CN100416457C - Apparatus and method for dynamic configuration of temperature profile in an integrated circuit - Google Patents
Apparatus and method for dynamic configuration of temperature profile in an integrated circuit Download PDFInfo
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- CN100416457C CN100416457C CNB2006101011511A CN200610101151A CN100416457C CN 100416457 C CN100416457 C CN 100416457C CN B2006101011511 A CNB2006101011511 A CN B2006101011511A CN 200610101151 A CN200610101151 A CN 200610101151A CN 100416457 C CN100416457 C CN 100416457C
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Abstract
An integrated circuit including a temperature sensor, configurable temperature profile logic circuit, at least one controller, and temperature control logic circuit. The temperature sensor provides an operating temperature value. The configurable temperature profile logic circuit provides a configured operating temperature range. The temperature control logic circuit has a first input receiving the operating temperature value, a second input receiving the configured operating temperature range, and at least one output coupled to each controller. The temperature control logic circuit controls one or more controllers to maintain the operating temperature value within the configured operating temperature range. The IC may include an interface mechanism that enables external configuration of the configurable temperature profile logic circuit, such as a system BIOS interface, an operating system interface and an application program interface. The controller may be a duty cycle controller, a frequency controller, a core voltage controller, a fan controller, and a functional block controller or combination.
Description
Technical field
The present invention relates to integrated circuit, particularly relate to the dynamic configuration of temperature profile of integrated circuit, in order to the control problem of the operating temperature that solves integrated circuit.
Background technology
There are many integrated circuit to provide the control function of operating temperature now.For example, but certain the logical circuit sensing in the microprocessor obtains core operation temperature (core operating temperature), and makes operating temperature can remain in the fixing scope by the adjustment of operating frequency or operating voltage.Normally during manufacturing test, upper temperature limit threshold value (threshold) is write in the read-only buffer; In case when the DIE Temperature of assembly surpassed threshold value, control logic circuit promptly can reduce core frequency or core operation voltage, makes DIE Temperature can be returned in the acceptable scope.
Yet, set to adjust because above-mentioned traditional temperature control technology can't reach dynamic type, therefore for user or system combination person in the inconvenience very of some occasion.For example, wish to make environmental protection or the electricity-saving system that a utmost point need reduce energy resource consumption as system combination person.Again for example, when the user needs long-time use laptop computer (laptop computer) and can't charge.In addition, must put computing machine in above-knee use and during a large amount of heat of suffering from laptop computer again and being produced as the user.
In view of top described, the utmost point need propose a kind of method or device, in order to allow user or system combination person dynamically be set the operating temperature feature (operatingtemperature profile) of integrated circuit (for example microprocessor).
Summary of the invention
According to one of embodiment of the invention, the present invention discloses a kind of integrated circuit, but it comprises temperature sensor design temperature characteristic logic circuit, at least one controller and temperature control logic circuit.Temperature sensor provides an operating temperature value.But design temperature characteristic logic circuit provides a setting operation temperature range.The temperature control logic circuit has that first input end is used for receiving operating temperature value, second input end is used for receiving the setting operation temperature range and at least one output terminal is connected to each controller.The temperature control logic circuit is controlled one or more controllers, and operating temperature value is maintained in the setting operation temperature range.
This integrated circuit can comprise an Interface Mechanism, but in order to adjust design temperature characteristic logic circuit.This Interface Mechanism can be basic input/output, operating system, application program or its combination.Feature protection logical circuit is used for getting rid of unallowed operating temperature range and sets.Controller can be work period controller, frequency controller, core voltage controller, fan governor, mac function controller or its combination.But design temperature characteristic logic circuit can be buffer and so on, for example machine specific register (machine specific register).
This integrated circuit can also comprise the critical logical circuit of excess temperature (over-temperature thresholdlogic), is used to provide a maximum temperature opereating specification and gives the temperature control logic circuit.In this example, this temperature control logic circuit is controlled each controller makes operating temperature less than the numerical value of maximum or maintain in the setting operation temperature range.
According to another embodiment of the present invention, the present invention discloses a microprocessor (microprocessor), and but it comprises the DIE Temperature sensor so that an operating temperature, superpotential critical circuit (over-voltagethreshold circuitry) to be provided to provide maximum operating temp scope design temperature feature circuit (configurable temperature profile circuitry) so that operating temperature range, one or more controller and a temperature-control circuit that has reduced to be provided.This temperature-control circuit is used for controlling one or more controllers, make its operate that warm numerical value maintains the maximum operating temp scope or the operating temperature range that reduced in.
