CN100464411C - 发光二极管封装结构及封装方法 - Google Patents

发光二极管封装结构及封装方法 Download PDF

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CN100464411C
CN100464411C CNB2005101005588A CN200510100558A CN100464411C CN 100464411 C CN100464411 C CN 100464411C CN B2005101005588 A CNB2005101005588 A CN B2005101005588A CN 200510100558 A CN200510100558 A CN 200510100558A CN 100464411 C CN100464411 C CN 100464411C
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soakage device
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CN1953164A (zh
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胡祯祥
谢逸中
谭理光
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
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    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes

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Abstract

本发明公开一种具有高散热效率的发光二极管封装结构及封装方法，其是将该发光二极管的芯片直接贴设在一均热装置上，该均热装置内可供设置一用于传热的工作流体，该芯片系电性连接至一线路基板上，该线路基板上对应该芯片贯穿设有一穿孔，该均热装置上对应该线路基板之穿孔形成有一凸出点结构，该凸出点结构卡合于该穿孔中，从而将该均热装置组装至该线路基板上。通过该工作流体在均热装置内的相变化过程或者快速流动而可达到迅速将该芯片所产生的热量均布于所述均热装置的目的，从而达到减少热阻的功效，及防止局部热点(Hot Spot)的出现，有效解决高发热量发光二极管的散热问题。

