CN100415518C

CN100415518C - Wiring pattern formation method, wiring pattern, and electronic device

Info

Publication number: CN100415518C
Application number: CNB200510107140XA
Authority: CN
Inventors: 新馆刚; 樱田和昭; 上原升
Original assignee: Seiko Epson Corp
Current assignee: Seiko Epson Corp
Priority date: 2004-09-28
Filing date: 2005-09-28
Publication date: 2008-09-03
Anticipated expiration: 2025-09-28
Also published as: CN1762706A

Abstract

The invention provides a wiring pattern formation method which can allow a conduction column to form the considerable height and realize the multi-layer and miniaturation simultaneously. The formation method is the wiring pattern formation method which allows a plurality of electric wirings (32, 36) that are overlapped and arranged to be conductively interconnected by the conduction column (34). The formation method is characterized in comprising the process for forming the electric wiring (32) which sprays a first liquid drip containing the formation materials of the electric wiring (32); and the process for forming the conduction column (34) which sprays a second liquid drip containing the formation materials of the conduction column (34); and the size of the second liquid drip is larger than the size of the first liquid drip.

Description

The formation method of Wiring pattern

Technical field

The present invention relates to formation method, Wiring pattern and the electronic instrument of Wiring pattern.

Background technology

Formation for the Wiring pattern that constitutes electronic instrument for example can be adopted photoetching process.But photoetching process not only needs the large-scale equipment and the complicated step of vacuum plant etc., and service efficiency is to have to make material almost to go out of use about a few percent, the manufacturing cost height.In addition, be restricted in the miniaturization of Wiring pattern.

Here, studied as the operation that with the photoetching process is representative, contained the liquid of functional material, directly describe to form the method (drop ejection mode) of Wiring pattern to the matrix material ejection.This method at first will disperse the aqueous body of conductive particle to be ejected on the substrate and to describe to form aqueous line from droplet discharging head, by heat treatment and laser irradiation aqueous line be burnt till then and form electric Wiring pattern (for example, with reference to Patent Document 1).According to such drop ejection mode manufacturing process is simplified, the material service efficiency also increases, manufacturing cost reduces.In addition, can make the Wiring pattern miniaturization.

No. 5132248 specification of [patent documentation 1] United States Patent (USP)

In order to make the electronic instrument miniaturization, the miniaturization of Wiring pattern multiple stratification simultaneously is important.In order to make the Wiring pattern multiple stratification, can connect the electric distribution of levels by means of interlayer dielectric laminated configuration electricity distribution, with the conduction column conducting.Here, when utilizing drop ejection mode to form multilayer wired pattern, ejection the 1st drop and describe to form aqueous line, this aqueous line is burnt till and form electric distribution on the formation position of electric distribution at first.Then, spray the 2nd drop and describe to form aqueous binding post, burn till this aqueous binding post and form conduction column in the end of this electricity distribution.Here, if constitute electric distribution and conduction column, reduce manufacturing cost when then can improve the reliability of electrical connection with identical materials.Under this situation, with from the identical drop of identical droplet ejection apparatus ejection as the 1st drop and the 2nd drop.

, conduction column need form the quite height that should connect interlayer dielectric, and when the 2nd drop was constituted with the drop identical with the 1st drop, the formation of conduction column needed long-time or be difficult to make conduction column to form quite height.Its result exists Wiring pattern to be difficult to the problem of multiple stratification.In addition, make the 1st drop when constituting with identical drop with the 2nd drop, electric distribution forms wide cut, exists Wiring pattern to be difficult to the problem of miniaturization.

Summary of the invention

The present invention makes in order to solve above-mentioned problem, and its purpose is, Wiring pattern and its formation method and the electronic instrument that can realize multiple stratification and miniaturization when making conduction column form quite highly are provided.

On the other hand, above-mentioned conduction column need connect interlayer dielectric, has to form quite height.Therefore, have and to spray a plurality of drops and pile up and forms quite highly aqueous post by drop ejection mode.But, even once spray a plurality of drops, also being difficult to guarantee the height of aqueous post, the increasing diameter conference of worrying aqueous post on the contrary causes electric distribution and the conduction column short circuit with adjacency.Therefore, wish to establish the method that forms conduction column quite highly by drop ejection mode.

In addition, burn till behind the electric distribution and when burning till conduction column, on both interfaces, can crack sometimes.By this, the problem that exists the reliability of the electrical connection of multilayer wired pattern to reduce.

The present invention is the invention that is used to solve above-mentioned problem, and its purpose is, provides the reliability that makes conduction column form electrical connection quite highly simultaneously good Wiring pattern and its formation method and electronic instrument.

In order to achieve the above object, the formation method of Wiring pattern of the present invention is the method that forms that is made Wiring pattern that the mutual conducting of a plurality of electric distribution of laminated configuration connects by conduction column, it is characterized in that having: ejection contains the 1st drop of the formation material of above-mentioned electric distribution, the operation of the above-mentioned electric distribution of formation; Contain the 2nd drop of the formation material of above-mentioned conduction column, the operation of the above-mentioned conduction column of formation with ejection; The volume of above-mentioned the 1st drop of the volume ratio of wherein above-mentioned the 2nd drop is big.

According to this formation,, can form the quite conduction column of height with the short time by spraying bulky the 2nd drop.Therefore can realize the multiple stratification of Wiring pattern.On the other hand, by the 1st little drop of ejection volume, can form electric distribution in a narrow margin.Therefore can realize the miniaturization of Wiring pattern.

In addition, the 2nd signal of telecommunication and the input that preferred input is used to spray the droplet ejection apparatus of above-mentioned the 2nd drop is used to spray the 1st signal of telecommunication of the droplet ejection apparatus of above-mentioned the 1st drop to be compared, and the variation of the signal of telecommunication during the drop ejection is big.

In addition, the 2nd signal of telecommunication and the input that preferred input is used to spray the droplet ejection apparatus of above-mentioned the 2nd drop is used to spray the 1st signal of telecommunication of the droplet ejection apparatus of above-mentioned the 1st drop to be compared, and the absolute value of the rate of change of the signal of telecommunication during the drop ejection is big.

In addition, preferred input is used to spray the 2nd signal of telecommunication of the droplet ejection apparatus of above-mentioned the 2nd drop, has the change time-out portion of the signal of telecommunication when drop sprays.

Constitute according to these, can make the volume of volume ratio the 1st drop of the 2nd drop big.

In order to achieve the above object, the formation method of Wiring pattern of the present invention, it is the method that forms that makes Wiring pattern that the mutual conducting of a plurality of electric distribution of laminated configuration connects by conduction column, it is characterized in that having: ejection contain the constituent material of above-mentioned electric distribution the 1st drop, describe to form the operation of aqueous line; The operation on the surface of interim dry above-mentioned aqueous line; Ejection contain the constituent material of above-mentioned conduction column the 2nd drop, on above-mentioned aqueous line, describe to form the operation of aqueous post; Operation with the above-mentioned aqueous line of heating and above-mentioned aqueous post, the above-mentioned electric distribution of formation and above-mentioned conduction column.

According to this formation, owing on the surface of the aqueous line of interim drying regime, describe to form aqueous post, so both are merged on the interface.And, by aqueous line and aqueous post are formally burnt till in the lump, can form electric distribution and conduction column.By this, can prevent from the interface of electric distribution and conduction column crackle to take place, thereby form the good Wiring pattern of reliability that conducting connects.

In addition, preferably, in the operation that forms above-mentioned aqueous post, repeat the ejection and the interim drying of above-mentioned the 2nd drop, a plurality of aqueous sub-posts of stacked formation are in the operation of above-mentioned aqueous line of heating and above-mentioned aqueous post, heat a plurality of aqueous sub-post of stacked formation, form above-mentioned conduction column.

According to this formation and since repeat by the aqueous sub-post of drop ejection form and it is dry temporarily, so the not moistening in the plane expansion of drop of ejection and can the aqueous sub-post of laminated configuration.And, by formally burning till aqueous sub-post in the lump, can form the quite conduction column of height with interim drying regime laminated configuration.

In addition, preferred above-mentioned interim drying is undertaken by blow gas.

In addition, preferred above-mentioned interim drying is undertaken by irradiation ultraviolet radiation.