This microprocessor can also comprise an Interface Mechanism, but is used for the operating temperature range that access design temperature feature circuit reduced with setting.This Interface Mechanism can be basic input/output, operating system or application program.This microprocessor can also comprise feature holding circuit (profile protectioncircuitry), is used for avoiding this operating temperature range that has reduced to be set in the operating temperature range that is not allowed to.Controller can be work period controller, frequency controller, core voltage controller, fan governor, mac function control or its combination.
According to another embodiment of the present invention, the present invention discloses a kind of dynamic establishing method of temperature profile of integrated circuit, comprises:
One temperature of this integrated circuit of sensing;
Set the operating temperature range that one of this integrated circuit has been demoted, and
Adjust temperature maintenance that at least one controlling mechanism makes this integrated circuit in the operating temperature range that this has reduced, wherein, the reduction of said integrated circuit the setting step of operating temperature range comprise:
Programme by an Interface Mechanism, wherein, the reduction of said integrated circuit the setting step of operating temperature range comprise:
The buffer of programming.
This dynamic establishing method also can comprise the programming by Interface Mechanism, for example by basic input/output, operating system or application program.This method can comprise programming one buffer.This method can comprise adjusts operating frequency or core voltage.This method can comprise adjusts the speed that an instruction is performed.This method can comprise selects to start fan.This method also can comprise the mac function of selecting to start integrated circuit.
Description of drawings
The kinetic controlling equation piece figure that figure one shows according to the integrated circuit operation temperature of the embodiment of the invention.
The reference numeral explanation
100 integrated circuit
101 DIE Temperature sensors
103 temperature control logic circuit
105 fixing critical logical circuits of excess temperature
But 107 design temperature characteristic logic circuit
109 features protection logical circuit
110 Interface Mechanism
111 basic input/outputs
113 operating systems
115 application programs
116 controlling mechanisms
117 work period controllers
119 frequency controllers
121 core voltage controllers
123 fan governors
125 other controllers
Embodiment
Below disclosed embodiment in order to enable those skilled in the art to make according to this and use the present invention.The various variations of these embodiment have also been contained in the present invention simultaneously, and the principle that these embodiment disclosed also can be applied to other enforcement occasion.That is scope of the present invention is not limited to disclose among the embodiment and the content of describing, and can be without prejudice to principle that this instructions discloses and novel feature following, obtain a scope the broadest.
The inventor notices some problems that the operating temperature control of aforementioned conventional integrated circuit is produced, therefore the inventor proposes a kind of System and method for, it can dynamically set the temperature profile of integrated circuit, in order to solve the temperature control problem of aforementioned integrated circuit when operating, will be in describing in detail below in conjunction with accompanying drawing.
The calcspar of figure one shows the dynamic control according to integrated circuit 100 operating temperatures of the embodiment of the invention.In one of them embodiment of the present invention, integrated circuit 100 is a microprocessor.Integrated circuit 100 comprises a DIE Temperature sensor (core temperature sensor) 101, gives temperature control logic circuit (temperature controllogic) 103 in order to a core operation temperature (core operating temperature) T to be provided.Temperature control logic circuit 103 in addition from fixedly critical logical circuit of excess temperature (fixedover-temperature threshold logic) 105 or superpotential critical circuit (over-voltage thresholdcircuitry) receive one " safe " (safe) or maximum operating temp scope (operating temperaturerange) TS, as previously mentioned.Different with traditional integrated circuit is, but integrated circuit 100 of the present invention also comprises design temperature characteristic logic circuit (configurable temperature profile logic) 107, and it provides one or more setting operation temperature ranges (configured operating temperaturerange) TR to give temperature control logic circuit 103.
Safe operation temperature range TS typically refers to the hurtful maximum permissible temperature scope of integrated circuit 100 internal circuits that can not allow.When the core operation temperature T near or when surpassing maximum (or door) Temperature numerical that safe operation temperature range TS sets, temperature control logic circuit 103 promptly can be taked adequate measures (it will describe in detail in the back), in order to reduce infringement or the fault of core operation temperature T to avoid integrated circuit 100.Based on some factors, integrated circuit 100 needs to operate in the setting operation temperature range TR.The numerical value of this setting operation temperature range TR comes for a short time with respect to the numerical value of safe operation temperature range TS.For example, desire to be applied to an environmental protection or save in the system of the energy, perhaps be used to reduce temperature with prolongation system, battery serviceable life, the perhaps heat that is produced for the minimizing system when integrated circuit 100.
