CN100437989C - Wafer packaging for asymmetric casting mold - Google Patents
Wafer packaging for asymmetric casting mold Download PDFInfo
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- CN100437989C CN100437989C CNB2005100898241A CN200510089824A CN100437989C CN 100437989 C CN100437989 C CN 100437989C CN B2005100898241 A CNB2005100898241 A CN B2005100898241A CN 200510089824 A CN200510089824 A CN 200510089824A CN 100437989 C CN100437989 C CN 100437989C
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- 238000004806 packaging method and process Methods 0.000 title description 14
- 238000005266 casting Methods 0.000 title 1
- 238000012856 packing Methods 0.000 claims abstract description 82
- 239000000084 colloidal system Substances 0.000 claims description 77
- 230000000994 depressogenic effect Effects 0.000 claims description 42
- 239000011248 coating agent Substances 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 31
- 238000005452 bending Methods 0.000 claims description 27
- 239000000853 adhesive Substances 0.000 abstract 4
- 230000001070 adhesive effect Effects 0.000 abstract 4
- 239000012790 adhesive layer Substances 0.000 abstract 3
- 238000013461 design Methods 0.000 description 9
- 238000007789 sealing Methods 0.000 description 8
- 238000004513 sizing Methods 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
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- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
The invention relates to the chip package of asymmetry mould, which comprises: one wire support, one chip, one adhesive layer, several packing lines and one packing adhesive, wherein said wire support has one main body and at least one interference plate; the main body has several internal pins and several external pins; the interference plate bends downwards to form one concave while its first end is connected to the main body, and second end is lower than the internal pins; the chip is fixed under the internal pins; the interference plate is at one side of chip; the adhesive layer is between the chip and the internal pins; the packing lines are connected between the internal pins and the chip; the packing adhesive at least covers chip, packing lines, internal pins, adhesive layer and interference plate, while the thickness of said adhesive above the concave and the thickness of said adhesive under the concave are rated higher than 1, and the ratio between the thickness under the external pins and the thickness above the external pins are different.
Description
Technical field
The invention relates to a kind of chip packing-body of asymmetric mold, and particularly relevant for a kind of chip packing-body with lead frame.
Background technology
To Dynamic Random Access Memory (dynamic random access memory, DRAM), employed packaged type can be divided into outer pin package (the small outline J-lead of small-sized J type, SOJ) with small-sized outer pin package (thin small outline package, TSOP) two kinds, and this advantage of two kinds is that transmission speed is fast, heat radiation is good and structure is little.Yet, if with regard to lead frame (lead frame), the outer pin package of small-sized J type and small-sized outer pin package can be divided into pin again, and (lead on chip LOC) encapsulates, and for example US Patent 4 above being positioned at chip, 862,245 or pin be positioned at chip below (chip on lead, COL), for example US Patent 4,989,068.
Figure 1A illustrates the cutaway view of the small-sized outer pin package body of the known LOC of having framework.Please refer to shown in Figure 1A, known small-sized outer pin package body 100a comprises a lead frame 110, a chip 120, an adhesion coating 130, many first bonding wire (bonding wire) 140a and a packing colloid (moldingcompound) 150, wherein lead frame 110 have a plurality of in pin portions 112 and a plurality of outer pin portion 114.Pin portion 112 belows in chip 120 is bonded to, and adhesion coating 130 is disposed between chip 120 and the interior pin portion 112, in order to fixed chip 120.These first bonding wires 140a is electrically connected at respectively between chip 120 and the interior pin portion 112, and packing colloid 150 coat in pin portion 112, chip 120, adhesion coating 130 and the first bonding wire 140a.
It should be noted that, the ratio of thickness D2 of thickness D1 and the packing colloid 150 that is positioned at outer pin 114 belows that is positioned at the packing colloid 150 of outer pin 114 tops is 1: 3, therefore when packing colloid 150 condensations are shunk, known small-sized outer pin package body 100 just is easy to generate the phenomenon of warpage (warpage), and damages.
Figure 1B illustrates the cutaway view of the small-sized outer pin package body of another the known LOC of having framework.Please continue with reference to Figure 1B, Figure 1B is similar to Figure 1A, its difference is: another kind of known small-sized outer pin package body 100b more comprises many second bonding wire 140b, and lead frame 110 comprises that more are converged electric bars (bus bar) 116, and these converge electric bar 116 with these in pin portions 112 adjacent.In addition, these second bonding wires 140b is electrically connected at respectively and converges between electric bar 116 and the chip 120.Yet the known small-sized outer pin package body 100b of this kind still exists above-mentioned problem.
