CN100390703C - Radiator heat transfer portion structure - Google Patents
Radiator heat transfer portion structure Download PDFInfo
- Publication number
- CN100390703C CN100390703C CNB2005100053419A CN200510005341A CN100390703C CN 100390703 C CN100390703 C CN 100390703C CN B2005100053419 A CNB2005100053419 A CN B2005100053419A CN 200510005341 A CN200510005341 A CN 200510005341A CN 100390703 C CN100390703 C CN 100390703C
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- Prior art keywords
- column
- heat transfer
- transfer portion
- conducting plate
- heat
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- 238000012546 transfer Methods 0.000 title claims description 41
- 238000003825 pressing Methods 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000009434 installation Methods 0.000 claims description 6
- 239000012634 fragment Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000013461 design Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 210000001364 upper extremity Anatomy 0.000 description 1
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Abstract
The present invention relates to the structure of a heat conducting part of a radiator, which is applied into a radiating module of an electronic device for implement heat conduction and combination with a heating element. The present invention comprises a heat conducting plate and a buckling shrapnel, wherein one side of the heat conducting plate, which is combined with the heating element, is provided with at least one snap ring column and at least one locking hole column. The buckling shrapnel is formed by combining a pair of pressing plates with a pair of structure plates, positions of the pressing plates corresponding to each snap ring column are all provided with a hook hole, and the position corresponding to each locking hole column is provided with a locking hole. The snap ring columns and the locking hole columns are used by the heat conducting plate for supporting a buckling shrapnel which is fixedly clamped and fixedly locked on the snap ring columns and the locking hole columns to fixedly clamp the heating element, and the heating face of the heating element can be combined with the heat-conducting board in a heat conducting mode.
Description
Technical field
The present invention relates to a kind of radiator heat transfer portion structure, particularly relate in a kind of radiating module that is applied to notebook computer, in order to the radiator heat transfer portion structure of a heater element operative connection.
Background technology
The circuit structure of general notebook computer; for example; with central processing unit, South Bridge chip, north bridge chips and display chip etc. is topmost computing or control module, because those chips working at high speed or carry out a large amount of computings usually, so usually can produce high temperature.Can under a normal working temperature, work in order to make related chip, therefore relevant for heat dissipation problem, press for the important topic that overcomes for notebook computer in fact, because notebook computer is subjected to gently, the restriction of thin, short, little and inner space, so on the planning of circuit design and its mechanism of radiating module is arranged, how to effectively utilize also seem especially important of space.
Existing known notebook computer is in the planning of circuit design, custom all designs central processing unit, South Bridge chip, north bridge chips or display chip etc. on motherboard, therefore those chips will inevitably be positioned at identical plane, also because so, the design of relevant heat abstractor also can design on same plane thereupon, and because all circuit or mechanism are arranged on same plane, make notebook computer space at grade seem crowded, and then seem loose in vertical space.
Modern consumer, raise day by day for the usefulness of notebook computer display card and the flexible demand of upgrading, therefore the design of display card, having broken away from the past only design trends towards the same with desktop computer in the notion of motherboard, display card is designed to the design of pluggable cassette, so the position of display card will can be not in the same plane with central processing unit, South Bridge chip or north bridge chips etc.Because the characteristic of notebook computer slimming, in order to dwindle the space that the plug type display card is installed, the design of its plug-in card mode, different with desktop computer in the mode of vertical insertion motherboard slot, but insert a slot of being located at motherboard with level, therefore how to solve the problem of the heat radiation that shows the khaki display chip, also just become a problem that must overcome.
The position that existing known heat abstractor mainly is provided with, be to be arranged on the central processing unit or display chip of motherboard, by heat-conducting plate with heat abstractor, closely heat conduction fits on the hot surface of central processing unit or display chip, reaching the effect of heat conduction and heat radiation, however present notebook computer, the design of relevant display interface card, after trending towards the design of card insert type, make known heat abstractor, can't be applicable to the type of card insert type display card.
