CN100492859C - Power supply device for vehicle - Google Patents
Power supply device for vehicle Download PDFInfo
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- CN100492859C CN100492859C CN 200580032603 CN200580032603A CN100492859C CN 100492859 C CN100492859 C CN 100492859C CN 200580032603 CN200580032603 CN 200580032603 CN 200580032603 A CN200580032603 A CN 200580032603A CN 100492859 C CN100492859 C CN 100492859C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The invention provides a power supply device for a vehicle which can stress the complication of an underfloor structure even when the power supply device is provided with two power converters, and can enhance the mounting density of semiconductor devices. The power supply device for a vehicle is provided with a heat receiving block, wherein one-phase amount of semiconductor devices of one power converter is mounted to a first component fitting surface, and one-phase amount of semiconductor elements 1B of the other converter is mounted to a second component fitting surface; a straight heat pipe with its base end bonded like projection from the third component fitting surface of the heat receiving block; three heat transfer stacks, wherein the heat receiving block, the straight heat pipe, and a heat radiating fin fitted with the straight heat pipe, are integrally assembled; and a flame wherein one heat transfer stack is arranged at center, one of the remaining heat transfer stacks is made to face at a specified interval with respect to the center heat transfer stack in each first component fitting surface, and the other remaining heat transfer stack is made to face at a specified interval with respect to the center heat transfer stack in each second component fitting surface. A first element fitting surface to which the semiconductor elements of the first semiconductor element group are fitted, and a second element fitting surface to which the semiconductor elements of the second semiconductor element group are fitted, are provided on one surface of one heat receiving block which is formed into a plate shape.
Description
Technical field
The present invention relates to be set at the vehicle power source device that supply vehicle under the floor of rail truck drives the electric power of usefulness, particularly relate to the cooling device that employed semiconductor element group in the supply unit is cooled off.
Background technology
As the underfloor vehicle power source device that is arranged on rail truck, adopt power-converting device shown in Figure 26.This power-converting device by possess by the thyristor of 3 phase bridge joints (below, abbreviate semiconductor element as) 101, the circuit of the phase capacitor 102 that between the AK of each phase (anode negative electrode), connected and the filtering capacitor 103 that between dc terminal PN, connected, the direct current power that will be transfused to dc terminal PN from the railway stringing becomes alternating electromotive force by the switch change-over of semiconductor element 101, and this alternating electromotive force is offered diagram each equipment of abridged (electric light, air-conditioning etc.) after ac terminal UVW output.Foregoing circuit in order to be removed well and to be arranged in the semiconductor element cooling unit 104 by the heat efficiency that semiconductor element 101 takes place.
Figure 27 be with the component part of conventional semiconductor element cooling unit 104 utilize the cross section to represent end view (for example, with reference to TOHKEMY 2003-235112 communique).In Figure 27, semiconductor element cooling unit 104 is installed in the floor of car body 105 and hangs on the casing of establishing 106, semiconductor element 101, phase capacitor 102, filtering capacitor 103, grid amplifier 107 etc. are configured in the airtight portion among the casing 106, and the electrical connection of semiconductor element cooling unit 104 and casing 106 sides is also by utilizing bolt etc. to be connected both sides' terminal in this airtight or having omitted illustrated conductor and carried out.
In semiconductor element cooling unit frame 115, as shown in figure 29, be formed with three side by side and make the outstanding laterally assembling window 118 of inner edge portion 115a.In these assembling windows 118, insert the heat generating part 110 of heat transfer group cover 112 respectively on one side from the car side, and utilize on boundary plates 116 formed pilot hole 120 with boundary plates 116 usefulness bolted in semiconductor element cooling unit frame 115, the filler of being installed on the boundary plates 116 117 is pushed by inner edge portion 115a thus, with the watertightness of maintenance with semiconductor element cooling unit frame 115 borders, heat transfer group cover 112 is fixed in semiconductor element cooling unit frame 115, and fin 109 is configured in the opening portion outside the casing 106.Figure 30 represents that the Y-Y of this state is to looking sectional view.
Here, the face that is mounted of semiconductor element cooling unit frame 115 is formed slopely as shown like that.In view of the above, heat generating part 110 sides of straight tube heat pipe 108 just become the below, and the refrigerant of being enclosed in the inside of straight tube heat pipe 108 carries out thermolysis to atmosphere because of evaporating from the heat that semiconductor element 101 takes place in heat generating part 110 sides after fin 109 sides are condensed.Refrigerant after condensing carries out the circulation returned to heat generating part 110 sides repeatedly by means of gravity in the inside of straight tube heat pipe 108.Because fin 109 carries out thermolysis by natural cooling to atmosphere, so generally perpendicularly be provided with respect to ground, just becoming from ascending air between the fin 109 is easy to circulation.