This shows that above-mentioned existing chip packaging body obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that chip packing-body exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of chip packing-body of asymmetric mold of new structure, just become the current industry utmost point to need improved target.
Because the defective that above-mentioned existing chip packaging body exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, chip packing-body in the hope of the asymmetric mold of founding a kind of new structure, can improve general existing chip packaging body, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
In view of this, purpose of the present invention is exactly that a kind of chip packing-body of asymmetric mold is being provided, and it has better reliability degree (reliability).
In addition, another object of the present invention is exactly that a kind of chip packing-body of asymmetric mold is being provided, and it has less warpage (warpage) deflection.
Based on above-mentioned purpose or other purposes, the present invention proposes a kind of chip packing-body of asymmetric mold, it comprises a lead frame, a chip, an adhesion coating, many first bonding wires and a packing colloid, and wherein lead frame comprises a lead frame body and at least one spoiler.The lead frame body have a plurality of in pin portions and a plurality of outer pin portion.Part between spoiler first end and second end is bent to form a depressed part downwards towards the body below, and wherein first end is connected with the lead frame body, and second end is lower than interior pin portion.Chip is bonded to pin subordinate side in these, and spoiler is positioned at the lateral location of chip.Adhesion coating is disposed between chip and these the interior pin portions, and these first bonding wires are electrically connected at respectively between these interior pin portions and the chip.Packing colloid is coating chip, these first bonding wires, pin portion, adhesion coating and spoiler in these at least, the ratio of thickness and the thickness of the packing colloid that is positioned at the depressed part below of packing colloid that wherein is positioned at depressed part top is greater than 1, and the thickness that is positioned at the packing colloid of outer pin subordinate side is unequal with the thickness that is positioned at the packing colloid above the outer pin portion, and chip area accounts for below 25% of packing colloid area.
According to the embodiment of the invention, second end of spoiler can be the level of being bent into.
According to the embodiment of the invention, spoiler is to bend downwards to form depressed part, pin portion in upwards bending, and second end again is lower than.
According to the embodiment of the invention, lead frame more comprises at least one support bar (supporting bar), and it connects between second end and lead frame body of spoiler.In addition, support bar also can be connected between lead frame body and the spoiler side.
According to the embodiment of the invention, pin portion can be heavy (down-set) design of putting in these.
According to the embodiment of the invention, spoiler can be to have a plurality of perforates.
According to the embodiment of the invention, lead frame can comprise that more are converged electric bars (bus bar), and these to converge electric bar adjacent with these interior pin portions.In addition, the chip packing-body of asymmetric mold more comprises many second bonding wires, and it is electrically connected at chip respectively and converges between the electric bar, and packing colloid more coats second bonding wire and converges electric bar.
Based on above-mentioned purpose or other purposes, the present invention proposes a kind of chip packing-body of asymmetric mold, it comprises a lead frame, a chip, an adhesion coating, many first bonding wires and a packing colloid, and wherein lead frame comprises a lead frame body and at least one spoiler.The lead frame body have a plurality of in pin portions and a plurality of outer pin portion.Spoiler has one first end and one second end, and wherein first end is connected with the lead frame body, and the part between spoiler first end and second end is bent to form a depressed part upwards bending downwards towards the body below, and this second end is higher than pin portion in those.Chip is bonded to pin subordinate side in these, and spoiler is positioned at the lateral location of chip.Adhesion coating is disposed between chip and these the interior pin portions, and these first bonding wires are electrically connected at respectively between these interior pin portions and the chip.Packing colloid is coating chip, these first bonding wires, pin portions, adhesion coating and spoiler in these at least, and the thickness that wherein is positioned at the packing colloid of outer pin subordinate side is unequal with the thickness that is positioned at the packing colloid above the outer pin portion.
According to the embodiment of the invention, second end of spoiler can be the level of being bent into.
According to the embodiment of the invention, lead frame more comprises at least one support bar (supporting bar), and it connects between second end and lead frame body of spoiler.In addition, support bar also can be connected between lead frame body and the spoiler side.
According to the embodiment of the invention, pin portion can be heavy (down-set) design of putting in these.
According to the embodiment of the invention, spoiler can be to have a plurality of perforates.