This shows that above-mentioned existing radiator heat transfer portion structure obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that radiator heat transfer portion structure exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.
Because the defective that above-mentioned existing radiator heat transfer portion structure exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of radiator heat transfer portion structure of new structure, can improve general existing radiator heat transfer portion structure, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcome the defective that existing radiator heat transfer portion structure exists, and provide a kind of new radiator heat transfer portion structure, technical matters to be solved is to make in its radiating module that can be applied to an electronic installation, in order to a heater element operative connection, it can make the firm operative connection of interface card and heat-conducting plate is one, can not damage because of carrying or moving of notebook computer, and can be with the display chip of interface card or drawing chip etc., the heat energy that is produced when work is effectively derived, thereby is suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of radiator heat transfer portion according to the present invention's proposition, be applied in the radiating module of electronic installation, in order to the heater element operative connection, it comprises: a heat-conducting plate, itself and the one side that this heater element combines are provided with at least one clasp column and at least one lockhole column; An and fastening spring sheet, be by a pair of pressing plate and a pair of structural slab be combined into, described pressing plate is to be the high shell fragment in middle low both sides, and this pressing plate colludes the hole in being equipped with one corresponding to each this clasp column place, then is provided with a locking hole corresponding to each this lockhole column place; Wherein this heat-conducting plate is to support this fastening spring sheet by this clasp column and this lockhole column, and fix and be locked on the above-mentioned clasp column with this heater element of clamping by this fastening spring sheet, and make the heating face of this heater element, can operative connection in this heat-conducting plate.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid radiator heat transfer portion, wherein said heat-conducting plate are a tabular.
Aforesaid radiator heat transfer portion, wherein said heat-conducting plate are made with copper or aluminium material.
Aforesaid radiator heat transfer portion, wherein said clasp column is to be riveted on this heat-conducting plate.
Aforesaid radiator heat transfer portion, the wherein said hole of colluding comprises a hole portion and the elongated hole portion of colluding.
Aforesaid radiator heat transfer portion, wherein said pressing plate are a metal clips.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, the invention relates to a kind of radiator heat transfer portion structure, be applied in the radiating module of an electronic installation, in order to a heater element operative connection, it comprises: a heat-conducting plate and a fastening spring sheet, wherein this heat-conducting plate and the one side that this heater element combines are provided with at least one clasp column and at least one lockhole column; Again, this fastening spring sheet is by a pair of pressing plate and a pair of structural slab be combined into, and this pressing plate is equipped with one and colludes the hole, and corresponding to each this lockhole column place, then be provided with a locking hole corresponding to each this clasp column place; And this heat-conducting plate is to support a fastening spring sheet by this at least one clasp column and at least one this lockhole column, and fix and be locked on those columns with this heater element of clamping by this fastening spring sheet, and make the heating face of this heater element, can operative connection in this heat-conducting plate.
By technique scheme, radiator heat transfer portion structure of the present invention has following advantage at least:
1, by enforcement of the present invention, can make interface card because of the heat energy that work is produced effectively, can effectively derive.
2,, interface card and heat spreader structures firmly are combined as a whole by enforcement of the present invention.
3, by enforcement of the present invention, it is more simple and efficient that the operation that interface card is combined with heat spreader structures becomes.
In sum, the radiator heat transfer portion structure of special construction of the present invention, it has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it all has bigger improvement on product structure or function, have large improvement technically, and produced handy and practical effect, and more existing radiator heat transfer portion structure has the multinomial effect of enhancement, thereby be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of instructions, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the three-dimensional exploded view for the present embodiment radiator heat transfer portion structure.
Fig. 2 is the three-dimensional exploded view for the radiator heat transfer portion structure of present embodiment and an interface card.
Fig. 3 is that the radiator heat transfer portion structure for present embodiment combines figure with the solid of an interface card.
Fig. 4 is the A-A cut-open view when combining with display card for radiator heat transfer portion structure among Fig. 3.