One or more setting operation temperature range TR can set up different protections according to different embodiment and set.In one of them embodiment of the present invention, use characteristic protection logical circuit 109 is got rid of one or more unallowed operating temperature ranges.In the embodiment of an x86 compatibility, outside the highest protection level (for example, the core protection level of the 0th grade or operating system), but can be in order to avoid design temperature characteristic logic circuit 107 by improper redjustment and modification.This practice can be in order to guarantee keeping some default less temperature ranges, and for example one is the environment friendly system or the cooling system of life-saving.In other embodiments of the invention, then allow the user to adjust or programme (programming) but design temperature characteristic logic circuit 107 by one or more Interface Mechanism 110.This Interface Mechanism 110 comprises a basic input/output (BIOS) interface 111, an operating system software interface 113 and an Application Program Interface 115.By one of these Interface Mechanism 110 or its combination, the user can adjust by external access (external access) approach; Certainly, other access approach also can be suitable for.In one embodiment of the invention, but design temperature characteristic logic circuit 107 is the machine specific register (machine specific register) in the microprocessor, its content is write fashionable via operating system software interface 113 in the system that is operated, be positioned the highest privilege level (privilege level) (for example privilege level 0).
But according to numerical value TS, TR, T that the fixedly critical logical circuit 105 design temperature characteristic logic circuit 107 of excess temperature, DIE Temperature sensor 101 are provided respectively, temperature control logic circuit 103 is able to come by one or more controlling mechanisms 116 temperature of control integrated circuit 100.Therefore, in certain embodiments, the present invention uses one or more controlling mechanisms 116, and it comprises work period controller (duty cycle controller) 117, frequency controller (frequency controller) 119, core voltage controller (core voltage controller) 121, fan governor (fan controller) 123 and other controller 125.Temperature control logic circuit 103 control operation temperature are in TS and the specified selection operation scope of TR.Wherein, the TS input can be predetermined to be maximum executable operations temperature range, then is to reduce operating temperature according to more aforementioned reasons as for the TR input.
In running, work period controller 117 is used for adjusting the speed of the steering order (control instructions) that enters integrated circuit 100 execution logic circuit (not shown)s.For example, in a pipe guide (pipeline device) (as microprocessor), work period controller 117 is used for controlling the speed that micro-order is performed.Frequency controller 119 is used for adjusting the core operation frequency of integrated circuit 100, also can combine control with core voltage controller 121.Core voltage controller 121 is used for adjusting the core voltage (for example " Vdd ") of integrated circuit 100.Fan governor 123 optionally starts (opening or closing) fan or other cooling device (not shown). and " other " controller 125 is meant the mechanism of some may command integrated circuit 100 temperature.For example, in the embodiment of microprocessor, other controller 125 comprises some logical circuits, and it can close some non-essential logic function square, and for example non-essential L2 high-speed cache is in order to promote treatment effeciency.
One of advantage of the present invention is that operational threshold can be done dynamically to set according to different purposes, for example in order to keep battery life, prolong the bulk life time of integrated circuit 100 or to reduce the heat that produces.Known as those skilled in the art, if integrated circuit 100 can operate under the lower temperature, generally speaking can prolong the life-span and the fiduciary level of integrated circuit 100.
The above is preferred embodiment of the present invention only, is not in order to limit the scope of claim of the present invention; All other do not break away from the equivalence of being finished under the spirit that invention discloses and changes or modify, and all should comprise in the scope of claim of the present invention.
The present invention requires following right of priority: No. the 60/696th, 703, the U.S. Provisional Application case of submitting on July 5th, 2005; And No. 11/277,104, U.S.'s formal application case of submitting on March 21st, 2006.
Claims (9)
1. integrated circuit comprises:
One temperature sensor is in order to provide an operating temperature value;
But a design temperature characteristic logic circuit is in order to provide an operating temperature range of having set;
At least one controller, it all has a control input end; And
One temperature control logic circuit, it has a first input end in order to receive this operating temperature value, one second input end in order to receive the control input end that this operating temperature range of having set and at least one output terminal are connected to this controller respectively;
One Interface Mechanism, but in order to adjust this design temperature characteristic logic circuit from the external world;
One feature protection logical circuit, but its be connected between this Interface Mechanism and this design temperature characteristic logic circuit, be used for getting rid of unallowed operating temperature range,
Wherein, this at least one controller of above-mentioned temperature control logic circuit control, this operating temperature value is maintained in the setting operation temperature range and
Wherein, above-mentioned Interface Mechanism comprise following one of them:
One basic input/output, an operating system and an application program.
2. integrated circuit as claimed in claim 1, wherein, but whether described feature protection logical circuit should be modified by design temperature characteristic logic circuit according to protection level decision.
3. integrated circuit as claimed in claim 1, wherein above-mentioned at least one controller comprise one of following or its combination:
One work period controller, a frequency controller, a core voltage controller, a fan governor and a mac function controller.
4. integrated circuit as claimed in claim 1, but wherein above-mentioned design temperature characteristic logic circuit comprises:
One buffer.
5. integrated circuit as claimed in claim 1 also comprises:
The critical logical circuit of one excess temperature is in order to provide one three input end of a maximum operating temp scope to this temperature control logic circuit; And
Wherein above-mentioned this at least one controller of temperature control logic circuit control maintains in this setting operation temperature range or this maximum operating temp scope this operating temperature value.
