CN100375916C

CN100375916C - Liquid crystal display module

Info

Publication number: CN100375916C
Application number: CNB031248853A
Authority: CN
Inventors: 廖学士; 游川倍; 郭建宏
Original assignee: AU Optronics Corp
Current assignee: AU Optronics Corp
Priority date: 2003-09-29
Filing date: 2003-09-29
Publication date: 2008-03-19
Anticipated expiration: 2023-09-29
Also published as: CN1603890A

Abstract

The present invention provides a liquid crystal display module with good heat dissipation effect. The present invention mainly comprises a display panel, a back light module, a control chip, a module shell and a heat dissipation pad, wherein the back light module also comprises a metal frame and an outer shell; the heat dissipation pad is used for efficiently conducting heat energy produced by the control chip to the outside of the liquid crystal display module through the module shell, the metal frame and the outer shell in order to lower the temperature in the liquid crystal display module.

Description

Liquid crystal display device module

Technical field

(liquid crystal display module LCDmodule), refers to a kind of LCD MODULE of tool high heat dissipation effect especially to the invention provides a kind of LCD MODULE.

Background technology

LCD widely is applied in various electronic products, as mobile phone, PDA(Personal Digital Assistant) and mobile computer (notebook) etc., and along with the fast development in large scale flat-panel screens market, LCD with compact characteristic is being played the part of considerable role especially, become the market mainstream and replace the cathode ray tube (CRT) display gradually, yet because that the continuous generation of meeting thermal conductances such as LCD when running control chip and backlight module cause temperature is more and more high, if heat will cause the temperature contrast of display panels excessive in the time of can't effectively conducting to the external world, cause the visual bright band of generation on the display panel, have a strong impact on display effect.

Please refer to Fig. 1, Fig. 1 is the structural representation of available liquid crystal display module 10.Available liquid crystal display module 10 includes a display panel 12, a backlight module 14, at least one control chip 16 and a casing (frame) 18.Wherein, backlight module 14 also includes a bottom and the shell (housing) 22 that a metal framework (metalframe) 20 is positioned at backlight module 14, and control chip then utilizes the carrier band (TAB tape) 24 (or a bendable printed circuit board (PCB)) of a tape automated bonding to be arranged at the side of backlight module 14.

As shown in Figure 1; because available liquid crystal display module 10 is coated in the casing 18; and casing 18 mainly is to design to be used for protecting LCD MODULE 10; to avoid dust and water to enter in the LCD MODULE 10; so the heat dissipation design of a large amount of air vents is not arranged mostly; the heat that is produced when therefore control chip 16 carries out computing can be closed in the liquid crystal display device module 10 and can't effectively get rid of, and then causes the temperature contrast of display panel 12 excessive.The situation that occurs brightness disproportionation when using after a while in the display frame easily causes display effect not good, even can reduce the serviceable life of LCD MODULE 10.Therefore how increasing radiating effect makes LCD MODULE 10 keep optimal display result to become the important topic that LCD designs.

Summary of the invention

Therefore, the object of the present invention is to provide a kind of LCD MODULE with high heat dissipation effect, with effective solution available liquid crystal display module because of problem that poor heat radiation was caused.

For reaching above-mentioned purpose, the invention provides a kind of LCD MODULE, consist predominantly of a display panel, at least one control chip and this display panel are electrically connected, one backlight module is positioned under this display panel, be used to provide the required light source of this display panel, and at least one cooling pad (heat-dissipative pad) contacts with this control chip, be used for conducting the heat energy that this control chip produces.Because cooling pad of the present invention uses the material of a high heat conductance and characteristic such as high temperature resistant, therefore can be effectively the thermal energy conduction of control chip generation be partly reached the effect of quick heat radiating to the casing of LCD MODULE or metal framework etc.

In order a nearlyer step to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing.Yet accompanying drawing is only for reference and aid illustration usefulness, is not to be used for the present invention is limited.

Description of drawings

Fig. 1 is the structural representation of available liquid crystal display module;

Fig. 2 to Fig. 5 is the structural representation of LCD MODULE of the present invention.

