CN100461984C - Circuit assembling structure - Google Patents
Circuit assembling structure Download PDFInfo
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- CN100461984C CN100461984C CNB2005101125310A CN200510112531A CN100461984C CN 100461984 C CN100461984 C CN 100461984C CN B2005101125310 A CNB2005101125310 A CN B2005101125310A CN 200510112531 A CN200510112531 A CN 200510112531A CN 100461984 C CN100461984 C CN 100461984C
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Abstract
The circuit mounting structure comprises: a first base material having multi first circuit pins, and having a first register mark and a second register mark located at same side of circuit pins; and a second base material having multi second circuit pins and a transparent area located at one side of the second circuit pins. When the first base material is attached to the second material, if the edge of transparent area is located between the first register mark and the second register mark, and the first register mark is located at the outside of transparent area, then the first circuit pins are connected to the second circuit pins.
Description
Technical field
The present invention is about a kind of circuit assembling structure, particularly about a kind of circuit assembling structure that is applied to display.
Background technology
The structure of display dress is general use coil type crystal grain engage (Tape Automated Bonding, TAB) or ambetti engage (Chip On Glass, technology such as COG).Compared to coil type crystal grain joining technique, employed flexible circuit board of ambetti joining technique and printed circuit board (PCB) quantity are few, are minimized cost.
For the number of plies of the quantity that further reduces flexible circuit board and printed circuit board (PCB) to obtain bigger cost benefit, (WiringOn Array WOA) directly gets up chip for driving serial connection (Cascade) to use the product of ambetti joining technique also can use cabling on the glass substrate usually.In the chip for driving of serial connection, only carry data and control signal just can be transferred in other chip for driving that is connected in series each other to first chip for driving.Be different from general mode of respectively each chip for driving being carried data and control signal, the flexible circuit board that connects panel only need provide data and control signal to first chip for driving and power supply signal to each chip for driving, but do not need to provide individually data and control signal to each chip for driving, therefore can reduce the quantity and the board area of flexible circuit board upward wiring, and reduce price.Because chip for driving more can be simplified the design of printed circuit board (PCB) with the serial connection of the cabling on the glass substrate, make its number of plies minimizing, low price.
Because the signal kinds of gate drive chip (Gate Driver) is less, relative also less of required contact number is so on panel periphery wiring (layout) and weld pad (pad) layout, be easier to the collocation serial connection and design.Recently, under the requirement that reduces cost, managing has become the direction that the panel dealer makes great efforts to develop with source driving chip (Source Driver) serial connection.But,, under the restriction of naked crystalline substance (flip chip) size, reduced the design flexibility of panel wiring because the signal kinds of source driving chip is more; And,, more increase the difficulty in the design as sharing tester table, module tool etc. in order to be compatible with existing processing procedure.Therefore how to improve the cabling design on the glass substrate, the Material Cost of panel circuit is more saved, be the target that periphery design is made great efforts always.
Please refer to Figure 1A is existing display.Panel 10 has an active region 11, and multiple source driver 12 and a plurality of gate drivers 13 are arranged at around the active region 11.Source electrode driver 12 is done the signal transmission with printed circuit board (PCB) 17a and 17b with gate drivers 13 respectively by flexible circuit board 20.Shown in Figure 1B, zone 14 between the adjacent two source electrode driver 12a:12b that are not connected in series in the panel 10, some standby pattern 16 (dummy pattern) and aligning structure 15 are only arranged, and aligning structure 15 provides panel 10 and flexible circuit board 20 to make the usefulness of circuit assembling.
Shown in Fig. 1 C, aligning structure 15 comprises a contraposition mark 151 (alignment mark).When panel 10 engaged with flexible circuit board 20, flexible circuit board 20 was aimed at inspection with a transmission region 21 with the alignment mark 151 of panel 10.When alignment mark 151 just was positioned at transmission region 21 inside, the circuit pin (lead) 121 of source electrode driver 12 was promptly aimed at the circuit pin 22 on the flexible circuit board 20.Shown in Fig. 1 D, as long as transmission region 21 staggers with alignment mark 151, promptly indication circuit pin 121 promptly staggers with the circuit pin, but can't know the degree that staggers.