According to the embodiment of the invention, lead frame can comprise that more are converged electric bars (bus bar), and these to converge electric bar adjacent with these interior pin portions.In addition, the chip packing-body of asymmetric mold more comprises many second bonding wires, and it is electrically connected at chip respectively and converges between the electric bar, and packing colloid more coats second bonding wire and converges electric bar.
According to the embodiment of the invention, the ratio of thickness and the thickness of the packing colloid of the depressed part below that is positioned at spoiler of packing colloid that is positioned at the depressed part top of spoiler can be greater than 1.
According to the embodiment of the invention, chip area accounts for below 25% of packing colloid area.
Based on above-mentioned purpose or other purposes, the present invention proposes a kind of chip packing-body of asymmetric mold, it comprises a lead frame, a chip, an adhesion coating, many first bonding wires and a packing colloid, and wherein lead frame comprises a lead frame body and at least one spoiler.The lead frame body has a plurality of interior pin portions, a plurality of outer pin portion and a chip bearing seat.Spoiler has one first end and one second end, and wherein first end is connected with the lead frame body, and the part between spoiler first end and second end is bent to form a depressed part downwards towards the body below.Chip is bonded on the chip bearing seat, and spoiler is positioned at the lateral location of chip.Adhesion coating is disposed between chip and the chip bearing seat, and these first bonding wires are electrically connected at respectively between these interior pin portions and the chip.Packing colloid is coating chip, these first bonding wires, pin portion, adhesion coating, spoiler and chip bearing seat in these at least, the thickness of thickness and the packing colloid that is positioned at outer pin portion top that wherein is positioned at the packing colloid of outer pin subordinate side is unequal, and the ratio of thickness and the thickness that is positioned at this packing colloid below this depressed part of this packing colloid that is positioned at this depressed part top is greater than 1.
According to the embodiment of the invention, second end of spoiler can be the level of being bent into.
According to the embodiment of the invention, spoiler is to bend downwards to form depressed part, and upwards bending, and second end of spoiler again is a pin portion in being higher than.
According to the embodiment of the invention, spoiler is bending downwards forming depressed part, and upwards bending, and second end of spoiler again and interior pin portion are copline.
According to the embodiment of the invention, spoiler is to bend downwards to form depressed part, and upwards bending, and second end of spoiler again is a pin portion in being lower than.
According to the embodiment of the invention, spoiler is to bend downwards with the formation depressed part, and second end is lower than interior pin portion.
According to the embodiment of the invention, lead frame more comprises at least one support bar, and it connects between second end and lead frame body of spoiler.In addition, support bar also can be to connect between lead frame body and the spoiler side.
According to the embodiment of the invention, pin portion can be heavy (down-set) design of putting in these.
According to the embodiment of the invention, the chip bearing seat can be a pin portion in being lower than.
According to the embodiment of the invention, the lead frame body more can have many and converge electric bars (bus bar), and these to converge electric bar adjacent with these interior pin portions.In addition, the chip packing-body of asymmetric mold more can comprise many second bonding wires, and it is electrically connected at chip respectively and these converge between the electric bar, and packing colloid more coats second bonding wire and converges electric bar.
According to the embodiment of the invention, spoiler can be to have a plurality of perforates.
According to the embodiment of the invention, chip area accounts for below 25% of packing colloid area.
Based on above-mentioned, the present invention designs the heavy spoiler of putting (down-set) on lead frame, shrinks the phenomenon of the warpage that is produced to improve the packing colloid condensation, and therefore chip packing-body of the present invention has better reliability degree.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Figure 1A illustrates the cutaway view of the small-sized outer pin package body of the known LOC of having framework.
Figure 1B illustrates the cutaway view of the small-sized outer pin package body of another the known LOC of having framework.
Fig. 2 A illustrates the vertical view according to the not sizing shaped chip packing-body of first embodiment of the invention, and wherein Fig. 2 A does not illustrate first bonding wire and packing colloid.
Fig. 2 B illustrate into after the sealing fully the formed chip packaging body along the cutaway view of the A-A ' line of Fig. 2 A.
Fig. 2 C illustrates and is complete formed chip packaging body and along the cutaway view of the B-B ' line of Fig. 2 A after the sealing.
Fig. 3 A illustrates the vertical view according to the chip packing-body of the not sizing shaped of second embodiment of the invention, and wherein Fig. 3 A does not illustrate first bonding wire, second bonding wire and packing colloid.
