CN100425717C - Copper alloy for lead-wire frame and its production - Google Patents
Copper alloy for lead-wire frame and its production Download PDFInfo
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- CN100425717C CN100425717C CNB2006100413512A CN200610041351A CN100425717C CN 100425717 C CN100425717 C CN 100425717C CN B2006100413512 A CNB2006100413512 A CN B2006100413512A CN 200610041351 A CN200610041351 A CN 200610041351A CN 100425717 C CN100425717 C CN 100425717C
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims description 23
- 239000000463 material Substances 0.000 claims abstract description 27
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- 229910052725 zinc Inorganic materials 0.000 claims abstract description 20
- 238000005098 hot rolling Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 19
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 18
- 238000000137 annealing Methods 0.000 claims abstract description 16
- 238000005097 cold rolling Methods 0.000 claims abstract description 16
- 238000001816 cooling Methods 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 9
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000011701 zinc Substances 0.000 claims description 26
- 239000011777 magnesium Substances 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 18
- 238000003490 calendering Methods 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- 239000012535 impurity Substances 0.000 claims description 15
- 238000012545 processing Methods 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 8
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 5
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 claims description 5
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
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- 230000004927 fusion Effects 0.000 claims description 3
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- 229910017827 Cu—Fe Inorganic materials 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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Abstract
This invention provides a kind of fuse frame in copper alloy and its manufacturing method , the copper alloy: Fe:2.0- 2.6wt%,Zn:0.05-0.1wt%,P:0.01-0.03wt%,Mg:0-0.05wt%, Re:0.01-1.5wt%,Whose manufacturing method is: Pour the raw material into casting mould after they melting, cooling it with the speed that over 80DEG C/min in the temperature range that the liquid temperature rise till 400-DEG C; hot-rolling and rolling the casting blank in the heating temperature under 1000DEG C, then cold-rolling and rolling it again and again, twin-stage annealing continuously at 300DEG C-600DEG C ; That cold rolling process makes its thickness change amount to be more than 40% , getting the finished product by low temperature anneal at 450DEG C. The copper alloy has fine hot-workability, especially has these characteristic property such as good tensile strength , hardness , coefficient of elongation and conductance rates , it is the best material to produce the electronic component such as the fuse frame.
Description
Technical field
The present invention relates to copper alloy, relate in particular to a kind of copper alloy for lead-wire frame and manufacture method thereof, belong to the non-ferrous metal technical field.
Background technology
The current information age is that the information industry of representative have swepts the globe with Internet, and electronic information industrial expansion decisive role.In China, electronics and information industry has become mainstay industry, and semiconducter device is the foundation stone of this mainstay industry just, and unicircuit (IC) chip is an endosome, and encapsulation is an ectosome; IC is made of several major parts such as chip, lead-in wire and lead frame, adhesives, packaged materials.Wherein, the major function of lead frame is to provide the mechanical support carrier for chip, and connect the IC external circuit, transmit electrical signal as conducting medium, and the heat that is produced when outwards distributing chip operation with packaged material, become component very crucial among the IC.Therefore the IC encapsulation requires it must possess high strength, high conduction, thermal conductivity and reaches a series of over-all propertieies such as good weldability, solidity to corrosion, plastic packaging, oxidation-resistance well, thereby very strict to the performance requriements of its material therefor.
Since eighties of last century sixties, first unicircuit came out in the world, semiconductor integrated circuit had obtained very big development with package metals material (blaster fuse frame material, lead material, scolder etc.), and its consumption is increasing, and novel material constantly occurs.Since the eighties in last century, copper alloy becomes the main raw of making lead frame, has now accounted for about 80% of lead frame market, and alloy designations has reached kind more than 100.