By the wires design among the figure as can be known, all will there be the required alignment mark of joint technology 151 at the edge of each sheet panel 10.Since these alignment marks 151 between two driving elements and its limited location require and can not change arbitrarily in processing procedure, so that the side space, two ends of the circuit pin of driving element effectively can't be used in line design, especially fail in response to the many requirements of source electrode driver contact number, also limited the design of glass substrate upward wiring, very unfortunate.
Summary of the invention
The object of the present invention is to provide a kind of circuit assembling structure, the contraposition joint accuracy of a part that the wiring pattern at two driver intervals is designed to aligning structure with the design that takes into account the glass substrate upward wiring simultaneously and when improving the circuit assembling.
Circuit assembling structure of the present invention is used contraposition and is engaged circuit on two different grounds, and for example display pannel and flexible circuit board engages.
The invention provides a kind of circuit assembling structure, comprising: have a plurality of first circuit pins on one first ground, and have the same side that one first alignment mark and one second alignment mark are arranged at these first circuit pins; And one second have the side that a plurality of second circuit pins and a transparent area are arranged at these second circuit pins on the ground.When first ground is overlapped in second ground, if the transparent area edge is between first alignment mark and second alignment mark, and first alignment mark is positioned at outside the transparent area, then these first circuit pins contact these second circuit pins.
The present invention also provides a kind of circuit assembling structure, comprising: one first ground; A plurality of driving elements, serial connection is arranged on described first ground, and each driving element has a plurality of first circuit pins; One first alignment mark is formed between adjacent two driving elements; One second alignment mark is arranged between described adjacent two driving elements on described first ground; And one second ground, has the side that a plurality of second circuit pins and a transparent area are arranged at described second circuit pin on it, when described first ground is overlapped in described second ground, if described transparent area edge is between above-mentioned two alignment marks, and described first alignment mark is positioned at outside the described transparent area, and the then described first circuit pin contacts described second circuit pin.
Above-mentioned first alignment mark can be a conductive pattern, a circuit trace or a numbering mark, as cuts sheet numbering (Chip ID) or glass plate numbering (Plate ID) etc.For an active display panel, when first alignment mark and second alignment mark are formed between adjacent two driving elements, utilize alignment mark and its spacing of wiring pattern on every side, engage the mode that alignment precision is checked as another, to reach whether inspection aims at and the alignment error effect of the duplication check (double check) in permissible range whether.In addition, utilize the space, bonding land between two driving elements to come routing of layout, also can improve the elasticity in the design of glass substrate upward wiring.
Description of drawings
Figure 1A is existing display;
Figure 1B is the enlarged drawing of two plate junctions among Figure 1A;
Fig. 1 C is the enlarged drawing of aligning structure among Figure 1B;
Fig. 1 D is the existing state of aligning structure when misalignment;
Fig. 2 is a circuit assembling structure of the present invention;
Fig. 3 A is the alignment of circuit assembling structure of the present invention;
Fig. 3 B is the alignment limit of circuit assembling structure of the present invention;
Fig. 3 C is the misalignment state of circuit assembling structure of the present invention;
Fig. 4 is for being the embodiment of first alignment mark with circuit trace;
Fig. 5 is for being labeled as the embodiment of first alignment mark with numbering;
Fig. 6 is the welding pad structure that is connected with the first circuit pin;
Fig. 7 A is the LCD with circuit assembling structure of the present invention;
Fig. 7 B is the enlarged drawing at liquid crystal panel and flexible printed wiring board junction surface among Fig. 7 A.