According to these formations, owing to can carry out interim drying, so can the suppression equipment cost and the rising of manufacturing cost by simple manufacturing equipment and manufacturing process.In addition, even because of interim baking temperature rises for the moment, owing to can return to normal temperature at once, so can shorten manufacturing time.

On the other hand, Wiring pattern of the present invention is characterised in that, uses the formation method of above-mentioned Wiring pattern and makes.

According to this formation, can provide the good Wiring pattern of reliability of electrical connection.In addition, owing to adopt drop ejection mode, so the Wiring pattern of miniaturization and multiple stratification can be provided.

On the other hand, electronic instrument of the present invention is characterised in that to possess above-mentioned Wiring pattern.

According to this formation, because the good Wiring pattern that possesses miniaturization and multiple stratification simultaneously of reliability that is electrically connected, so can provide the reliability of electrical connection good small electronic apparatus.

Description of drawings

Fig. 1 is the exploded perspective view of the Liquid crystal module of COF (chip on the Chip On Film film) structure.

Fig. 2 is the key diagram of the Wiring pattern of embodiment.

Fig. 3 relates to the activity list of formation method of the Wiring pattern of the 1st embodiment.

Fig. 4 is the figure that is input to the example of the signal of telecommunication on the piezoelectric element of droplet discharging head.

Fig. 5 is the figure of the example of the time per unit signal of telecommunication that is used to spray many drops.

Fig. 6 relates to the activity list of formation method of the Wiring pattern of the 2nd embodiment.

Fig. 7 relates to the key diagram of formation method of the Wiring pattern of the 2nd embodiment.

Fig. 8 relates to the key diagram of formation method of the Wiring pattern of the 2nd embodiment.

Fig. 9 is the stereogram of droplet ejection apparatus.

Figure 10 is the side cut away view of droplet discharging head.

Figure 11 is the stereogram of mobile phone.

Figure 12 is the side cut away view of 2 layers of distribution FPC.

Figure 13 is the side cut away view of multilayer wired FPC.

Figure 14 is the side cut away view of VHD assembly.

Figure 15 is the exploded perspective view of image display device.

Figure 16 is a stereogram of directly describing the framework of Wiring pattern.

Among the figure, 32-electricity distribution, 34-conduction column, 36-electricity distribution

The specific embodiment

Following with reference to the description of drawings embodiments of the present invention.In addition, in each used accompanying drawing of following explanation, because each member is taken as discernible size, so suitably changed the engineer's scale of each member.

(the 1st embodiment)

Fig. 1 is the exploded perspective view of the Liquid crystal module of COF (chip on the Chip On Film film) structure.In the present embodiment, with flexible printed wiring board (Flexible Printed Circuit; Hereinafter referred to as " FPC ") the formation method of 30 Wiring pattern is that example describes.FPC30 is the substrate that has formed

electric Wiring pattern

39a, 39b on the surface with flexual film substrate 31.The details aftermentioned, but in the Liquid crystal module 1 of COF structure shown in Figure 1, FPC30 is connected with the end of liquid crystal panel 2, and liquid crystal drive IC100 is installed on the surface of FPC30.And, will drive signal by means of FPC30 and output to the liquid crystal panel 2 with IC100 from this liquid crystal drive, can carry out image in the liquid crystal panel 2 and show.

[Wiring pattern]

Fig. 2 is the key diagram of the Wiring pattern of embodiment, is that the distribution of FPC forms enlarged drawing partly.In addition, Fig. 2 (a) is the section plan of the B-B line of Fig. 2 (b), and Fig. 2 (b) is the side cut away view of the A-A line of Fig. 2 (a).Shown in Fig. 2 (b), the formation of the Wiring pattern of present embodiment is that the electric distribution 32 of lower floor and the electric distribution 36 on upper strata are stacked by means of interlayer dielectric 54, are connected by conduction column 34 conductings simultaneously.In addition, below Shuo Ming Wiring pattern is nothing but an example, and the present invention can also be applicable to Wiring pattern in addition.

Shown in Fig. 2 (b), FPC30 has by what polyimides etc. constituted has a flexual film substrate 31.On the surface of this film substrate 31, form underlying insulation film 51.This underlying insulation film 51 is by constituting with the electrical insulating property material as principal component such as the ultraviolet curing resin of acrylic acid etc.In addition, this underlying insulation film 51 also can be made of the electrical insulating property material of thermohardening type resins such as ultraviolet curing resin that mixes acrylic acid etc. and epoxy.

On the surface of this underlying insulation film 51, be formed with a plurality of electric distributions 32.This Wiring pattern 32 by conductive materials such as Ag form fixed pattern.In addition, be formed with dielectric film 52 in the layer in the non-formation zone of the electric distribution 32 on the surface of underlying insulation film 51.And, by adopting drop described later ejection mode, the line * spacing of electric distribution 32 can miniaturization to for example degree of 30 μ m * 30 μ m.

In addition, form interlayer dielectric 54 like that according to the electric distribution 32 of main covering.This interlayer dielectric 54 is made of same resin material with underlying insulation film 51.And, connect interlayer dielectric 54 according to the top, edge from the part of electric distribution 32 and be formed with the quite conduction column 34 of height like that.This conduction column 34 forms cylindric by the conductive material of Ag identical with electric distribution 32 etc.If illustrate, the thickness of electric distribution 32 is about 2 μ m, and then the height of conduction column 34 just is formed with about 8 μ m.

On the surface of this interlayer dielectric 54, be formed with the electric distribution 36 of layer.This upper strata electricity distribution 36 and lower floor electricity distribution 32 equally also are made of the conductive material of Ag etc.In addition, shown in Fig. 2 (a), upper strata electricity distribution 36 also can with lower floor's electricity distribution 32 cross-over configuration.And upper strata electricity distribution 36 is connected with the upper end of conduction column 34, guarantees the conducting with lower floor's electricity distribution 32.

In addition, shown in Fig. 2 (b), in the non-formation zone of the electric distribution 36 on the surface of interlayer dielectric 54, be formed with dielectric film 56 in the layer.In addition, be formed with diaphragm 58 like that according to the electric distribution 36 of main covering.Dielectric film 56 and diaphragm 58 are by constituting with the same resin material of underlying insulation film 51 in this layer.

More than be that example is illustrated with the Wiring pattern that possesses 2 layers of electric distribution 32,36, but also can be the Wiring pattern that possesses the electric distribution more than 3 layers.Under this situation, as long as just passable to the same formation of the structure of the 2nd layer electric distribution 36 from the electric distribution of electric distribution to the n+1 layer of n layer with electric distribution 32 from the 1st layer.

[the formation method of Wiring pattern]

The formation method of the Wiring pattern of the 1st embodiment below is described.

Fig. 3 is the activity list of formation method of the Wiring pattern of the 1st embodiment.The order of the number of steps on following left end hurdle according to Fig. 3, the limit illustrates each operation with reference to Fig. 2 (b) limit.

At first, the surface (step 1) of the film substrate 31 shown in washing Fig. 2 (b).Specifically, the excimers UV with wavelength 172nm shone the surface of film substrate 31 about 300 seconds.In addition, both can also can use ultrasonic washing with water equal solvent washing film substrate 31.In addition, can also under normal pressure, wash with plasma irradiation film substrate 31.

Then, as the prerequisite that on the surface of film substrate 31, forms underlying insulation film 51, describe to form the dykes and dams (periphery) (step 2) of underlying insulation film 51.This describes to be undertaken by drop ejection mode (ink-jetting style).That is to say, will be with droplet ejection apparatus described later as the periphery ejection of the resin material before the curing of the formation material of underlying insulation film 51 along the formation zone of underlying insulation film 51.

Then, make the resin material of ejection solidify (step 3).Specifically, the UV of illumination wavelength 365nm makes the UV gel-type resin curing as the formation material of underlying insulation film 51 about about 4 seconds.By this, the periphery in the formation zone of underlying insulation film 51 forms dykes and dams.

Then, describe to form underlying insulation film 51 (step 4) in the inboard of the dykes and dams that form.This describes also to be undertaken by drop ejection mode.Specifically, with whole inboards of the droplet discharging head of droplet ejection apparatus described later scanning dykes and dams, simultaneously from the resin material of this droplet discharging head ejection before as the curing of the formation material of underlying insulation film 51.Here, even the resin material of ejection flows,, expand so can not surmount the formation zone of underlying insulation film 51 owing to can stop with the dykes and dams of periphery.