The major country of production of copper base alloy blaster fuse frame material is Japan, the U.S., Germany, France and Britain, and Japan is with fastest developing speed.On present world market, mainly by the supply of material of Japanese manufacturer, product accounts for the lead frame market in the whole world about 70% to blaster fuse frame material.In addition, also production of copper alloy lead wire frame material of manufacturers such as U.S.'s Olympic brass, German De Make, Wieland, French Ge Lisai, Texas Instruments, AMAX.
The research of China's blaster fuse frame material, trial-production, production are started late, and start from " eight or five " latter stage.The main enterprises of domestic production copper alloy for lead-wire frame band has at present: Luoyang Copper Processing Plant, Beijing Jin Ying company, the safe copper industry of Shanghai gold company, the industrial group in Ningbo etc., product only limits to 3 trade mark: KFC (the Japanese trade mark, i.e. C19210), C194 and the C1220 (U.S.'s trade mark) of Cu-Fe-P alloy.The lead frame copper strip industrial scale is little, description is few, has only KFC to produce in batches at present, and the quality low precision.The alloy of other kind can't be produced, even have that produced in small quantities also exists the quality instability, softening temperature is low, internal stress is inhomogeneous, width and a problem such as thickness deviation is overproof, appearance requirement is defective.
The Cu-Fe that produces is in 3 trades mark of alloy, and the C194 alloy is representative a kind of.The quality of the C194 lead frame copper alloy of producing can't meet the demands at present, low precision, description is few, unstable properties, the copper strips yield rate has big defective 40～50% at aspects such as template situation, residualinternal stress, surface smoothness, limit portion burrs.
Summary of the invention
The purpose of this invention is to provide a kind of copper alloy for lead-wire frame and manufacture method thereof, be intended to effectively solve the copper alloy for lead-wire frame over-all properties and do not satisfy problems such as production requirement, alloy structure are inhomogeneous, precipitated phase small and dispersedization, characteristics such as the tensile strength of copper alloy of the present invention, hardness, unit elongation, specific conductivity and softening temperature all can satisfy the many requirement of electronics industry to the blaster fuse frame material performance preferably.
Purpose of the present invention is achieved through the following technical solutions:
Copper alloy for lead-wire frame is characterized in that: the quality percentage composition of its composition is as follows---
Fe 2.0～2.6wt％，
Zn 0.05～0.1wt％，
P 0.01～0.03wt％，
Mg 0.01～0.05wt％，
Mishmetal Re 0.01～1.5wt%,
All the other components of this copper alloy are Cu and unavoidable impurities.
Further, above-mentioned copper alloy for lead-wire frame, described copper alloy also contain in As, Sb, Bi, Pb, Sn, the Ni element at least a above element and total amount less than 0.05wt%, and S content is below 25ppm; The tensile strength of described copper alloy is that 500MPa is above, hardness 150Hv above, specific conductivity 65%IACS is above, unit elongation is more than 6.5%.
Again further, the manufacture method of copper alloy for lead-wire frame is characterized in that may further comprise the steps---
1. at first main raw material and auxiliary material are injected mold after 1200～1300 ℃ of fusions, cool off with 80 ℃/ speed of cooling more than the min in the temperature range of liquidus temperature to 400 ℃, control composition content F e is that 2.0～2.6wt%, Zn are that 0.05～0.1wt%, P are that 0.01～0.03wt%, Mg are that 0.01～0.05wt%, mishmetal Re are that 0.01～1.5wt%, all the other components are Cu and unavoidable impurities in manufacturing processed;
2. the strand that obtains is carried out the hot rolling calendering in the Heating temperature below 1000 ℃, control composition content F e is that 2.0～2.6wt%, Zn are that 0.05～0.1wt%, P are that 0.01～0.03wt%, Mg are that 0.01～0.05wt%, mishmetal Re are that 0.01～1.5wt%, all the other components are Cu and unavoidable impurities in manufacturing processed;
3. hot rolled band is carried out cold rolling calendering repeatedly, cold rolling is delayed in 300 ℃～600 ℃ temperature range and is carried out twin-stage continuous annealing, and control composition content F e is that 2.0～2.6wt%, Zn are that 0.05～0.1wt%, P are that 0.01～0.03wt%, Mg are that 0.01～0.05wt%, mishmetal Re are that 0.01～1.5wt%, all the other components are Cu and unavoidable impurities in manufacturing processed;
4. after twin-stage continuous annealing, carry out cold rolling and prolong processing, its amounts of thickness variation is reached more than 40%, carry out the low-temperature annealing below 450 ℃ again, obtain the band finished product, control composition content F e is that 2.0～2.6wt%, Zn are that 0.05～0.1wt%, P are that 0.01～0.03wt%, Mg are that 0.01～0.05wt%, mishmetal Re are that 0.01～1.5wt%, all the other components are Cu and unavoidable impurities in manufacturing processed.