That Figure 31 to Figure 33 represents is set under the floor of rail truck, carry out from direct current to exchanging or from an example of the semiconductor power conversion apparatus of the conversion of AC-to DC, Figure 31 is the pie graph of power transformation circuit, Figure 22 is the side cross-sectional views of semiconductor power conversion apparatus, and Figure 33 is the A-A line sectional view of Figure 32.
This semiconductor power conversion apparatus has two separate inverter circuits, and (invertercircuit: power transformation circuit), each inverter circuit has six semiconductor elements 201 of 3 phase bridge joints as shown in figure 31; And be connected filtering capacitor 202 between positive terminal and negative terminal.
This power-converting device, when the input dc power power between the terminals P of DC side, N of illustrated railway stringing never, just be transformed into alternating electromotive force, and offer motor 203 after exporting from terminal U, V, the W of AC side by control is connected/cut off to semiconductor element 201 with the order of regulation.
In this power-converting device, be provided with and be used for semiconductor cooling device that the heat efficiency that takes place from semiconductor element 201 is removed well.
As Figure 32 and shown in Figure 33, these semiconductor cooling device 204 parts are incorporated in the casing of being installed on the side of bottom of car body 205 206, and are fixed in formed opening (not shown) on the boundary plates 207 of frame shape.
The side that semiconductor cooling device 204 has boundary plates of being set at 207 is accommodated in inside with semiconductor element 201 and grid amplifier 209, and seals above-mentioned opening airtight 210; Be used to make it thermolytic opening portion 211 with the opposite side that is arranged on boundary plates 207.
In airtight 210, at the bottom mounting panel of for example using the formed framework of chevron steel, and two groups of filtering capacitors 202 are installed respectively thereon, the not shown conductor that is imported in the casing 206 is connected to filtering capacitor 202.
In the piece 212 that respectively is heated, heat pipe radiator 213 is installed.This heat pipe radiator 213 has the side that an end is connected to the piece 212 that is heated, and towards the opening portion 211 outstanding heat pipes 214; With on this heat pipe 214 along its length every with at interval and the tabular fin of installing 215 of multi-disc.Heat pipe 214 connects each fin 215, and each fin 215 is fixed with the state of the outer peripheral face that is flush-mounted in heat pipe 214.
Above-mentioned existing for motor vehicle supply unit, be provided with a heat transfer group cover mutually by each of the semiconductor element of 3 phase bridge joints, therefore in possessing the vehicle power source device of many power-converting devices, just have and to each power-converting device the semiconductor element cooling unit to be set, the problem that the deck construction of vehicle is complicated and so on.
In addition, in existing for motor vehicle supply unit, on a face of the piece that is heated, semiconductor element is installed, the phase capacitor is installed on another face.Yet, in recent years by distribution being shortened or adopting reciprocal distribution, make progress with the packaging technology that reduces inductive component, the phase capacitor that connects near semiconductor element just no longer needs, so the single face of the piece that is heated becomes free space and packaging density is descended, so on the free space face, constitute the semiconductor element of another power-converting device, though can improve packaging density, but have when the contingency semiconductor element destroys, unbroken the opposing party's semiconductor element is brought dysgenic problem.
And, in being arranged at the semiconductor cooling device of this supply unit, the semiconductor element 201 that constitutes an inverter circuit physically damaged situation under, the remains of Po Sun semiconductor element 201 will contact the semiconductor element 201 of another inverter circuit of formation etc., bring dysgenic possibility for another inverter circuit and exist.
Summary of the invention
The present invention considers that with regard to making the problems referred to above point finishes, and it is a kind of under the situation that possesses two power-converting devices that its purpose is to provide, and a method, semiconductor element destroys can not bring dysgenic vehicle power source device to the opposing party's semiconductor element.
In order to achieve the above object, provide following the 1st to the 5th invention in this application.
But the 1st invention is a kind of vehicle power source device that possesses two inverter circuits of independent operation, it is characterized in that, comprise: piece will be heated, three heat transfer group covers that straight tube heat pipe and fin assemble respectively integratedly, the above-mentioned piece that is heated has and is in the 1st and the 2nd parts installed surface that concerns in the table, and the 3rd parts installed surface that touches the side end face with respect to the above-mentioned the 1st and the 2nd parts installed surface, and the thyristor of part mutually of some 1 in above-mentioned two inverter circuits is installed on above-mentioned the 1st parts installed surface, and another 1 thyristor of part mutually in two inverter circuits has been installed on above-mentioned the 2nd parts installed surface; The base end part of above-mentioned straight tube heat pipe is engaged with on the above-mentioned piece that is heated in the mode of giving prominence to from above-mentioned the 3rd parts installed surface of the above-mentioned piece that is heated, and the heat of the above-mentioned piece that is heated is transported to top ends; Above-mentioned fin is flush-mounted in above-mentioned straight tube heat pipe; And the frame that above-mentioned three heat transfer groups cover is installed as follows, promptly an above-mentioned heat transfer group cover is configured in central authorities, and in the remaining above-mentioned heat transfer group cover is opposed with predetermined distance each other with respect to the above-mentioned heat transfer group cover, above-mentioned the 1st parts installed surface that are configured in central authorities; In the remaining above-mentioned heat transfer group cover another is opposed with predetermined distance each other with respect to the above-mentioned heat transfer group cover, above-mentioned the 2nd parts installed surface that are configured in central authorities.