The main element symbol description
Circuit assembling structure 30 first grounds 31 first circuit pins 311
First alignment mark, 33 second alignment marks, 34 conductive patterns 35
Outside short loop 36 numbering marks 37 standby pin 38 weld pads 39
First conductive layer, 391 insulating barriers, 392 open-works 3921
Second conductive layer, 393 thin-film transistors, 40 chip for driving 50
714 flexible circuit boards, 72 printed circuit board (PCB)s, 73 junction surfaces 74, conducting wire
Embodiment
Following conjunction with figs. is described circuit assembling structure of the present invention in detail, and enumerates preferred embodiment and be described as follows:
Please refer to Fig. 2, be circuit assembling structure of the present invention.Circuit assembling structure 30 lays respectively on one first ground 31 and one second ground 32.Have a plurality of first circuit pins 311 on first ground 31, and have the same side that one first alignment mark 33 and one second alignment mark 34 are arranged at these first circuit pins 311.Has the side that a plurality of second circuit pins 321 and a transparent area 322 are arranged at these second circuit pins 321 on second ground 32.When first ground 31 is overlapped in second ground 32, if transparent area 322 edges are positioned within the space D of first alignment mark 33 and second alignment mark 34, and first alignment mark 33 is positioned at outside the transparent area 322, then these first circuit pin, 311 these second circuit pins 321 of contact.
The foregoing circuit package assembly is positioned at the junction of two plates, can be applicable to the electronics that display etc. has circuit board bridging arrangement or circuit board and a panel bridging arrangement and produces in the device alignment precision when engaging to improve the circuit pin.Among the present invention, first ground 31 can be liquid crystal panel or the organic electroluminescence panel with thin-film transistor array, and the first circuit pin 311 can be connected to the chip for driving on the panel.Second ground 32 can be flexible base plate, for example flexible printed wiring board.Transparent area 322 can be the spacious zone of not connecting up as shown in Figure 2, or only utilizes an edge line drawing to remember on the second transparent ground 32, or forms in 32 borings of second ground.First alignment mark 33 and second alignment mark 34 can be the light tight structure of arbitrary shape, but should keep suitable space D between the two with the translation permissible range as the transparent area edge line.First alignment mark 33 can be a conductive pattern, a circuit trace or a numbering mark, will explanation individually in following examples.
Please refer to Fig. 3 A-3C, is the embodiment of first alignment mark 33 with conductive pattern, and icon structure of the present invention to method for position.Conductive pattern 35 on first ground 31 is covered in the side regions of the first circuit pin 311, and is connected in the first circuit pin 311, but keeps a uncovered area 313.Second alignment mark 34 of one circle is located in the uncovered area 313, and with conductive pattern 35 space D of being separated by.Transparent area 322 on second ground 32 also is circular, cooperates the shape of second alignment mark 34 and establishes, and in a better embodiment, its slightly larger in diameter is in second alignment mark 34 of circle, and less than the width of uncovered area.
As shown in Figure 3A, in the time of on second ground 32 is overlapped in first ground 31,, represent the first circuit pin 311 just to aim at second circuit pin 321 if the edge line 323 of transparent area 322 is positioned at the space D central authorities of the conductive pattern 35 and second alignment mark 34.Shown in Fig. 3 B, if the edge line 323 of transparent area 322 is positioned at the intersection of conductive pattern 35 and uncovered area 313, represent the first circuit pin 311 not aim at second circuit pin 321 fully, but still in acceptable error range.Shown in Fig. 3 C, if the edge line 323 of transparent area 322 exceeds the intersection of conductive pattern 35 and uncovered area 313, and enter in the overlay area of conductive pattern 35, represent the first circuit pin 311 to depart from second circuit pin 321 fully and do not contact with each other, though or have the small part contact not reach the requirement of quality bills of materials.
