CN100395373C - Growth appts. of Chemical gaseous phase deposition - Google Patents

Growth appts. of Chemical gaseous phase deposition Download PDF

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Publication number
CN100395373C
CN100395373C CNB2006100392361A CN200610039236A CN100395373C CN 100395373 C CN100395373 C CN 100395373C CN B2006100392361 A CNB2006100392361 A CN B2006100392361A CN 200610039236 A CN200610039236 A CN 200610039236A CN 100395373 C CN100395373 C CN 100395373C
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China
Prior art keywords
casing
reaction chamber
tube
graphite reaction
sleeve pipe
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Expired - Fee Related
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CNB2006100392361A
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Chinese (zh)
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CN1834286A (en
Inventor
韩平
赵红
谢自力
王荣华
王�琦
夏冬梅
修向前
张�荣
郑有炓
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Nanjing University
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Nanjing University
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Abstract

The present invention discloses a chemical vapor deposition growth device which adopts a radio-frequency induction heater for heating, a graphite reaction chamber is arranged in the center of the radio-frequency induction heater, the graphite reaction chamber is arranged in a vacuum quartz pipe (1), and a thermolysis BN casing tube (2) group with the advantage of high temperature resistance is arranged between the quartz tube and the graphite reaction chamber (3) heated through induction. The BN casing tube group comprises 2 to 6 casing tubes, and the space of casing tube walls and the space between the casing tube walls and the quartz tube wall are from 1mm to 10mm. The BN casing tube group with a plurality of layers is used as a radiation shield which effectively reduces energy loss caused by heat radiation. Because the thermal conductivity of the BN material is low, a temperature gradient which is more than 100 DEG C/mm can be realized, and the BN material has good heat preservation effect. High vacuum is maintained in the quartz tube, and vacuums are arranged among BN casing tubes and between the BN casing tubes and the quartz tubes, which is favorable to heat loss reduction.