The 2nd invention is a kind of semiconductor cooling device, possesses: constitute the piece that is heated of the 1st and the 2nd element installed surface of the 1st and the 2nd semiconductor element group of two inverter circuits of independent operation mutually but have to have installed; And be connected to radiating part on the above-mentioned piece that is heated, it is characterized in that: the above-mentioned the 1st and the 2nd element installed surface is set at in the one side.
In addition, the 3rd invention is a kind of semiconductor cooling device, possesses: constitute the piece that is heated of the 1st and the 2nd element installed surface of the 1st and the 2nd semiconductor element group of two inverter circuits of independent operation mutually but have to have installed; And be connected to radiating part on the above-mentioned piece that is heated, it is characterized in that: the above-mentioned the 1st and the 2nd element installed surface is configured to relation in the table.
In addition, the 4th invention is a kind of semiconductor cooling device, possesses: constitute a plurality of pieces that are heated of the 1st and the 2nd element installed surface of the 1st and the 2nd semiconductor element group of two inverter circuits of independent operation mutually but have to have installed; And be connected to radiating part on the above-mentioned piece that respectively is heated, it is characterized in that: above-mentioned a plurality of pieces that are heated be configured to above-mentioned the 1st element installed surface each other or above-mentioned the 2nd element installed surface opposite each other.
In addition, the 5th invention is a kind of semiconductor cooling device, possesses: but have a plurality of pieces that are heated that will constitute the 1st and the 2nd element installed surface that the 1st and the 2nd semiconductor element group of two inverter circuits of independent operation mutually installs; And be connected to radiating part on the above-mentioned piece that respectively is heated, it is characterized in that: above-mentioned a plurality of be heated piece with the above-mentioned the 1st and the 2nd element installed surface become the mode that concerns in the table be provided with, simultaneously with above-mentioned the 1st element installed surface and the spaced apart configuration of the mutual opposed mode of above-mentioned the 2nd element installed surface, and be provided with the crashproof parts that prevent that the semiconductor element at the semiconductor element of two above-mentioned the 1st element installed surfaces of the above-mentioned interblock that is heated of adjacency and above-mentioned the 2nd element installed surface from colliding.
By constituting as described above, just provide a kind of and have under 2 the situation of power-converting device, a method, semiconductor element destroys can not bring dysgenic vehicle power source device to the opposing party's semiconductor element.
According to the present invention, the semiconductor element that constitutes an inverter circuit physically damaged situation under, the remains of Po Sun semiconductor element can not contact the semiconductor element that constitutes other inverter circuits, so can not bring harmful effect to other inverter circuits.
Description of drawings
Fig. 1 is the electrical circuit diagram of embodiments of the present invention 1.
Fig. 2 will constitute the end view that the receiving state of the power-converting device of execution mode 1 partly utilizes the cross section to represent.
Fig. 3 A is the end view that constitutes the heat transfer group cover of execution mode 1.
Fig. 3 B constitutes the front view of the heat transfer group cover of execution mode 1.
Fig. 4 represents to constitute the sectional view of installment state of three heat transfer groups covers of execution mode 1.
Fig. 5 is the partial cross section figure of the concrete assembled configuration of the expression heat transfer group cover that constitutes execution mode 1.
Fig. 6 is the front view of the semiconductor cooling device of embodiments of the present invention 2.
Fig. 7 is the plane graph of the semiconductor cooling device of Fig. 6.
Fig. 8 is the right flank of the semiconductor cooling device of Fig. 6.
Fig. 9 is the front view of the semiconductor cooling device of embodiments of the present invention 3.
Figure 10 is the plane graph of the semiconductor cooling device of Fig. 9.
Figure 11 is the right side view of the semiconductor cooling device of Fig. 9.
Figure 12 is the front view of the semiconductor cooling device of embodiments of the present invention 4.
Figure 13 is the left side view of the semiconductor cooling device of Figure 12.
Figure 14 is the front view of the semiconductor cooling device of embodiments of the present invention 5.
Figure 15 is the left side view of the semiconductor cooling device of Figure 14.
Figure 16 is the front view of the semiconductor cooling device of embodiments of the present invention 6.
Figure 17 is the right side view of the semiconductor cooling device of Figure 15.
Figure 18 is the front view of the semiconductor cooling device of embodiments of the present invention 7.
Figure 19 is the right side view of the semiconductor cooling device of Figure 18.
Figure 20 is the front view of the semiconductor cooling device of embodiments of the present invention 8.