Then, make the resin material of ejection solidify (step 5).Specifically, the UV of illumination wavelength 365nm makes the UV gel-type resin curing as the formation material of underlying insulation film 51 about about 60 seconds.By this, on the surface of film substrate 31, form underlying insulation film 51.

Then, as the prerequisite that on the surface of underlying insulation film 51, forms electric distribution 32, adjust the contact angle (step 6) on the surface of underlying insulation film 51.As described below, ejection contains under the situation of drop of formation material of electric distribution 32, and when excessive, the drop of ejection becomes pearl, is difficult to form at institute's allocation the electric distribution of the shape that formalizes with the contact angle on the surface of underlying insulation film 51.On the other hand, when too small, the expansion of the droplets wet of ejection is difficult to make electric distribution miniaturization with the surface contact angle of underlying insulation film 51.Because the surface of the underlying insulation film 51 that solidifies is lyophobicity, so shine about its surperficial 15 seconds by the excimers UV with wavelength 172nm, can adjust the contact angle on the surface of underlying insulation film 51.The degree of the mitigation of lyophobicity can be with the irradiation time adjustment of ultraviolet light, also can by with adjustment such as ultraviolet light intensity, wavelength, heat treatment (heating) combine.In addition, can enumerate oxygen as the plasma treatment of reacting gas or make the processing of exposure of substrates in ozone atmosphere etc. as other method of lyophily processing.

Then, on the surface of underlying insulation film 51, describe to form the aqueous line 32p (step 7) that will become electric distribution described later.This describes to be undertaken by the drop ejection mode of using droplet ejection apparatus described later.Here ejection be the dispersion liquid that will be distributed to as the conductive particle of the formation material of electric distribution in the dispersant.Preferably use silver as this conductive particle.Beyond the desilver, except that any the metal microparticle that contains gold, copper, palladium, nickel, also can use the particulate of electric conductive polymer or superconductor etc.

Electroconductive particle also can dispersed use at its surface applied organic matter etc. for improving.As the coating material that on the surface of conductive particle, applies, for example can enumerate the polymer that brings out steric hindrance or Coulomb repulsion and so on.In addition, the particle diameter of conductive particle preferably 5nm above, below the 0.1 μ m.This is because when bigger than 0.1 μ m, cause easily nozzle bore stop up, by the droplet discharging head ejection difficulty that becomes.This is because than 5nm hour in addition, increases with respect to the volume ratio of the coating agent of conductive particle, and the organic ratio in the electric conductor that obtains is too much.

As the dispersant that uses so long as can disperse above-mentioned conductive particle, cohesion does not take place just not do special qualification, beyond dewatering, can enumerate methyl alcohol, ethanol, propyl alcohol, alcohols such as butanols, normal heptane, normal octane, decane, toluene, dimethylbenzene, isopropyl toluene, durene, indenes, dipentene, tetrahydronaphthalene, decahydronaphthalenes, the hydrocarbon compound of cyclohexyl benzene etc., glycol dimethyl ether in addition, ethylene glycol diethyl ether, the Ethylene Glycol Methyl ethylether, diethylene glycol dimethyl ether, diethyl carbitol, the diethylene glycol (DEG) methyl ethyl ether, 1, the 2-dimethoxy-ethane, the ether compound of two (2-methoxy ethyl) ether Dui diox etc., and propene carbonate, gamma-butyrolacton, the N-N-methyl-2-2-pyrrolidone N-, dimethyl formamide, methyl-sulfoxide, the polar compound of cyclohexanone etc.Wherein, from the stability of atomic dispersiveness and dispersion liquid and be applicable to the easiness of drop ejection mode, preferred water, alcohols, hydrocarbon compound, ether compound can be enumerated water, hydrocarbon compound as particularly preferred dispersant.These dispersants both can use separately, and the mixture that perhaps also can form more than 2 kinds uses.

Be that 0.001mmHg is above, 200mmHg following (more than about 0.133Pa, below the 26600Pa) preferably as the dispersant vapour pressure at room temperature that contains the liquid of conductive particle.Vapour pressure is than under the high situation of 200mmHg, and ejection back dispersant sharply evaporates, and is difficult to form the favorable conductive body.In addition, more preferably the vapour pressure of dispersant at (more than about 0.133Pa, below the 6650Pa) more than the 0.001mmHg, below the 50mmHg.This be because, vapour pressure takes place to be difficult to stably spray because of the spray nozzle clogging that drying produces when spraying drop in drop ejection mode under the high situation of 50mmHg easily.On the other hand, dry slow under the situation of the dispersant that the vapour pressure under the room temperature is lower than 0.001mmHg, easy residual dispersant in the electric conductor is difficult to obtain the electric conductor of good matter after the heat of back step operation and/or light are handled.

The dispersate concentration that above-mentioned conductive particle is distributed under the situation in the dispersant is more than the 1 quality %, below the 80 quality %, can adjust according to the desirable thickness of electric conductor.Condense easily when surpassing 80 quality %, can not obtain the uniform conductive body.

In the scope of the surface tension of the dispersion liquid of preferred above-mentioned conductive particle more than 0.02N/m, below the 0.07N/m.This be because, when spraying with drop ejection mode that surface tension is lower than 0.02N/m when the liquid, wetability increase generation flight bending easily because of composition for ink with respect to nozzle face, when surpassing 0.07N/m, be difficult to control spray volume, ejection time because of the shape of the meniscus of spray nozzle front end is unstable.

For the adjustment form surface tension, in the scope that can appropriately reduce with the contact angle of underlying insulation film 51, surface tension modifier that can trace adds fluorine system, silicon system, nonionic system etc. in above-mentioned dispersion liquid.Nonionic is that surface tension modifier is of value to the wettability of underlying insulation film 51 and well changes, improves the leveling of film, the generation that prevents the granular substance of filming, the generation on shaddock shape surface etc.Even above-mentioned dispersion liquid contains the also not influence of organic compounds such as alcohol, ether, ester, ketone as required.

The viscosity of preferred above-mentioned dispersion liquid is more than the 1mpas, below the 50mPas.This be because, under the situation that ratio of viscosities 1mPas is little when spraying with drop ejection mode, nozzle periphery portion is contaminated easily because of the outflow of ink, in addition under the situation that ratio of viscosities 50mPas is big, because of the increase frequency of the obstruction of nozzle bore, the slick and sly drop of the ejection difficulty that becomes.

In the present embodiment, the drop (the 1st drop) that sprays above-mentioned dispersion liquid from droplet discharging head drips in the place that needs form electric distribution.At this moment, preferably, hydrops (expansion) adjusts the overlapping degree of the drop of continuous ejection like that so that not taking place.Particularly preferred employing a plurality of drops in the 1st ejection are not connected to each other like that at interval and spray, and are full of its such at interval jet method by the 2nd later ejection.

As mentioned above, on the surface of underlying insulation film 51, form aqueous line 32p.

Then, carry out (the step 8) of burning till of aqueous line 32p.Specifically, will form the film substrate 31 of aqueous line 32p heating on 150 ℃ the heating plate about 30 minutes.This burns till processing and carries out in common atmosphere, but also can carry out in the inert gas atmosphere of nitrogen, argon gas, helium etc. as required.In addition, the treatment temperature of formally burning till is taken as 150 ℃, but having or not with the heat resisting temperature of quantity, matrix material etc. of the thermal behavior of the kind of the preferred boiling point (vapour pressure) of considering dispersant contained among the aqueous line 32p, atmosphere and pressure, atomic dispersiveness and oxidisability etc., coating material set suitably.

Like this burn till processing, except processing, also can be undertaken by lamp annealing by common heating plate, electric furnace etc.Do not do special qualification as the anneal light source of employed light of lamp, can use as light source with excimer laser of infrared lamp, xenon lamp, YAG laser, argon laser, carbon dioxide laser, XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl etc. etc.These light sources generally use in the scope more than output 10W, below the 5000W, but are sufficient in the scope that 100W is above in the present embodiment, 1000W is following.

