CN100466167C - Making method of pliable active component array base board - Google Patents
Making method of pliable active component array base board Download PDFInfo
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- CN100466167C CN100466167C CNB2007100034900A CN200710003490A CN100466167C CN 100466167 C CN100466167 C CN 100466167C CN B2007100034900 A CNB2007100034900 A CN B2007100034900A CN 200710003490 A CN200710003490 A CN 200710003490A CN 100466167 C CN100466167 C CN 100466167C
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Abstract
The invention discloses a manufacturing method of pliability initiative elements array base plate. The method includes steps as following. Firstly, the pliability base plate is conglutinated to horniness base plate to form a base plate module with adhesion layer. In the base plate module, adhesion layer includes colloid and at least one victim. Then, the pliability base plate which is conglutinated to horniness base plate is preceded with an initiative elements array craftwork. Then the light source is emitted to the adhesion layer. The pliability base plate and the horniness base plate are separated. Said manufacturing method can make pliability base plate which is after the initiative elements array craftwork separated with the horniness base plate easily, and improve the percent of pass of production of the pliability initiative elements array base plate.
Description
Technical field
The present invention relates to the manufacture method of a kind of substrate module and active component array base board, and particularly relevant for the manufacture method of a kind of substrate module and pliability (flexible) active component array base board.
Background technology
Now, replace hard substrate with flexible base plate and make the trend that display has become the display development.Whether flat-panel screens possesses pliability, depends on its employed substrate material.When the employed substrate of flat-panel screens is hard substrate (rigid substrate), flat-panel screens will not have pliability.Otherwise, when the employed substrate of flat-panel screens is flexible base plate (as plastic base), just flat-panel screens has good pliability.At present, the technology of making thin-film transistor on hard substrate is gradually ripe, but the technology of making thin-film transistor still remains to be developed on flexible base plate.
In order to answer the demand of flexible base plate introducing technology, can utilize hard substrate as support, in existing equipment, on flexible base plate, carry out all kinds of technologies, to increase the technology qualification rate.For example,, need usually earlier flexible base plate to be attached on the hard substrate, carry out a series of film-forming process afterwards again if will on flexible base plate, make thin-film transistor.The method that flexible base plate is attached on the hard substrate is normally coated between flexible base plate and the hard substrate with adhesive agent.Yet,, after film-forming process finishes, flexible base plate may be damaged element on the flexible base plate from the process that hard substrate takes off if the stickiness of adhesive agent is too strong.On the other hand, when the adhesive agent stickiness is too weak, can make again in the middle of film-forming process, to be subjected to displacement between flexible base plate and the hard substrate and to cause the technology failure.Therefore, engage the technology qualification rate that (bonding) will have influence on flexible array base plate between flexible base plate and the hard substrate.
On the other hand, because general flexible base plate is a plastic material, the situation of electric charge accumulation takes place when being carried out to membrane process easily, and make electrically being affected of thin-film transistor.Therefore, when making the pliability thin-film transistor array base-plate, how avoiding electric charge to be accumulated on the plastic base also is a considerable ring in the middle of the pliability thin-film transistor array base-plate technology.
Summary of the invention
Problem to be solved by this invention provides a kind of manufacture method of pliability active component array base board, to solve the difficult problem of taking off of flexible base plate on hard substrate.
The present invention provides a kind of substrate module in addition, to improve the technology qualification rate of flexible base plate.
The present invention provides a kind of manufacture method of pliability active component array base board again, to avoid flexible base plate the situation of buildup of static electricity takes place when carrying out technology.
The present invention also provides a kind of substrate module, to improve the characteristic of the element on the flexible base plate.
The present invention proposes a kind of manufacture method of pliability active component array base board, and it may further comprise the steps.At first, utilize adhesion layer that flexible base plate is attached to hard substrate.Wherein, adhesion layer comprises colloid and at least one sacrificial body.Then, carry out active cell array technology at the flexible base plate that is attached on the hard substrate.Then, utilize the light source irradiation adhesion layer.Thereupon, make flexible base plate separate with hard substrate.
Based on the manufacture method of above-mentioned pliability active component array base board, the present invention proposes a kind of substrate module in addition.This substrate module comprises hard substrate, flexible base plate and adhesion layer.Wherein, adhesion layer is attached between hard substrate and the flexible base plate, and adhesion layer comprises colloid and at least one sacrificial body.