Fig. 3 B illustrates and is complete formed chip packaging body and along the cutaway view of the A-A ' line of Fig. 3 A after the sealing.
Fig. 3 C illustrates and is complete formed chip packaging body and along the cutaway view of the B-B ' line of Fig. 3 A after the sealing.
Fig. 4 A to Fig. 4 D illustrates the cutaway view according to the chip packing-body of third embodiment of the invention.
100a, 100b: known small-sized outer pin package body
110,210: lead frame
112,212a, 412a: interior pin portion
114,212b, 414b: outer pin portion
116,218,418: converge electric bar
120,220,420: chip
130,230,430: adhesion coating
140a, 240a, 440a: first bonding wire
140b, 240b, 440b: second bonding wire
150,250,450: packing colloid
212,412: the lead frame body
214,314,414: spoiler
214a, 314a, 414a: first end
214b, 314b, 414b: second end
214c, 314c: perforate
216: support bar
214d, 314d, 414c: depressed part
412c: chip bearing seat
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, its embodiment of chip packing-body, structure, feature and the effect thereof of the asymmetric mold that foundation the present invention is proposed, describe in detail as after.
Fig. 2 A illustrates the vertical view according to the chip packing-body of the not sizing shaped of first embodiment of the invention, and wherein Fig. 2 A does not illustrate first bonding wire and packing colloid.Fig. 2 B illustrates and is complete formed chip packaging body and along the cutaway view of the A-A ' line of Fig. 2 A after the sealing, and Fig. 2 C illustrates and is formed chip packaging body and along the cutaway view of the B-B ' line of Fig. 2 A fully after the sealing.Please refer to Fig. 2 A and Fig. 2 B, the chip packing-body of present embodiment comprises a lead frame 210, a chip 220, an adhesion coating 230, many first bonding wire 240a and a packing colloid 250, its chips 220 is bonded to lead frame 210 belows, and adhesion coating 230 is disposed between chip 220 and the lead frame 210, in order to fixed chip 220.In addition, the material of adhesion coating 230 can be pi (polyimide) or non-conductive glue.These first bonding wires 240a is electrically connected at respectively between chip 220 and the lead frame 210, and the material of the first bonding wire 240a can gold, aluminium or other conductive material.In addition, packing colloid 250 covered section lead frames 210, chip 220, adhesion coating 230 and the first bonding wire 240a, and the material of packing colloid 250 can be epoxy resin (epoxy) or other insulating material.
Please refer to Fig. 2 A and Fig. 2 C, more specifically, lead frame 210 comprises a lead frame body 212 and at least one spoiler 214, and wherein lead frame body 212 has a plurality of interior 212a of pin portion and a plurality of outer pin 212b of portion.Spoiler 214 for bending downwards forming a depressed part 214d, and spoiler 214 has one first end 214a and one second end 214b, wherein the first end 214a is connected with body 212, and the second end 214b is lower than the interior 212a of pin portion.In addition, the second end 214b also can be bent into level or other angles.
For lead frame 210, spoiler 214 is positioned at the both sides of the major axis of chip 220.Yet the present invention does not limit the quantity and the allocation position of spoiler 214.In addition, in the present embodiment, lead frame 210 more can comprise a support bar 216, and it connects between the second end 214b and lead frame body 212 of spoiler 214.In other words, the two ends of spoiler 214 all can be connected with lead frame body 212.Yet support bar 216 also can be the side that connects lead frame body 212 and spoiler 214.Perhaps, the second end 214b of spoiler 214 can not be connected with lead frame body 212 yet.Moreover the present invention does not limit the quantity and the allocation position of support bar 216.In addition, in order to improve mould stream, spoiler 214 can be to have a plurality of perforate 214c.
In the present embodiment, do not have difference in height between interior pin 212a of portion and the lead frame body 212, but in another embodiment, 212a of pin portion also can be heavy (down-set) design of putting in these.In other words, 212a of pin portion is lower than lead frame body 212 in these.In addition, adhesion coating 230 is disposed between chip 220 and these the interior 212a of pin portion, and these first bonding wires 240a electrically connects between these interior 212a of pin portion and the chip 220.