By as above-mentioned burn till processing, the dispersant that contains among aqueous line 32p volatilization to guarantee electrically contacting between conductive particle, forms electric distribution 32.

Then, describe to form the aqueous post 34p (step 9) that will become the aftermentioned conduction column in the end of the electric distribution 32 that burns till.This describe with the aqueous line 32p of step 7 describe equally, undertaken by the drop ejection mode of using droplet ejection apparatus described later.Here ejection be to be distributed to the drop (the 2nd drop) of the dispersion liquid in the dispersant as the conductive particle of the formation material of conduction column 34, specifically, the aqueous body of describing usefulness with aqueous line 32p is identical.That is, as long as after describing aqueous line 32p, use the identical droplet discharging head of filling identical aqueous body to spray the 2nd drop in the formation position of conduction column 34.

But the volume of the 1st drop from the volume ratio of the 2nd drop of the droplet discharging head ejection that is used to describe to form aqueous post 34p from the droplet discharging head ejection that is used to describe to form aqueous line 32p is big.If illustrate, then the volume of the 1st drop is about 3pl, and the volume of the 2nd drop is exactly about 15pl.Specifically, be used to spray the 1st signal of telecommunication of the droplet discharging head of the 1st drop by making input, the 2nd signal of telecommunication of droplet discharging head that is used to spray the 2nd drop with input is different, just can make the volume of volume ratio the 1st drop of the 2nd drop big.

Fig. 4 is the figure that is input to the example of the signal of telecommunication on the piezoelectric element of droplet discharging head.Below with Fig. 4 the principle of 3 kinds of drops that ejection tiny dots, mid point, a little bigger volume are different is described.In Fig. 4, drive waveforms [A] is to generate the basic waveform that drives signal generating circuit.

Waveform [B] forms with the Part1 of basic waveform, be used to shake near the tackify meniscus (surface of the aqueous body in the nozzle), the divergent nozzle opening aqueous body, prevent that small drop ejection is bad in possible trouble.B1 is the state of meniscus static determinacy.In addition the B2 volume representing to make piezoelectric element slowly charge, expand aqueous body chamber (ink chamber), make the meniscus action in the indentation nozzle a little.

Waveform [C] forms with the Part2 of basic waveform, is the waveform of the drop of ejection tiny dots.At first, make the piezoelectric element charging sharp from the state (C1) of static determinacy, in the quick indentation nozzle of meniscus.Then, when refilling the time that begins to vibrate on the direction of nozzle with meniscus an indentation, make aqueous body chamber dwindle (C3) a little, the drop of tiny dots circles in the air.The effect of the form of circling in the air of control drop when in addition, suspending the 2nd discharge (C4) performance after the discharge in the way and make the residual signal vibration damping of meniscus after the ejection action and piezoelectric element.

Waveform [D] forms with the Part3 of basic waveform, is the waveform of the drop of ejection mid point.At first, the state (D1) from static determinacy gently makes meniscus indentation significantly (D2).Then, in the time of with time of the direction that refills nozzle towards meniscus, shrink aqueous body chamber (D3) sharp, the drop of ejection mid point.In addition, in D4,, can make the residual vibration vibration damping of meniscus and piezoelectric element to the piezoelectric element charge/discharge.

The Part2 of waveform [E] combination basic waveform and Part3 and form are the waveforms that is used to spray a little bigger drop.At first, the drop of ejection point in the process of expression E1, E2, E3.Then, when the vibration of residual a little meniscus is with time of being full of with liquid in the nozzle after the point ejection, the waveform of ejection mid point is applied on the piezoelectric element.The drop that sprays in the process of E4, E5 has the volume bigger than mid point, lumps together with the drop of the point of front and forms a little bigger drop again.

Here, if compare waveform C and waveform D, the absolute value of the rate of change of the signal of telecommunication of drop when ejection (during piezoelectric element discharges) input droplet discharging head (with transverse axis as the time, with the gradient of the longitudinal axis as the signal of telecommunication figure under the voltage condition) is big more, and the volume of the drop of ejection is also just big more.In addition, the signal of telecommunication the when drop as waveform D sprays does not change under the situation of time-out portion, compares with the situation that change time-out portion (C3) is arranged as waveform C, and the volume of the drop of its ejection increases.In addition, the variation (height of the sloping portion of signal of telecommunication figure) of the signal of telecommunication during the drop ejection is big more, and the volume of the drop of ejection is big more.On the other hand, shown in waveform E, when spraying drop in the time of with meniscus vibration, the volume of ejection drop increases.That is to say, give attraction (charging) signal, the volume of the drop of ejection is increased meniscus being full of to spray in the time of vibrating on the direction of nozzle (discharge) signal to give droplet discharging head or make in time in the meniscus indentation nozzle.

Therefore, if the absolute value of the rate of change of the signal of telecommunication when making the 2nd signal that is input to the droplet discharging head that is used to spray the 2nd drop of describing aqueous post with respect to the drop ejection of the 1st signal that is input to the droplet discharging head that is used to spray the 1st drop of describing aqueous line greatly.In addition, also can make the change time-out portion of the big or signal of telecommunication when abolishing the drop ejection of the variation of the signal of telecommunication in drop when ejection.In addition, ejection drop in the time of also can be with meniscus vibration.In addition, both can adopt in them any, also can adopt several simultaneously.By this, it is big to make the volume ratio of the 2nd drop of describing aqueous post describe the volume of the 1st drop of aqueous line.

As mentioned above, conduction column need form quite height.Therefore, need spray a plurality of drops by drop ejection mode also piles up to form the quite aqueous post of height.In the present embodiment, owing to make from the volume of the 2nd drop of the droplet discharging head ejection that is used to describe to form aqueous post, volume than the 1st drop that is used to describe aqueous line is big, so can describe to form the quite aqueous post of height at short notice with the drop of minority relatively.

Fig. 5 represents that time per unit is used to spray the figure of example of the signal of telecommunication of many drops.In the waveform [F] of Fig. 5, F1 is applied to state on the piezoelectric element and static determinacy with intermediate potential.Make meniscus indentation nozzle interior (F2) sharp when therefore piezoelectric element is recharged.When meniscus was full of on the direction of nozzle time with vibration again, piezoelectric element was dynamically extended, and along with shrink the aqueous body of the action of piezoelectric element chamber, it is meniscus outstanding (F3) and ejection drop as a result.In the time of the residual vibration vibration damping that makes meniscus and piezoelectric element, recharge in addition until intermediate potential (F4).Like this, by the vibration and the excitation of quick repetition meniscus, can be with short cycle ejection drop.

Therefore, also can repeat to attract signal and ejection signal fast from middle current potential simultaneously about the 2nd signal of telecommunication that is used to describe the 2nd signal of telecommunication of aqueous post and/or is used to describe aqueous line according to vibration with meniscus.By this, can shorten and describe the time with short cycle ejection drop.

In addition, in above-mentioned steps 9, spray a plurality of drops and pile up the quite aqueous post 34p of height of formation shown in Fig. 2 (b) by drop ejection mode.But even once spray a plurality of drops, the height of guaranteeing aqueous post 34p also is difficult, worries the increasing diameter conference of aqueous post 34p and the electric distribution and the conduction column short circuit of adjacency on the contrary.Therefore, also the drop ejection can be divided into repeatedly, repeat the drop ejection and the interim drying of minority.Like this, if the new drop of the interim dry back ejection of Pen Chu drop formerly, owing to new drop would not be expanded on the surface of underlying insulation film 51, so just can make aqueous post 34p form quite height (with reference to the 2nd embodiment).

Above-mentioned interim drying carry out the dry tack free of minority drop of ejection at least.Specifically, blow the dry-air blast of low air of humidity and inert gas etc. towards the drop of ejection.The temperature of dry-air blast both can be normal temperature (about 25 ℃), also can be high temperature.Also can replace drying up wind with the drop of infrared radiation ejection in addition with infrared lamp etc.Like this, dry up wind or irradiation infrared ray, just can carry out interim drying, so can the suppression equipment cost and the rising of manufacturing cost by simple manufacturing equipment and manufacturing process owing to adopt.In addition, even because of interim drying temperature rises temporarily, owing to can return to normal temperature immediately, so can shorten manufacturing time.

