CN100370886C - A printed wiring board and production method thereof - Google Patents
A printed wiring board and production method thereof Download PDFInfo
- Publication number
- CN100370886C CN100370886C CNB2004100424325A CN200410042432A CN100370886C CN 100370886 C CN100370886 C CN 100370886C CN B2004100424325 A CNB2004100424325 A CN B2004100424325A CN 200410042432 A CN200410042432 A CN 200410042432A CN 100370886 C CN100370886 C CN 100370886C
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- Prior art keywords
- printed wiring
- information
- wiring board
- copper sheet
- plies
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 65
- 229910052802 copper Inorganic materials 0.000 claims abstract description 63
- 239000010949 copper Substances 0.000 claims abstract description 63
- 238000003466 welding Methods 0.000 claims abstract description 37
- 238000013461 design Methods 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000010410 layer Substances 0.000 claims description 32
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000010586 diagram Methods 0.000 claims description 13
- 238000009434 installation Methods 0.000 claims description 11
- 239000011229 interlayer Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 238000012827 research and development Methods 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention discloses a printed circuit board and a manufacture method thereof. The method comprises the steps that when a printed circuit board PCB is designed, information that an element pin is extensively contacted with a copper sheet is obtained, and the information that the element pin is extensively contacted with the copper sheet is generated in a PCB design file. According to the information that the element pin is extensively contacted with the copper sheet in the PCB design file, the printed circuit board of the present invention is generated, namely the printed circuit board is provided with an assembly mark layer. When the present invention is used, appropriate welding tools and welding temperature are selected according to the information of the assembly mark layer, the generation of the problems of difficult welding and false welding is avoided when a plug-in unit is welded, and the welding quality is assured.
Description
Technical field
The present invention relates to the manufacturing process of the electronics or the communications field, be specifically related to a kind of printed wiring board and manufacture method thereof.
Background technology
PCB (printed wiring board) is the indispensable basic comprising important documents of all electronic products.Every kind of electronic equipment almost arrives computer greatly for a short time to electronic watch, calculator, the communication electronic equipment, and military armament systems as long as electronic devices and components such as integrated circuit are arranged, for the electric interconnection between them, all will use printed wiring board.In relatively large electronic product research process, the most basic success factor is design, documentation and the manufacturing of the printed wiring board of this product.The design of printed board and workmanship directly have influence on the quality and the cost of entire product, even cause the success or failure of commercial competition.Along with the adjustment of machine product breed structure, PCB product required area in unit constantly reduces, and makes the precision of PCB product and complexity improve.Because the intensive installation of the element of electronic circuit, for specific (special) requirements such as anti-tampering and wirings, used printed board not only has upper and lower surface for cabling in some electronic products, also being provided with in the centre of plate can be by the interlayer Copper Foil of special processing, for example, the used printed board material of present computer motherboard is many more than 4 layers.Like this, the pin of some plug-in units may all have annexation with several layers of while, in order to take into account electric property, to reduce and disturb, usually mostly adopt large stretch of copper sheet, therefore will be during the welding of the grounding pin of these plug-in units because of too fast trouble and the hidden danger that exists in some welding of dispelling the heat, such as: 1. welding needs high-power heater; 2. cause faulty soldered joint easily.Like this, when welding, just need more powerful flatiron to weld, perhaps when machine welds, should use different welding temperatures and time parameter, be difficult to welding or rosin joint otherwise cause easily.Common faulty soldered joint is depended merely on visual inspection and be can't see, and connects in a short time normally, and the long-time running meeting was lost efficacy.The inefficacy solder joint state that returns in market that is shown in Figure 1.