In one embodiment of this invention, above-mentioned flexible base plate comprises a plastic base, and hard substrate comprises a glass substrate.
In one embodiment of this invention, above-mentioned sacrificial body comprises the sacrificial pattern layer, between colloid and flexible base plate.Wherein, the material of sacrificial pattern layer for example is tin indium oxide, indium zinc oxide or combinations thereof, and the formation method of sacrificial pattern layer comprises the combination of sputtering process, evaporation process or above-mentioned technology.In addition, the thickness of sacrificial pattern layer is about 0.1 micron to 5 microns.
In one embodiment of this invention, above-mentioned sacrificial body comprises a plurality of sacrifice particulates, is doped in the colloid.Simultaneously, sacrifice particulate and comprise a plurality of oxide fine particles, a plurality of amorphous silicon particulate or combinations thereof, and the particle diameter of sacrifice particulate for example is 0.01 micron to 10 microns.
In one embodiment of this invention, above-mentioned active cell array technology comprises amorphous silicon film transistor array processes or poly-silicon thin film transistor array technology.
In one embodiment of this invention, above-mentioned light source comprises LASER Light Source, ultraviolet source or other light source, and the wavelength of light source for example is 200 nanometer to 700 nanometers, is preferably 200 nanometer to 400 nanometers.
The present invention reintroduces a kind of manufacture method of pliability active component array base board, and it may further comprise the steps.At first, utilize adhesion layer that flexible base plate is attached to hard substrate.Wherein, adhesion layer comprises colloid and is doped in the interior electrically conductive particles of colloid.Then, carry out active cell array technology at the flexible base plate that is attached on the hard substrate.Then, utilize the light source irradiation adhesion layer, so that the stickiness of colloid reduces.Thereupon, make flexible base plate separate with hard substrate.
Based on the manufacture method of above-mentioned pliability active component array base board, the present invention more proposes a kind of substrate module.This substrate module comprises hard substrate, flexible base plate and adhesion layer.Wherein, adhesion layer is attached between hard substrate and the flexible base plate, and adhesion layer comprises colloid and is doped in the interior electrically conductive particles of colloid.
In one embodiment of this invention, above-mentioned flexible base plate for example is a plastic base, and hard substrate for example is a glass substrate.
In one embodiment of this invention, above-mentioned electrically conductive particles comprises oxide fine particle, amorphous silicon particulate or metal particle.Wherein, the material of metal particle for example is gold, silver, copper, titanium oxide or combinations thereof.In addition, the particle diameter of electrically conductive particles for example is 0.01 micron to 10 microns.
In one embodiment of this invention, above-mentioned active cell array technology comprises amorphous silicon film transistor array processes or poly-silicon thin film transistor array technology.
In one embodiment of this invention, above-mentioned light source comprises LASER Light Source, ultraviolet source or other light source.
Because the present invention uses when sticking together flexible base plate and hard substrate and has the sacrificial body or the adhesion layer of electrically conductive particles, so the present invention not only can make flexible base plate engage with hard substrate well, and flexible base plate is separated with hard substrate easily.On the other hand, flexible base plate can be avoided the accumulation of electric charge by the sacrificial pattern layer of electrically conductive particles in the colloid or conductivity, uses the technology qualification rate and the element characteristic that improve the pliability active component array base board.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Figure 1A is to the manufacturing process of Fig. 1 C for the pliability active component array base board of the present invention's first embodiment;
Fig. 2 A is to the manufacturing process of Fig. 2 C for the pliability active component array base board of the present invention's second embodiment;
Fig. 3 A is to the manufacturing process of Fig. 3 C for the pliability active component array base board of the present invention's the 3rd embodiment.
