin combination as claimed in claim 1, it is characterized in that: also comprise some fin that have perforation, another sleeve is set in the perforation of each fin, and each fin is identical with described radiating fin, and this another sleeve is identical with described sleeve.
8. heat abstractor, comprise radiating fin combination and heat pipe, the combination of this radiating fin comprises the radiating fin that has perforation and is embedded at sleeve in this perforation, described heat pipe is placed through in the described sleeve, described sleeve comprises a tubular body, this tubular body is embedded in the described perforation, it is characterized in that: described sleeve also comprises a flange that goes out from described tubular body ora terminalis radial expansion, and this flange is close to a side of described radiating fin.
9. heat abstractor as claimed in claim 8 is characterized in that: described sleeve and riveted joint of described radiating fin or interference fit.
10. heat abstractor as claimed in claim 8 is characterized in that: the opposite side of described radiating fin protrudes out a ring edge around described perforation, and the internal face of this ring edge is close to the outside wall surface of described tubular body.
11. heat abstractor as claimed in claim 8 is characterized in that: the material that described sleeve adopts heat conductivility and/or welding performance to be better than described radiating fin is made.
12. heat abstractor as claimed in claim 11 is characterized in that: described radiating fin is made of aluminum, and described sleeve is made of copper or silver.
13. heat abstractor as claimed in claim 8, it is characterized in that: also comprise some fin that have perforation, another sleeve is set in the perforation of each fin, and described heat pipe is placed through in this another sleeve, each fin is identical with described radiating fin, and this another sleeve is identical with described sleeve.
CN200610061361.2A 2006-06-28 2006-06-28 Radiation fin assembly and heat radiating device applied the same Expired - Fee Related CN100499980C (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200610061361.2A CN100499980C (en) 2006-06-28 2006-06-28 Radiation fin assembly and heat radiating device applied the same
US11/623,288 US20080000619A1 (en) 2006-06-28 2007-01-15 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200610061361.2A CN100499980C (en) 2006-06-28 2006-06-28 Radiation fin assembly and heat radiating device applied the same

Publications (2)

Publication Number Publication Date
CN101098604A CN101098604A (en) 2008-01-02
CN100499980C true CN100499980C (en) 2009-06-10

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US (1) US20080000619A1 (en)
CN (1) CN100499980C (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090038776A1 (en) * 2007-08-10 2009-02-12 Tsung-Hsien Huang Cooler module
CN101662917B (en) * 2008-08-26 2012-11-21 富准精密工业(深圳)有限公司 Radiating device
CN101943537B (en) * 2009-07-08 2014-03-19 鈤新科技股份有限公司 Radiating fin with expandable radiating area, radiator and manufacturing method thereof
US8375584B2 (en) * 2009-07-29 2013-02-19 Cpumate Inc Method for manufacturing large-area heat sink having heat-dissipating fins
CN102378545A (en) * 2010-08-05 2012-03-14 奇鋐科技股份有限公司 Radiating fin structure, radiator and manufacturing method thereof
WO2013114071A2 (en) * 2012-01-31 2013-08-08 Clean Thermodynamic Energy Conversion Ltd Steam generation
GB2499574B (en) * 2012-01-31 2016-09-14 Clean Thermodynamic Energy Conv Ltd Superheated fluid generation
US20140262188A1 (en) * 2013-03-15 2014-09-18 Ramana Venkato Rao Sistla Fin Spacing On An Evaporative Atmospheric Water Condenser
CN107175464A (en) * 2017-05-09 2017-09-19 柳州申通汽车科技有限公司 The processing technology of automotive air-conditioning condenser
CN107160121A (en) * 2017-05-09 2017-09-15 柳州申通汽车科技有限公司 The processing method of car condenser core body
CN107234943B (en) * 2017-05-09 2020-01-17 柳州申通汽车科技有限公司 Combined core of automobile air conditioner condenser
CN107144165B (en) * 2017-05-09 2020-01-17 柳州申通汽车科技有限公司 Combined heat exchange fin
CN107309640A (en) * 2017-05-09 2017-11-03 柳州申通汽车科技有限公司 A kind of assembly method of automotive air-conditioning condenser core body
CN107255376B (en) * 2017-05-09 2020-01-17 柳州申通汽车科技有限公司 Heat transfer method for automobile air conditioner condenser
CN107252985B (en) * 2017-05-09 2020-03-20 柳州申通汽车科技有限公司 Assembling method of automobile air conditioner condenser
CN107150571B (en) * 2017-05-09 2020-01-17 柳州申通汽车科技有限公司 Air conditioner condenser for automobile
US10612862B2 (en) * 2017-10-31 2020-04-07 Heatscape.Com, Inc. Method of forming a combined vapor chamber and heat pipe assembly
US20190178486A1 (en) * 2017-12-13 2019-06-13 Wei Chen Module for led lighting fixture
CN109945725A (en) * 2019-01-23 2019-06-28 珠海格力电器股份有限公司 Plate and its forming method, finned heat exchanger and air conditioner

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2426536A (en) * 1944-07-07 1947-08-26 Chase Brass & Copper Co Laminated heat-exchange fin
CN2389343Y (en) * 1999-08-24 2000-07-26 超众科技股份有限公司 Heat-pipe fin integrated radiator
CN2503607Y (en) * 2001-08-29 2002-07-31 庄金发 Cooling fin with heat conduction pipe
CN1385261A (en) * 2001-05-15 2002-12-18 爱美达股份有限公司 Hot pipe type radiation fin and assembling method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2368403A (en) * 1941-10-21 1945-01-30 United Aircraft Corp Method of manufacturing heat radiators
US2464735A (en) * 1944-07-07 1949-03-15 Chase Brass & Copper Co Composite heat-exchange fin
US4192052A (en) * 1976-02-23 1980-03-11 E. I. Du Pont De Nemours And Company Method for bonding a heat exchanger fin to a tube
US4207662A (en) * 1977-06-22 1980-06-17 Nihon Radiator Co., Ltd. Method of manufacturing an aluminum heat exchanger
US5947111A (en) * 1998-04-30 1999-09-07 Hudson Products Corporation Apparatus for the controlled heating of process fluids
US6651733B1 (en) * 2002-10-16 2003-11-25 Sunonwealth Electric Machine Industry Co., Ltd. Heat sink
US20050039890A1 (en) * 2003-08-08 2005-02-24 Lee Hsieh Kun Heat dissipating device and method of making it

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2426536A (en) * 1944-07-07 1947-08-26 Chase Brass & Copper Co Laminated heat-exchange fin
CN2389343Y (en) * 1999-08-24 2000-07-26 超众科技股份有限公司 Heat-pipe fin integrated radiator
CN1385261A (en) * 2001-05-15 2002-12-18 爱美达股份有限公司 Hot pipe type radiation fin and assembling method thereof
CN2503607Y (en) * 2001-08-29 2002-07-31 庄金发 Cooling fin with heat conduction pipe

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US20080000619A1 (en) 2008-01-03
CN101098604A (en) 2008-01-02

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Granted publication date: 20090610

Termination date: 20130628