CN100425573C - Mfg. method of nano ceramics - Google Patents
Mfg. method of nano ceramics Download PDFInfo
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- CN100425573C CN100425573C CNB2004100229445A CN200410022944A CN100425573C CN 100425573 C CN100425573 C CN 100425573C CN B2004100229445 A CNB2004100229445 A CN B2004100229445A CN 200410022944 A CN200410022944 A CN 200410022944A CN 100425573 C CN100425573 C CN 100425573C
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- porcelain
- pottery
- nano material
- nanometer
- vacuum
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Abstract
The present invention discloses a method for producing nanometer porcelain. In the method, textile porcelain to be certificated and packed, such as 75 porcelain, 95 porcelain and 99 porcelain which take alumina as a base, a certificated high-voltage electricity transmitting bottle to be glazed, porcelain for sealing produced semiconductor components of the epoxy resin and porcelain for valve gates and water taps are cleaned, dried and put in a vacuum container; when the degree of vacuum reaches 133.3*10<-3> to 133.3*10<-7>Pa, the nanometer material on a heating source is heated till the temperature reaches 20 to 1200 DEG C; after the temperature is maintained for 0.5 to 4.0 hours, vacuum is relieved, the nanometer material is distributed in the interior of all porcelain, and heating is stopped; the temperature of the porcelain lowers, the porcelain cools naturally, and the product is taken out, cleaned and dried. The porosity of the textile porcelain is changed into compactness, hydrophilicity is changed into hydrophobicity, the lubricating property of the porcelain is increased, and broken yarn rate is reduced by 2/3 to 20/21 times. The high-voltage electricity transmitting bottle does not need to be glazed, the compression resistance and environment usability are increased, and production cost is reduced; the airtightness and moisture resistance of the nanometer porcelain for sealing semiconductor components and nanometer porcelain for valve gates and water taps are good.
Description
Technical field
The present invention relates to a kind of manufacture method of under vacuum state, textile machines, high voltage power transmission porcelain vase usefulness, semiconductor components and devices epoxy encapsulation usefulness, valve and water tap being used that is impregnated with the nano material pottery.
Background technology
Along with the high speed development of textile manufacturing machine and improving constantly of automatic degree, the movement velocity of yarn also improves constantly, the broken yarn problem is the major issue that people pay close attention to always in spinning and weaving process process, for head it off, before on spinning and the weaving machine, adopt metalwork to give yarn guide, many in recent years employing 75 porcelain or 95 porcelain or 99 porcelain are as guide, because the composition and the manufacturing process of material, make two big drawbacks of 75 porcelain or 95 porcelain and 99 porcelain be: the porousness wetting ability, have a strong impact on performance, owing to the friction between porcelain spare and the yarn, reduce the work-ing life of textile machines pottery after use for some time.To spin rate in order reducing to break, under the condition that adds large space humidity, more to increase the friction between yarn and the porcelain spare.In order to overcome the shortcoming of 75 porcelain or 95 porcelain or 99 porcelain, improve smooth finish, wear resistance and the raising moisture resistance energy in use of pottery itself, must handle (the P of " international electronic material " 2003/12 to the textile machines pottery
12And the P of 2003/9-10
72Report).
Remove this, must be difficult for by electrical breakdown with anticreep by glaze to increase the compactness on transmission of electricity porcelain vase surface at the outside surface that is applied to the high voltage power transmission porcelain vase on the ultra-high-tension power transmission line in the past.This is complex process by glaze technology one, the 2nd, and the production cost height.Because hole is many, the moisture resistance poor performance influences work-ing life of semiconductor components and devices to the semiconductor components and devices epoxy encapsulation with pottery.
Summary of the invention
The object of the present invention is to provide a kind of improve compactness, good, the anti abrasive textile machines of moisture resistance performance, high voltage power transmission porcelain vase with and production cost is low, the semiconductor components and devices epoxy encapsulation of moisture resistance performance better, high low temperature good cycle than the plastic packaging with and the manufacture method that is impregnated with the nano material pottery used of valve, water tap.