6. microprocessor comprises:
One DIE Temperature sensor is in order to provide an operating temperature value;
One superpotential critical circuit is in order to provide a maximum operating temp scope;
But a design temperature feature circuit is in order to provide an operating temperature range that has reduced;
At least one controller; And
One temperature-control circuit, but be connected with this DIE Temperature sensor, this superpotential critical circuit, this design temperature feature circuit, this controller, in order to this at least one controller of control, make this operating temperature value maintain this maximum operating temp scope maybe in this operating temperature range that has reduced;
One feature holding circuit, but its be linked to Interface Mechanism and should design temperature feature circuit between, be used for avoiding this operating temperature range that has reduced to be set in unallowed operating temperature range;
One Interface Mechanism, but in order to access should design temperature feature circuit setting the operating temperature range that this has reduced,
Wherein, above-mentioned Interface Mechanism comprise following one of them:
One basic input/output, an operating system and an application program.
7. microprocessor as claimed in claim 6, wherein above-mentioned at least one controller comprise one of following or its combination:
One work period controller, a frequency controller, a core voltage controller, a fan governor and a mac function controller.
8. the dynamic establishing method of the temperature profile of an integrated circuit comprises:
One temperature of this integrated circuit of sensing;
Set the operating temperature range that one of this integrated circuit has reduced;
Get rid of one or more unallowed operating temperature ranges; And
Adjust temperature maintenance that at least one controlling mechanism makes this integrated circuit in the operating temperature range that this has reduced,
Wherein, the reduction of said integrated circuit the setting step of operating temperature range comprise:
Programme by an Interface Mechanism,
Wherein, the reduction of said integrated circuit the setting step of operating temperature range comprise:
The buffer of programming.
9. as the dynamic establishing method of the temperature profile of integrated circuit as described in the claim 8, wherein the set-up procedure of above-mentioned controlling mechanism comprise following one of them:
Adjust operating frequency or core voltage;
Adjust the speed that an instruction is performed;
Select to start a fan;
Select to start a mac function of this integrated circuit.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US69670305P | 2005-07-05 | 2005-07-05 | |
| US60/696,703 | 2005-07-05 | ||
| US11/277,104 | 2006-03-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1889010A CN1889010A (en) | 2007-01-03 |
| CN100416457C true CN100416457C (en) | 2008-09-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2006101011511A Active CN100416457C (en) | 2005-07-05 | 2006-07-05 | Apparatus and method for dynamic configuration of temperature profile in an integrated circuit |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102298431A (en) * | 2010-06-28 | 2011-12-28 | 鸿富锦精密工业（深圳）有限公司 | Computer heat radiation control system and method |
| WO2016169816A1 (en) * | 2015-04-21 | 2016-10-27 | Philips Lighting Holding B.V. | Identifying a temperature anomaly |
| CN108255528B (en) * | 2017-12-07 | 2021-08-27 | 深圳比特微电子科技有限公司 | Startup method of application specific integrated circuit |
| CN113534941A (en) * | 2021-07-29 | 2021-10-22 | 群联电子股份有限公司 | Temperature control method, memory storage device and memory control circuit unit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1153563A (en) * | 1994-04-28 | 1997-07-02 | 文鲁奈克斯技术公司 | Temp. management for integrated circuits |
| CN1369759A (en) * | 2001-02-12 | 2002-09-18 | 英业达股份有限公司 | System and method for instantaneously controlling temp of CPU for notebook computer |
| US20030158697A1 (en) * | 2002-02-19 | 2003-08-21 | Sun Microsystems, Inc. | Method and system for monitoring and profiling an integrated circuit die temperature |
| CN2674165Y (en) * | 2003-08-12 | 2005-01-26 | 翔耀电子（东莞）有限公司 | Device for controlling rotating speed and sensing temp. of computer's fan |
-
2006
- 2006-07-05 CN CNB2006101011511A patent/CN100416457C/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1153563A (en) * | 1994-04-28 | 1997-07-02 | 文鲁奈克斯技术公司 | Temp. management for integrated circuits |
| CN1369759A (en) * | 2001-02-12 | 2002-09-18 | 英业达股份有限公司 | System and method for instantaneously controlling temp of CPU for notebook computer |
| US20030158697A1 (en) * | 2002-02-19 | 2003-08-21 | Sun Microsystems, Inc. | Method and system for monitoring and profiling an integrated circuit die temperature |
| CN2674165Y (en) * | 2003-08-12 | 2005-01-26 | 翔耀电子（东莞）有限公司 | Device for controlling rotating speed and sensing temp. of computer's fan |
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| Publication number | Publication date |
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| CN1889010A (en) | 2007-01-03 |
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