Figure 21 is the right side view of the semiconductor cooling device of Figure 20.
Figure 22 is the plane graph of the semiconductor cooling device of Figure 20.
Figure 23 is the front view of the semiconductor cooling device of embodiments of the present invention 9.
Figure 24 is the right side view of the semiconductor cooling device of Figure 23.
Figure 25 is the plane graph of the semiconductor cooling device of Figure 23.
Figure 26 represents the electrical circuit diagram of the formation of the power-converting device in the existing apparatus.
Figure 27 will constitute the end view that the receiving state of the power-converting device of existing apparatus partly utilizes the cross section to represent.
Figure 28 A is the end view of the heat transfer group cover in the existing apparatus.
Figure 28 B is the front view of the heat transfer group cover in the existing apparatus.
Figure 29 represents the end view of the formation of the semiconductor element cooling unit frame in the existing apparatus.
Figure 30 is the sectional view of the installment state of three heat transfer group covers in the expression existing apparatus.
Figure 31 is the pie graph of the power transformation circuit of conventional semiconductor cooling device.
Figure 32 is the side cross-sectional views of conventional semiconductor power-converting device.
Figure 33 is the A-A line sectional view of Figure 27.
Embodiment
Below, based on preferred implementation shown in the drawings the present invention is at length described.
Fig. 1 is the electrical circuit diagram of embodiments of the present invention 1, and the direct current power of being imported on dc terminal P1, the N1 being transformed into the alternating electromotive force of 3 phases and offering the inverter circuit that illustrates each machine of abridged (air-conditioning etc.) is power-converting device 30A; With the direct current power that will be imported on dc terminal P2, the N2 be transformed into 3 mutually alternating electromotive force and offer the diagram each equipment of abridged (air-conditioning etc.) inverter circuit be that power-converting device 30B is set in the semiconductor element cooling unit 4.
Wherein, power-converting device 30A is by the filtering capacitor 3A that is connected to dc terminal P1, N1; 3 its DC side of phase bridge joint be connected to dc terminal P1, N1 and its AC side be connected to the diagram each equipment of abridged (air-conditioning etc.) six semiconductor element 1A constitute.Equally, power-converting device 30B is by the filtering capacitor 3B that is connected to dc terminal P2, N2; 3 its DC side of phase bridge joint be connected to dc terminal P2, N2 and its AC side be connected to the diagram each equipment of abridged (air-conditioning etc.) six semiconductor element 1B constitute.
Fig. 2 is with power-converting device 30A and the 30B configuration example of the set semiconductor element cooling unit 4 of the portion end view that partly utilizes the cross section to represent within it.This execution mode the heat transfer group cover 12 that replaces existing apparatus will be in table both sides heat transfer group cover 12A that semiconductor element has been installed be assembled in fixedly this point of semiconductor element cooling unit frame 15; And in the present embodiment filtering capacitor 3A and 3B two sides are installed in the semiconductor element cooling unit 4 differently on this point with respect to filtering capacitor 3 only is installed in existing apparatus, constitute with existing apparatus in addition identically.
Fig. 3 A is the end view of heat transfer group cover 12A, and Fig. 3 B is its front view.This heat transfer group cover 12A installs the semiconductor element 1A of the 1 phase part of power-converting device 30A on the 1st parts installed surface that is in the piece 21 that is heated that concerns in the table, the semiconductor element 1B of the 1 phase part of power-converting device 30B is installed on the 2nd parts installed surface.In addition, on the 3rd parts installed surface that touches the side end face with respect to the 1st and the 2nd parts installed surface with a plurality of straight tube heat pipe 8 almost parallels the mode of giving prominence to each termination this point altogether; Straight tube heat pipe 8 fin 9 this point with the predetermined distance setting-in on its length direction; And the fin 9a this point that is fixed in the most close piece 21 that is heated being the boundary plates 16 enforcement water-proofing treatment that filler 17 has been installed on the circle-shaped formed packing guide groove 19, similarly constitute with existing heat transfer group cover 12.
Above-mentioned heat transfer group cover 12A adds up to 3 of assemblings mutually corresponding to U, V, W, insert in heat generating part 10 separately under the state of assembling window 18 (with reference to Figure 29) of semiconductor element cooling unit frames 15 and be fixed in boundary plates 16, its state is different with existing apparatus.
Fig. 4 is that the Y-Y of the state that is fixed of three heat transfer groups of expression cover 12A is to looking sectional view.Here, three heat transfer group cover 12A, be parallel to each other and keep the mode of predetermined certain intervals to be fixed up side by side with the parts installed surface of the piece 21 that is heated, heat transfer group cover 12A with respect to central configuration, remaining heat transfer group cover 12A is opposite each other with the 1st parts installed surface, and remaining another heat transfer group cover 12A is fixed up in the 2nd parts installed surface mode opposite each other.Thus, the semiconductor element IA of 2 phases of formation power-converting device 30A is opposite each other, the semiconductor element 1A of remaining 1 phase toward the outer side, equally, the semiconductor element 1B of 2 phases of formation power-converting device 30B is opposite each other, the semiconductor element 1B of remaining 1 phase toward the outer side, semiconductor element 1A and semiconductor element 1B are spaced from each other by the piece 21 that is heated.