Description of reference numerals

10 LCD MODULE, 12 display panels

14 backlight modules, 16 control chips

18 casings, 20 metal frameworks

22 shells, 50 LCD MODULE

52 display panels, 54 backlight modules

56 control chips, 58 cooling pads

60 casings, 62 metal frameworks

The carrier band of 64 shells, 66 tape automated bondings

Embodiment

Please refer to Fig. 2, Fig. 2 is the structural representation of LCD MODULE first embodiment of the present invention.As shown in Figure 2, LCD MODULE 50 of the present invention includes a display panel 52, one backlight modules 54 and is used to provide light source, and a control chip 56 is used for controlling display panel 52 display images, one cooling pad 58 is used for conducting the heat energy that control chip 56 produces, and a casing 60.Wherein, backlight module 54 also includes a metal framework 62 and is used for supporting backlight module 54, and a shell 64.And control chip utilizes the carrier band (TAB tape) 66 (or a bendable printed circuit board (PCB)) of a tape automated bonding to be arranged at the side of backlight module 54.In addition, cooling pad 58 of the present invention is arranged between the shell 64 of control chip 56 and backlight module 54, and is positioned at the groove on the shell 64, to avoid increasing the volume of LCD MODULE 50.

As shown in Figure 2, a side of cooling pad 58 contacts with control chip 56, and the printed circuit board (PCB) (Fig. 2 does not show) that opposite side then is with shell 64, metal framework 62, casing 60 or are arranged in backlight module 54 belows contacts.Because the material of cooling pad 58 of the present invention has high heat conductance and resistant to elevated temperatures characteristic, therefore can conduct the heat energy that control chip 56 produces apace, and devices such as shell 64, metal framework 62, casing 60 or printed circuit board (PCB) (among Fig. 2 show) generally are made of metal material or include a large amount of metals and constitute thing, so also have the high heat conductance characteristic, therefore can thermal energy conduction be gone out outside the LCD MODULE 50 apace, effectively reduce the temperature of LCD MODULE 50.In addition, cooling pad 58 of the present invention itself also can utilize the selection of material and have the characteristic of anti-high-breakdown-voltage, therefore also has the function of protection control chip 56.

For convenience of description, the synoptic diagram of each embodiment below all use with Fig. 2 in identical mark.Please refer to Fig. 3, Fig. 3 is the structural representation of LCD MODULE second embodiment of the present invention.As shown in Figure 3, LCD MODULE 50 of the present invention includes a display panel 52, one backlight modules 54 and is used to provide light source, and a control chip 56 is used for controlling display panel 52, one cooling pads 58 and is used for conducting the heat energy that control chip 56 produces, and a casing 60.Wherein, backlight module 54 also includes a metal framework 62 and is used for supporting backlight module 54, and a shell 64.In addition, control chip then utilizes the carrier band 66 (or a bendable printed circuit board (PCB)) of a tape automated bonding to be arranged at the side of backlight module 54.

Be in the cooling pad 58 of present embodiment different with first embodiment of the invention of second embodiment shown in Figure 3 is arranged between control chip 56 and the casing 60, and a side of cooling pad 58 contacts with the printed circuit board (PCB) (Fig. 3 does not show) that control chip 56, shell 64 or are positioned at backlight module 54 belows, opposite side then contacts with casing 60, with thermal energy conduction that control chip 56 is produced to LCD MODULE 50.In addition as shown in Figure 3, rubber-like cooling pad 58 of the present invention coats control chip 56 fully, increases the contact area of cooling pad 58 and control chip 56, with the effect of effective increase heat radiation.

Please refer to Fig. 4 and Fig. 5, Fig. 4 and Fig. 5 are respectively the structural representation of LCD MODULE the 3rd embodiment of the present invention and the 4th embodiment.As shown in Figure 4 and Figure 5, LCD MODULE 50 of the present invention includes a display panel 52, one backlight modules 54 and is used to provide light source, and a control chip 56 is used for controlling display panel 52, one cooling pad 58 is used for conducting the heat energy that control chip 56 produces, and a casing 60.Wherein, backlight module 54 also includes a metal framework 62 and is used for supporting backlight module 54, and a shell 64.

Fig. 4 and the 3rd embodiment shown in Figure 5 and the difference of the 4th embodiment and above-mentioned first embodiment and second embodiment are that control chip 56 is arranged at the front of display panel 52, and its production method utilizes glass top chip (chip on glass, COG) chip (chip on film or on the film, COF) mode is formed at display panel 52 surfaces, also or utilize the carrier band (TAB tape) or a bendable printed circuit board (PCB) of a tape automated bonding to be electrically connected with display panel 52.In the 3rd embodiment, cooling pad 58 is arranged between the shell 64 of control chip 56 and backlight module 54, and be positioned at a groove on the shell 64, to avoid increasing the volume of LCD MODULE 50, and a side of cooling pad 58 contacts with control chip 56 and casing 60, opposite side then contacts with shell 64, and the thermal energy conduction that control chip 56 is produced is to LCD MODULE 50.In the 4th embodiment, 58 of cooling pads are arranged between control chip 56 and the casing 60, and a side of cooling pad 58 coats control chip 56 fully and contacts with shell 64, and opposite side then contacts with casing 60, and the heat conduction that control chip 56 is produced goes out outside the LCD MODULE 50.