Further, the manufacture method of above-mentioned copper alloy for lead-wire frame is characterized in that: described main raw material is No. 1 electrolytic copper, and auxiliary material is copper iron master alloy, copper phosphorus master alloy, simple substance zinc, simple substance magnesium and mishmetal Re.
Again further, the manufacture method of above-mentioned copper alloy for lead-wire frame is characterized in that: 2. control the crystal grain diameter of band less than 50 μ m in the hot rolling calendering course of processing in step; The crystal grain diameter of the calendering band after 3. step anneals is less than 50 μ m.
The outstanding substantive distinguishing features and the obvious improvement of technical solution of the present invention is mainly reflected in:
(1) copper alloy over-all properties of the present invention is superior, alloy structure even, the precipitated phase small and dispersed, and the alloy price is relatively low, the production efficiency height;
(2) tensile strength of finished product reaches that 500MPa is above, hardness 150Hv above, specific conductivity 65%IACS is above, unit elongation is more than 6.5%, can satisfy the many requirement of electronics industry to the blaster fuse frame material performance preferably;
(3) copper alloy for lead-wire frame of the present invention also has good hot workability, helps manufacturing, and is the best materials of producing electrical and electronic parts such as lead frame.
Embodiment
For satisfying electrical and electronic parts such as lead frame desired kind of specific character of material, the invention provides a kind of copper alloy for lead-wire frame and manufacture method thereof, select the component concentration of best Fe, Zn, P, Mg, mishmetal Re, manufacture with advanced persons' such as the rolling processing conditions of only strand cooling conditions, strand and heat-treat condition process means.
Copper alloy for lead-wire frame, Fe:2.0～2.6wt% in this copper alloy, Zn:0.05～0.1wt%, P:0.01～0.03wt%, Mg:0.01～0.05wt%, mishmetal Re:0.01～1.5wt%, also contain in As, Sb, Bi, Pb, Sn, the Ni element at least a above element and total amount in the copper alloy less than 0.05wt%, and S content is below 25ppm; The tensile strength 500MPa of this copper alloy is above, hardness 150Hv above, specific conductivity 65%IACS is above, unit elongation is more than 6.5%.
Each component content of copper alloy of the present invention: Fe is the main strengthening element in the alloy, and alloy is through after the suitable ageing treatment, and the particle form that the Fe element distributes with disperse is distributed in the copper matrix and plays the ageing strengthening effect.Because the saturation solubility of Fe in Cu minimum (only being 0.0004% below 300 ℃) under the normal temperature, alloy can be realized higher specific conductivity; Can crystal grain thinning by adding a spot of Fe, postpone the recrystallization process of copper, improve its intensity and hardness, but excessive plasticity, specific conductivity and the thermal conductivity that can reduce copper of Fe element, the addition of Fe element is controlled at 2.0～2.6 scope.
The adding of Zn can prevent to occur fragility second and equate effect in the middle of metallic matrix and coating, can improve the welding property of alloy, but excessively adds the conductivity that the Zn element can reduce alloy, and the content of Zn element is limited in 0.05～0.1 scope.