Fig. 3 A-3C has illustrated a kind of contraposition assemble method of circuit, and at first, the pre-aeolotropic conductive film (ACF) that pastes on a plurality of first circuit pins 311 can utilize a contraposition reference signs 312 as auxiliary during attaching.When second ground 32 and first ground 31 are overlapping, whether the edge line 323 of inspecting transmission region 322 drops on the interior degree of space D of the conductive pattern 35 and second alignment mark 34, be aligned with each other to judge corresponding first circuit pin 311 and second circuit pin 321.If be adjusted to the situation of Fig. 3 A, then utilize hot cramping that the first circuit pin 311 and second circuit pin 321 are in the same place through aeolotropic conductive film joint (bonding).Compare with Fig. 1 C-1D, whether prior art only can have aligning by the decision circuitry pin, but the present invention can further set the permissible range of bit errors with the width of space D, therefore has the effect of duplication check (double check).
Please refer to Fig. 4, is the embodiment of first alignment mark 33 with circuit trace.The side of the first circuit pin 311 can be the cabling of any circuit, for example the outside short loop 36 that prevents electrostatic breakdown (Electro-StaticDischarge damage) of Fig. 4 (0uter Short Ring, OSR).Second alignment mark 34 and is separated by a space D so that the usefulness of aiming at inspection to be provided with outside short loop 36 between the outside short loop 36 and the first circuit pin 311.
Please refer to Fig. 5, with the numbering mark, as to cut sheet numbering or glass plate numbering etc. be the embodiment of first alignment mark 33.Second alignment mark 34 can be located between the numbering mark 37 and a standby pin (dummy leads) 38 of first ground 31, and is separated by a space D so that the usefulness of aiming at inspection to be provided with numbering mark 37.
Metal materials such as among above-mentioned all embodiment, first alignment mark 33 and second alignment mark 34 all can aluminium, molybdenum, chromium and alloy thereof are made.The space D of first alignment mark 33 and second alignment mark 34 can be 50 μ m to 150 μ m, is preferably 100 μ m.The circular mark that second alignment mark 34 can be a diameter 150 μ m to 250 μ m is made between the first circuit pin 311 and first alignment mark 33 being fit to.At this moment, 34 pictures of transparent area are decided to be the border circular areas of a diameter 250 μ m to 350 μ m so that big in the area of second alignment mark.Therefore, when first ground 31 and second ground 32 were done contraposition, permissible error was positive and negative 50 μ m.
Please refer to Fig. 6, be the welding pad structure that is connected with the first circuit pin.When on first ground 31 other circuit element being arranged still, usually connect the first circuit pin 311 and these circuit elements with a weld pad 39, to provide from the circuit element on electrical signal transfer to the first ground 31 of second ground 32, the structure of weld pad 39 comprises that one first conductive layer 391 is formed on first ground 31, and be contacted with the first circuit pin 311, one insulating barrier 392 is positioned on first conductive layer 391, and have an open-work 3921, and one second conductive layer 393 contacts with first conductive layer 391 via open-work 3921.The other end of first conductive layer 391 is connected in 393 of a thin-film transistor 40, the second conductive layers and engages with a chip for driving 50, and chip for driving 50 may be source driving chip or gate-drive chip.
Please refer to Fig. 7 A, is example with a LCD, and the application of circuit assembling structure of the present invention is described.LCD 70 comprises that a liquid crystal panel 71 joins by a flexible circuit board 72 and a printed circuit board (PCB) 73.Have a plurality of driving elements that serial connection is provided with on the liquid crystal panel 71, comprise the source driving chip 711 of serial connection and the grid drive chip 712 that is connected in series.With source driving chip 711 is example, and simultaneously with reference to Fig. 7 B and Fig. 3 A, it directly is assemblied on the glass substrate with the method that ambetti engages, and again with the cabling on the glass substrate (WOA) serial connection, and extends a plurality of first circuit pins 311.72 of flexible printed wiring boards have a plurality of second circuit pins 321 and transparent area 322 to be arranged at a side of these second circuit pins 321.