Its result, even if the semiconductor element 1A that constitutes power-converting device 30A physically damaged situation under, also can alleviate the influence that brings to semiconductor element 1B, equally, even if the semiconductor element 1B that constitutes power-converting device 30B physically damaged situation under, also can alleviate the influence that brings to semiconductor element 1A, so even if any one party has taken place also can bring harmful effect to the opposing party hardly under the situation of element destruction in power-converting device 30A and 30B.
Fig. 5 is the partial cross section figure that the concrete installation constitution of semiconductor element 1A and 1B is installed among the expression heat transfer group cover 12A, with respect to the piece 21 that is heated, utilization is formed through hole on the piece 21 that is heated, and by bolt 23 semiconductor element 1A and 1B is tightened together and fixes.Thus, just can seek to be used to install the reduction of number of bolt of semiconductor element 1A and 1B and the reduction of bolt installation work-hour number.
According to this execution mode 1, even if under situation with two power-converting devices, since with one of them power-converting device 1 mutually the semiconductor element mounting of part on the 1st parts installed surface of the piece that is heated, wherein the semiconductor element mounting of 1 of another power-converting device phase part is on the 2nd parts installed surface of the piece that is heated, so also can suppress the complicated of deck construction, improve the packaging density of semiconductor element simultaneously.
In addition, 3 side by side among the heat transfer groups cover of configuration, with respect to the heat transfer group cover of central configuration, a remaining heat transfer group cover is opposite each other with the 1st parts installed surface, and remaining another heat transfer group cover is fixed in the 2nd parts installed surface mode opposite each other, even if so a certain side in two power-converting devices has been taken place under the situation of element destruction, can not bring harmful effect yet, reliability is improved to the opposing party.
And then, utilize on the piece that is heated formed through hole to fix with common clamping tool with the semiconductor element at the back side with being configured in its surface respectively, also obtain thus materials used and man-hour number reduction become possible and so on effect.
Fig. 6 is the front view of the semiconductor cooling device of embodiments of the present invention 2, and Fig. 7 is the plane graph of the semiconductor cooling device of Fig. 1, and Fig. 8 is the right side view of the semiconductor cooling device of Fig. 6.
As shown in Figure 6, in execution mode 2, be the tabular element installed surface that forms and be set as two inverter circuits with respect to the rough face of 1 piece 62 that is heated of configuration vertically in ground.That is, the center line C.L with a face of the vertical disconnected piece that is heated is that the 1st element installed surface 62a, right side are the 2nd element installed surface 62b as the left side, border.
The 1st semiconductor element group G1 that forms by corresponding to six semiconductor elements 51 of U, the V of an inverter circuit, W phase is installed on the 1st element installed surface 62a, the 2nd semiconductor element group G2 that forms by corresponding to six semiconductor elements 51 of U, the V of another inverter circuit, W phase is installed on the 2nd element installed surface 62b.
In addition, on another face of piece 62 that is heated, many tabular fin 65 are along laterally vertically being installed at certain intervals.
Like this, be installed in in the one side by whole semiconductor elements 51 that will constitute two inverter circuits, even if the semiconductor element 51 of an inverter circuit physically damaged situation under, bring influence also can not for the semiconductor element 51 of another inverter circuit.
Then, embodiments of the present invention 3 are described.Fig. 9 is the front view of the semiconductor cooling device of embodiments of the present invention 3, and Figure 10 is the plane graph of the semiconductor cooling device of Fig. 9, and Figure 11 is the right side view of the semiconductor cooling device of Fig. 9.
As shown in Figure 9, in execution mode 3, be the tabular element installed surface that forms and be set as two inverter circuits with respect to the rough face of 1 piece 62 that is heated of configuration vertically in ground.That is, the center line C.L with a face of the cross-section piece 62 that is heated is that the border upside is that the 1st element installed surface 62a, downside are the 2nd element installed surface 62b.
The 1st semiconductor element group G1 that forms by corresponding to six semiconductor elements 51 of U, the V of an inverter circuit, W phase is installed on the 1st element installed surface 62a, the 2nd semiconductor element group G2 that forms by corresponding to six semiconductor elements 51 of U, the V of another inverter circuit, W phase is installed on the 2nd element installed surface 62b.
In addition, on another face of piece 62 that is heated, many tabular fin 65 are along laterally vertically being installed at certain intervals.
Like this, be installed in in the one side by whole semiconductor elements 51 that will constitute two inverter circuits, even if the semiconductor element 51 of an inverter circuit physically damaged situation under, bring influence also can not for the semiconductor element 51 of another inverter circuit.