20: radiator heat transfer portion structure 211: heat-conducting plate
212: clasp column 213: ring groove
214: lockhole column 215: screw
216: fastening spring sheet 217: pressing plate
218: locking hole 219: collude the hole
220: collude hole portion 221: elongated hole portion
222: structural slab 40: radiator supporting plate structure
50: interface card 51: heater element
52: perforation 60: motherboard
61: slot
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of radiator heat transfer portion structure, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
See also shown in Figure 1, be for the three-dimensional exploded view of present embodiment radiator heat transfer portion structure and see also shown in Figure 2, be to be the radiator heat transfer portion structure of present embodiment and the three-dimensional exploded view of an interface card, it is to be applied in the radiating module of an electronic installation, in order to a heater element (display chip or drawing chip) operative connection, this radiator heat transfer portion structure 20 comprises: a heat-conducting plate 211 and a fastening spring sheet 216.
Heat-conducting plate 211 is the good metal plate of a heat conduction, its in order to an electronic installation in heater element 51 operative connection, in order to the heat that this heater element 51 is produced because of work, contact and derive effectively by face, and this heater element is to be a display chip or a drawing chip with heat-conducting plate 211.In order to conduct heat effectively, heat-conducting plate 211 is generally made with copper or aluminium material, and its heat-conducting effect is preferable.
For can be closely in conjunction with this heater element 51, so heat-conducting plate 211 itself and the one side that this heater element 51 combines, at least one clasp column 212 and at least one lockhole column 214 be provided with.Those columns are with riveted way, are riveted on this heat-conducting plate 211, so that it can firmly combine with heat-conducting plate 211.And wherein clasp column 212 at its column near the upper limb place, be provided with the ring groove 213 of a level; Lockhole column 214 then is provided with a screw 215 on the top of its column.
Fastening spring sheet 216, be by a pair of pressing plate 217 and a pair of structural slab 222 be combined intos, structural slab 222 is in order to support and to fix this pressing plate 217, and pressing plate 217 is to be the high metal clips in middle low both sides, again, pressing plate 217 is corresponding to each clasp column 212 place, be equipped with one and collude hole 219, and corresponding to each lockhole column 214 place, then be provided with a locking hole 218, again for fastening spring sheet 216 can be combined more easily with clasp column 212, be designed to include one and collude a hole portion 220 and an elongated hole portion 221 so will collude hole 219.
Seeing also shown in Figure 2ly, is to be the radiator heat transfer portion structure of present embodiment and the three-dimensional exploded view of an interface card, sees also shown in Figure 3ly again, is that the radiator heat transfer portion structure for present embodiment combines figure with the solid of an interface card.The radiator heat transfer portion structure 20 (as shown in fig. 1) of present embodiment wherein is to be subjected to the support of a radiator supporting plate structure 40 and firm.Interface card 50 can be a display interface card (VGA card) or a drawing interface card (MXM card), and the display chip of interface card 50 or drawing chip are the belows that is positioned at interface card 50, by a slot (Slot) 61 with after motherboard 60 is connected, and by the perforation of being located on this interface card 50 52, feasible clasp column 212 and the lockhole column of being located on the heat-conducting plate 211 214, can pass those perforation 52, collude hole 219 by a fastening spring sheet 216 more afterwards, be sheathed on ring groove 213 places of clasp column 212 and combination, and again with the locking hole 218 of fastening spring sheet 216, aim at the screw 215 of lockhole column 214, and by the screw combination that locked.
When fastening spring sheet 216 is desired ring groove 213 in conjunction with clasp column 212, be to comprise a hole portion 220 and the elongated hole portion 221 of colluding because collude hole 219, therefore can be by the space of elongated hole portion 221, make and collude hole 219 to aim at the operation of clasp columns 212 more convenient.Again because the pressing plate 217 of fastening spring sheet 216, be to be the high shell fragment in middle low both sides, therefore, when colluding, close behind clasp column 212 at fastening spring sheet 216 1 ends, and the other end is when being locked in a lockhole column 214 by screw, this moment, shell fragment was oppressed and can produce tension force, by this tension force interface card 50 was very firmly set firmly.