The ratio of thickness D5 and the thickness D6 of the packing colloid 250 of the depressed part 214d below that is positioned at spoiler 214 of packing colloid 250 that it should be noted that the depressed part 214d top that is positioned at spoiler 214 is greater than 1.In addition, the thickness D3 that is positioned at the packing colloid 250 of outer pin 212b top is unequal with the thickness D4 that is positioned at the packing colloid 250 below the outer pin 212b.In other words, the chip packing-body of present embodiment adopts asymmetric mold.
Because the design of spoiler 214 can change the stress distribution (stress distribution) and the warping phenomenon of entire chip packaging body when packing colloid 250 condensations are shunk, therefore compared to known techniques, chip packing-body of the present invention has higher reliability.In addition, the present invention is not defined for the LOC packaging body, more can be used for the chip packing-body that other have chip bearing seat (Die pad) framework, its be describe in detail as after.Moreover in the present embodiment, chip 220 areas account for below 25% of packing colloid area.
[second embodiment]
Fig. 3 A illustrates the vertical view according to the chip packing-body of the not sizing shaped of second embodiment of the invention, and wherein Fig. 3 A does not illustrate first bonding wire, second bonding wire and packing colloid.Fig. 3 B illustrates and is complete formed chip packaging body and along the cutaway view of the A-A ' line of Fig. 3 A after the sealing, and Fig. 3 C illustrates and is formed chip packaging body and along the cutaway view of the B-B ' line of Fig. 3 A fully after the sealing.Please refer to Fig. 3 A to Fig. 3 B, present embodiment is similar to first embodiment, and its difference is: in the present embodiment, spoiler 314 has one first end 314a and one second end 314b, and wherein the first end 314a is connected with lead frame body 212.In addition, spoiler 314 is bending downwards, to form a depressed part 314d, and upwards bending again, and spoiler 314 has one first end 314a and one second end 314b, the 212a of pin portion in wherein the second end 314b is higher than.In addition, the second end 314b also can be bent into level or other angles.Yet as the foregoing description, the second end 314b of spoiler 314 also can be connected to lead frame body 212 (illustrating as Fig. 3 A) via support bar 216.Perhaps, the second end 314b of spoiler 314 also can be free end (free end).Perhaps, support bar 216 also can connect between spoiler 314 sides and the lead frame body 212.In addition, spoiler 310 also can have a plurality of perforate 314c.
Similarly, be positioned at the ratio of thickness D5 and the thickness D6 of the packing colloid 250 of the depressed part 314d below that is positioned at spoiler 314 of packing colloid 250 of depressed part 314d top of spoiler 314 greater than 1.In addition, in the present embodiment, the thickness D4 of packing colloid 250 that is positioned at the outer pin 212b of portion below is also unequal with the thickness D3 of the packing colloid 250 that is positioned at the outer pin 212b of portion top, and in other words, chip packing-body of the present invention adopts asymmetric mold.In addition, chip 220 areas account for below 25% of packing colloid 250 areas.
Please continue with reference to figure 3A and Fig. 3 B, the lead frame body 210 of present embodiment comprises that more are converged electric bars 218, and it is adjacent with the interior pin 212a of portion to converge electric bar 218.In addition, the chip packing-body of the asymmetric mold of present embodiment more comprises many second bonding wire 240b, connects these respectively and converges between electric bar 218 and the chip 220.Yet the remittance electricity bar 218 of present embodiment also can be applied among first embodiment.
Yet in another embodiment, spoiler 314 also can be downward bending, to form depressed part 314d, and the 212a of pin portion in upwards bending, and the second end 314b again is lower than.
[the 3rd embodiment]
Fig. 4 A to Fig. 4 D illustrates the cutaway view according to the chip packing-body of third embodiment of the invention.Please refer to Fig. 4 A and Fig. 4 B, the chip packing-body of present embodiment comprises a lead frame (indicate), a chip 420, an adhesion coating 430, many first bonding wire 440a and a packing colloid 450, wherein lead frame comprises a lead frame body 412 and at least one spoiler 414, and lead frame body 412 has a plurality of interior 412a of pin portion, a plurality of outer pin 412b of portion and a chip bearing seat 412c.Chip 420 is disposed on the chip bearing seat 412c, and adhesion coating 430 is disposed between chip 420 and the chip bearing seat 412c, in order to fixed chip 420.These first bonding wires 440a is electrically connected at respectively between chip 420 and the interior pin 412a of portion, and packing colloid 450 coating chip 420, the first bonding wire 440a, the interior pin 412a of portion, adhesion coating 430, spoiler 414 and chip bearing seat 412c at least, the thickness D4 that wherein is positioned at the packing colloid 450 of the outer pin 412b of portion below is unequal with the thickness D 3 that is positioned at the packing colloid 450 above the outer pin 412b of portion.In addition, chip area 420 accounts for below 25% of packing colloid 450 areas.