Then, embodiments of the present invention 4 are described.Figure 12 is the front view of the semiconductor cooling device of embodiments of the present invention 4, and Figure 13 is the left side view of the semiconductor cooling device of Figure 12.
As shown in figure 12, in execution mode 4, be tabular form and with respect to ground generally vertically a face of 1 piece 62 that is heated of configuration be set as the 1st element installed surface 62a, and six semiconductor elements 51 that constitute the 1st semiconductor element group G1 are installed, another face of the piece 62 that is heated is set as the 2nd element installed surface 62b and six semiconductor elements 51 that constitute the 2nd semiconductor element group G2 is installed.
In addition, an end that is the formed heat pipe 64 of L font generally is installed in a side of the piece 62 that is heated, at the tabular fin 65 of another distolateral multi-disc of this heat pipe 64 vertically every to be installed at interval.
Like this, be installed in by whole semiconductor elements 51 that will constitute an inverter circuit on the face of the piece 62 that is heated, and on as another face of its inboard, the whole semiconductor elements 51 that constitute another inverter circuit are installed, even if the semiconductor element 51 of an inverter circuit physically damaged situation under, bring influence also can not for the semiconductor element 51 of another inverter circuit.
Then, embodiments of the present invention 5 are described.Figure 14 is the front view of the semiconductor cooling device of embodiments of the present invention 5, and Figure 15 is the left side view of the semiconductor cooling device of Figure 14.
As shown in figure 14, in execution mode 5, the outside that is a sidewall of formed 1 piece 62 that is heated of angle tubular is set as the 1st element installed surface 62a, and six semiconductor elements 51 that constitute the 1st semiconductor element group G1 are installed, outside as another sidewall of its inboard is set as the 2nd element installed surface 62b, and six semiconductor elements 51 that constitute the 2nd semiconductor element group G2 are installed.
In addition, in the inside that is heated piece 62, tabular fin 65 levels of the multi-disc of Yan Shening and up and down every being provided with at interval along its length, each fin 65 is connected between the inner face of two side of the piece 62 that is heated.In addition, the 66th, cooling fan is sent cooling air towards the inside of the piece 62 that is heated, to promote utilizing fin 65 to dispel the heat.
Like this, be installed in the outside of a sidewall of the piece 62 that is heated by whole semiconductor elements 51 that will constitute an inverter circuit, and the whole semiconductor elements 51 that constitute another inverter circuit are installed in outside as another sidewall of its inboard, even if the semiconductor element 51 of an inverter circuit physically damaged situation under, bring influence also can not for the semiconductor element 51 of another inverter circuit.In addition, owing to transmit from both sides with respect to fin 65 heats, so can efficient dispel the heat well.
Then, embodiments of the present invention 6 are described.Figure 16 is the front view of the semiconductor cooling device of embodiments of the present invention 6, and Figure 17 is the right side view of the semiconductor cooling device of Figure 15.
As Figure 16 and shown in Figure 17, in execution mode 6, possess and be tabular and form and with a pair of piece 62 that is heated up and down with respect to the state configuration of ground inclination, the upper side of the downside of the piece 62 that is heated of upside and the piece 62 that is heated of downside is set as the 1st element installed surface 62a and the 1st semiconductor element group G1 is installed, and is configured in mutual opposed mode.In addition, the downside of the piece 62 that is heated of the upper side of the piece 62 that is heated of upside and downside is set as the 2nd element installed surface 62b and the 2nd semiconductor element group G2 is installed.
In addition, an end of the heat pipe 64 of d-axis shape is installed in side of the piece 62 that is heated and outstanding towards oblique upper, and the tabular fin 65 of multi-disc is vertically every to be installed at interval on this heat pipe 64.
Like this, be installed in a pair of piece 62 of being heated mutually on opposed by whole semiconductor elements 51 that will constitute an inverter circuit, and on its inboard face, install to constitute whole semiconductor elements 51 of another inverter circuit, even if the semiconductor element 51 of an inverter circuit physically damaged situation under, bring influence also can not for the semiconductor element 51 of another inverter circuit.
In addition, can also each be separated and be provided with mutually by each of U, V, W phase with the cooler be made up of be heated piece 62 and fin 65, in the case, because the cooler of operating becomes small-sized, so the advantage of assembling operation property improvement and so on is just arranged.
Then, embodiments of the present invention 7 are described.Figure 18 is the front view of the semiconductor cooling device of embodiments of the present invention 7, and Figure 19 is the right side view of the semiconductor cooling device of Figure 18.
As Figure 18 and shown in Figure 19, in execution mode 7, be tabular and form and be set as the 1st element installed surface 62a and the 1st semiconductor element group G1 is installed with the upper side with respect to 1 piece 62 that is heated of the state configuration of ground inclination, the downside of the piece 62 that is heated is set as the 2nd element installed surface 62b and the 2nd semiconductor element group G2 is installed.