Description

The growth apparatus of chemical vapor deposition
Technical field
Design, especially the pyrolysis BN sleeve pipe group of growth apparatus that the present invention relates to prepare the CVD material is as the growth apparatus of the preparation CVD material of attemperator.
Background technology
Third generation semi-conductor, wide bandgap material have excellent photoelectric properties, have widely at communication, message area and use.Chemical vapor deposition (CVD) method is one of method commonly used of epitaxy wide-band gap semiconductor thin film material.
The epitaxy of thin-film material such as SiC, GaN all at high temperature realizes, the growth temperature of SiC is 1300 ~ 1600 ℃, the growth temperature of GaN is 1000 ~ 1200 ℃, the heating unit of the CVD material growing device that is adopted should have the excellent insulating performance, so just can satisfy the requirement of material preparation, also can realize the energy conservation object of less energy-consumption.
At present, the type of heating of epitaxial device that is used for the CVD material of SiC thin-film material preparation adopts the radio-frequency induction heating mostly.Because growth temperature is up to 1300 ~ 1600 ℃, for avoiding silica tube softening, between the graphite reaction chamber of silica tube and sensed heating, need resistant to elevated temperatures high purity lagging material, for obtaining high-quality epitaxial material, also needing to guarantee in the high growth temperature process, not have the impurity self-thermal insulation material in reaction chamber, to overflow.
Traditional horizontal CVD equipment is to adopt graphite felt to realize the high-temperature-resistant thermal-insulation function.The defective of this method is:
1, graphite felt is a vesicular.
Easily adsorb impurity, and be difficult for cleaning, also be difficult for the adjustment and the combination of assembling as required.Can not guarantee that inclusion-free is overflowed in the high growth temperature process after certain usage period.
2, graphite felt can not self-supporting.
Be difficult in vertical CVD equipment, using, and the CVD equipment claimed of not having this configuration has the quartzy cavity of large-size, and on quartzy tube wall additional water-cooled or air cooling jacket pipe, to guarantee that tube wall is in lower temperature in the epitaxial process.Such equipment cost height, power consumption are big.
Summary of the invention
Design, especially the pyrolysis BN sleeve pipe group of growth apparatus that the present invention seeks to propose a kind of CVD of preparation material is as the growth apparatus of the preparation CVD material of attemperator.
The present invention seeks to realize like this: the epitaxial device of CVD material, the heating of employing radio-frequency induction, be provided with the graphite reaction chamber in the middle of the radio-frequency induction heater, the graphite reaction chamber places in the vitreosil pipe, it is characterized in that being provided with between the graphite reaction chamber of silica tube and sensed heating resistant to elevated temperatures pyrolysis BN sleeve pipe group.
Described pyrolysis BN sleeve pipe group comprises two sleeve pipes at least, and as 2-6 sleeve pipe forming sleeves group, casing wall spacing, casing wall and quartzy tube wall spacing 〉=1mm are less than 10mm.The thickness of casing wall is 0.2-8mm.
The present invention is in particular for adopting pyrolysis BN sleeve pipe group as attemperator in horizontal CVD material growing device.
Mechanism of the present invention is: pyrolysis BN material has high-melting-point, high heat insulating ability, high purity, high-compactness, long lifetime, is difficult for distinguishing features such as absorption impurity, easy cleaning.By material property preferred plan is to select the pyrolysis BN sleeve pipe of wall thickness greater than 5mm for use, so that pipe surface temperature is reduced to below 600 ℃ of conventional requirement, but the cost of this scheme is high and present level of processing still is difficult to realize.
The present invention program's characteristics are:
1, utilize multilayer BN sleeve pipe group to cover cover, reduce power loss due to the thermal radiation effectively as radiation.
2, BN material thermal conductivity is low, can realize the thermograde that 100 ℃/mm is above, has good heat insulation effect.
3, keep high vacuum in the silica tube, therefore low between the BN sleeve pipe, be vacuum between BN sleeve pipe and the silica tube along silica tube radial thermal conductivity, help to reduce calorific loss.
4, guarantee in the high growth temperature process, not have the impurity self-thermal insulation material in reaction chamber, to overflow, obtain high-quality epitaxial material.
Description of drawings
Fig. 1 is a cross section structure synoptic diagram of the present invention, indicates among the figure: silica tube 1 (outmost turns), three layers of BN sleeve pipe 2, graphite reaction chamber 3, epitaxial substrates growth platform 4 (center rectangle).Wherein the direction of arrow is represented the thermal radiation direction, and arrow density is represented caloradiance
Embodiment
As shown in the figure, heating and attemperator comprise following structure:
Heating unit adopts the radio-frequency induction heating, is provided with the graphite reaction chamber in the middle of the radio-frequency induction heater, and the graphite reaction chamber places in the vitreosil pipe.Between the graphite reaction chamber of silica tube and sensed heating, be provided with resistant to elevated temperatures pyrolysis BN sleeve pipe group.
The radio-frequency induction process furnace: power 30 ~ 40KW, about frequency 40KHZ.
Graphite reaction chamber (heating member): hollow, size are pressed the design of epitaxial substrate diameter.
Attemperator, BN sleeve pipe group: the sleeve pipe number is selected three layers greater than 2 in the present embodiment, and thicker pipe is selected two layers also effect preferably.When requiring high insulating effect, can select the pipe of four layers or more multi-layered number.
Casing length is 2-3 a times of heating member length, cover tube spacing, sleeve pipe and silica tube spacing 〉=1mm, between sleeve pipe, sleeve pipe and silica tube isolate, support with the BN ring, in above-mentioned reaction chamber, outer tube places silica tube to the mid-heating member of inner sleeve (graphite reaction chamber 3, epitaxial substrate growth platform 4).
The BN casing wall thickness that the present invention program adopts select for use present level of processing the BN thickness that can realize, present pyrolysis BN telescopic working method is: the boron nitride-base ceramic (employings such as Shanghai silicate institute, Inst. of Composite material, Harbin Polytechnic Univ.) of preparation of polymeric preceramic body heat solution or the preparation of low-cost combustion synthesis process, the thickness of pyrolysis BN casing pipe sleeve tube wall is 0.2-2mm at present.Realize insulation by making up, assembling, can guarantee that inclusion-free is overflowed in the high growth temperature process, have satisfactory performance price ratio and lower manufacturing cost simultaneously.The BN telescopic better effects if that wall thickness is big.
The present invention program's advantage also comprises:
1, owing to can carry out the combination and the adjustment of assembling easily, so this covering device can at high temperature carry out the epitaxy of wide band gap semiconducter thin-film materials such as SiC, GaN, also can realize Si sill (Si at a lower temperature 1-xGe x, Si 1-x-yGe xC yDeng) epitaxy.
2, effective heat insulation effect of BN sleeve pipe group attemperator can make the power consumption of CVD material growing device obviously reduce;
3, pyrolysis BN can realize self-supporting, both can be used for horizontal CVD material growing device, also can be used for vertical CVD material growing device, thereby can effectively reduce manufacturing cost, technical difficulty and the use power consumption of vertical CVD material growing device.
The technical indicator that the present invention program has realized in horizontal CVD material growing device:
The high growth temperature temperature range: 800 ~ 1400 ℃, during growth silica tube outside wall temperature<600 ℃ (air-cooled); The low-temperature epitaxy temperature range: 550 ~ 850 ℃, during growth silica tube outside wall temperature<200 ℃ (air-cooled).