Then, turn back to Fig. 2 (b), burn till the aqueous post 34p (step 10) of describing to form.Specifically, will form the film substrate 31 of aqueous line 32p and aqueous post 34p heating on 150 ℃ the heating plate about 30 minutes.By this, the dispersant volatilization that contains among the aqueous post 34p to guarantee electrically contacting between conductive particle, forms conduction column 34.

In addition, also can in step 7, make the aqueous line 32p that describes to form carry out the interim dry processing of burning till that replaces step 8 of handling, in step 9, describe to form aqueous post 34p in its end.Under this situation, with the aqueous line 32p and the aqueous post 34p that interim drying regime is burnt till in processing in the lump that burn till of step 10.By this, can improve the connecting airtight property of electric distribution 32 and conduction column 34.In addition, owing to burn till in the lump at last all, manufacturing process is simplified.

Then, as the prerequisite that on the formation layer of electric distribution 32, forms dielectric film 52 in the layer, adjust the contact angle (step 11) on the surface of underlying insulation film 51.Because the surface of the underlying insulation film 51 that solidifies is lyophobicity, so in order to give its surface, with the excimers UV irradiation of wavelength 172nm about 60 seconds with lyophily.

Then, describing to form dielectric film 52 (step 12) in the layer around the electric distribution 32.This describe also with underlying insulation film 51 describe carry out with droplet ejection apparatus equally.Here, at first around conduction column 34 and electric distribution 32, vacate the gap, at its outside ejection resin material.Be because when contact the resin material of formation material that sprays like that as dielectric film 52 in the layer with conduction column 34, the worry resin material is moistening to be risen to the upper end of conduction column 34 and can not be connected with electric distribution 36 conductings in upper strata.

Then, in about 10 seconds of excimers UV of the gap internal radiation wavelength 172nm around conduction column 34 and electric distribution 32, implement lyophily and handle (step 13).Like this, since give conduction column 34 and electric distribution 32 around the gap with lyophily, so resin material in this Clearance Flow, contacts with electric distribution 32 with conduction column 34.Under this situation, resin material is moistening to be risen on the surface of electric distribution 32, but the not moistening upper end that rises to conduction column 34.Therefore, can guarantee the conducting of the electric distribution 36 on conduction column 34 and upper strata.

And, make the resin material of ejection solidify (step 14).Specifically, the UV of illumination wavelength 365nm solidifies the UV gel-type resin as the formation material of dielectric film 52 in the layer about about 4 seconds.By this, form dielectric film 52 in the layer.

Then, mainly on the surface of electric distribution 32, describe to form interlayer dielectric 54 (step 15).This describe also with underlying insulation film 51 describe carry out with droplet ejection apparatus equally.Here also preferably around conduction column 34, vacate gap, ejection resin material.

Then, make the resin material of ejection solidify (step 15).Specifically, the UV of illumination wavelength 365nm makes the UV gel-type resin curing as the formation material of interlayer dielectric 54 about about 60 seconds.By this, form interlayer dielectric 54.

Then, on the surface of interlayer dielectric 54, form the electric distribution 36 on upper strata.Its concrete method is identical with the step 6～step 10 that is used to form lower floor's electricity distribution 32.

Then, on the formation layer of electric distribution 36, form dielectric film 56 in the layer.Its concrete method is identical with the step 11～step 14 that is used on the formation layer of electric distribution 32 forming dielectric film 52 in the layer.In addition, if carry out step 15 and step 16, just can on the surface of upper strata electricity distribution 36, form interlayer dielectric.

Like this, just can laminated configuration electricity distribution by repeating step 6～step 16.In addition, just can on the surface of the electric distribution of the superiors, form diaphragm 58 as long as use with the same method of step 15 and step 16.

According to more than, can form the Wiring pattern of present embodiment shown in Figure 2.

As mentioned above, the formation of the formation method of the Wiring pattern of present embodiment is, have: ejection contains the 1st drop of the formation material of electric distribution, the operation (step 7,8) that forms electric distribution and ejection and contains the 2nd drop of the formation material of conduction column, the operation (step 9,10) of formation conduction column, and the volume of volume ratio the 1st drop of the 2nd drop is big.According to this formation,, can form the quite conduction column of height at short notice by spraying bulky the 2nd drop.Therefore, can realize the multiple stratification of Wiring pattern.On the other hand, by the 1st little drop of ejection volume, can form electric distribution in a narrow margin.Therefore, can realize the miniaturization of Wiring pattern.If illustrate, can make the width of the line * spacing of a plurality of electric distributions, reach to 30 μ m * 30 μ m from always 50 μ m * 50 μ m miniaturizations.

In addition, follow the miniaturization and the multiple stratification of Wiring pattern, make the FPC miniaturization become possibility, make and adopt electro-optical device and the electronic instrument miniaturization of this FPC also to become possibility.

In addition, in the formation method of the Wiring pattern of present embodiment,,, can reduce manufacturing cost so can improve the service efficiency of material owing to adopt drop ejection mode to form electric distribution and conduction column, various dielectric film.

In addition, in the present embodiment, be that example is illustrated, but also go for the present invention as the formation method of the Wiring pattern of hard substrate with the formation method of the Wiring pattern of FPC.In addition, in the present embodiment, to being illustrated under the situation that forms conduction column on the part of electric distribution, the situation that still forms conduction column on the electrode engagement face of electric distribution is also contained in the technical scope of the present invention.

(the 2nd embodiment)

Fig. 6 is the activity list of formation method of the Wiring pattern of the 2nd embodiment.In addition, Fig. 7 and Fig. 8 are the key diagrams of the formation method of the 2nd embodiment Wiring pattern.The order of the number of steps on following left end hurdle according to Fig. 6 illustrates each operation.In addition, because step 1～6 are identical with the 1st embodiment with step 11～16, so omit its explanation.At first, shown in Fig. 7 (a), on the surface of film substrate 31, form underlying insulation film 51.

Then, shown in Fig. 7 (b), describing to form on the surface of underlying insulation film 51 to become the aqueous line 32p (step 7a) of electric distribution later on.This describes to be undertaken by the drop ejection mode of using droplet ejection apparatus described later.Here ejection be the dispersion liquid that will be distributed to as the conductive particle of the formation material of electric distribution in the dispersant.Preferably use silver as this conductive particle.Beyond the desilver, except that any the metal microparticle that contains gold, copper, palladium, nickel, also can use the particulate of electric conductive polymer and superconductor etc.

Electroconductive particle also can use at its surface applied organic matter for improving dispersiveness.As the coating material that on the surface of conductive particle, applies, for example can enumerate the polymer that brings out steric hindrance or Coulomb repulsion and so on.In addition, the particle diameter of conductive particle preferably 5nm above, below the 0.1 μ m.This is because when bigger than 0.1 μ m, cause easily nozzle bore stop up, by the droplet discharging head ejection difficulty that becomes.This is because than 5nm hour in addition, increases with respect to the volume ratio of the coating agent of conductive particle, and the organic ratio in the electric conductor that obtains is too much.

As the dispersant that uses so long as can disperse above-mentioned conductive particle, cohesion does not take place just not do special qualification, beyond dewatering, can enumerate the hydrocarbon compound of alcohols such as methyl alcohol, ethanol, propyl alcohol, butanols, normal heptane, normal octane, decane, toluene, dimethylbenzene, isopropyl toluene, durene, indenes, dipentene, tetrahydronaphthalene, decahydronaphthalenes, cyclohexyl benzene etc.; Perhaps glycol dimethyl ether, ethylene glycol diethyl ether, Ethylene Glycol Methyl ethylether, diethylene glycol dimethyl ether, diethyl carbitol, diethylene glycol (DEG) methyl ethyl ether, 1, the polar compound of the ether compound of 2-dimethoxy-ethane, two (2-methoxy ethyl) ether, Dui diox etc. and propene carbonate, gamma-butyrolacton, N-N-methyl-2-2-pyrrolidone N-, dimethyl formamide, methyl-sulfoxide, cyclohexanone etc.Wherein, from the stability of atomic dispersiveness and dispersion liquid and be applicable to the easness of drop ejection mode, preferred water, alcohols, hydrocarbon compound, ether compound can be enumerated water, hydrocarbon compound as particularly preferred dispersant.These dispersants both can use separately, and the mixture that perhaps also can form more than 2 kinds uses.