Description

发光二极管封装结构及封装方法
【技术领域】
本发明涉及发光源的封装结构及封装方法，特别是关于具有高散热效率的发光二极管封装结构及封装方法。
【背景技术】
发光二极管(LED，Light-emitting Diode)作为发光源由于具有高效益的特性，而在汽车、交通信号灯指示、屏幕显示，甚至照明等领域得到广泛应用。作为固体光源本身的一个特点，LED发光源在工作时也将发出热量，而它所散发出的热量能否及时导出或散发出去，将成为影响LED发光品质与寿命的关键因素，这是因为，随着温度的升高，LED的发光效益将显著下降，严重影响其发光亮度及缩短其使用寿命。
图1揭示为现有LED模块的其中一封装结构，基本构成为一LED芯片(die)11、一封装层12、一电路板13及两支架14、15，该芯片11放置在其中一支架15所形成的碗部空间内，其工作时产生的热量将通过该支架15而传导至电路板13上散发出去，但因其只利用该支架15进行导热，效率较差。
图2及图3揭示为LED模块的另一种改良型封装结构，基本构成为若干LED模块20穿设通过一电路板28而直接贴设在一金属散热板29上，每一LED模块20包括一LED芯片21、一透光封装层22及一铜底座23，该芯片21安装在铜底座23上所形成的碗部空间内；该电路板28上对应每一LED模块20设置有一穿孔281，该等LED模块20放置在电路板28的穿孔281内并通过其铜底座23与金属散热板29接触；从而，该芯片21所产生的热量可通过该铜底座23而传导至金属散热板29上散发出去，即此种封装方式是通过辅助设置散热结构来加强散热效果。然而，此种散热方式中，LED芯片21所产生的热量须先经由铜底座23再传递至金属散热板29上，导致在热量传递过程中产生较大热阻，且金属散热板29的传热速度亦较慢，热量不易在散热板29上迅速且均匀散开，导致容易在该铜底座23与该金属散热板29的接合处形成热点(Hot Spot)，不利于热量的进一步散发。
且，随着业界积极提高LED的发光亮度，LED发光源亦有替代普通萤光灯管而作为照明用途的趋势，但是提高LED亮度的同时其产生的热量也同步增多，且应用在照明用途中，LED发光源通常以密集方式设置以提升照明亮度，如此使LED的散热问题更突显其重要性。
【发明内容】
有鉴于此，在此实有必要提供一种具高散热效率的发光二极管封装结构及封装方法。
该发光二极管封装结构包括一均热装置、至少一发光二极管芯片及一封装于该芯片外周的透光性封装层，该均热装置内设置有一用于传热的工作流体，该芯片是直接贴设在该均热装置上，该芯片系电性连接至一线路基板上，该线路基板上对应该芯片贯穿设有一穿孔，该均热装置上对应该线路基板之穿孔形成有一凸出点结构，该凸出点结构卡合于该穿孔中，从而将该均热装置组装至该线路基板上。
该发光二极管封装方法包括如下步骤：提供一均热装置，且该均热装置内容纳有一用于传热的工作流体，该均热装置上形成有一凸出点结构；提供一线路基板，该线路基板上贯穿设有一穿孔；将该均热装置的凸出点结构卡合于该线路基板的穿孔中，从而将该均热装置组装至该线路基板上；将一发光二极管芯片结合至该均热装置上并与该线路基板电性连接；及在该芯片的外周封装一透光性封装层。
上述发光二极管的封装结构及封装方法是通过使LED芯片直接与均热装置热传接触，相比现有的通过支架或者铜底座进行导热的方式而言，可达到有效减少热阻的功效，且通过在上述均热装置内设置工作流体，通过工作流体在腔内的相变化过程或者快速流动而达到迅速将LED芯片所产生的热量均布于所述均热装置的目的，从而达到防止局部热点(Hot Spot)的出现，有效解决高发热量LED发光源的散热问题。
【附图说明】
下面参考附图，结合实施例对本发明作进一步描述。
图1是LED模块其中一现有封装结构示意图。
图2是LED模块另一现有封装结构的立体分解示意图。
图3是图2组装后的局部剖示图。
图4是本发明发光二极管封装结构第一实施例的立体分解示意图。
图5是图4的组装剖示图。
图6是本发明发光二极管封装结构第二实施例的组装剖示图。
图7是本发明发光二极管封装结构第三实施例的组装剖示图。
图8是本发明发光二极管封装结构第四实施例的组装剖示图。
图9是本发明发光二极管封装结构第五实施例的立体分解示意图。
【具体实施方式】
图4揭示为本发明发光二极管封装结构的第一实施例，包括一散热器30、一热管40(Heat Pipe)、一线路基板50及若干发光二极管(LED)芯片60；其中，该散热器30包括一底座31及形成在该底座上的若干散热鳍片32，该底座31上沿其表面内凹形成有一沟槽311，用以容纳该热管40；在本实施例中，该热管40为扁平状结构，该等散热鳍片32为多行多列排布的若干细柱；该线路基板50可为印刷电路板(PCB)或者陶瓷基板，贯穿该线路基板50的上下表面设置有若干穿孔51，以供该等LED芯片60放置其中；当然，该线路基板50上还设置有正负极线路以与LED芯片60形成电性连接，此为现有技艺而于此不赘述。
请一并参照图5，组装时，该热管40放置并收容于散热器30底座31的沟槽311中，为降低结合热阻，可在沟槽311内或者热管40的外表面上涂布锡膏或者导热胶等热介面材料以减少散热器30与热管40之间的结合热阻；该线路基板50是结合在热管40裸露在外的扁平表面上以及散热器30的底座31上，且根据需要可在线路基板50与热管40及底座31之间设置一电绝缘层(图未示)；该等LED芯片60则设置在线路基板50的穿孔51中并直接与热管40的扁平表面相贴设，或者通过导热胶70等导热介质而固结在该扁平表面上，且每一LED芯片60可通过打线方式(Wire Bonding)与线路基板50的正负极线路实现电性连接；最后于该LED芯片60上封装一透光封装层80如硅胶或者环氧树脂，以保护LED芯片60不受外界影响及破坏，同时，亦具有将该LED芯片60稳固连接至热管40上的功效。
据此，每一LED芯片60在工作时产生的热量则可直接经由该热管40吸收并通过该散热器30散发出去，由于该热管40内呈真空状态且于其中空腔体内封装有用于传热的工作流体(未标示)，该工作流体在吸热后将产生汽化，由于蒸气在腔内的传播阻力几乎可以忽略，因此，产生的蒸气将迅速充满整个腔室，而当碰到热管40的冷却面(即散热器30与热管40的接触界面)时将再次冷却成液体，冷却后的液体可通过设置在管内壁的毛细结构42而返回至蒸发区，达到利用相变化原理快速将LED芯片60产生的热量均布于整根热管40上，并再通过与热管40接触的散热器30散发出去，由于相变传热具有快速输送大量热能、温度分布均匀、构造简单、重量轻、无需外加作用力、寿命长、低热阻、远距传输等特性，可达到快速且充分传导热量的目的，从而确保该等LED芯片60正常工作并维持最大发光亮度。
图6揭示为本发明发光二极管封装结构的第二实施例，其与上述第一实施例的区别在于所设热管40a的裸露表面上对应每一个LED芯片60向内冲设形成有一凹陷43，从而，该等LED芯片60可植入所形成的凹陷43中，并可在该凹陷43的表面上涂布抗氧化的反光物质，以降低发光损耗，进一步提高LED芯片60的发光亮度。
可以理解地，上述实施例中亦可在散热器30的底座31上同时开设多道容纳热管40或40a的沟槽311，以同时设置更多的LED芯片60，而达到提升整体发光亮度。
为达提升发光亮度的目的，图7揭示为本发明发光二极管封装结构的第三实施例，该实施例是采用具有较大接触平面的蒸发腔100(Vapor Chamber)作为均热装置，由于该蒸发腔100具有比上述热管40、40a更大的裸露表面，因此可提供更多的LED芯片安装空间，图中揭示为同时供三排LED芯片60并列设置，该等LED芯片60是穿设线路基板50a后直接或通过导热介质与蒸发腔100的裸露表面热传接触，该蒸发腔100内亦填充有工作流体，亦是利用工作流体的相变化达到均热的目的，并通过设于蒸发腔100上端的若干散热鳍片(未标示)而将热量及时散发出去，可以理解地，在该蒸发腔100与LED芯片60的结合处亦可向内冲设形成凹陷结构，以使该等LED芯片60能植入其中。
图8揭示为本发明发光二极管封装结构的第四实施例，其与上述第三实施例之区别在于，本实施例在蒸发腔100a与LED芯片60的结合处形成为若干个凸出点结构，该等凸出点结构与设置在线路基板50b上的穿孔(未标示)对应并可伸入至该等穿孔中，如此可方便地实现蒸发腔100a与线路基板50b之间的定位及方便组装。
图9揭示为本发明发光二极管封装结构的第五实施例，为达均热及移除热量之目的，本实施例利用工作流体直接流经一冷却板200的液冷方式对LED芯片60所产生的热量进行移除，若干LED芯片60可通过穿设线路基板50c上所设置的穿孔51后而与冷却板200的外表面热传接触，该冷却板200内开设有弯曲迂回流道201，供冷却工作液通过，从而，LED芯片60工作时产生的热量即可传递至该冷却板200并通过该工作流体在流道201内的循环流动而均布于该冷却板200上，然后，吸收热量后的高温液体在外界泵体210的驱动下在液冷***中作热交换，比如经由设置在外界管道220上的热交换器230将热量带走，冷却后的液体即再次进入冷却板200内，如此使工作流体在液冷***中循环流动，达到移除LED芯片60热量的目的，可以理解地，该冷却板200与LED芯片60的结合处亦可向下冲设形成凹陷结构，以使该等LED芯片60能植入其中，且该冷却板200与LED芯片60的结合处亦可形成若干个凸出点结构，以使该等LED芯片60能够贴设在该等凸出点结构上及方便冷却板200与线路基板50c之间的定位及组装。
本发明的上述实施例中，LED芯片是与热管、蒸发腔及冷却板等均热装置直接热传接触，相比现有的通过支架或者铜底座进行导热的方式而言，可达到有效减少热阻的功效，且通过在上述均热装置内设置工作流体，通过工作流体在腔内的相变化过程或者快速流动而达到迅速将LED芯片所产生的热量均布于所述均热装置上，并随之通过外部设置的散热器、散热鳍片或者热交换器而将热量从均热装置上移除，从而达到防止局部热点(Hot Spot)的出现，有效解决高发热量LED发光源的散热问题。