In addition, an end of the heat pipe 64 of d-axis shape is installed in side of the piece 62 that is heated and outstanding towards oblique upper, and the tabular fin 65 of multi-disc is vertically every to be installed at interval on this heat pipe 64.
Like this, be installed in a face of 1 piece 62 that is heated by whole semiconductor elements 51 that will constitute an inverter circuit, and on its inboard face, install to constitute whole semiconductor elements 51 of another inverter circuit, even if the semiconductor element 51 of an inverter circuit physically damaged situation under, bring influence also can not for the semiconductor element 51 of another inverter circuit.
Then, embodiments of the present invention 8 are described.Figure 20 is the front view of the semiconductor cooling device of embodiments of the present invention 8, and Figure 21 is the right side view of the semiconductor cooling device of Figure 20, and Figure 22 is the plane graph of the semiconductor cooling device of Figure 20.
Such as shown in these figures, in execution mode 8, possess and be the tabular a plurality of pieces 62 that are heated that form and vertically dispose with respect to ground.Piece 62 one face of respectively being heated are set as the 1st element installed surface 62a and two semiconductor elements 51 that constitute the 1st semiconductor element group Gl are installed, and another face is set as the 2nd element installed surface 62b and two semiconductor elements 51 that constitute the 2nd semiconductor element group G2 are installed.
Respectively be heated piece 62 its 1st element installed surface 62a and the 2nd element installed surface 62b with mutual opposed mode every with spaced and parallel be configured.And, surface at each semiconductor element 51, wait the metal conductor 67 that the cross section is the コ font to be fixed up by bonding respectively, and then on the surface of two semiconductor elements 51 of adjacency, wait the conductor 68 that the cross section is the コ font to be fixed up by bonding in the mode of crossing between them.These conductors the 67, the 68th are used for the power converting circuit service voltage, by improving rigidity with the metallic plate bending or with enlarged in thickness.
In addition, an end of the heat pipe 64 of d-axis shape is installed in side of the piece 62 that is heated and outstanding towards oblique upper, and the tabular fin 65 of multi-disc is vertically every to be installed at interval on this heat pipe 64.
Like this, by conductor 67,68 is installed on two semiconductor elements 51 on the two sides of the piece 62 that respectively is heated, just can prevent semiconductor element 51 collisions of semiconductor element 51 and the 2nd element installed surface 62b of the 1st element installed surface 62a, even if therefore the semiconductor element 51 of an inverter circuit physically damaged situation under, bring influence also can not for the semiconductor element 51 of another inverter circuit.
Then, embodiments of the present invention 9 are described.Figure 23 is the front view of the semiconductor cooling device of embodiments of the present invention 9, and Figure 24 is the right side view of the semiconductor cooling device of Figure 23, and Figure 25 is the plane graph of the semiconductor cooling device of Figure 23.
Such as shown in these figures, in execution mode 9, possess and be the tabular a plurality of pieces 62 that are heated that form and vertically dispose with respect to ground.Piece 62 one face of respectively being heated are set as the 1st element installed surface 62a and two semiconductor elements 51 that constitute the 1st semiconductor element group Gl are installed, and another face is set as the 2nd element installed surface 62b and two semiconductor elements 51 that constitute the 2nd semiconductor element group G2 are installed.
Respectively be heated piece 62 its 1st element installed surface 62a and the 2nd element installed surface 62b with mutual opposed mode every with spaced and parallel be configured.And, be provided with dividing plate 69 at two 62 of pieces that are heated of adjacency.
In addition, an end of the heat pipe 64 of d-axis shape is installed in side of the piece 62 that is heated and outstanding towards oblique upper, and the tabular fin 65 of multi-disc is vertically every to be installed at interval on this heat pipe 64.
Like this, two 62 of pieces that are heated by adjacency are provided with dividing plate 19, just can prevent semiconductor element 51 collisions of semiconductor element 51 and the 2nd element installed surface 62b of the 1st element installed surface 62a, even if therefore the semiconductor element 51 of an inverter circuit physically damaged situation under, bring influence also can not for the semiconductor element 51 of another inverter circuit.