When room temperature, the solubleness of P in copper is almost nil, can reduce the specific conductivity and the thermal conductivity of copper, but its mechanical property and welding property to copper has desirable influence, P can also improve the flowability of copper alloy melt, P is the form adding with reductor when the copper smelting alloy, and unnecessary P is solid-solubilized in the copper matrix can prevent hydrogen embrittlement; In the ag(e)ing process of alloy, P also combines with Fe, forms Fe
3The precipitate of P and play certain ageing strengthening effect.The adding of P is for deoxidation, is solid-solubilized in the copper matrix and prevents hydrogen embrittlement, rather than by separating out Fe
3P strengthens.In the advantageous effect of giving full play to the P element, should reduce P content as far as possible, guaranteeing the high conduction performance of alloy, the content of P element is limited to 0.01～0.03 scope.
The Mg that adds trace descends the specific conductivity of copper, but can improve the oxidation-resistance property of copper, and copper is had desoxydatoin.Identical with the principle that limits the P element, the content of Mg element is limited in 0.01～0.05 scope.
The effect of mixed rare-earth elements Re mainly is:
(1) deoxidation dehydrogenation: the chemically reactive of rare earth is very strong, with the avidity of the oxygen avidity much larger than copper and oxygen, and generates fusing point than copper height, rare earth oxide that density is littler than copper, receives good desoxydatoin; Rare earth and hydrogen are combined into the little hydride of density, float to copper liquid surface, at high temperature decompose again, discharge hydrogen, or oxidizedly enter slag and be removed;
(2) cleaning molten: rare earth to the effect that removes of other harmful element also clearly, these dystectic rare earth compounds will keep solid state to discharge from liquid copper with slag, thereby reach the effect that removes detrimental impurity, rare earth especially can be removed the crystal boundary impurity element significantly, increase the significant quantity of elements such as Fe, P after impurity element is removed, can increase substantially the intensity of alloy;
(3) crystal grain thinning: add mishmetal Re in alloy, obvious crystal grain thinning in the fusion-casting process makes alloy alloy plasticity raising after follow-up thermomechanical treatment;
(4) promote the second phase particle to separate out: after in alloy, adding mishmetal Re, tiny, the disperse of the second phase particle (fe) of separating out in the band, size is probably at 5～20nm; In addition, can improve the recrystallization temperature of alloy behind the interpolation mishmetal Re, thereby improve the high temperature resistance softening performance of alloy, the softening temperature of interalloy of the present invention adds an amount of mishmetal Re all more than 480 ℃, and composition range is controlled at 0.01～1.5.
In technical solution of the present invention, based on sulphur in the main raw material impurity to the influence of technology and product, its main raw material is selected electrolytic copper for use No. 1, sulfur-bearing as few as possible in the impurity, and will prevent punch process the time owing to oil pollution is sneaked into S, even the deformation performance that a spot of S also can make hot rolling add man-hour sharply descends, the content of control S, workpiece cracking in the time of can avoiding hot rolling.Usually, the content of S must be less than 0.0025wt%, and ideal value is less than 0.0015wt%.
