CN100413062C - Method for producing heat pipes - Google Patents
Method for producing heat pipes Download PDFInfo
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- CN100413062C CN100413062C CNB2004100280140A CN200410028014A CN100413062C CN 100413062 C CN100413062 C CN 100413062C CN B2004100280140 A CNB2004100280140 A CN B2004100280140A CN 200410028014 A CN200410028014 A CN 200410028014A CN 100413062 C CN100413062 C CN 100413062C
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- photoresist layer
- making method
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- control making
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Abstract
The present invention relates to a manufacturing method of a heat pipe, which comprises the following steps: a substrate is provided, and an oxidizing layer is formed on the surface of the substrate; a photoresistive layer is attached on the oxidizing layer; a passage is formed on the photoresistive layer via a micro electromechanical manufacturing technology; the open end of the passage is sealed; a layer of high molecular polymer covers the surface of the photoresistive layer to form an outer housing of the heat pipe; a hole for the flow of working fluid is opened on the outer housing and the photoresistive layer; the working fluid is filled via the hole, and then the hole is sealed. The heat pipe which is made via the manufacturing method has the advantages that the occupied space is small, the condition that heat generation electronic components are smaller and smaller is satisfied, a pipe wall of the heat pipe has flexibility, one end of the heat pipe can be bent optionally to contact the heat generation electronic components, and the heat pipe can be installed limberly and are not be limited by the space of the heat generation electronic components.
Description
[technical field]
The invention relates to a kind of manufacture method of heat pipe, refer in particular to a kind of manufacture method that is applied to the heat pipe of heat-generating electronic elements heat radiation.
[background technology]
Fast development along with electronics and information industry, electronic component disposal abilities such as central processing unit are strengthened day by day, the heat that produces all increases with it, fin can't satisfy radiating requirements gradually in conjunction with the heat radiation module of fan, especially notebook computer, heat pipe is a critical elements that is widely used in heat transfer usefulness at present.Heat pipe is as a kind of heat transfer unit (HTU), and it is an amount of hydraulic fluid of splendid attire in sealing low pressure heat conductivility good metal housing, and when utilizing hydraulic fluid to do in housing that vapour-liquid two is alternate to be transformed and absorb or the principle of emitting big calorimetric is carried out work.Hydraulic fluid is selected the liquid that heat of vaporization height, good fluidity, chemical property are stable, boiling point is lower usually for use, as water, ethanol, acetone etc.For quickening the back-flow velocity of cooling back liquid, on inner walls, also be provided with capillary structure usually, under the capillary absorption affinity effect of capillary structure, quicken the back-flow velocity of liquid greatly.Because the hydraulic fluid circulation rate in the heat pipe is fast, so the heat transfer efficiency height.
The method of at present existing multiple manufacturing heat pipe, wherein a kind of method is: a heating panel is processed, to offer the terminal non-through passage of heat of multiple tracks; Again the openend of each passage of heat is sealed and keep at least one openend; Carry out while filling operation fluid and evacuation process from this openend that is retained, and again to its final technology of being sealed.Though the heat pipe that traditional heat control making method is processed into has hot preferably transfer efficiency, can satisfy heat-generating electronic elements heat radiation requirement to a certain extent, but the general volume of heat pipe is bigger, need use with radiator, fan combination just can reach better heat radiating effect, and institute takes up space bigger.Along with electronic component performance such as central processing unit improve constantly, caloric value is increasing, the conventional heat pipe volume bigger than normal with the electronic element piece day of year contradiction that becomes to diminishing, can not satisfy the heat radiation of the high electronic component of caloric value.
Along with micro electronmechanical manufacturing technology constantly develops, the research of microsystem began to be paid attention to by people in recent years.Micro electronmechanical manufacturing technology is a kind of integrated and microminiaturization system manufacturing technology in conjunction with multiple technologies fields such as light, mechanical, electrical, material, control, physics, living doctor, chemistry.Micro electronmechanical manufacturing technology is the technology that is skillful in making micro-structural, different being of this kind technology and traditional mechanical processing method maximum: micro electronmechanical manufacturing technology can batch manufacturing, modification for different parameters is convenient, can accomplish that workpiece and finished product are one-body molded, and can combine closely with the conventional semiconductor process technique.Micro electronmechanical manufacturing technology is the basis of all micro electro mechanical system (MEMS) technology development, and this technology can produce the micro-structural trickleer than hair, element and product etc.Therefore, industry begins to use this technology and processes small heat dissipation element.