As the various embodiments described above, spoiler 414 has one first end 414a and one second end 414b, and wherein the first end 414a is connected with lead frame body 412.Spoiler 414 for bending downwards forming a depressed part 414c, and the second end 414b is positioned at below the 412a of pin portion.In addition, the second end 414b also can be bent into level or other angles.In addition, lead frame 410 more can comprise a support bar (shown in similar Fig. 2 A and Fig. 3 A), and it connects between the second end 414b and lead frame body 412 of spoiler 414.Perhaps, support bar also can be the side that connects lead frame body 412 and spoiler 414.Perhaps, the second end 414b of spoiler 414 can not be connected with lead frame body 412 yet.Moreover spoiler 414 also can be to have a plurality of perforates (shown in similar Fig. 2 A and Fig. 3 A).The ratio of thickness D5 and the thickness D6 of the packing colloid 450 of the depressed part 414c below that is positioned at spoiler 414 of packing colloid 450 of depressed part 414c top that it should be noted that spoiler 414 is greater than 1.
In the present embodiment, lead frame comprises that more are converged electric bars 418, and it is adjacent with the interior pin 412a of portion to converge electric bar 418.In addition, the chip packing-body of the asymmetric mold of present embodiment more comprises many second bonding wire 440b, connects these respectively and converges between electric bar 418 and the chip 420.In addition, 412a of pin portion sinks to install meter in these, and chip bearing seat 412c also can be the 412a of pin portion in being lower than.
Please refer to Fig. 4 C, spoiler 414 also can be downward bending, and to form a depressed part 414c, upwards bending, and the second end 414b again and the interior pin 412a of portion are copline.Yet the second end 414b also can be bent into level or other angles.In another embodiment, spoiler 414 also can be downward bending, to form a depressed part 414c, and the 412a of pin portion in upwards bending, and the second end 414b again is lower than.In addition, as the foregoing description, the second end 414b of spoiler 414 also can be connected to lead frame body 412 (similar illustrate as Fig. 2 A) via a support bar.Perhaps, the second end 414b of spoiler 414 also can be free end (free end).Perhaps, support bar also can connect between spoiler 414 sides and the lead frame body 412.In addition, spoiler 414 also can have a plurality of perforates (similar illustrate as Fig. 2 A).
Please refer to Fig. 4 D, spoiler 414 also can bend downwards earlier to form depressed part 414c, the 412a of pin portion in upwards bending, and the second end 414b of spoiler 414 again is higher than.In addition, the second end 414b also can be bent into level or other angles.Similarly, the second end 414b of spoiler 414 can be a free end.Or the second end 414b of spoiler 414 also can be connected to lead frame body 412 via a support bar.Perhaps, support bar also can connect between spoiler 414 sides and the lead frame body 412.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (33)
1, a kind of chip packing-body of asymmetric mold is characterized in that it comprises:
One lead frame comprises:
One lead frame body, have a plurality of in pin portions and a plurality of outer pin portion;
At least one spoiler, this spoiler has one first end and one second end, wherein this first end is connected with this body, and the part between this first end and this second end towards the bending downwards of this body below forming a depressed part, and make this second end of this spoiler be lower than pin portion in those;
One chip be bonded to pin subordinate side in those, and this spoiler is positioned at the dual-side position of this chip;
One adhesion coating is disposed between this chip and those the interior pin portions;
Many first bonding wires are electrically connected at respectively between those interior pin portions and this chip; And
One packing colloid, at least coat this chip, those first bonding wires, pin portion, this adhesion coating and this spoiler in those, the ratio of thickness and the thickness of this packing colloid that is positioned at this depressed part below of this packing colloid that wherein is positioned at this depressed part top is greater than 1, and the thickness that is positioned at this packing colloid of those outer pin subordinate sides is unequal with the thickness that is positioned at this packing colloid above those outer pin portions, and this chip area accounts for below 25% of this packing colloid area.
2, the chip packing-body of asymmetric mold according to claim 1 is characterized in that this second end of wherein said spoiler is the level of being bent into.