The manufacturing process of copper alloy for lead-wire frame: 1. at first with No. 1 electrolytic copper 1200～1300 ℃ of fusings, add copper iron master alloy, copper phosphorus master alloy, magnesium simple substance, carry out the minitype vertical type semicontinuous casting after the fusions such as zinc simple substance and mishmetal, utilize mold once to cool off and utilize water to drench and carry out the secondary cooling, make in the temperature range of liquidus line to 400 ℃ speed of cooling 80 ℃/more than the min, control composition content F e is 2.0～2.6wt% in manufacturing processed, Zn is 0.05～0.1wt%, P is 0.01～0.03wt%, Mg is 0.01～0.05wt%, mishmetal Re is 0.01～1.5wt%; 2. strand is behind 900～1000 ℃ temperature range internal heating, make its thickness reach 6mm through the hot rolling calendering, the end temp of hot rolling calendering is 700 ℃, make grain-size less than 50 μ m by chilling, control composition content F e is that 2.0～2.6wt%, Zn are that 0.05～0.1wt%, P are that 0.01～0.03wt%, Mg are that 0.01～0.05wt%, mishmetal Re are 0.01～1.5wt% in manufacturing processed; 3. hot rolled band being carried out repeatedly cold rolling calendering, to make its thickness be 1mm, in 300 ℃～600 ℃ temperature range, carry out twin-stage annealing, the crystal grain diameter that makes the calendering band after the annealing is less than 50 μ m, and control composition content F e is that 2.0～2.6wt%, Zn are that 0.05～0.1wt%, P are that 0.01～0.03wt%, Mg are that 0.01～0.05wt%, mishmetal Re are 0.01～1.5wt% in manufacturing processed; 4. cold rolling calendering makes thickness reach 0.5mm, carries out low-temperature annealing again, obtains the band finished product; Control composition content F e is that 2.0～2.6wt%, Zn are that 0.05～0.1wt%, P are that 0.01～0.03wt%, Mg are that 0.01～0.05wt%, mishmetal Re are 0.01～1.5wt% in manufacturing processed.
In the manufacturing process of the present invention: alloy raw material is No. 1 electrolytic copper, copper iron master alloy, copper phosphorus master alloy, magnesium simple substance, zinc simple substance and mishmetal, adopts the medium-frequency induction furnace melting.
For best, also can by semicontinuous casting with continuous casting for casting technique after the raw material fusing.In the castingprocesses in the temperature range of liquidus line to 400 ℃, cool off with the speed of cooling that 80 ℃/min is above, when speed of cooling is lower than 80 ℃/min, elements segregation will take place, later hot rolling processibility is brought adverse influence, and cause the reduction of production efficiency; Controlled chilling speed, the temperature range of preferred liquid phase line temperature to 400 ℃; Below 400 ℃, the length of cooling time changes the excessive segregation that alloying element can not take place during casting.
Behind the melt-casting, carry out hot-work.Hot worked Heating temperature should be 900～1000 ℃ scope, if temperature surpasses ceiling temperature, it is overheated to take place, and causes the hot rolling cracking, reduces production efficiency.In 900～1000 ℃ temperature range, carry out hot rolling and add man-hour, small segregation and cast structure will disappear, in constituent content scopes such as Fe of the present invention, Zn, P, can obtain the rolled strip of homogeneous microstructure, better hot rolling processing temperature is about 950 ℃.Hot rolling processing back crystal grain diameter is below 50 μ m, and crystal grain diameter is greater than 50 μ m, and thereafter cold rolling working modulus, annealed condition and range will narrow down, and make deterioration in characteristics.
After the hot rolling processing, carry out surfacing cut as required, carry out the annealing in the temperature range of cold rolling processing and 300～600 ℃ thereafter repeatedly.Adopt cryogenic twin-stage continuous annealing behind the first high temperature, reach the purpose (crystal grain diameter is less than 50 μ m) of control grain-size and precipitated phase.When temperature was lower than 300 ℃, it was longer to carry out the required time of structure property control; Surpass 600 ℃, crystal grain will become thick in the short period of time.If the crystallization crystal grain after the annealing greater than 50 μ m, can make mechanical characteristics and processing characteristics reductions such as tensile strength.Therefore make crystal grain diameter less than 50 μ m, better crystal grain diameter is less than 25 μ m.
Resulting annealed material, carrying out cold rolling rolling processing reaches more than 40% its amounts of thickness variation, also carry out the low-temperature annealing below 450 ℃, obtain that tensile strength 500MPa is above, hardness 150Hv above, specific conductivity 65%IACS is above, the copper alloy of unit elongation more than 6.5%.Discontented 40% o'clock of cold rolling working modulus, the insufficient strength because of work hardening produces can not improve mechanical characteristics fully.Therefore the ideal working modulus is more than 50%.In order further to improve tensile strength of alloys, hardness, unit elongation, especially characteristic such as specific conductivity, low temperature annealing process is very necessary, be higher than under 450 ℃ the temperature, because of thermal capacity excessive, make material soften at short notice, and no matter adopt intermittent type or continous way, all be easy to generate the characteristic inequality of material internal.Therefore, stress relief annealed condition should be below 450 ℃.