Along with the heat-generating electronic elements performance improves constantly, respective volume but diminishes day by day, how to provide a kind of manufacture method that can satisfy the heat pipe of the heat-generating electronic elements heat radiation that caloric value is big, volume is little to become the key that industry solves this type of problem.
[summary of the invention]
The object of the present invention is to provide a kind of manufacture method that can satisfy the heat pipe of the heat-generating electronic elements heat radiation that caloric value is big, volume is little.
The manufacture method of heat pipe of the present invention may further comprise the steps: a substrate is provided, forms an oxide layer at this substrate surface; At this oxide layer surface attachment one photoresist layer; On photoresist layer, form passage by micro electronmechanical manufacturing technology; The openend of passage is sealed; At photoresist layer surface coverage one deck high molecular polymer, form the shell of heat pipe; On shell and photoresist layer, offer an aperture that supplies working fluid to enter; By the aperture to the passage internal-filling liquid; Sealing of hole.
Owing to utilize micro electronmechanical manufacturing technology, make this heat pipe little than the volume of conventional heat pipe among the present invention, institute takes up space little, can satisfy the situation that the heat-generating electronic elements volume diminishes day by day; In addition, the thermotube wall that utilizes micro electronmechanical fabrication technique is thin to have a pliability, can be arbitrarily crooked and heat-generating electronic elements one end in contact, the heat-generating electronic elements spatial limitation that is not subjected to flexible for installation.
With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.
[description of drawings]
Fig. 1 is a heat control making method schematic diagram of the present invention.
Fig. 2 is the processing schematic diagram of photoresist layer shown in Figure 1.
Fig. 3 is the still unsealed schematic perspective view of heat pipe of the present invention.
Fig. 4 is the generalized section along Fig. 3 IV-IV line.
[embodiment]
See also Fig. 1 to Fig. 4, heat control making method of the present invention is: a substrate 10 (in the embodiment of the invention be substrate with the silicon wafer) is provided; Form the very thin silicon dioxide oxide layer 20 of one deck with dry type oxidation process on the surface of substrate 10.There is the substrate 10 of oxide layer 20 to place on the vacuum coater above-mentioned surface attachment, is coated with an amount of photoresist and adheres to liquid it is evenly distributed on the oxide layer 20, form a photoresist layer 30.After coating finishes, place it on the heating plate and carry out soft baking, make photoresist layer 30 become solid-state homogeneous film, so far can form required photoresist layer 30 by original liquid state with 90 ℃ of temperature.Above-mentioned photoresist layer 30 is placed on the microscope carrier of exposure machine and exposes by instrument 100, so as with required design transfer to photoresist layer 30; With developer solution the pattern on the photoresist layer 30 is carried out development treatment, exposed portion is removed with chemical solution, unexposed portion stays, thereby forms a passage 40 on photoresist layer 30.Then, photoresist layer 30 is washed, dries up, be placed on the heating plate and carry out roasting firmly with 120 ℃ of temperature.Afterwards, remove substrate 10 with potassium hydroxide etch, at this moment, the main effect of oxide layer 20 is the obstacles during as potassium hydroxide etch, utilize potassium hydroxide to SiO 2 etch rate slowly principle reach the purpose of protection photoresist layer 30.The openend of passage 40 is sealed, a high molecular polymer is provided, it is coated on the surface of photoresist layer 30, form a housing and be enclosed in the shell 50 of the outer surface of photoresist layer 30 as heat pipe.On shell 50 and photoresist layer 30, offer one with the aperture 60 of external communications.Then, shell 50 surfaces are dried, splash into passage 40 as working fluid 70 by aperture 60 with deionized water after, use the colloid sealing of hole, can finish the manufacturing process of whole heat pipe.
Owing to utilize micro electronmechanical manufacturing technology, make this heat pipe volume little than conventional heat pipe among the present invention, institute takes up space little, can satisfy the situation that the heat-generating electronic elements volume diminishes day by day; In addition, utilize the thermotube wall attenuation of micro electronmechanical fabrication technique to have pliability, arbitrarily bending and heat-generating electronic elements one end in contact, the heat-generating electronic elements spatial limitation that is not subjected to flexible for installation.