In order to guarantee welding quality, need in PCBA (printed wiring buck plate) course of processing, contact the number of plies difference of copper sheets and select different flatirons or machine for use, and different temperature parameters is set at different pins.But the present effective means of neither one will be researched and developed the number of plies information of the pin large tracts of land contact copper sheet of design and pass to production process.If need these information also can only lean on artificial enquiry, manual record, manual delivery when producing.Specific operation process is as follows: research and development artificial enquiry PCB design document, plug-in unit ground connection number of plies information is carried out record, manually for example mail, processing guiding book etc. pass to production by certain mode with these information then, produce again and take corresponding countermeasure, select the flatiron and the weld time of appropriate power according to the information of obtaining.Clearly, this manual type inspection, Data transmission not only waste time and energy, and very difficult the perfect and accurate of data that guarantee, if there is an omission problem of entire equipment operate as normal will occur influencing, same problem when reprocessing, veneer is also arranged, so said method seldom uses aborning, in fact also seldom has the research staff to do like this.Normal conditions are: research and development are not transmitted ground connection number of plies information and give to be produced, and produce and do not distinguish the many and few pin of the ground connection number of plies yet, occur through regular meeting therefore that the more pin of some ground connection numbers of plies is difficult to weld or the situation of rosin joint.
Summary of the invention
The invention provides a kind of printed wiring board and manufacture method thereof, be difficult to welding and problem of faulty soldering with what avoid in the prior art occurring when the welding plug-in unit.
For this reason, the invention provides following technical scheme:
A kind of printed wiring board comprises:
Printed wiring, the top layer of the described printed wiring board that is laid in and/or interlayer are used to realize on the described printed wiring board wiring between the required element and are electrically connected;
Via hole is distributed on the described printed wiring, is used to connect the described printed wiring of different layers;
Solder joint is distributed on the described printed wiring, is used for welding required element on the described printed wiring board by the large tracts of land contact copper sheet number of plies information of pin pad;
The assembling label layer is distributed in around the described solder joint, is used for contacting according to the large tracts of land of described pin pad the welding condition of the described solder joint of connection number of plies sign indication of copper sheet number of plies information generation.
The large tracts of land contact copper sheet number of plies information of described pin pad comprises: the silk-screen with pattern and/or literal code name.
A kind of manufacture method of printed wiring board comprises:
A, obtain the information of component pin large tracts of land contact copper sheet during printed wiring board in design;
B, the information of described component pin large tracts of land contact copper sheet is created in the printed wiring board design document;
C, generate according to the information of the component pin large tracts of land in described printed wiring board design document contact copper sheet and to have the corresponding printed wiring board that connects number of plies sign of element large tracts of land contact copper sheet information.
The information of described component pin large tracts of land contact copper sheet comprises: element number, component pin number, the real ground connection number of plies, the hot link ground connection number of plies of connecting.
Described printed wiring board design document comprises: printed wiring board file, light are painted file, are produced with installation diagram, production/test program file; Described printed wiring board file is used to provide the distributed intelligence of described printed wiring, described light is painted file and is used to provide making sheet information, described production is used for providing the information of consulting with installation diagram when printed wiring board assembles, described production/test program file is used to provide the printed wiring board exploitation, produces and the welding DLL (dynamic link library).
Described step B specifically comprises:
B1, in described production with generating veneer ground plane ordered series of numbers table in the installation diagram, described veneer ground plane ordered series of numbers table comprises following information: element number, component pin number, the real ground connection number of plies, the hot link ground connection number of plies of connecting;
B2, in described production/test program file, increase the information of described component pin large tracts of land contact copper sheet.
According to the information of the component pin large tracts of land contact copper sheet that increases among the described step B2, obtain the number of plies information of printed wiring board component pin pad large tracts of land contact copper sheet.
Described method also comprises:
Obtain the number of plies information of component pin pad large tracts of land contact copper sheet according to described production/test program file;
Number of plies information according to the described component pin pad large tracts of land contact copper sheet that obtains generates printed wiring board production weld job guiding book.