Embodiment:
The copper alloy № 1～6 of composition as shown in table 1 (wt%),
Table 1
It should be noted that in the fusion process of alloy, each element all has scaling loss in various degree, its burn out rate Fe:1～2%, Zn:1～3%, P:2～5%, Mg:20～30%, mishmetal Re:30～50%; In the process of batching, should supply.Add electrolytic copper and copper iron master alloy when melting begins earlier, begin heating, treat that its fusing back adds 1/3 copper phosphorus master alloy, insulation 1～3min earlier; Add zinc, magnesium and rare earth afterwards, treat its fusing back insulation 3～5min, add the copper phosphorus master alloy of residue 2/3 again, insulation 10min casting behind the fine melt; Use the strand of minitype vertical type semicontinuous caster casting 70 * 180 * 1000 (mm), utilize mold once to cool off and utilize water to drench and carry out the secondary cooling, make in the temperature range of liquidus line to 400 ℃ speed of cooling 80 ℃/more than the min.Thereafter, each strand behind 900～1000 ℃ temperature range internal heating, through hot rolling calendering so that its thickness is 6mm, from the surface and the crackle at edge estimate the hot rolling processibility.After overpickling, the experiment material that does not observe crackle under 50 times opticmicroscope is evaluated as, and it is poor that the experiment material that can observe crackle is evaluated as.The end temp of hot rolling calendering is 700 ℃, by chilling grain-size is controlled at about 50 μ m.Carrying out cold rolling calendering then, to make its thickness be 1mm, carries out the twin-stage anneal in 300～600 ℃ temperature range, impels the second phase particle to separate out the raising performance, and carrying out cold rolling calendering afterwards again, to make its thickness be 0.5mm, carries out low-temperature annealing at last.
Clip test film from the above resulting band carries out the mensuration of tensile strength, hardness, unit elongation and specific conductivity, and every performance index are all measured according to GB.More than resulting outcome record in table 2.
Table 2
| Embodiment | Tensile strength (MPa) | Hardness Hv | Unit elongation (%) | Specific conductivity (%IACS) | The hot rolling processing characteristics |
| 1 | 500 | 150 | 6.5 | 71 | Good |
| 2 | 512 | 152 | 6.6 | 70 | Good |
| 3 | 516 | 150 | 6.8 | 68 | Good |
| 4 | 520 | 156 | 6.7 | 67 | Good |
| 5 | 525 | 158 | 6.9 | 68 | Good |
| 6 | 530 | 160 | 6.6 | 65 | Good |
Obviously, this copper alloy has good hot workability, helps manufacturing, and especially has characteristics such as good tensile strength, hardness, unit elongation and specific conductivity, is the best materials of producing electrical and electronic parts such as lead frame; This coppr alloy-metal is the row of alloy C194 in Cu-Fe.
More than by specific embodiment technical solution of the present invention has been done to further specify, the example that provides only is an exemplary applications, can not be interpreted as a kind of restriction to claim protection domain of the present invention.
Claims (7)
1. copper alloy for lead-wire frame, it is characterized in that: the quality percentage composition of its composition is as follows---
Fe 2.0～2.6wt％，
Zn 0.05～0.1wt％，
P 0.01～0.03wt％，
Mg 0.01～0.05wt％，
Mishmetal Re 0.01～1.5wt%,
All the other components of this copper alloy are Cu and unavoidable impurities.
2. copper alloy for lead-wire frame according to claim 1 is characterized in that: described copper alloy also contains in As, Sb, Bi, Pb, Sn, the Ni element at least a above element and total amount less than 0.05wt%, and S content is below 25ppm.