Be that 0.001mmHg is above, 200mmHg following (more than about 0.133Pa, below the 26600Pa) preferably as the dispersant vapour pressure at room temperature that contains the liquid of conductive particle.Vapour pressure is than under the high situation of 200mmHg, and ejection back dispersant sharply evaporates, and is difficult to form the favorable conductive body.

In addition, more preferably the vapour pressure of dispersant at (more than about 0.133Pa, below the 6650Pa) more than the 0.001mmHg, below the 50mmHg.This be because, vapour pressure takes place to be difficult to stably spray because of the spray nozzle clogging that drying produces when spraying drop in drop ejection mode under the high situation of 50mmHg easily.On the other hand, dry slow under the situation of the dispersant that the vapour pressure under the room temperature is lower than 0.001mmHg, easy residual dispersant in the electric conductor is difficult to obtain the electric conductor of good matter after the heat of back step operation and/or light are handled.

In the scope of the surface tension of the dispersion liquid of preferred above-mentioned conductive particle more than 0.02N/m, below the 0.07N/m.This be because, when spraying with drop ejection mode that surface tension is lower than 0.02N/m when the liquid, wetability increase generation flight bending easily because of composition for ink with respect to nozzle face, and when surpassing 0.07N/m, be difficult to control spray volume, ejection time because of the shape of the meniscus of spray nozzle front end is unstable.

For the adjustment form surface tension, in the scope that can reduce rightly with the contact angle of underlying insulation film 51, surface tension modifier that can trace adds fluorine system, silicon system, nonionic system etc. in above-mentioned dispersion liquid.Nonionic is that surface tension modifier is of value to the wettability of underlying insulation film 51 and well changes, improves the leveling of film, the generation that prevents the granular substance of filming, the generation on shaddock shape surface etc.Even above-mentioned dispersion liquid contains the also not influence of organic compounds such as alcohol, ether, ester, ketone as required.

In the present embodiment, the drop (the 1st drop) that sprays above-mentioned dispersion liquid from droplet discharging head drips in the place that needs form electric distribution.At this moment, preferably, hydrops (expansion) adjusts the overlapping degree of the drop of continuous ejection like that so that not taking place.Particularly preferred the employing at interval and ejection make that a plurality of drops are not connected to each other in the 1st ejection, are full of its such at interval jet method by the 2nd later ejection.

Then, interim dry aqueous line 32p (step 7b).This interim drying carry out the dry tack free of aqueous at least line 32p.Specifically, blow the dry-air blast of low air of humidity or inert gas etc. towards aqueous line 32p.The temperature of dry-air blast both can be normal temperature (about 25 ℃), also can be high temperature.Also can dry up wind in addition, with the aqueous line 32p of infrared radiation with replacements such as infrared lamps.Like this, dry up wind or irradiation infrared ray, just can carry out interim drying, so can the suppression equipment cost and the rising of manufacturing cost by simple manufacturing equipment and manufacturing process owing to adopt as interim dry concrete grammar.In addition, even because of interim drying temperature rises temporarily, owing to can return to normal temperature immediately, so can shorten manufacturing time.

Then, shown in Fig. 7 (c), on the part of dry temporarily aqueous line 32p, describe to form the aqueous sub-post 34a (step 8a) that will become conduction column.This describe with the aqueous line 32p of step 7a describe equally, undertaken by the drop ejection mode of using droplet ejection apparatus described later.Here ejection be to be distributed to the drop (the 2nd drop) of the dispersion liquid in the dispersant as the conductive particle of the formation material of conduction column, specifically, the drop (the 1st drop) of the aqueous body used with describing aqueous line 32p is identical.That is to say, describe aqueous line 32p after, as long as spray aqueous body in the formation position of conduction column with identical droplet discharging head.

As mentioned above, conduction column need form quite height.Therefore, need spray a plurality of drops and pile up formation aqueous post quite highly by drop ejection mode.But, even once spray a plurality of drops, also be difficult to guarantee the height of aqueous post, worry the increasing diameter conference of aqueous post and the electric distribution and the conduction column short circuit of adjacency on the contrary.Therefore, drop ejection is divided into repeatedly carries out.And, in its drop ejection once, form the low aqueous sub-post of height than the aqueous post that needs.For example, once spray the drop about 10, describe to form the 1st layer aqueous sub-post 34a earlier.

Then, interim dry aqueous sub-post 34a (step 8b).This interim drying carry out the dry tack free of aqueous at least sub-post 34a.As method more specifically, identical with the method for interim dry aqueous line in step 7b, the preferred employing dries up wind or irradiation infrared ray.

Repeat step 8a and step 8b (step 9) thereafter.As mentioned above, owing to make the 1st layer aqueous sub-post 34a dry temporarily, so, on the surface of underlying insulation film 51, can not expand even spray new drop in its surface yet.Therefore, if newly spray drop about 10, shown in Fig. 8 (a), can be above the 1st layer of aqueous sub-post 34a the aqueous sub-post 34b of the 2nd layer of stacked formation.Like this, by repeating step 8a and step 8b, stacked a plurality of

aqueous sub-post

34a, 34b, 34c just can form the quite aqueous post 34p of height.

That then, carries out aqueous line 32p and aqueous post 34p formally burns till (step 10).By above-mentioned, because aqueous line 32p and

aqueous sub-post

34a, 34b, 34c form with interim dry status, so its integral body formally can be burnt till in the lump.Specifically, carried out in about 30 minutes in heating on 150 ℃ the heating plate by the film substrate 31 that aqueous line 32p and aqueous post 34p are formed.

This burns till in common atmosphere and carries out, but also can carry out in the inert gas atmosphere of nitrogen, argon gas, helium etc. as required.In addition, the treatment temperature of formally burning till is taken as 150 ℃, but having or not with the heat resisting temperature of quantity, matrix material etc. of the thermal behavior of the kind of the preferred boiling point (vapour pressure) of considering dispersant contained among aqueous line 32p and the aqueous post 34p, atmosphere and pressure, atomic dispersiveness and oxidisability etc., coating material set suitably.

Like this burn till processing, except processing, also can be undertaken by lamp annealing by common heating plate, electric furnace.Do not do special qualification as the anneal light source of employed light of lamp, can use as light source with excimer laser of infrared lamp, xenon lamp, YAG laser, argon laser, carbon dioxide laser, XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl etc. etc.These light sources generally use in the scope more than output 10W, below the 5000W, are sufficient in the scope that 100W is above in the present embodiment, 1000W is following.

By so formally burning till, the dispersant volatilization that contains among aqueous line 32p and the aqueous post 34p can be guaranteed electrically contacting between conductive particle.By this, shown in Fig. 8 (b), form electric distribution 32 and conduction column 34.

As mentioned above, the formation of the formation method of the Wiring pattern of present embodiment is to have: the operation (step 7a) of being described to form aqueous line by drop ejection mode; The operation (step 7b) on the surface of interim dry its aqueous line; On the part of aqueous line, describe to form the operation (step 8a) of aqueous post by drop ejection mode; With the operation (step 10) that aqueous line and aqueous post are formally burnt till.According to such formation, owing on the surface of the aqueous line of interim drying regime, describe to form aqueous post, so both are merged on the interface.In addition, by formally burning till aqueous line and aqueous post in the lump, electric distribution and conduction column are formed.By this, can prevent from the interface of electric distribution and conduction column, crackle to take place, can form the good Wiring pattern of reliability that conducting connects.

In addition, the formation of the formation method of the Wiring pattern of present embodiment is to have: the operation (step 8a) of being described to form aqueous sub-post by drop ejection mode; The operation (step 8b) of interim dry this aqueous sub-post; Repeat the operation (step 9) of step 8a and step 8b; Formally burn till the operation (step 10) of the aqueous sub-post of laminated configuration.According to this formation, owing to repeat,, just can make aqueous sub-post laminated configuration so the drop of ejection can moistening in the plane expansion by the forming and its interim drying of the aqueous sub-post of drop ejection.And, by formally burning till aqueous sub-post in the lump, just can form the quite conduction column of height with interim dry status laminated configuration.