By above technical scheme provided by the invention as can be seen, the present invention passes to the PCB work flow with the assembly information of printed wiring board automatically by the PCB design cycle, add the assembling label layer that on pcb board, generates correspondence man-hour at PCB, make welding personnel by just the can visually see different welding conditions of each element pin of pcb board, thereby select corresponding soldering appliance and weld time according to different signs, avoid at the many solder joint of the when welding contact copper sheet number of plies because of the overrun phenomenon of can't welding of causing or rosin joint of heat radiation, guarantee welding quality, thereby improve the veneer reliability of operation.In addition, the assembly information that the present invention will obtain in the time of also will designing PCB is increased in production/test program file, provide component pin pad contact copper sheet number of plies information interface in the pcb board by this document to developing software of different production lines and software vendor, make that the developer can be according to actual needs, select different developing software for use, generate multi-form job instruction, convenience to the configuration of operations such as different welding equipments, personnel and parameter, has improved production efficiency in producing welding.
Description of drawings
Fig. 1 is the schematic diagram of the inefficacy solder joint that exists in the prior art;
Fig. 2 is the assembling label layer example in the PCB design of the present invention;
Fig. 3 is the assembling label layer schematic diagram that utilizes on the actual pcb board that is processed into of the present invention;
Fig. 4 is that the assembling label layer indicates the implication schematic diagram among Fig. 2 and Fig. 3;
Fig. 5 is that another kind of assembling label layer indicates pattern;
Fig. 6 is the cutaway view of printed wiring board of the present invention;
Fig. 7 is the flow chart of the inventive method;
Fig. 8 is the veneer ground plane ordered series of numbers table that generates in PCB design output file in the inventive method.
Embodiment
Core of the present invention is by the assembly information on the printed wiring board is passed to the PCB work flow automatically, produce and have the pcb board that assembles label layer, the welding condition that indicates according to the assembling label layer when PCB assembles is selected suitable soldering appliance and weld time to different solder joints, guarantees the element welding quality.
In order to make those skilled in the art person understand the present invention better, the present invention is described in further detail below in conjunction with drawings and embodiments.
Fig. 2 shows the assembling label layer example in the PCB design of the present invention, and Fig. 3 is the assembling label layer of utilizing on the actual pcb board that is processed into of the present invention.
With reference to Fig. 2 and Fig. 3, printed wiring board provided by the invention comprises following a few part:
Printed wiring, the top layer of the printed wiring board that is laid in and/or interlayer are used to realize on the described printed wiring board wiring between the required element and are electrically connected, and are generally fine copper wire or copper sheet, as the printed wiring among Fig. 3 30;
Via hole is distributed on the described printed wiring, is used to connect the printed wiring of different layers, as the via hole among Fig. 3 31;
Solder joint is distributed on the described printed wiring, is used for by required element on the large tracts of land contact copper sheet number of plies information welding printed wiring board of pin pad, as the solder joint among Fig. 3 32;
The assembling label layer is distributed in around the solder joint, is used for contacting according to the large tracts of land of described pin pad the welding condition of the connection number of plies sign indication solder joint of copper sheet number of plies information generation.As the assembling label layer 33 among Fig. 3.Pad silk marks, the silk marks on every side of three ground pin solder joints among Fig. 3 on every side in JP3 and the JP4 left side square frame among Fig. 2, the welding condition implication of its sign has indicated the copper sheet number of plies information of solder joint contact as shown in Figure 4 by the square silk-screen layer of diverse location and quantity.According to this number of plies information, when pcb board assembles, just can select suitable soldering appliance and welding temperature, and then guarantee welding quality.
Certainly, the present invention is not limited to indicia patterns shown in Figure 4, can also adopt other pattern or come mark with the literal code name.Such as, can also adopt diverse location shown in Figure 5 and quantity camber line shape silk-screen layer to indicate the copper sheet number of plies information of solder joint contact.
In order to understand the present invention better, can also be with reference to the cutaway view of pcb board shown in Figure 6, by this figure as can be seen, the solder joint that is connected with a plurality of copper layers can be bigger with the contact area of copper sheet, therefore this point needed to select the bigger soldering appliance of power and higher welding temperature is set.The solder joint that should be noted that be can clearly discern by Fig. 4 or assembling label layer (silk-screen sign) shown in Figure 5, and suitable soldering appliance and temperature selected easily according to this label layer.