In addition, on photoresist layer 30, can form a plurality of passages 40, and the shape of passage 40 can be decided according to the actual requirements.
Claims (9)
1. heat control making method may further comprise the steps:
(1) provides a substrate, form an oxide layer at this substrate surface;
(2) at this oxide layer surface attachment one photoresist layer;
(3) on photoresist layer, form passage by micro electronmechanical manufacturing technology;
(4) openend with passage seals;
(5), form the shell of heat pipe at photoresist layer surface coverage one deck high molecular polymer;
(6) on shell and photoresist layer, offer an aperture that supplies working fluid to enter;
(7) by the aperture to the passage internal-filling liquid;
(8) sealing of hole.
2. heat control making method as claimed in claim 1 is characterized in that: the photoresist layer in above-mentioned (2) step is by adhering to liquid at oxide layer surface coated photoresist, carries out soft roasting and form then.
3. heat control making method as claimed in claim 1 is characterized in that: above-mentioned (3) step further may further comprise the steps:
(1) with the photoresist layer exposure, make required design transfer to photoresist layer;
(2) pattern on the photoresist layer is carried out development treatment;
(3) photoresist layer washed, dry up, roasting firmly, form above-mentioned passage.
4. heat control making method as claimed in claim 1 is characterized in that: also comprise with potassium hydroxide etch between above-mentioned (3) step and (4) step and remove substrate.
5. heat control making method as claimed in claim 1 is characterized in that: above-mentioned (8) step is to utilize the colloid sealing of hole.
6. heat control making method as claimed in claim 1 is characterized in that: the working fluid in the described passage is a deionized water.
7. heat control making method as claimed in claim 1 is characterized in that: described substrate is a silicon wafer.
8. heat control making method as claimed in claim 1 is characterized in that: described oxide layer is a silicon dioxide.
9. heat control making method as claimed in claim 1 is characterized in that: offer a plurality of passages on the described photoresist layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100280140A CN100413062C (en) | 2004-07-06 | 2004-07-06 | Method for producing heat pipes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100280140A CN100413062C (en) | 2004-07-06 | 2004-07-06 | Method for producing heat pipes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1719600A CN1719600A (en) | 2006-01-11 |
| CN100413062C true CN100413062C (en) | 2008-08-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100280140A Expired - Fee Related CN100413062C (en) | 2004-07-06 | 2004-07-06 | Method for producing heat pipes |
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| Country | Link |
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| CN (1) | CN100413062C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4199074A1 (en) * | 2021-12-16 | 2023-06-21 | Siemens Aktiengesellschaft | Electronic module comprising a pulsating heat pipe with a channel structure |
| EP4199075A1 (en) * | 2021-12-16 | 2023-06-21 | Siemens Aktiengesellschaft | Electronic module comprising a pulsating heat pipe with a channel structure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109742061B (en) * | 2019-01-14 | 2020-06-30 | 清华大学 | Flexible electronic device and method of manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010022219A1 (en) * | 1998-04-13 | 2001-09-20 | Masami Ikeda | Plate type heat pipe and its mounting structure |
| US20040052056A1 (en) * | 2001-12-13 | 2004-03-18 | Minehiro Tonosaki | Cooling device, electronic equipment device, and method of manufacturing cooling device |
-
2004
- 2004-07-06 CN CNB2004100280140A patent/CN100413062C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010022219A1 (en) * | 1998-04-13 | 2001-09-20 | Masami Ikeda | Plate type heat pipe and its mounting structure |
| US20040052056A1 (en) * | 2001-12-13 | 2004-03-18 | Minehiro Tonosaki | Cooling device, electronic equipment device, and method of manufacturing cooling device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4199074A1 (en) * | 2021-12-16 | 2023-06-21 | Siemens Aktiengesellschaft | Electronic module comprising a pulsating heat pipe with a channel structure |
| EP4199075A1 (en) * | 2021-12-16 | 2023-06-21 | Siemens Aktiengesellschaft | Electronic module comprising a pulsating heat pipe with a channel structure |
| WO2023110219A1 (en) * | 2021-12-16 | 2023-06-22 | Siemens Aktiengesellschaft | Electronics module comprising a pulsating heat pipe with a channel structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1719600A (en) | 2006-01-11 |
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