In addition, in the formation method of the Wiring pattern of present embodiment,,, reduce manufacturing cost so can improve the service efficiency of material owing to adopt drop ejection mode to form electric distribution and conduction column, various dielectric film.In addition, can make electric distribution multiple stratification and miniaturization.If illustrate, can make the width of the line * spacing of a plurality of electric distributions, reach to 30 μ m * 30 μ m from always 50 μ m * 50 μ m miniaturizations.By this, make the FPC miniaturization become possibility, make and adopt electro-optical device and the electronic instrument miniaturization of this FPC also to become possibility.

In addition, in the present embodiment, be that example is illustrated, but also go for the present invention as the formation method of the Wiring pattern of hard substrate with the formation method of the Wiring pattern of FPC.In addition, in the present embodiment, to being illustrated under the situation that forms conduction column on the electric distribution, the situation that still forms conduction column on the electrode engagement face of electric distribution is also contained in the technical scope of the present invention.

(droplet ejection apparatus)

Below spray the droplet ejection apparatus of mode with drop with Fig. 9 and Figure 10 explanation.

Fig. 9 is the stereogram of droplet ejection apparatus.In Fig. 9, directions X is the left and right directions on basis 12, and the Y direction is a fore-and-aft direction, and the Z direction is an above-below direction.Droplet ejection apparatus 10 constitutes based on the platform 46 of droplet discharging head (being designated hereinafter simply as ink gun) 20 and mounting substrate 31.In addition, the action of droplet ejection apparatus 10 is by control device 23 controls.

The platform 46 of mounting substrate 31 can be moved and locatees along the Y direction by the 1st mobile device 14, by motor 44 along θ _zDirection is shaken and is located.On the other hand, ink gun 20 can be moved and locatees along directions X by the 2nd mobile device, is moved and locatees along the Z direction by linear motor 62.Ink gun 20 is shaken and locatees along α, β, γ direction respectively by motor 64,66,68 in addition.By this, droplet ejection apparatus 10 can correctly be controlled the relative position and the posture of the ink ejection face 20P and the substrate 31 on the platform 46 of ink gun 20.

The structure example of ink gun 20 is described with reference to Figure 10 here.Figure 10 is the side cut away view of droplet discharging head.Ink gun 20 usefulness drops ejection mode is from nozzle 91 ejection inks 21.The known various technology such as mode that can use piezoelectricity mode or heating ink as piezoelectric element to spray ink by the bubble (foaming) that produces as drop ejection mode with piezoelectric element ejection ink.Wherein, because the piezoelectricity mode can not make the ink gain of heat, do not give material and form advantage with influence etc. so have.Therefore, the ink gun 20 for Figure 10 adopts above-mentioned piezoelectricity mode.

On the ink gun main body 90 of ink gun 20, form reservoir 95 and by a plurality of ink chamber 93 of reservoir 95 differences.Reservoir 95 is formed for supplying with the stream of each ink chamber 93 with ink.In addition, the nozzle plate that constitutes ink ejection face is installed on the lower surface of ink gun main body 90.On this nozzle plate, a plurality of nozzles 91 of ejection ink and each ink chamber 93 are corresponding and opening mouth.And, form ink flow path towards the nozzle 91 of correspondence by each ink chamber 93.On the other hand, oscillating plate 94 is installed on the upper surface of ink gun main body 90.This oscillating plate 94 constitutes the wall of each ink chamber 93.Corresponding and be provided with piezoelectric element 92 in the outside of this oscillating plate 94 and each ink chamber 93.Piezoelectric element 92 is the elements with piezoelectrics such as pair of electrodes (not shown) clamping crystals.This pair of electrodes is being connected with drive circuit 99.

And, when drive circuit 99 is input to the signal of telecommunication on the piezoelectric element 92, piezoelectric element 92 dilatancies or contraction distortion.During piezoelectric element 92 contraction distortions, the pressure of ink chamber 93 reduces, and ink 21 flow into the ink chamber 93 from reservoir 95.In addition, during piezoelectric element 92 dilatancies, the pressure of ink chamber 93 increases, and ink 21 is from nozzle 91 ejections.In addition, apply voltage, can control the deflection of piezoelectric element 92 by change.In addition, apply the frequency of voltage, can control the deformation velocity of piezoelectric element 92 by change.That is to say,, just can control the ejection condition of ink 21 by the voltage that applies of control to piezoelectric element 92.

In addition, gland component 22 shown in Figure 9 is used for preventing that the ink of ink gun 20 from spraying the drying of face 20P, makes ink ejection face 20P carry out gland when ink discharge device 10 standbies.In addition, cleaning part 24 is used for removing the obstruction of the ink of ink gun 20, can attract the inside of nozzle.In addition, cleaning part 24 is used to remove the dirt of ink ejection face 20P, can carry out the CONTACT WITH FRICTION of ink ejection face 20P.

[electro-optical device]

In the present embodiment, be that example describes with the Wiring pattern that forms FPC.Therefore, turn back to Fig. 1, the Liquid crystal module as one of electro-optical device that adopts this FPC example is described.

Fig. 1 is the exploded perspective view of the Liquid crystal module of COF (chip on the Chip On Film film) structure.When roughly distinguishing Liquid crystal module 1, possess and colored show with liquid crystal panel 2, the FPC30 that is connected with liquid crystal board face 2 and be installed in liquid crystal drive IC100 on the FPC30.In addition, on liquid crystal panel 2, set up lighting device such as rear light and other subsidiary machine as required.

Liquid crystal panel 2 has by encapsulant 4 bonding a pair of substrate 5a and substrate 5b, encloses liquid crystal in the gap between this substrate 5a and substrate 5b, the so-called cell gap.In other words, liquid crystal by substrate 5a and substrate 5b clamping.Generally for example glass, synthetic resin etc. form by translucent material for these substrates 5a and substrate 5b.On the outer surface of substrate 5a and substrate 5b, pasting Polarizer.

In addition, the inner surface at substrate 5a forms electrode 7a, formation electrode 7b on the inner surface of substrate 5b.Indium tin oxide) etc. for example (Indiun Tin Oxide: translucent material forms by ITO for this electrode 7a, 7b.Substrate 5a has the extension that stretches out with respect to substrate 5b, is formed with a plurality of terminals 8 on this extension.When these terminals 8 form electrode 7a on substrate 5a and electrode 7a form simultaneously.Thereby these terminals 8 are for example formed by ITO.In these terminals 8, comprise terminal that extends integratedly by electrode 7a and the terminal that is connected with electrode 7b by means of conductive material (not shown).

On the other hand, on the surface of FPC30, use the formation method of the Wiring pattern of present embodiment to form Wiring pattern 39a, 39b.That is to say, form input Wiring pattern 39a towards central authorities, forming to export towards central authorities from the opposing party's minor face and using Wiring pattern 39b from the side's of FPC30 minor face.Forming electrode pad (not shown) in these inputs with the Wiring pattern 39a and the end of exporting with the center side of Wiring pattern 39b.

Liquid crystal drive IC100 is installed on the surface of this FPC30.Specifically, a plurality of pad electrodes that form on the active face of liquid crystal drive with IC100 are by means of ACF (AnisotropicConductive Film: anisotropic conductive film) 160 be connected in a plurality of electrode pads that form on the FPC30 surface.This ACF160 is by being dispersed in a plurality of conductive particles the bonding with forming in the resin of thermoplasticity or Thermocurable.Like this, by liquid crystal drive IC100 is installed, just can realize so-called COF structure on the surface of FPC30.

And, possess liquid crystal drive and be connected on the substrate 5a of liquid crystal panel 2 with the FPC30 of IC100.Specifically, the output of FPC30 is connected electrically on the terminal 8 of substrate 5a by means of ACF140 with distribution 39b.In addition, because FPC30 has pliability, so can realize save spaceization by fold comfortablely.

Above-mentioned such Liquid crystal module that constitutes 1 is imported liquid crystal drive IC100 with Wiring pattern 39a with signal by means of the input of FPC30.When carrying out like this, go out to drive signal with Wiring pattern 39b and output to the liquid crystal panel 2 with IC100 from liquid crystal drive by means of the input of FPC30.By this, carrying out image on liquid crystal panel 2 shows.