3, the chip packing-body of asymmetric mold according to claim 1 is characterized in that wherein said spoiler is bending with after forming this depressed part downwards, upwards bending again.
4, the chip packing-body of asymmetric mold according to claim 1 is characterized in that wherein said lead frame more comprises at least one support bar, connects between this second end and this lead frame body of this spoiler.
5, the chip packing-body of asymmetric mold according to claim 4 is characterized in that wherein said support bar is connected between this lead frame body and this spoiler side.
6, the chip packing-body of asymmetric mold according to claim 1 is characterized in that wherein those interior pin portions are the heavy meter that installs.
7, the chip packing-body of asymmetric mold according to claim 1 is characterized in that wherein said spoiler has a plurality of perforates.
8, the chip packing-body of asymmetric mold according to claim 1 is characterized in that wherein said lead frame comprises that more are converged electric bars, and those to converge electric bar adjacent with those interior pin portions.
9, the chip packing-body of asymmetric mold according to claim 8, it is characterized in that it more comprises many second bonding wires, be electrically connected at this chip respectively and those converge between the electric bar, converge electric bar and this packing colloid more coats those second bonding wires and those.
10, a kind of chip packing-body of asymmetric mold is characterized in that it comprises:
One lead frame comprises:
One lead frame body, have a plurality of in pin portions and a plurality of outer pin portion;
At least one spoiler, this spoiler has one first end and one second end, and wherein this first end is connected with this body, and the part between this first end and second end bends downwards to form a depressed part towards this body below, and upwards bending again, and make this second end be higher than pin portion in those;
One chip be bonded to pin subordinate side in those, and this spoiler is positioned at the lateral location of this chip;
One adhesion coating is disposed between this chip and those the interior pin portions;
Many first bonding wires are electrically connected at respectively between those interior pin portions and this chip; And
One packing colloid, at least coat this chip, those first bonding wires, pin portions, this adhesion coating and this spoiler in those, it is unequal wherein being positioned at the thickness of this packing colloid of those outer pin subordinate sides and the thickness that is positioned at this packing colloid above those outer pin portions.
11, the chip packing-body of asymmetric mold according to claim 10 is characterized in that this second end of wherein said spoiler is the level of being bent into.
12, the chip packing-body of asymmetric mold according to claim 10 is characterized in that wherein said lead frame more comprises at least one support bar, connects between this second end and this lead frame body of this spoiler.
13, the chip packing-body of asymmetric mold according to claim 12 is characterized in that wherein said support bar is connected between this lead frame body and this spoiler side.
14, the chip packing-body of asymmetric mold according to claim 10 is characterized in that wherein those interior pin portions are the heavy meter that installs.
15, the chip packing-body of asymmetric mold according to claim 10 is characterized in that wherein said spoiler has a plurality of perforates.
16, the chip packing-body of asymmetric mold according to claim 10 is characterized in that wherein said lead frame comprises that more are converged electric bars, and those to converge electric bar adjacent with those interior pin portions.
17, the chip packing-body of asymmetric mold according to claim 16, it is characterized in that it more comprises many second bonding wires, be electrically connected at this chip respectively and those converge between the electric bar, converge electric bar and this packing colloid more coats those second bonding wires and those.
18, the chip packing-body of asymmetric mold according to claim 10, the thickness ratio of thickness and this packing colloid of the depressed part below that is positioned at this spoiler of this packing colloid of depressed part top that it is characterized in that wherein being positioned at this spoiler is greater than 1.
19, the chip packing-body of asymmetric mold according to claim 10 is characterized in that wherein said chip area accounts for below 25% of this packing colloid area.
20, a kind of chip packing-body of asymmetric mold is characterized in that it comprises:
One lead frame comprises:
One lead frame body has a plurality of interior pin portions, a plurality of outer pin portion and a chip bearing seat;
At least one spoiler, this spoiler have one first end and one second end, and wherein this first end is connected with this lead frame body, and the part between this first end and this second end is bent to form a depressed part downwards towards this body below;
One chip is disposed on this chip bearing seat, and this spoiler is positioned at the dual-side position of this chip;
One adhesion coating is disposed between this chip and this chip bearing seat;
Many first bonding wires are electrically connected at respectively between those interior pin portions and this chip; And
One packing colloid, at least coat this chip, those first bonding wires, pin portion, this adhesion coating, this spoiler and this chip bearing seat in those, the thickness of thickness and this packing colloid that is positioned at those outer pin portion tops that wherein is positioned at this packing colloid of those outer pin subordinate sides is unequal, and the ratio of thickness and the thickness that is positioned at this packing colloid below this depressed part of this packing colloid that is positioned at this depressed part top is greater than 1.