Claims (1)

1. the growth apparatus of chemical vapor deposition, the heating of employing radio-frequency induction, be provided with the graphite reaction chamber in the middle of the radio-frequency induction heater, the graphite reaction chamber places in the vitreosil pipe (1), it is characterized in that being provided with between the graphite reaction chamber (3) of silica tube and sensed heating resistant to elevated temperatures pyrolysis BN sleeve pipe (2) group; Described BN sleeve pipe group is a 2-6 sleeve pipe, and casing wall spacing, casing wall and quartzy tube wall spacing are 1mm-10mm; The thickness of casing wall is 0.2-8mm; Casing length be heating member graphite reaction chamber (3) length 2-3 doubly, between casing wall, sleeve pipe and silica tube with the BN ring isolate, support.
CNB2006100392361A 2006-03-31 2006-03-31 Growth appts. of Chemical gaseous phase deposition Expired - Fee Related CN100395373C (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
CNB2006100392361A CN100395373C (en) 2006-03-31 2006-03-31 Growth appts. of Chemical gaseous phase deposition

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CN1834286A CN1834286A (en) 2006-09-20
CN100395373C true CN100395373C (en) 2008-06-18

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102465333B (en) * 2010-11-18 2015-04-15 南京大学 Vertical hydride vapor phase epitaxy growth system
CN103184514B (en) * 2013-04-11 2016-07-06 中国科学院苏州纳米技术与纳米仿生研究所 crystal growing furnace
CN103924208B (en) * 2014-04-17 2016-08-24 史永贵 A kind of method preparing multi-layer graphene thin film
CN107740183A (en) * 2017-10-12 2018-02-27 北京大学 A kind of high temperature clean chamber system and method suitable for AlN crystal growths

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1052874A (en) * 1988-10-06 1991-07-10 罗纳·布朗克化学公司 Boron-nitrogen polymer, its method for making and as the usage of boron nitride parent
CN2429528Y (en) * 2000-06-16 2001-05-09 烽火通信科技股份有限公司 Preheating furnace for producing preformed products for optical fibers
WO2001061070A1 (en) * 2000-02-18 2001-08-23 G.T. Equipment Technologies Inc. Method and apparatus for chemical vapor deposition of polysilicon

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1052874A (en) * 1988-10-06 1991-07-10 罗纳·布朗克化学公司 Boron-nitrogen polymer, its method for making and as the usage of boron nitride parent
WO2001061070A1 (en) * 2000-02-18 2001-08-23 G.T. Equipment Technologies Inc. Method and apparatus for chemical vapor deposition of polysilicon
CN2429528Y (en) * 2000-06-16 2001-05-09 烽火通信科技股份有限公司 Preheating furnace for producing preformed products for optical fibers

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