In addition, in electro-optical device of the present invention, change the refractive index of material and change the device of electrooptics effect of transmitance of light, also comprise the device that converts electric energy to luminous energy etc. except having with electric field.The present invention that is to say, even not only also can extensively be suitable for to liquid crystal indicator but also in the light-emitting device of the display unit (Field Emission Display and Surface-Conduction Electron-Emitter Display etc.) of organic EL (Electro-Lu minute escence) device and inorganic EL device, plasm display device, electrophoretic display apparatus, use electronic emission element etc. etc.For example, the FPC that possesses Wiring pattern of the present invention just is connected with organic EL panel and can constitutes organic el element.

[electronic instrument]

Below with Figure 11 the electronic instrument that the film forming method that uses present embodiment is made is described.Figure 11 is the stereogram of mobile phone.Among Figure 11, symbol 1000 expression mobile phones, symbol 1001 expression display parts.The display part 1001 of this mobile phone 1000 adopts the electro-optical device of the Wiring pattern that possesses present embodiment.Therefore, the good small-sized mobile phone 1000 of reliability of electrical connection can be provided.

The invention is not restricted to above-mentioned mobile phone, the image display device of the electronic instrument of suitable video tape recorder, automobile navigation apparatus, pager, electronic notebook, desk-top electronic calculator, word processor, work station, video telephone, POS terminal, touch panel etc. and using as e-book, personal computer, digital camera, LCD TV, detecting or monitoring direct viewing type, no matter under any situation, can provide the good small electronic apparatus of reliability of electrical connection.

Below, the application examples to multi-layered wiring board of the present invention is described.

Figure 12 is the side cut away view of 2 layers of distribution FPC.On the surface of the polyimide substrate 202 of this FPC, use photoetching etc. to form Cu Wiring pattern 208.ACF connects liquid crystal panel 204 on an end of this Cu Wiring pattern 208, by the soft solder reflowing connector 207 etc. has been installed in another end.In addition, on the surface of Cu Wiring pattern 208, by thermo-compressed COF drive unit IC206 has been installed by means of copper facing.In addition, the end at the Cu Wiring pattern 208 of the central portion of polyimide substrate 202 has been formed the conduction column 212 that is made of Al etc. by drop ejection mode.It is such to cover Cu Wiring pattern 208 simultaneously with the upper end of exposing this conduction column 212, has been formed the dielectric film 210 that is made of resin material etc. by drop ejection mode.On the surface of this dielectric film 210, form the installation composition surface 213 that constitutes by Al etc., copper facing 214 is implemented on this surface by drop ejection mode.And coating soft solder 216 has been installed chip element 218 by reflowing on the surface of this copper facing 214.Like this, form stacked wiring part, by plating processing simultaneously composition surface 213 and COF installation portion are installed simultaneously, can make 2 layers of distribution FPC effectively by drop ejection mode.

Figure 13 is the side cut away view of multilayer wired FPC.On the surface of the polyimide substrate 302 of this FPC, intersected laminated configuration dielectric film 310 and electric distribution 311.The electric distribution 311 that has connected levels by the conduction column 312 that connects dielectric film 310.And, composition surface 313 form to be installed on the surface of dielectric film, copper facing 314 is implemented on this surface, by soft solder reflowing etc. splicing ear 304, BGA/CSP305, chip part 306 and connector 307 etc. have been installed.In addition, all form, just can realize to install the multilayer wired FPC of electronic unit with the spacing of 50～100 μ m by drop ejection mode by above-mentioned dielectric film 310, electric distribution 314 and conduction column 312.

Figure 14 is the side cut away view of VHD assembly, and Figure 14 (a) is a minimal modules, and Figure 14 (b) is the thinnest assembly.

Even the assembly of Figure 14 (b), also can be with above-mentioned same laminated configuration electric distribution 502 and dielectric film 504.Here, LSI518, capacitor dielectric 520, resistance 524 and other passive component 522 have been installed on the electric distribution 502 in intermediate layer.And by forming dielectric film 504 by drop ejection mode, these passive components 522 are embedded in the inside of assembly.By this, can form the thinnest assembly.

In the assembly of Figure 14 (a), above-mentioned outside on assembly formation the composition surface is installed and W-CSP412 is installed and SiP414.This W-CSP412 is the electrode on configuring chip surface more to high-density.SiP can 3 dimensions install chip and encapsulation in addition.By this, can form minimum assembly.In addition, capacitor dielectric 420,520 and resistance 424,524 etc. also can be formed by drop ejection mode.

Figure 15 is the configuration example of having carried on the electronic instrument under the situation of above-mentioned multi-layered wiring board, is the exploded perspective view of image display device.Above-mentioned multi-layered wiring board 610 is configured in the inside of top framework 602 and bottom framework 604, has constituted display unit.

Figure 16 is a stereogram of directly describing the framework of Wiring pattern.Formation method with Wiring pattern of the present invention can directly be described Wiring pattern 710 at the inner face of framework 702.That is to say, describe metal material by drop ejection mode and form electric distribution and conduction column, in addition, describe (perhaps coating) by drop ejection mode and form dielectric film, by this, can directly form Wiring pattern 710 at the inner face of framework 702.By this, the part that can reduce electronic instrument is counted and manufacturing cost.

In addition, technical scope of the present invention does not limit the respective embodiments described above, in the scope that does not exceed aim of the present invention, comprises the content that the respective embodiments described above is increased all changes.That is to say that concrete material of enumerating and formation etc. are an example only in each embodiment.Can suitably change.

Claims

1. the formation method of a Wiring pattern is the method that forms that is made Wiring pattern that the mutual conducting of a plurality of electric distribution of laminated configuration connects by conduction column, it is characterized in that having:

Ejection contains the 1st drop of the formation material of above-mentioned electric distribution, the operation of the above-mentioned electric distribution of formation; Contain the 2nd drop of the formation material of above-mentioned conduction column, the operation of the above-mentioned conduction column of formation with ejection;

The volume of above-mentioned the 1st drop of the volume ratio of above-mentioned the 2nd drop is big.

2. the formation method of Wiring pattern according to claim 1 is characterized in that:

The 2nd signal of telecommunication and the input that input is used to spray the droplet ejection apparatus of above-mentioned the 2nd drop is used to spray the 1st signal of telecommunication of the droplet ejection apparatus of above-mentioned the 1st drop to be compared, and the variation of the signal of telecommunication during the drop ejection is big.

3. the formation method of Wiring pattern according to claim 1 is characterized in that:

The 2nd signal of telecommunication and the input that input is used to spray the droplet ejection apparatus of above-mentioned the 2nd drop is used to spray the 1st signal of telecommunication of the droplet ejection apparatus of above-mentioned the 1st drop to be compared, and the absolute value of the rate of change of the signal of telecommunication during the drop ejection is big.

4. the formation method of Wiring pattern according to claim 1 is characterized in that:

The 2nd signal of telecommunication that input is used to spray the droplet ejection apparatus of above-mentioned the 2nd drop has the change time-out portion of the signal of telecommunication when drop sprays.

5. the formation method of a Wiring pattern is the method that forms that is made Wiring pattern that the mutual conducting of a plurality of electric distribution of laminated configuration connects by conduction column, it is characterized in that having:

Ejection contain the constituent material of above-mentioned electric distribution the 1st drop, describe to form the operation of aqueous line;

The operation on the surface of interim dry above-mentioned aqueous line;

Ejection contain the constituent material of above-mentioned conduction column the 2nd drop, on above-mentioned aqueous line, describe to form the operation of aqueous post; With

Heat the operation of above-mentioned aqueous line and above-mentioned aqueous post, the above-mentioned electric distribution of formation and above-mentioned conduction column.

6. the formation method of Wiring pattern according to claim 5 is characterized in that:

In the operation that forms above-mentioned aqueous post, repeat the ejection and the interim drying of above-mentioned the 2nd drop, a plurality of aqueous sub-posts of stacked formation,

In the operation of above-mentioned aqueous line of heating and above-mentioned aqueous post, heat a plurality of aqueous sub-post of stacked formation, form above-mentioned conduction column.

7. according to the formation method of claim 5 or the described Wiring pattern of claim 6, it is characterized in that above-mentioned interim drying is to be undertaken by blow gas.

8. according to the formation method of claim 5 or the described Wiring pattern of claim 6, it is characterized in that above-mentioned interim drying is undertaken by irradiation ultraviolet radiation.