Claims (6)
1. but a vehicle power source device that possesses two inverter circuits of independent operation is characterized in that, comprising:
Three heat transfer group covers that the piece that is heated, straight tube heat pipe and fin are assembled respectively integratedly, the above-mentioned piece that is heated has and is in the 1st and the 2nd parts installed surface that concerns in the table and the 3rd parts installed surface that is equivalent to the side end face with respect to the above-mentioned the 1st and the 2nd parts installed surface, and the thyristor of part mutually of some 1 in above-mentioned two inverter circuits is installed on above-mentioned the 1st parts installed surface, and another 1 thyristor of part mutually in above-mentioned two inverter circuits has been installed on above-mentioned the 2nd parts installed surface; The base end part of above-mentioned straight tube heat pipe is engaged with on the above-mentioned piece that is heated in the mode of giving prominence to from above-mentioned the 3rd parts installed surface of the above-mentioned piece that is heated, and the heat of the above-mentioned piece that is heated is transported to top ends; Above-mentioned fin is flush-mounted in above-mentioned straight tube heat pipe; And
The frame of above-mentioned three heat transfer groups cover is installed as follows, and promptly an above-mentioned heat transfer group cover is configured in central authorities; One in the remaining above-mentioned heat transfer group cover with respect to the above-mentioned heat transfer group cover that is configured in central authorities, and above-mentioned the 1st parts installed surface is opposed with predetermined distance each other; In the remaining above-mentioned heat transfer group cover another is with respect to the above-mentioned heat transfer group cover that is configured in central authorities, and above-mentioned the 2nd parts installed surface is opposed with predetermined distance each other.
2. according to the described vehicle power source device of claim 1, it is characterized in that:
Be installed in above-mentioned thyristor and the above-mentioned thyristor that is installed on above-mentioned the 2nd parts installed surface on above-mentioned the 1st parts installed surface of the above-mentioned piece that is heated, the shared through hole that in the above-mentioned piece that is heated, forms and being fixed.
3. a semiconductor cooling device possesses: constitute a plurality of pieces that are heated of the 1st and the 2nd element installed surface of the 1st and the 2nd semiconductor element group of two inverter circuits of independent operation mutually but have to have installed; And be connected to radiating part on the above-mentioned piece that respectively is heated, it is characterized in that:
Above-mentioned a plurality of piece that is heated be configured to above-mentioned the 1st element installed surface each other or above-mentioned the 2nd element installed surface opposite each other.
4. according to the described semiconductor cooling device of claim 3, it is characterized in that:
Each each in mutually is provided with mutually the cooler of forming by above-mentioned be heated piece and above-mentioned radiating part.
5. a semiconductor cooling device possesses: constitute a plurality of pieces that are heated of the 1st and the 2nd element installed surface of the 1st and the 2nd semiconductor element group of two inverter circuits of independent operation mutually but have to have installed; And be connected to radiating part on the above-mentioned piece that respectively is heated, it is characterized in that:
Above-mentioned a plurality of be heated piece with the above-mentioned the 1st and the 2nd element installed surface become the mode that concerns in the table be provided with, simultaneously with the mutual opposed mode devices spaced apart configuration of above-mentioned the 1st element installed surface and above-mentioned the 2nd element installed surface, and be provided with the crashproof parts that prevent that the semiconductor element at the semiconductor element of two above-mentioned the 1st element installed surfaces of the above-mentioned interblock that is heated of adjacency and above-mentioned the 2nd element installed surface from colliding.
6. according to the described semiconductor cooling device of claim 5, it is characterized in that:
Above-mentioned crashproof parts double as is to the conductor of above-mentioned inverter circuit service voltage.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004308136A JP4202999B2 (en) | 2004-10-22 | 2004-10-22 | Power supply for vehicle |
| JP308429/2004 | 2004-10-22 | ||
| JP308136/2004 | 2004-10-22 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810179587 Division CN101436818A (en) | 2004-10-22 | 2005-10-18 | Semiconductor cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101040426A CN101040426A (en) | 2007-09-19 |
| CN100492859C true CN100492859C (en) | 2009-05-27 |
Family
ID=36539201
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810179587 Pending CN101436818A (en) | 2004-10-22 | 2005-10-18 | Semiconductor cooling device |
| CN 200580032603 Expired - Fee Related CN100492859C (en) | 2004-10-22 | 2005-10-18 | Power supply device for vehicle |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810179587 Pending CN101436818A (en) | 2004-10-22 | 2005-10-18 | Semiconductor cooling device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4202999B2 (en) |
| CN (2) | CN101436818A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5404310B2 (en) * | 2009-10-27 | 2014-01-29 | 株式会社東芝 | Power supply |
| KR101588989B1 (en) * | 2011-12-09 | 2016-01-26 | 미쓰비시덴키 가부시키가이샤 | Cooling device for under-floor device for vehicle |
| JP5872913B2 (en) * | 2012-01-20 | 2016-03-01 | 株式会社日立製作所 | Refrigerator for railway vehicle power converter |
| JP2015050257A (en) * | 2013-08-30 | 2015-03-16 | 株式会社東芝 | Power conversion device for vehicle and railway vehicle |
-
2004
- 2004-10-22 JP JP2004308136A patent/JP4202999B2/en active Active
-
2005
- 2005-10-18 CN CN 200810179587 patent/CN101436818A/en active Pending
- 2005-10-18 CN CN 200580032603 patent/CN100492859C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101436818A (en) | 2009-05-20 |
| CN101040426A (en) | 2007-09-19 |
| JP2006121843A (en) | 2006-05-11 |
| JP4202999B2 (en) | 2008-12-24 |
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