Wherein, Reference numeral is:
100,200,300: substrate module
110,210,310: adhesion layer
112,212,312: colloid
114: sacrifice particulate
114a, 214a: hole
120,220,320: flexible base plate
130,230,330: hard substrate
214: the sacrificial pattern layer
314: electrically conductive particles
Embodiment
First embodiment
Figure 1A is to the manufacturing process of Fig. 1 C for the pliability active component array base board of the present invention's first embodiment.At first, please refer to Figure 1A, utilize adhesion layer 110 that flexible base plate 120 is attached to hard substrate 130, to form a substrate module 100.Wherein, adhesion layer 110 comprises colloid 112 and the sacrifice particulate 114 that is doped in the colloid 112.In the present embodiment, sacrifice particulate 114 and comprise oxide fine particle, amorphous silicon particulate or combinations thereof, and the particle diameter of sacrifice particulate 114 for example is 0.01 micron to 10 microns.In addition, flexible base plate 120 for example is a plastic base, and hard substrate 130 for example is a glass substrate.
Then, please refer to Figure 1B, carry out active cell array technology at the flexible base plate 120 that is attached on the hard substrate 130.Wherein, active cell array technology comprises amorphous silicon film transistor array processes or poly-silicon thin film transistor array technology.Particularly, these technologies comprise thin film deposition processes, lithography process, etch process, doping process etc.In the substrate module 100 of present embodiment, sacrifice particulate 114 though contain in the adhesion layer 110, be unlikely to influence the stickiness (shown in Figure 1A) of colloid 112.That is adhesion layer 110 can make flexible base plate 120 and hard substrate 130 be bonded together well.So, when carrying out active cell array technology, can not be subjected to displacement between flexible base plate 120 and the hard substrate 130 and cause the mis-alignment between each rete (misalignment) in the active member, help to promote the technology qualification rate of pliability active component array base board.
Thereupon, please continue to utilize light source irradiation adhesion layer 110 with reference to Figure 1B.In the present embodiment, light source for example is with respect to a side of hard substrate 130 adhesion layer 110 to be shone (shown in arrow among the figure) by adhesion layer 110.For example, the light source that shines on adhesion layer 110 comprises LASER Light Source, ultraviolet source or other light source.Specifically, the wavelength of aforementioned light source for example is 200 nanometer to 700 nanometers, and is preferably 200 nanometer to 400 nanometers.
Then, please refer to Fig. 1 C, make flexible base plate 120 separate with hard substrate 130.Because the sacrifice particulate 114 in the adhesion layer 110 is subjected to after the above-mentioned light source irradiation, can be vaporized and in adhesion layer 110, forms hole (voids) 114a.Therefore, flexible base plate 120 just can be separated at an easy rate with hard substrate 130, and flexible base plate 120 with hard substrate 130 separating process in be not easy to cause the infringement of element.
Second embodiment
Fig. 2 A illustrates the manufacturing process of pliability active component array base board of the present invention's second embodiment to Fig. 2 C.The manufacturing process of the pliability active component array base board of present embodiment is described similar to first embodiment.To the flow process shown in Fig. 2 C, utilize adhesion layer 210 that flexible base plate 220 is attached to hard substrate 230 according to Fig. 2 A earlier,, then carry out active cell array technology at the flexible base plate 220 that is attached on the hard substrate 230 to form substrate module 200.Then, utilize light source irradiation adhesion layer 210, make flexible base plate 220 separate again with hard substrate 230.
Both different part are that adhesion layer 210 comprises colloid 212 and sacrificial pattern layer 214 (shown in Fig. 2 A) in the present embodiment.Wherein, the material of sacrificial pattern layer 214 for example is tin indium oxide, indium zinc oxide or combinations thereof, and the thickness of sacrificial pattern layer 214 is about 0.1 micron to 5 microns.In addition, the method for formation sacrificial pattern layer 214 comprises the combination of sputtering process, evaporation process or above-mentioned technology.Particularly, the method that forms sacrificial pattern layer 214 for example is to carry out sputtering process or evaporation process on colloid 212, with with indium zinc oxide or tin indium oxide is formed on the colloid 212, and, promptly form sacrificial pattern layer 214 with indium zinc oxide layer or indium tin oxide layer patterning.At this moment, sacrificial pattern layer 214 is between colloid 212 and flexible base plate 220, and by colloid 212 flexible base plate 220 and hard substrate 230 is bonded together well.In addition, the method that forms sacrificial pattern layer 214 also can for example be to form indium zinc oxide or tin indium oxide on flexible base plate 220, with indium zinc oxide layer or indium tin oxide layer patterning, promptly forms sacrificial pattern layer 214 afterwards.