21, the chip packing-body of asymmetric mold according to claim 20 is characterized in that this second end of wherein said spoiler is the level of being bent into.
22, the chip packing-body of asymmetric mold according to claim 20 is characterized in that wherein said spoiler for bending to form this depressed part downwards, and upwards bending, and this second end of this spoiler again is for being higher than pin portion in those.
23, the chip packing-body of asymmetric mold according to claim 20 is characterized in that wherein said spoiler is to bend to form this depressed part downwards, and upwards bending, and this second end of this spoiler again and those interior pin portions are copline.
24, the chip packing-body of asymmetric mold according to claim 20, it is characterized in that wherein said spoiler for bending downwards forming this depressed part, and this second end of this spoiler is for being lower than those interior pin portions.
25, the chip packing-body of asymmetric mold according to claim 24 is characterized in that wherein said spoiler is bending with after forming this depressed part downwards, upwards bending again.
26, the chip packing-body of asymmetric mold according to claim 20 is characterized in that wherein said lead frame more comprises at least one support bar, connects between this second end and this lead frame body of this spoiler.
27, the chip packing-body of asymmetric mold according to claim 26 is characterized in that wherein said support bar is connected between this lead frame body and this spoiler side.
28, the chip packing-body of asymmetric mold according to claim 20 is characterized in that wherein those interior pin portions are the heavy meter that installs.
29, the chip packing-body of asymmetric mold according to claim 20 is characterized in that wherein said chip bearing seat is lower than pin portion in those.
30, the chip packing-body of asymmetric mold according to claim 20 is characterized in that wherein said lead frame comprises that more are converged electric bars, and those to converge electric bar adjacent with those interior pin portions.
31, the chip packing-body of asymmetric mold according to claim 30, it is characterized in that it more comprises many second bonding wires, be electrically connected at this chip respectively and those converge between the electric bar, converge electric bar and this packing colloid more coats those second bonding wires and those.
32, the chip packing-body of asymmetric mold according to claim 20 is characterized in that wherein said spoiler has a plurality of perforates.
33, the chip packing-body of asymmetric mold according to claim 20 is characterized in that wherein said chip area accounts for below 25% of this packing colloid area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100898241A CN100437989C (en) | 2005-08-05 | 2005-08-05 | Wafer packaging for asymmetric casting mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100898241A CN100437989C (en) | 2005-08-05 | 2005-08-05 | Wafer packaging for asymmetric casting mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1909217A CN1909217A (en) | 2007-02-07 |
| CN100437989C true CN100437989C (en) | 2008-11-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100898241A Expired - Fee Related CN100437989C (en) | 2005-08-05 | 2005-08-05 | Wafer packaging for asymmetric casting mold |
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| Country | Link |
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| CN (1) | CN100437989C (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1116770A (en) * | 1994-06-06 | 1996-02-14 | 摩托罗拉公司 | Method and apparatus for improving interfacial adhesion between a polymer and a metal |
| US6414379B1 (en) * | 2000-09-29 | 2002-07-02 | Siliconware Precision Industries Co., Ltd. | Structure of disturbing plate having down set |
| US20020109215A1 (en) * | 1998-10-21 | 2002-08-15 | Hitachi, Ltd. | Semiconductor device |
| US20030062601A1 (en) * | 2001-05-15 | 2003-04-03 | James Harnden | Surface mount package |
-
2005
- 2005-08-05 CN CNB2005100898241A patent/CN100437989C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1116770A (en) * | 1994-06-06 | 1996-02-14 | 摩托罗拉公司 | Method and apparatus for improving interfacial adhesion between a polymer and a metal |
| US20020109215A1 (en) * | 1998-10-21 | 2002-08-15 | Hitachi, Ltd. | Semiconductor device |
| US6414379B1 (en) * | 2000-09-29 | 2002-07-02 | Siliconware Precision Industries Co., Ltd. | Structure of disturbing plate having down set |
| US20030062601A1 (en) * | 2001-05-15 | 2003-04-03 | James Harnden | Surface mount package |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1909217A (en) | 2007-02-07 |
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