For achieving the above object, the technical solution used in the present invention is: utilize that existing what be used for textile enterprise is the textile machines pottery of matrix with the aluminium sesquioxide, as the porcelain spare of 75 porcelain or 95 porcelain or 99 porcelain, through be up to the standards by the high voltage power transmission porcelain vase of glaze, semiconductor components and devices epoxy encapsulation with pottery and valve, water tap with pottery as the preparation object, behind the cleaning, drying, they are put into vacuum vessel, simultaneously nano material is positioned on the heating source in the vacuum vessel, treats that the vacuum tightness in the vacuum vessel reaches 133.3 * 10
-3～133.3 * 10
-7During Pa, nano material 20 ℃～1200 ℃ heating, was kept 0.5～4.0 hour, remove vacuum, stop to heat, the cooling back is taken out stand-by.
Adopt the nano-spun loom of as above technical scheme preparation to compare with conventional ceramic with nano ceramics with valve, water tap with nano ceramics with pottery, nanometer high voltage power transmission porcelain vase, semiconductor components and devices encapsulation, its characteristics are:
1. the porousness with original textile machines pottery becomes compactness, has increased ceramic lubricity, and wetting ability becomes hydrophobic nature, has increased ceramic oilness.
2. reduced spin and pottery between friction, can reduce by 2～20 times of the broken yarn rates of textile manufacturing machine, can reduce noise.
3. the nano material in the nanometer high voltage power transmission porcelain vase can fetter and isolating metal ion, free state ion and polar molecule, cut off electronic conduction and mechanism of ionic conduction in the porcelain vase, help improving the resistance to pressure of porcelain vase, do not need to the transmission of electricity porcelain vase by glaze, can reduce production costs.
4. the acid and alkali-resistance of nanometer high voltage power transmission porcelain vase, salt spray resistance are applicable to industry zone or coastal ultra-high-tension power transmission line than good by glaze high voltage power transmission porcelain vase performance.
5. the semiconductor components and devices epoxy encapsulation is better than the plastic packaging with the moisture resistance performance of nano ceramics, and high low temperature cycle performance is strong, has improved high-temperature behavior and low-temperature performance.
The water-absorbent of 6. made nano ceramics is littler 50～100 times than the water-absorbent of conventional ceramic.
Embodiment
Below the specific embodiment of the present invention is described in further detail.
1. with the textile machines pottery of Proper Packing, as with Al
2O
3The textile machines pottery that manufactures for 75 porcelain of base or 95 porcelain or 99 porcelain, treat through being up to the standards by the high voltage power transmission porcelain vase of glaze, semiconductor components and devices epoxy encapsulation with ceramic member and valve, water tap with ceramic member through cleaning water and organic solvent, clean as alcohol etc., remove the dirt of surface or endoporus, make its surface not stay any physics dirt or oil stain; The mechanical water in surface and the endoporus is removed in oven dry;
2. the textile machines pottery that will cross through clean, treat to be placed vacuum vessel with ceramic member and valve, switch water tap with ceramic member by the high voltage power transmission porcelain vase of glaze, semiconductor components and devices epoxy encapsulation, simultaneously nano material is put on the heating source in the vacuum vessel;
3. to evacuating atmosphere in vacuum vessel, treat that the vacuum tightness in the vacuum vessel reaches 133.3 * 10
-3～133.3 * 10
-7During Pa, the nano material on the heating source is heated up, temperature is controlled at 20 ℃～1200 ℃ and kept 0.5～4.0 hour, to exitting in the vacuum vessel, nano material stops heating source being heated after all being distributed to all pottery the insides, naturally cooling cooling, it is stand-by to take out cleaning, drying.
Through after this technology, nano material all is distributed to textile machines pottery, high voltage power transmission porcelain vase, semiconductor components and devices epoxy encapsulation usefulness pottery and valve, water tap with inside the ceramic product, increased their density, air and steam can not enter in the product; Because nano material is distributed in the pottery the inside, wetting ability becomes hydrophobicity performance, has improved their insulating property simultaneously.
Nano material is: nonmetal, organism etc.
Embodiment 1:
Vacuum tightness in the vacuum vessel is 4.5 * 133.3 * 10
-4Pa, the nano material Heating temperature is 120 ℃, 2.0 hours heat-up times, other condition is identical with the explanation in the specification sheets;
Embodiment 2:
Vacuum tightness in the vacuum vessel is 1.5 * 133.3 * 10
-5Pa, the nano material Heating temperature is 800 ℃, and be 1.5 hours heat-up time, and other condition is identical with the specification sheets explanation;
Embodiment 3:
Vacuum vessel vacuum tightness is: 5.5 * 133.3 * 10
-7Pa, 1000 ℃ of nano material Heating temperatures, be 3.5 hours heat-up time, other condition is identical with explanation in the specification sheets.