See also shown in Figure 4, it is the A-A cut-open view when the present embodiment radiator heat transfer portion structure combines with display card among Fig. 3, radiator heat transfer portion structure by present embodiment, can make the heating face of the heater element of being located on this interface card 50 51 (display chip or drawing chip), can with this heat-conducting plate 211 operative connection closely.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (6)
1. a radiator heat transfer portion is to be applied in the radiating module of electronic installation, in order to the heater element operative connection, it is characterized in that it comprises:
One heat-conducting plate, itself and the one side that this heater element combines are provided with at least one clasp column and at least one lockhole column; And
One fastening spring sheet, be by a pair of pressing plate and a pair of structural slab be combined into, described pressing plate is to be the high shell fragment in middle low both sides, and this pressing plate colludes the hole in being equipped with one corresponding to each this clasp column place, then is provided with a locking hole corresponding to each this lockhole column place;
Wherein this heat-conducting plate is to support this fastening spring sheet by this clasp column and this lockhole column, and fix and be locked on the above-mentioned clasp column with this heater element of clamping by this fastening spring sheet, and make the heating face of this heater element, can operative connection in this heat-conducting plate.
2. radiator heat transfer portion according to claim 1 is characterized in that wherein said heat-conducting plate is a tabular.
3. radiator heat transfer portion according to claim 1 is characterized in that wherein said heat-conducting plate is made with copper or aluminium material.
4. radiator heat transfer portion according to claim 1 is characterized in that wherein said clasp column is to be riveted on this heat-conducting plate.
5. radiator heat transfer portion according to claim 1 is characterized in that the wherein said hole of colluding comprises a hole portion and the elongated hole portion of colluding.
6. radiator heat transfer portion according to claim 1 is characterized in that wherein said pressing plate is to be a metal clips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100053419A CN100390703C (en) | 2005-02-02 | 2005-02-02 | Radiator heat transfer portion structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100053419A CN100390703C (en) | 2005-02-02 | 2005-02-02 | Radiator heat transfer portion structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1815403A CN1815403A (en) | 2006-08-09 |
| CN100390703C true CN100390703C (en) | 2008-05-28 |
Family
ID=36907633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100053419A Expired - Fee Related CN100390703C (en) | 2005-02-02 | 2005-02-02 | Radiator heat transfer portion structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100390703C (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1422111A (en) * | 2001-11-29 | 2003-06-04 | 株式会社东芝 | Cooling apparatus with cooling fan and electronic equipment |
| JP2003209211A (en) * | 2002-01-16 | 2003-07-25 | Toshiba Corp | Electronic apparatus |
| CN2603431Y (en) * | 2003-01-17 | 2004-02-11 | 大众电脑股份有限公司 | Holder structure for CPU heat sink |
| CN2611970Y (en) * | 2003-03-27 | 2004-04-14 | 广达电脑股份有限公司 | Fixer of radiator |
-
2005
- 2005-02-02 CN CNB2005100053419A patent/CN100390703C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1422111A (en) * | 2001-11-29 | 2003-06-04 | 株式会社东芝 | Cooling apparatus with cooling fan and electronic equipment |
| JP2003209211A (en) * | 2002-01-16 | 2003-07-25 | Toshiba Corp | Electronic apparatus |
| CN2603431Y (en) * | 2003-01-17 | 2004-02-11 | 大众电脑股份有限公司 | Holder structure for CPU heat sink |
| CN2611970Y (en) * | 2003-03-27 | 2004-04-14 | 广达电脑股份有限公司 | Fixer of radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1815403A (en) | 2006-08-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Guo Lihong Inventor before: Yang Zhikai Inventor before: Wang Fenggu Inventor before: Zheng Yilun |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170406 Address after: Tianjin Binhai New Area Tanggu justice 24-403 Patentee after: Guo Lihong Address before: Taiwan, China Patentee before: Inventec Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080528 Termination date: 20170202 |