PCB design for convenience, the difference that the different bond pad shapes that can also be directly contact the pin of large tracts of land copper sheet by element are distinguished solder joint connects the copper number of plies, can certainly adopt the combination of above-mentioned different marker methods.In a word, all are within the scope that the pattern of the difference contact copper number of plies can Direct Recognition on the pcb board, that be used to distinguish solder joint and literal all are encompassed in the present invention and are protected.
Usually, for the ease of the PCB assembling, also be used to provide some element plug-in mountings, inspection, the required information of maintenance with the component information label layer on two surfaces up and down of printed wiring board.Usually indicate with some patterns and literal code name.For example element numbers and nominal value, element gabarit shape and manufacturer make, date of manufacture or the like.These component information label layer can adopt and assemble the same material of label layer.Such as silk marks C169, R345 among Fig. 3 and the pictorial symbolization on next door thereof, wherein, C169 is illustrated in this position and need welds and be numbered 169 electric capacity, and R345 is illustrated in this position and need welds and be numbered 345 resistance.
The printed wiring board that provides for the invention described above, the present invention is mainly by obtaining the information of component pin large tracts of land contact copper sheet when designing pcb board, then these information are created in the PCB design document, the information that is about to the component pin large tracts of land contact copper sheet on the pcb board passes to production and processing process automatically by design document, produces the pcb board of the message identification layer that has component pin large tracts of land contact copper sheet.
Below with reference to flow process shown in Figure 7 the inventive method is elaborated.
Step 701: obtain the information of component pin large tracts of land contact copper sheet when design printed wiring board PCB, the information of described component pin large tracts of land contact copper sheet comprises: element number, component pin number, the real ground connection number of plies, the hot link ground connection number of plies of connecting.
Step 702: the information that the component pin large tracts of land of obtaining is contacted copper sheet is created in the PCB design document, promptly in the PCB design process, on the software platform that software supplier provides, the interface and the data of relying on this platform to provide, when the PCB design was near completion, the information that the component pin large tracts of land of obtaining is contacted copper sheet was created in the design document.Described PCB design document comprises: PCB file, light are painted file, are produced with installation diagram, production/test program file; Described PCB file is used to provide the distributed intelligence of described printed wiring, described light is painted file and is used to provide making sheet information, described production is used for providing the information of consulting with installation diagram when pcb board assembles, described production/test program file is used to provide the PCB exploitation, produces and the welding DLL (dynamic link library).
Such as, according to predetermined standard and sign rule, around the pcb board component pin, design the necessarily silk-screen of contact copper sheet number of plies implication of expression, promptly foregoing assembling label layer.Such as, can be with reference to Fig. 4 or identification method and pattern shown in Figure 5.These signs are embodied in the PCB file and light is painted in the file, add man-hour according to this document can process have these the assembling label layer pcb board.
Step 703: the information of painting the component pin large tracts of land contact copper sheet in the file according to light when making pcb board generates the corresponding number of plies that connects and identifies on pcb board.
Step 704: producing with generating veneer ground plane ordered series of numbers table in the installation diagram, described veneer ground plane ordered series of numbers table comprises following information: element number, component pin number, the real ground connection number of plies, the hot link ground connection number of plies of connecting.
The ground connection of the research and development control for convenience number of plies is consulted to carry out suitable process equipment with production in the reasonable scope and is selected and the operation setting, and the present invention also designs the production of output with generating veneer ground plane ordered series of numbers table in the installation diagram, as shown in Figure 8 at PCB.Wherein, components is a position of components number, and pin number represents the numbering of pin, and shape connect represents the real number of plies that connects ground connection, and thermal connect represents the number of plies of hot link ground connection.Real connection ground connection is defined as, and the pin connection pads is connected fully with ground (being generally the bulk copper sheet), does not have branch.Hot link ground connection is defined as, and the pin connection pads not exclusively is connected with ground (being generally the bulk copper sheet), and branch is arranged, and purpose is the transmission for the heat that slows down.Shape connect and thermalconnect sum are total ground connection number of plies.For simplified design, can not distinguish at the ground connection form, as long as there is being connected on electric on plug-in unit pin and ground, count total ground connection number of plies without exception.Certainly, in order to guarantee better welding quality, also can carry out different signs at the real situation that connects ground connection and hot link ground connection.