Fig. 7 B is the enlarged drawing at liquid crystal panel 71 and flexible circuit board 72 junction surfaces 74.The conductive pattern 35 and second alignment mark 34 are made between adjacent two source driving chip 711a and the 711b.When the bonding land of liquid crystal panel 71 (bonding pad) when being overlapped in flexible printed wiring board 72, transparent area 322 edges are placed between the conductive pattern 35 and second alignment mark 34, and conductive pattern 35 is positioned at outside the transparent area 322, so can make the first circuit pin 311 aim at second circuit pin 321.
Comparison diagram 7B and Figure 1B, show that conductive pattern 35 be that cabling on a kind of new glass substrate designs, its part with a spaciousness is avoided second alignment mark 34, make the side space of bonding land also can be utilized to design various circuits, for example be connected in series the conducting wire 714 of chip for driving 711a and 711b.So can improve compatibility, the alignment precision of existing processing procedure and reduce cost.
When the present invention and prior art compare mutually, have more and get row characteristic and advantage ready:
1. need not change joining tool existing boards such as (bonding tool), the compatibility of newly-designed importing of accelerating module section and raising technology.
2. improve little spacing and engage the accuracy that (fine pitch bonding) processing procedure is aimed at inspection.
3. improve the elasticity in the design of glass substrate upward wiring, increase the programmable space of circuit.
4. under the changeless situation of second alignment mark, the while can utilize the space, bonding land between two driving elements to do the design of glass substrate upward wiring.
5. utilize the spacing of alignment mark and wiring around it, engage the mode that alignment precision is checked as another
6. the effect that has duplication check.
Above-listed detailed description is at the specifying of preferred embodiment of the present invention, but the foregoing description is not in order to restriction protection scope of the present invention, and all the technology of the present invention spirit institutes that do not break away from do equivalence and implement or change, and all should be contained in the protection range of this case.
Claims (18)
1. a circuit assembling structure is characterized in that, comprising:
One first ground has a plurality of first circuit pins;
One first alignment mark is arranged on described first ground, and is positioned at a side of the described first circuit pin;
One second alignment mark is arranged on described first ground, and is positioned at described first a circuit pin side identical with described first alignment mark; And
One second ground has the side that a plurality of second circuit pins and a transparent area are arranged at described second circuit pin on it,
When described first ground was overlapped in described second ground, if described transparent area edge is between above-mentioned two alignment marks, and described first alignment mark was positioned at outside the described transparent area, and the then described first circuit pin contacts described second circuit pin.
2. a kind of circuit assembling structure as claimed in claim 1 is characterized in that, described first alignment mark is a conductive pattern.
3. a kind of circuit assembling structure as claimed in claim 2 is characterized in that, described first alignment mark is connected in the described first circuit pin.
4. a kind of circuit assembling structure as claimed in claim 1 is characterized in that, has a thin film transistor (TFT) array on described first ground.
5. a kind of circuit assembling structure as claimed in claim 1 is characterized in that, the described first circuit pin is connected to a chip for driving.
6. a kind of circuit assembling structure as claimed in claim 1 is characterized in that, the spacing of described first alignment mark and described second alignment mark is 50 μ m to 150 μ m.
7. a kind of circuit assembling structure as claimed in claim 1 is characterized in that, the material of described first alignment mark and described second alignment mark is the combination that aluminium, molybdenum, chromium and alloy thereof are formed.
8. a kind of circuit assembling structure as claimed in claim 1 is characterized in that, described second alignment mark is the circular mark of a diameter 150 μ m to 250 μ m.
9. a kind of circuit assembling structure as claimed in claim 1 is characterized in that, described transparent area is the border circular areas of a diameter 250 μ m to 350 μ m.
10. a kind of circuit assembling structure as claimed in claim 1 is characterized in that, described second ground is a flexible base plate.
11. a kind of circuit assembling structure as claimed in claim 1 is characterized in that, the described first circuit pin is connected to a weld pad, and the structure of described weld pad comprises:
One first conductive layer is contacted with the described first circuit pin;
One insulating barrier is positioned on described first conductive layer, and has an open-work; And
One second conductive layer contacts with described first conductive layer by described open-work.