In general, when carrying out active cell array technology on flexible base plate 220, nonconducting flexible base plate 220 is easy to generate the electric charge accumulation, and reduces the qualification rate of active component array base board.Yet, in substrate module 200,,, so be difficult for stored charge on the flexible base plate 220 as indium tin oxide or indium-zinc oxide because sacrificial pattern layer 214 is to be made by the conductivity material.In addition, engage between flexible base plate 220 and the hard substrate 230 good, so when carrying out active cell array technology, flexible base plate 220 can not produce slippage.In other words, the substrate module 200 of present embodiment helps to promote the technology qualification rate of pliability active component array base board.
In this enforcement, sacrificial pattern layer 214 has similar character to the sacrifice particulate 114 of first embodiment, and in fact, the light source irradiation that sacrificial pattern layer 214 is subjected to certain energy also can be vaporized afterwards, and forms hole 214a in adhesion layer 210.Therefore, flexible base plate 220 can be separated easily with hard substrate 230.Simultaneously, flexible base plate 220 with hard substrate 230 separating process in be not easy to cause damage.
Among first embodiment and second embodiment, adhesion layer (110 and 210) can make flexible base plate (120 and 220) engage well with hard substrate (130 and 230), and the unlikely mis-alignment that when active cell array technology, produces.In addition, sacrifice particulate 114 and sacrificial pattern layer 214 through all vaporizing after the light source irradiation or the part vaporization, and in adhesion layer (110 and 210), form hole (114a and 214a), flexible base plate (120 and 220) can be separated after finishing active cell array technology easily with hard substrate (130 and 230).Therefore, in the manufacturing process of pliability active component array base board of the present invention and the substrate module (100 and 200), utilize the design of a sacrificial body (sacrificing particulate 114 and sacrificial pattern layer 214), can effectively improve the technology qualification rate of pliability active component array base board.What deserves to be mentioned is that the design of sacrificial body also can be to be present in the adhesion layer (110 and 210) with other pattern among the present invention, and be not limited to sacrifice particulate mentioned in the foregoing description 114 and sacrificial pattern layer 214.For example, sacrificial body of the present invention also for example can be an above-mentioned sacrifice particulate 114 and the combination of sacrificial pattern layer 214.
The 3rd embodiment
Fig. 3 A illustrates the manufacturing process of the pliability active component array base board of the third embodiment of the present invention to Fig. 3 C.The manufacturing process of the pliability active component array base board of present embodiment and first embodiment and second embodiment are described roughly the same.Its different part is, adhesion layer 310 comprises colloid 312 and is doped in electrically conductive particles 314 (as shown in Figure 3A) in the colloid 312 in the present embodiment.Electrically conductive particles 314 comprises oxide fine particle, amorphous silicon particulate or metal particle.Wherein, the material of metal particle for example is gold, silver, copper, titanium oxide or combinations thereof.In addition, the particle diameter of electrically conductive particles 314 for example is 0.01 micron to 10 microns.
In substrate module 300, electrically conductive particles 314 is similar to the sacrificial pattern layer 214 of second embodiment, all can avoid the electric charge accumulation on the flexible base plate 320.In addition, electrically conductive particles 314 can't make the stickiness of adhesion layer 310 reduce, so when carrying out active cell array technology, flexible base plate 320 can not make the technology failure because of slippage.So the substrate module 300 of present embodiment helps to promote the technology qualification rate of pliability active component array base board.
In addition, because after the light source irradiation of the certain energy of colloid 314 warps in the adhesion layer 310 (shown in Fig. 3 B), its stickiness can reduce, so flexible base plate 320 can delamination (shown in Fig. 3 C) with hard substrate 330.
Generally speaking, substrate module 300 also can avoid causing because of flexible base plate 320 and hard substrate 330 are not easily separated the impaired problem of active member on the flexible base plate 320 except can effectively avoid the accumulation of unnecessary electric charge in the manufacture process of active member.
In the various embodiments described above, the thickness of colloid can be 1 micron to 50 microns for example.
In sum, the manufacture method of pliability active component array base board of the present invention and substrate module have the advantage of the following stated at least:
1. in the manufacture process of substrate module of the present invention and pliability active component array base board, engaging between flexible base plate and hard substrate is good, and when carrying out active cell array technology, each rete is difficult for taking place mis-alignment in the active member.
