CN100468722C - 对安全性敏感的半导体产品,尤其是智能卡芯片 - Google Patents
对安全性敏感的半导体产品,尤其是智能卡芯片 Download PDFInfo
- Publication number
- CN100468722C CN100468722C CN200480019735.3A CN200480019735A CN100468722C CN 100468722 C CN100468722 C CN 100468722C CN 200480019735 A CN200480019735 A CN 200480019735A CN 100468722 C CN100468722 C CN 100468722C
- Authority
- CN
- China
- Prior art keywords
- security
- sensitive
- semiconductor product
- interstitital texture
- desired semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 239000003990 capacitor Substances 0.000 claims abstract description 6
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 4
- 239000010703 silicon Substances 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 12
- 229920005591 polysilicon Polymers 0.000 claims description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 238000009792 diffusion process Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07363—Means for preventing undesired reading or writing from or onto record carriers by preventing analysis of the circuit, e.g. dynamic or static power analysis or current analysis
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Storage Device Security (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03102105.8 | 2003-07-11 | ||
EP03102105 | 2003-07-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1820369A CN1820369A (zh) | 2006-08-16 |
CN100468722C true CN100468722C (zh) | 2009-03-11 |
Family
ID=34042936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200480019735.3A Expired - Fee Related CN100468722C (zh) | 2003-07-11 | 2004-07-05 | 对安全性敏感的半导体产品,尤其是智能卡芯片 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7577926B2 (zh) |
EP (1) | EP1654762A1 (zh) |
JP (1) | JP2007528121A (zh) |
CN (1) | CN100468722C (zh) |
WO (1) | WO2005006437A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1691413A1 (fr) * | 2005-02-11 | 2006-08-16 | Axalto SA | Composant électronique protégé contre les attaques. |
JP2006228910A (ja) * | 2005-02-16 | 2006-08-31 | Matsushita Electric Ind Co Ltd | 半導体装置 |
US8201258B2 (en) * | 2007-10-17 | 2012-06-12 | Spansion Llc | Secure personalization of memory-based electronic devices |
CN102456544B (zh) * | 2010-10-19 | 2015-08-26 | 上海华虹宏力半导体制造有限公司 | 芯片信息去除方法 |
US9735105B2 (en) * | 2015-10-16 | 2017-08-15 | Nokia Technologies Oy | Integrated secure device |
US11977614B2 (en) | 2021-09-20 | 2024-05-07 | International Business Machines Corporation | Circuit design watermarking |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69333881T2 (de) * | 1992-07-31 | 2006-07-13 | Hughes Electronics Corp., El Segundo | Sicherheitssystem für eine integrierte Schaltung und Verfahren mit implantierten Verbindungen |
US6137318A (en) * | 1997-12-09 | 2000-10-24 | Oki Electric Industry Co., Ltd. | Logic circuit having dummy MOS transistor |
US6414884B1 (en) * | 2000-02-04 | 2002-07-02 | Lucent Technologies Inc. | Method and apparatus for securing electronic circuits |
US6515304B1 (en) * | 2000-06-23 | 2003-02-04 | International Business Machines Corporation | Device for defeating reverse engineering of integrated circuits by optical means |
JP4553461B2 (ja) * | 2000-08-23 | 2010-09-29 | ルネサスエレクトロニクス株式会社 | 半導体装置、その設計方法および設計装置 |
DE10058078C1 (de) * | 2000-11-23 | 2002-04-11 | Infineon Technologies Ag | Integrierte Schaltungsanordnung mit Analysierschutz und Verfahren zur Herstellung der Anordnung |
DE10120520A1 (de) * | 2001-04-26 | 2002-11-14 | Infineon Technologies Ag | Halbleiterbauelement und Herstellungsverfahren |
EP1490902B1 (en) * | 2002-03-21 | 2010-08-11 | Nxp B.V. | Semiconductor device with a protective security coating and method of manufacturing the same |
US6924552B2 (en) | 2002-10-21 | 2005-08-02 | Hrl Laboratories, Llc | Multilayered integrated circuit with extraneous conductive traces |
-
2004
- 2004-07-05 JP JP2006520050A patent/JP2007528121A/ja not_active Withdrawn
- 2004-07-05 WO PCT/IB2004/051117 patent/WO2005006437A1/en active Application Filing
- 2004-07-05 EP EP04744485A patent/EP1654762A1/en not_active Withdrawn
- 2004-07-05 US US10/564,079 patent/US7577926B2/en active Active
- 2004-07-05 CN CN200480019735.3A patent/CN100468722C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20060168702A1 (en) | 2006-07-27 |
WO2005006437A8 (en) | 2006-03-02 |
EP1654762A1 (en) | 2006-05-10 |
US7577926B2 (en) | 2009-08-18 |
CN1820369A (zh) | 2006-08-16 |
JP2007528121A (ja) | 2007-10-04 |
WO2005006437A1 (en) | 2005-01-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: NXP CO., LTD. Free format text: FORMER OWNER: KONINKLIJKE PHILIPS ELECTRONICS N.V. Effective date: 20071012 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20071012 Address after: Holland Ian Deho Finn Applicant after: Koninkl Philips Electronics NV Address before: Holland Ian Deho Finn Applicant before: Koninklijke Philips Electronics N.V. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090311 Termination date: 20110705 |