12. a kind of circuit assembling structure as claimed in claim 1 is characterized in that, described first alignment mark is a numbering mark.
13. a kind of circuit assembling structure as claimed in claim 1 is characterized in that, described first alignment mark is the cabling of any circuit.
14. a circuit assembling structure is characterized in that, comprising:
One first ground;
A plurality of driving elements, serial connection is arranged on described first ground, and each driving element has a plurality of first circuit pins;
One first alignment mark is formed between adjacent two driving elements;
One second alignment mark is arranged between described adjacent two driving elements on described first ground; And
One second ground has the side that a plurality of second circuit pins and a transparent area are arranged at described second circuit pin on it,
When described first ground was overlapped in described second ground, if described transparent area edge is between above-mentioned two alignment marks, and described first alignment mark was positioned at outside the described transparent area, and the then described first circuit pin contacts described second circuit pin.
15. a kind of circuit assembling structure as claimed in claim 14 is characterized in that, described driving element is a source driving chip.
16. a kind of circuit assembling structure as claimed in claim 14 is characterized in that, described driving element is a grid drive chip.
17. a kind of circuit assembling structure as claimed in claim 14 is characterized in that, the area of described transparent area is greater than the described second alignment mark area.
18. a kind of circuit assembling structure as claimed in claim 14 is characterized in that, described first alignment mark is the conductive pattern of described adjacent two driving elements of a connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101125310A CN100461984C (en) | 2005-09-30 | 2005-09-30 | Circuit assembling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101125310A CN100461984C (en) | 2005-09-30 | 2005-09-30 | Circuit assembling structure |
Publications (2)
| Publication Number | Publication Date |
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| CN1942052A CN1942052A (en) | 2007-04-04 |
| CN100461984C true CN100461984C (en) | 2009-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005101125310A Active CN100461984C (en) | 2005-09-30 | 2005-09-30 | Circuit assembling structure |
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| CN (1) | CN100461984C (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101437359B (en) * | 2007-11-15 | 2012-08-08 | 福建华映显示科技有限公司 | Circuit board with position indication and jointing method (thereof) |
| CN101847617B (en) * | 2009-03-23 | 2011-09-21 | 南茂科技股份有限公司 | Packaging substrate and chip packaging structure |
| KR102163358B1 (en) * | 2014-07-21 | 2020-10-12 | 엘지디스플레이 주식회사 | Display Device |
| TWI657362B (en) | 2015-03-23 | 2019-04-21 | 群創光電股份有限公司 | Touch device |
| CN106155370B (en) * | 2015-03-23 | 2019-06-21 | 群创光电股份有限公司 | Touch device |
| CN107688249B (en) * | 2016-08-05 | 2021-09-10 | 豪威科技股份有限公司 | Liquid crystal panel test platform |
| JP2019159240A (en) * | 2018-03-16 | 2019-09-19 | シャープ株式会社 | Display panel |
| CN108493183B (en) * | 2018-04-02 | 2020-05-08 | 昆山国显光电有限公司 | Array substrate, chip on film, alignment method of chip on film and display device |
| US10964644B2 (en) | 2018-04-02 | 2021-03-30 | Kunshan Go-Visionox Opto-Electronics Co., Ltd. | Array substrate, chip on film, and alignment method |
| CN108811324A (en) * | 2018-08-27 | 2018-11-13 | 惠科股份有限公司 | Circuit board assembly, display panel and display device |
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| JPH08136723A (en) * | 1994-11-14 | 1996-05-31 | Toppan Printing Co Ltd | Production of color filter |
| US6366468B1 (en) * | 2000-04-28 | 2002-04-02 | Hewlett-Packard Company | Self-aligned common carrier |
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| CN1942052A (en) | 2007-04-04 |
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