Step 705: the information that in production/test program file, increases component pin large tracts of land contact copper sheet.Because the information such as program control, parameter of analyzing PCB data output production demand are finished the software of the direct information of generation and are had varied to obtain production line.Each production line, each supplier's software is all different, a lot of major companies all are independently developed software, therefore, the information of component pin large tracts of land contact copper sheet is added in production/test program file, for other related development provides pcb board component pin pad contact copper sheet number of plies information interface, made things convenient for the research staff to select the exploitation of different software for use to PCB.
Step 706: the number of plies information of obtaining component pin pad large tracts of land contact copper sheet according to described production/test program file.
Step 707: the number of plies information according to the component pin pad large tracts of land contact copper sheet that obtains generates PCB production weld job guiding book.Produce weld job guiding book guiding work personnel by this PCB and carry out rational equipment and parameter configuration, and inspection information is provided, make things convenient for the pcb board trouble shoot, guarantee to reprocess quality.
In the invention described above method, described production weld job guiding book utilizes PCB design output, will be appreciated that, change a little,, or directly do not read contact copper sheet number of plies information in this file not by the above-mentioned production/test program file that has added relevant contact copper sheet number of plies information, and utilize other PCB to design output file, output contact copper sheet number of plies information, and then instruct production and processing, these all should be included within the scope that the present invention contains.
Though described the present invention by embodiment, those of ordinary skills know, the present invention has many distortion and variation and do not break away from spirit of the present invention, wish that appended claim comprises these distortion and variation and do not break away from spirit of the present invention.
Claims (8)
1. a printed wiring board is characterized in that, comprising:
Printed wiring, the top layer of the described printed wiring board that is laid in and/or interlayer are used to realize on the described printed wiring board wiring between the required element and are electrically connected;
Via hole is distributed on the described printed wiring, is used to connect the described printed wiring of different layers;
Solder joint is distributed on the described printed wiring, is used for welding required element on the described printed wiring board by the large tracts of land contact copper sheet number of plies information of pin pad;
The assembling label layer is distributed in around the described solder joint, is used for contacting according to the large tracts of land of described pin pad the welding condition of the described solder joint of connection number of plies sign indication of copper sheet number of plies information generation.
2. printed wiring board as claimed in claim 1 is characterized in that, the large tracts of land contact copper sheet number of plies information of described pin pad comprises: the silk-screen with pattern and/or literal code name.
3. a method of making printed wiring board is characterized in that, comprising:
A, obtain the information of component pin large tracts of land contact copper sheet during printed wiring board in design;
B, the information of described component pin large tracts of land contact copper sheet is created in the printed wiring board design document;
C, generate the printed wiring board that the correspondence that has element large tracts of land contact copper sheet information connects number of plies sign according to the information of the component pin large tracts of land in described printed wiring board design document contact copper sheet.
4. method as claimed in claim 3 is characterized in that, the information of described component pin large tracts of land contact copper sheet comprises: element number, component pin number, the real ground connection number of plies, the hot link ground connection number of plies of connecting.
5. as claim 3 or 4 described methods, it is characterized in that described printed wiring board design document comprises: printed wiring board file, light are painted file, are produced with installation diagram, production/test program file; Described printed wiring board file is used to provide the distributed intelligence of described printed wiring, described light is painted file and is used to provide making sheet information, described production is used for providing the information of consulting with installation diagram when printed wiring board assembles, described production/test program file is used to provide the printed wiring board exploitation, produces and the welding DLL (dynamic link library).