3. copper alloy for lead-wire frame according to claim 1 is characterized in that: the tensile strength of described copper alloy is that 500MPa is above, hardness 150Hv above, specific conductivity 65%IACS is above, unit elongation is more than 6.5%.
4. make the method for the described copper alloy for lead-wire frame of claim 1, it is characterized in that may further comprise the steps---
1. at first main raw material and auxiliary material are injected mold after 1200～1300 ℃ of fusions, cool off with 80 ℃/ speed of cooling more than the min in the temperature range of liquidus temperature to 400 ℃, control composition content F e is that 2.0～2.6wt%, Zn are that 0.05～0.1wt%, P are that 0.01～0.03wt%, Mg are that 0.01～0.05wt%, mishmetal Re are that 0.01～1.5wt%, all the other components are Cu and unavoidable impurities in manufacturing processed;
2. the strand that obtains is carried out the hot rolling calendering in the Heating temperature below 1000 ℃, control composition content F e is that 2.0～2.6wt%, Zn are that 0.05～0.1wt%, P are that 0.01～0.03wt%, Mg are that 0.01～0.05wt%, mishmetal Re are that 0.01～1.5wt%, all the other components are Cu and unavoidable impurities in manufacturing processed;
3. hot rolled band is carried out cold rolling calendering repeatedly, cold rolling is delayed in 300 ℃～600 ℃ temperature range and is carried out twin-stage continuous annealing, and control composition content F e is that 2.0～2.6wt%, Zn are that 0.05～0.1wt%, P are that 0.01～0.03wt%, Mg are that 0.01～0.05wt%, mishmetal Re are that 0.01～1.5wt%, all the other components are Cu and unavoidable impurities in manufacturing processed;
4. after twin-stage continuous annealing, carry out cold rolling and prolong processing, its amounts of thickness variation is reached more than 40%, carry out the low-temperature annealing below 450 ℃ again, obtain the band finished product, control composition content F e is that 2.0～2.6wt%, Zn are that 0.05～0.1wt%, P are that 0.01～0.03wt%, Mg are that 0.01～0.05wt%, mishmetal Re are that 0.01～1.5wt%, all the other components are Cu and unavoidable impurities in manufacturing processed.
5. the manufacture method of copper alloy for lead-wire frame according to claim 4 is characterized in that: 2. control the crystal grain diameter of band less than 50 μ m in the hot rolling calendering course of processing in step.
6. the manufacture method of copper alloy for lead-wire frame according to claim 4, it is characterized in that: the crystal grain diameter of the calendering band after 3. step anneals is less than 50 μ m.
7. the manufacture method of copper alloy for lead-wire frame according to claim 4, it is characterized in that: described main raw material is No. 1 electrolytic copper, auxiliary material is copper iron master alloy, copper phosphorus master alloy, simple substance zinc, simple substance magnesium and mishmetal Re.
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| CN103667770B (en) * | 2013-11-27 | 2015-11-11 | 余姚市士森铜材厂 | A kind of precipitation hardenable copper alloy |
| CN103667774B (en) * | 2013-11-27 | 2016-08-17 | 余姚市士森铜材厂 | A kind of preparation method of Copper alloy semiconductor lead frame |
| CN103878551A (en) * | 2014-03-27 | 2014-06-25 | 上海理工大学 | Method for producing high-strength copper nickel silica lead frame material |
| JP6766330B2 (en) * | 2015-09-11 | 2020-10-14 | 日立金属株式会社 | Battery lead material and battery lead material manufacturing method |
| WO2023167230A1 (en) * | 2022-03-04 | 2023-09-07 | 株式会社プロテリアル | Copper alloy material and method for manufacturing copper alloy material |
| CN115821107A (en) * | 2022-12-15 | 2023-03-21 | 安徽鑫科铜业有限公司 | Etched lead frame copper casting blank and production method thereof |
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