2. among the present invention, sacrificial body forms hole through vaporizing after the illumination in adhesion layer, make flexible base plate easily to separate with hard substrate, and the pliability active component array base board of finishing after the array processes is not fragile.Simultaneously, colloid is after the process light source irradiation of certain energy, and its stickiness decreases also has similar effect.Therefore, the technology qualification rate of pliability active component array base board also significantly promotes.
3. in the manufacture process of substrate module of the present invention and pliability active component array base board, can avoid issuable electric charge accumulation on the flexible base plate because of the design of electrically conductive particles and sacrificial pattern layer, the effect of the characteristic that promotes the pliability active component array base board is more arranged.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (9)
1. the manufacture method of a pliability active component array base board is characterized in that, comprising:
Utilize an adhesion layer that one flexible base plate is attached to a hard substrate, wherein this adhesion layer comprises a colloid and a sacrificial body, and this sacrificial body comprises a sacrificial pattern layer, between this colloid and this flexible base plate;
Carry out an active cell array technology at this flexible base plate that is attached on this hard substrate;
Utilize this adhesion layer of a light source irradiation; And
Make this flexible base plate separate with this hard substrate.
2. the manufacture method of pliability active component array base board according to claim 1 is characterized in that, the material of this sacrificial pattern layer comprises tin indium oxide, indium zinc oxide or combinations thereof.
3. the manufacture method of pliability active component array base board according to claim 1 is characterized in that, the formation method of this sacrificial pattern layer comprises a sputtering process, an evaporation process or combinations thereof.
4. the manufacture method of pliability active component array base board according to claim 1 is characterized in that, the thickness of this sacrificial pattern layer is 0.1 micron to 5 microns.
5. the manufacture method of pliability active component array base board according to claim 1 is characterized in that, this flexible base plate comprises a plastic base.
6. the manufacture method of pliability active component array base board according to claim 1 is characterized in that, this hard substrate comprises a glass substrate.
7. the manufacture method of pliability active component array base board according to claim 1 is characterized in that, this light source is a LASER Light Source or a ultraviolet source.
8. the manufacture method of pliability active component array base board according to claim 1 is characterized in that, the wavelength of this light source is 200 nanometer to 700 nanometers.
9. the manufacture method of pliability active component array base board according to claim 1 is characterized in that, the wavelength of this light source is 200 nanometer to 400 nanometers.
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102013414A (en) * | 2009-09-08 | 2011-04-13 | 群康科技(深圳)有限公司 | Making method of flexible display assembly |
| CN101964323B (en) * | 2010-08-13 | 2012-09-05 | 友达光电股份有限公司 | Manufacturing method of flexible display panel |
| CN102636898B (en) * | 2012-03-14 | 2014-03-12 | 京东方科技集团股份有限公司 | Manufacturing method of flexible display devices |
| CN102738078B (en) * | 2012-06-21 | 2014-11-12 | 京东方科技集团股份有限公司 | Method for manufacturing flexible display substrate |
| CN105158957A (en) | 2013-07-03 | 2015-12-16 | 京东方科技集团股份有限公司 | Preparing method for flexible display and flexible display |
| CN103700662B (en) * | 2013-12-09 | 2017-02-15 | 京东方科技集团股份有限公司 | Bearing substrate, and method for manufacturing flexible display device |
| CN104332416A (en) * | 2014-08-21 | 2015-02-04 | 京东方科技集团股份有限公司 | Preparation method of flexible display and flexible display |
| CN105355591B (en) * | 2015-10-12 | 2019-04-30 | 武汉华星光电技术有限公司 | The manufacturing method of flexible display substrates |
| CN106252240B (en) * | 2016-08-30 | 2018-12-21 | 上海集成电路研发中心有限公司 | The forming method of flexible substrate |
| CN107910458B (en) * | 2017-11-21 | 2020-03-10 | 合肥鑫晟光电科技有限公司 | Flexible display substrate, manufacturing method thereof and display panel |
| CN110364642B (en) * | 2019-05-29 | 2021-12-10 | 福建华佳彩有限公司 | Display device packaging process |
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