6. method as claimed in claim 5 is characterized in that, described step B specifically comprises:
B1, in described production with generating veneer ground plane ordered series of numbers table in the installation diagram, described veneer ground plane ordered series of numbers table comprises following information: element number, component pin number, the real ground connection number of plies, the hot link ground connection number of plies of connecting;
B2, in described production/test program file, increase the information of described component pin large tracts of land contact copper sheet.
7. method as claimed in claim 6 is characterized in that, according to the information of the component pin large tracts of land contact copper sheet that increases among the described step B2, obtains the number of plies information of printed wiring board component pin pad large tracts of land contact copper sheet.
8. as claim 6 or 7 described methods, it is characterized in that described method also comprises:
Obtain the number of plies information of component pin pad large tracts of land contact copper sheet according to described production/test program file;
Number of plies information according to the described component pin pad large tracts of land contact copper sheet that obtains generates printed wiring board production weld job guiding book.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100424325A CN100370886C (en) | 2004-05-18 | 2004-05-18 | A printed wiring board and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100424325A CN100370886C (en) | 2004-05-18 | 2004-05-18 | A printed wiring board and production method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1700839A CN1700839A (en) | 2005-11-23 |
| CN100370886C true CN100370886C (en) | 2008-02-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100424325A Expired - Lifetime CN100370886C (en) | 2004-05-18 | 2004-05-18 | A printed wiring board and production method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN100370886C (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103902779B (en) * | 2014-04-04 | 2018-03-09 | 无锡市同步电子科技有限公司 | A kind of method of PCB devices encapsulation storehouse pin silk-screen mark |
| CN104765931B (en) * | 2015-04-23 | 2018-09-28 | 上海斐讯数据通信技术有限公司 | a kind of PCB design method and system |
| CN104977524B (en) * | 2015-06-24 | 2017-11-17 | 中国电子科技集团公司第四十五研究所 | Retest method based on multi-point test around coordinate position of test point |
| CN106604553A (en) * | 2016-12-24 | 2017-04-26 | 上海与德信息技术有限公司 | Distinguishing method of printed circuit board |
| CN112580290B (en) * | 2020-12-25 | 2024-07-05 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method, PCB manufacturing device and storage medium |
| CN112750050A (en) * | 2020-12-30 | 2021-05-04 | 广州兴森快捷电路科技有限公司 | Processing method, apparatus, device and storage medium |
| CN112338307B (en) * | 2021-01-08 | 2021-03-19 | 四川赛狄信息技术股份公司 | High-precision circuit board packaging chip center pin difference compensating welding method and device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03228392A (en) * | 1990-02-02 | 1991-10-09 | Hitachi Ltd | Printed board |
| JPH0548224A (en) * | 1991-08-16 | 1993-02-26 | Matsushita Electric Ind Co Ltd | Printed-circuit board |
| JPH05102626A (en) * | 1991-10-11 | 1993-04-23 | Hitachi Ltd | Printed wiring board |
| JP2003017819A (en) * | 2001-06-29 | 2003-01-17 | Fujitsu Ltd | Printed wiring board and identifying method therefor |
| JP2003051650A (en) * | 2001-08-06 | 2003-02-21 | Ibiden Co Ltd | Printed wiring board, multilayer printed wiring board and manufacturing method therefor |
-
2004
- 2004-05-18 CN CNB2004100424325A patent/CN100370886C/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03228392A (en) * | 1990-02-02 | 1991-10-09 | Hitachi Ltd | Printed board |
| JPH0548224A (en) * | 1991-08-16 | 1993-02-26 | Matsushita Electric Ind Co Ltd | Printed-circuit board |
| JPH05102626A (en) * | 1991-10-11 | 1993-04-23 | Hitachi Ltd | Printed wiring board |
| JP2003017819A (en) * | 2001-06-29 | 2003-01-17 | Fujitsu Ltd | Printed wiring board and identifying method therefor |
| JP2003051650A (en) * | 2001-08-06 | 2003-02-21 | Ibiden Co Ltd | Printed wiring board, multilayer printed wiring board and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1700839A (en) | 2005-11-23 |
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