CN100370886C - A printed wiring board and production method thereof - Google Patents
A printed wiring board and production method thereof Download PDFInfo
- Publication number
- CN100370886C CN100370886C CNB2004100424325A CN200410042432A CN100370886C CN 100370886 C CN100370886 C CN 100370886C CN B2004100424325 A CNB2004100424325 A CN B2004100424325A CN 200410042432 A CN200410042432 A CN 200410042432A CN 100370886 C CN100370886 C CN 100370886C
- Authority
- CN
- China
- Prior art keywords
- printed wiring
- information
- wiring board
- copper sheet
- plies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 65
- 229910052802 copper Inorganic materials 0.000 claims abstract description 63
- 239000010949 copper Substances 0.000 claims abstract description 63
- 238000003466 welding Methods 0.000 claims abstract description 37
- 238000013461 design Methods 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000010410 layer Substances 0.000 claims description 32
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000010586 diagram Methods 0.000 claims description 13
- 238000009434 installation Methods 0.000 claims description 11
- 239000011229 interlayer Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 238000012827 research and development Methods 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100424325A CN100370886C (en) | 2004-05-18 | 2004-05-18 | A printed wiring board and production method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100424325A CN100370886C (en) | 2004-05-18 | 2004-05-18 | A printed wiring board and production method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1700839A CN1700839A (en) | 2005-11-23 |
CN100370886C true CN100370886C (en) | 2008-02-20 |
Family
ID=35476648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100424325A Expired - Lifetime CN100370886C (en) | 2004-05-18 | 2004-05-18 | A printed wiring board and production method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100370886C (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103902779B (en) * | 2014-04-04 | 2018-03-09 | 无锡市同步电子科技有限公司 | A kind of method of PCB devices encapsulation storehouse pin silk-screen mark |
CN104765931B (en) * | 2015-04-23 | 2018-09-28 | 上海斐讯数据通信技术有限公司 | a kind of PCB design method and system |
CN104977524B (en) * | 2015-06-24 | 2017-11-17 | 中国电子科技集团公司第四十五研究所 | Retest method based on multi-point test around coordinate position of test point |
CN106604553A (en) * | 2016-12-24 | 2017-04-26 | 上海与德信息技术有限公司 | Distinguishing method of printed circuit board |
CN112580290B (en) * | 2020-12-25 | 2024-07-05 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method, PCB manufacturing device and storage medium |
CN112750050A (en) * | 2020-12-30 | 2021-05-04 | 广州兴森快捷电路科技有限公司 | Processing method, apparatus, device and storage medium |
CN112338307B (en) * | 2021-01-08 | 2021-03-19 | 四川赛狄信息技术股份公司 | High-precision circuit board packaging chip center pin difference compensating welding method and device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03228392A (en) * | 1990-02-02 | 1991-10-09 | Hitachi Ltd | Printed board |
JPH0548224A (en) * | 1991-08-16 | 1993-02-26 | Matsushita Electric Ind Co Ltd | Printed-circuit board |
JPH05102626A (en) * | 1991-10-11 | 1993-04-23 | Hitachi Ltd | Printed wiring board |
JP2003017819A (en) * | 2001-06-29 | 2003-01-17 | Fujitsu Ltd | Printed wiring board and identifying method therefor |
JP2003051650A (en) * | 2001-08-06 | 2003-02-21 | Ibiden Co Ltd | Printed wiring board, multilayer printed wiring board and manufacturing method therefor |
-
2004
- 2004-05-18 CN CNB2004100424325A patent/CN100370886C/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03228392A (en) * | 1990-02-02 | 1991-10-09 | Hitachi Ltd | Printed board |
JPH0548224A (en) * | 1991-08-16 | 1993-02-26 | Matsushita Electric Ind Co Ltd | Printed-circuit board |
JPH05102626A (en) * | 1991-10-11 | 1993-04-23 | Hitachi Ltd | Printed wiring board |
JP2003017819A (en) * | 2001-06-29 | 2003-01-17 | Fujitsu Ltd | Printed wiring board and identifying method therefor |
JP2003051650A (en) * | 2001-08-06 | 2003-02-21 | Ibiden Co Ltd | Printed wiring board, multilayer printed wiring board and manufacturing method therefor |
Also Published As
Publication number | Publication date |
---|---|
CN1700839A (en) | 2005-11-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: SHENZHEN WUZHU CIRCUIT BOARD CO.,LTD. Assignor: HUAWEI TECHNOLOGIES Co.,Ltd. Contract fulfillment period: 2009.3.27 to 2014.3.26 Contract record no.: 2009990000670 Denomination of invention: Printed-wiring board and production method thereof Granted publication date: 20080220 License type: Exclusive license Record date: 20090617 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.3.27 TO 2014.3.26; CHANGE OF CONTRACT Name of requester: SHENZHEN WUZHU CIRCUIT BOARD CO.,LTD Effective date: 20090617 |
|
ASS | Succession or assignment of patent right |
Owner name: SHENZHEN WUZHU CIRCUIT BOARD CO.,LTD Free format text: FORMER OWNER: HUAWEI TECHNOLOGY CO., LTD. Effective date: 20090717 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090717 Address after: Xixiang bell industrial area, Baoan District, Guangdong, Shenzhen Patentee after: SHENZHEN WUZHU CIRCUIT BOARD CO.,LTD. Address before: Bantian HUAWEI headquarters office building, Longgang District, Shenzhen, Guangdong Patentee before: HUAWEI TECHNOLOGIES Co.,Ltd. |
|
DD01 | Delivery of document by public notice |
Addressee: Li Shiwei Document name: Notification to Pay the Fees |
|
C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN WUZHU TECHNOLOGY CO., LTD. Free format text: FORMER NAME: SHENZHEN CITY WUZHOU CIRCUIT GROUP LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 518128 Xixiang bell Industrial Zone, Baoan District, Guangdong, Shenzhen Patentee after: SHENZHEN WUZHU TECHNOLOGY Co.,Ltd. Address before: 518128 Xixiang bell Industrial Zone, Baoan District, Guangdong, Shenzhen Patentee before: SHENZHEN WUZHU CIRCUIT BOARD CO.,LTD. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20080220 |