In addition, in each disclosed embodiment of the present invention, control chip 56 all is the input signals that are used for controlling display panel 52 data lines, or be used for controlling the switch of display panel 52 sweep traces, therefore control chip 56 can be an one source pole drive integrated circult (Source Driver IC) or a grid-driving integrated circuit (Gate Driver IC), and the position of control chip 56 and quantity on demand function difference and be arranged at respectively around the display panel 52 in appropriate location or the LCD MODULE, and the position of cooling pad 58 is also different and change to some extent along with control chip 56 positions.

It should be noted that, in each embodiment of the invention described above, the function of cooling pad 58 is to conduct the heat energy that control chip 56 is produced, so the demand of its relative position and the visual heat radiation of size or the structural design of LCD MODULE and contact with wherein arbitrary device of said machine casing 60, metal framework 62, shell 64 or printed circuit board (PCB) (not shown), also or simultaneously contact reaching best radiating effect by heat conduction, but not only be defined in the disclosed scope of the foregoing description with said apparatus.

Compared to prior art, LCD MODULE of the present invention utilizes a cooling pad that the heat energy that control chip produces is conducted to outside the LCD MODULE by devices such as casing, metal framework or shells, so can effectively bring into play heat sinking function, make LCD MODULE can Yin Wendu too high or display panel excessive temperature differentials and influence display effect and serviceable life, can solve the heat dissipation problem that prior art faces.Cooling pad itself has high-breakdown-voltage in addition, also has the function of protection control chip.

The above only is the preferred embodiments of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to the covering scope of patent of the present invention.

Claims

1. liquid crystal display device module includes:

One display panels;

One backlight module is arranged at this display panels below;

At least one control chip and this display panel are electrically connected, and are used for controlling this display panel;

At least one cooling pad contacts with this control chip and is adjacent to this backlight module, is used for conducting the heat energy that this control chip and this backlight module produces;

One casing coats to this display panels of small part and this backlight module;

One metal framework is positioned at the bottom of this backlight module; And

One shell is used for coating this backlight module

Wherein this cooling pad is positioned at the side of this backlight module at least; And

Wherein this cooling pad is arranged in the groove on this shell.

2. liquid crystal display device module as claimed in claim 1, wherein this cooling pad has the characteristic of high heat conductance, high temperature resistant and anti-high-breakdown-voltage.

3. liquid crystal display device module as claimed in claim 1, wherein this cooling pad is between this control chip and this shell, and contact with this control chip, this shell and this metal framework, be used for conducting heat energy that this control chip produces to this shell and this metal framework.

4. liquid crystal display device module as claimed in claim 1, wherein this cooling pad is between this control chip and this shell, and contact with this control chip, this shell and this casing, be used for conducting heat energy that this control chip produces to this shell and this casing.

5. liquid crystal display device module as claimed in claim 1, wherein this cooling pad and contacts with this casing and this control chip between this casing and this control chip, is used for conducting heat energy that this control chip produces to this casing.

6. liquid crystal display device module as claimed in claim 1, wherein this cooling pad is between this casing and this control chip, and contact with this casing, this control chip and this shell, be used for conducting heat energy that this control chip produces to this casing and this shell.

7. liquid crystal display device module as claimed in claim 1, wherein this control chip is located in the carrier band of a tape automated bonding.

8. liquid crystal display device module as claimed in claim 1, wherein this control chip is located on the bendable printed circuit board (PCB).

9. liquid crystal display device module as claimed in claim 1, wherein this control chip directly is located at this panel surface.

10. liquid crystal display device module as claimed in claim 1 also includes a printed circuit board (PCB), is located at this backlight module below.

11. liquid crystal display device module as claimed in claim 10, wherein this cooling pad also contacts with this printed circuit board (PCB).

12. liquid crystal display device module as claimed in claim 1, wherein this control chip is an one source pole drive integrated circult or a grid-driving integrated circuit.