Claims (13)

1.一种发光二极管封装结构，包括一均热装置、至少一发光二极管芯片及一封装于该芯片外周的透光性封装层，其特征在于：该均热装置内设置有一用于传热的工作流体，该芯片是直接贴设在该均热装置上，该芯片系电性连接至一线路基板上，该线路基板上对应该芯片贯穿设有一穿孔，该均热装置上对应该线路基板之穿孔形成有一凸出点结构，该凸出点结构卡合于该穿孔中，从而将该均热装置组装至该线路基板上。
2.如权利要求1所述的发光二极管封装结构，其特征在于：该均热装置为一扁平的热管。
3.如权利要求2所述的发光二极管封装结构，其特征在于：该热管是设置在一散热器上，该散热器开设有一沟槽以容纳该热管，该芯片在工作时所产生的热量可通过所述工作流体的相变化而均布于该热管，并通过所述散热器进行散发。
4.如权利要求1所述的发光二极管封装结构，其特征在于：该均热装置为一具有接触平面的蒸发腔。
5.如权利要求4所述的发光二极管封装结构，其特征在于：该蒸发腔上接设有若干散热鳍片，该芯片在工作时所产生的热量可通过所述工作流体的相变化而均布于该蒸发腔，并通过所述散热鳍片进行散发。
6.如权利要求1所述的发光二极管封装结构，其特征在于：该均热装置为一内设有流道的冷却板，该芯片在工作时所产生的热量可通过所述工作流体在该流道内的循环流动而带走。
7.一种发光二极管封装方法，包括如下步骤：
提供一均热装置，且该均热装置内容纳有一用于传热的工作流体，该均热装置上形成有一凸出点结构；
提供一线路基板，该线路基板上贯穿设有一穿孔；
将该均热装置的凸出点结构卡合于该线路基板的穿孔中，从而将该均热装置组装至该线路基板上；
将一发光二极管芯片结合至该均热装置上并与该线路基板电性连接；及
在该芯片的外周封装一透光性封装层。
8.如权利要求7所述的发光二极管封装方法，其特征在于：该均热装置为一扁平的热管。
9.如权利要求8所述的发光二极管封装方法，还包括提供一设置有沟槽的散热器，并将该热管设置在所述散热器的沟槽内。
10.如权利要求7所述的发光二极管封装方法，其特征在于：该均热装置为一具有接触平面的蒸发腔。
11.如权利要求10所述的发光二极管封装方法，还包括在该蒸发腔的外表面设置若干散热鳍片。
12.如权利要求7所述的发光二极管封装方法，其特征在于：该均热装置为一内设有流道的冷却板。
13.如权利要求12所述的发光二极管封装方法，还包括在所述冷却板上连接一具有泵体及热交换器的循环管路。
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