Claims (1)
1, a kind of manufacture method that is impregnated with the pottery of nano material, with qualified textile machines to be packaged with the aluminium sesquioxide be 75 porcelain of base or 95 porcelain or 99 porcelain and treat through being up to the standards by the high voltage power transmission porcelain vase of glaze and semiconductor components and devices epoxy encapsulation with pottery, valve and water tap with ceramic with cleaning water and organic solvent cleaning, dry and place vacuum vessel, it is characterized in that: nano material is put on the heating source in the vacuum vessel; Take out straight sky, treat that the vacuum tightness in the vacuum vessel reaches 133.3 * 10
-3-133.3 * 10
-7Behind the Pa, nano material is warmed up to 20 ℃-1200 ℃ keeps exitting in vacuum vessel in 0.5-4.0 hour, nano material stops heating after all being distributed to the pottery the inside, cooling cooling naturally, and it is stand-by to take out the product cleaning, drying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100229445A CN100425573C (en) | 2004-02-27 | 2004-02-27 | Mfg. method of nano ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100229445A CN100425573C (en) | 2004-02-27 | 2004-02-27 | Mfg. method of nano ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1559977A CN1559977A (en) | 2005-01-05 |
| CN100425573C true CN100425573C (en) | 2008-10-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100229445A Expired - Fee Related CN100425573C (en) | 2004-02-27 | 2004-02-27 | Mfg. method of nano ceramics |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100425573C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102503377B (en) * | 2011-09-30 | 2013-07-17 | 中国电子科技集团公司第十三研究所 | High-strength semiconductor packaging ceramic material and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998022241A2 (en) * | 1996-11-15 | 1998-05-28 | Institut Für Neue Materialien Gem. Gmbh | Foundry binder |
| CN1308035A (en) * | 2001-02-05 | 2001-08-15 | 吴哲雄 | Ceramic surface treating technology |
| CN1351977A (en) * | 2001-11-26 | 2002-06-05 | 大连理工大学 | Technology for preparing nanometer ceramic particle material with industrial propane |
| CN1403624A (en) * | 2001-09-13 | 2003-03-19 | 北京航空航天大学 | Electron-beam physical vapor deposition process of preparing composite nano soft magnet and ceramic film |
| CN1410394A (en) * | 2001-09-24 | 2003-04-16 | 中国科学院理化技术研究所 | Method of forming metal composite titanium dioxide nano particle film on ceramic surface |
| TW562790B (en) * | 2002-08-29 | 2003-11-21 | Tien Kuang Entpr Co Ltd | Method of nanoparticulate coating for antifouling product |
-
2004
- 2004-02-27 CN CNB2004100229445A patent/CN100425573C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998022241A2 (en) * | 1996-11-15 | 1998-05-28 | Institut Für Neue Materialien Gem. Gmbh | Foundry binder |
| CN1308035A (en) * | 2001-02-05 | 2001-08-15 | 吴哲雄 | Ceramic surface treating technology |
| CN1403624A (en) * | 2001-09-13 | 2003-03-19 | 北京航空航天大学 | Electron-beam physical vapor deposition process of preparing composite nano soft magnet and ceramic film |
| CN1410394A (en) * | 2001-09-24 | 2003-04-16 | 中国科学院理化技术研究所 | Method of forming metal composite titanium dioxide nano particle film on ceramic surface |
| CN1351977A (en) * | 2001-11-26 | 2002-06-05 | 大连理工大学 | Technology for preparing nanometer ceramic particle material with industrial propane |
| TW562790B (en) * | 2002-08-29 | 2003-11-21 | Tien Kuang Entpr Co Ltd | Method of nanoparticulate coating for antifouling product |
Non-Patent Citations (4)
| Title |
|---|
| 纳米氧化物的制备与应用. 廖莉玲，刘吉平.贵州师范大学学报(自然科学版)，第20卷第2期. 2002 |
| 纳米氧化物的制备与应用. 廖莉玲，刘吉平.贵州师范大学学报(自然科学版)，第20卷第2期. 2002 * |
| 纳米陶瓷复合材料的制备及特性. 金正爱，邱向东.中国有色金属学报，第8卷第2期. 1998 |
| 纳米陶瓷复合材料的制备及特性. 金正爱，邱向东.中国有色金属学报，第8卷第2期. 1998 * |
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| Publication number | Publication date |
|---|---|
| CN1559977A (en) | 2005-01-05 |
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