CN100364713C - 一种Ag-Al-Cu-Ni-Sn系无铅焊锡 - Google Patents
一种Ag-Al-Cu-Ni-Sn系无铅焊锡 Download PDFInfo
- Publication number
- CN100364713C CN100364713C CNB2005100619421A CN200510061942A CN100364713C CN 100364713 C CN100364713 C CN 100364713C CN B2005100619421 A CNB2005100619421 A CN B2005100619421A CN 200510061942 A CN200510061942 A CN 200510061942A CN 100364713 C CN100364713 C CN 100364713C
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- Prior art keywords
- pure
- soldering tin
- free soldering
- dsc
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 238000005476 soldering Methods 0.000 title claims abstract description 16
- 229910018100 Ni-Sn Inorganic materials 0.000 title claims abstract description 13
- 229910018532 Ni—Sn Inorganic materials 0.000 title claims abstract description 13
- 239000012535 impurity Substances 0.000 claims abstract description 21
- 229910052718 tin Inorganic materials 0.000 claims abstract description 18
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 229910052709 silver Inorganic materials 0.000 claims description 15
- 230000008018 melting Effects 0.000 abstract description 35
- 238000002844 melting Methods 0.000 abstract description 35
- 230000006698 induction Effects 0.000 abstract description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 15
- 239000000203 mixture Substances 0.000 abstract description 15
- 230000005496 eutectics Effects 0.000 abstract description 2
- 238000003723 Smelting Methods 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 231100000331 toxic Toxicity 0.000 abstract 1
- 230000002588 toxic effect Effects 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 31
- 239000000956 alloy Substances 0.000 description 26
- 229910000679 solder Inorganic materials 0.000 description 22
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 16
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 11
- 239000002994 raw material Substances 0.000 description 11
- 229910052786 argon Inorganic materials 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- 238000000113 differential scanning calorimetry Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 238000005070 sampling Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000010792 warming Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000031709 bromination Effects 0.000 description 2
- 238000005893 bromination reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 230000007096 poisonous effect Effects 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- ZCILODAAHLISPY-UHFFFAOYSA-N biphenyl ether Natural products C1=C(CC=C)C(O)=CC(OC=2C(=CC(CC=C)=CC=2)O)=C1 ZCILODAAHLISPY-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
Description
No | 成分(重量%) | 熔点(℃) | ||||
Ag | Al | Cu | Ni | Sn | ||
1 | 1.0 | 0.001 | 2.0 | 0.5 | 余量 | 219.0 |
2 | 1.0 | 0.1 | 2.0 | 0.2 | 余量 | 219.9 |
3 | 1.0 | 0.5 | 2.0 | 0.001 | 余量 | 220.0 |
4 | 1.0 | 0.001 | 5.0 | 1.0 | 余量 | 218.6 |
5 | 1.0 | 0.001 | 10.0 | 1.0 | 余量 | 218.6 |
6 | 1.0 | 0.001 | 10.0 | 1.5 | 余量 | 211.7 |
7 | 1.0 | 0.001 | 10.0 | 1.2 | 余量 | 210.4 |
8 | 0.2 | 0.001 | 3.0 | 0.5 | 余量 | 219.5 |
9 | 1.0 | 0.001 | 1.0 | 0.5 | 余量 | 218.1 |
10 | 1.5 | 0.001 | 1.6 | 1.0 | 余量 | 218.5 |
11 | 0.1 | 1.0 | 2.0 | 0.1 | 余量 | 217.4 |
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100619421A CN100364713C (zh) | 2005-12-12 | 2005-12-12 | 一种Ag-Al-Cu-Ni-Sn系无铅焊锡 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100619421A CN100364713C (zh) | 2005-12-12 | 2005-12-12 | 一种Ag-Al-Cu-Ni-Sn系无铅焊锡 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1775455A CN1775455A (zh) | 2006-05-24 |
CN100364713C true CN100364713C (zh) | 2008-01-30 |
Family
ID=36765240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100619421A Expired - Fee Related CN100364713C (zh) | 2005-12-12 | 2005-12-12 | 一种Ag-Al-Cu-Ni-Sn系无铅焊锡 |
Country Status (1)
Country | Link |
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CN (1) | CN100364713C (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1313631C (zh) * | 2005-08-02 | 2007-05-02 | 马莒生 | 一种锡银铜镍铝系无铅焊料合金 |
CN102476249A (zh) * | 2010-11-25 | 2012-05-30 | 中国科学院金属研究所 | 一种耐大气腐蚀的Sn-Ag-Cu焊料 |
CN105382442A (zh) * | 2015-11-30 | 2016-03-09 | 苏州龙腾万里化工科技有限公司 | 一种加铜焊锡条 |
CN105290640A (zh) * | 2015-11-30 | 2016-02-03 | 苏州龙腾万里化工科技有限公司 | 一种无铅焊锡条 |
CN111112870A (zh) * | 2019-12-20 | 2020-05-08 | 深圳市镱豪金属有限公司 | 一种环保锡条 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1421296A (zh) * | 2001-11-27 | 2003-06-04 | 深圳市格林美环境材料有限公司 | 一种无铅焊料及其制备方法 |
JP2003211283A (ja) * | 2002-01-22 | 2003-07-29 | Japan Science & Technology Corp | 鉛フリーはんだ材料 |
JP2004261863A (ja) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | 鉛フリーはんだ |
JP2005125360A (ja) * | 2003-10-23 | 2005-05-19 | Matsushita Electric Ind Co Ltd | 高温はんだ材料,高温はんだ材料評価方法および電気/電子機器ならびにはんだ接合構造体 |
-
2005
- 2005-12-12 CN CNB2005100619421A patent/CN100364713C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1421296A (zh) * | 2001-11-27 | 2003-06-04 | 深圳市格林美环境材料有限公司 | 一种无铅焊料及其制备方法 |
JP2003211283A (ja) * | 2002-01-22 | 2003-07-29 | Japan Science & Technology Corp | 鉛フリーはんだ材料 |
JP2004261863A (ja) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | 鉛フリーはんだ |
JP2005125360A (ja) * | 2003-10-23 | 2005-05-19 | Matsushita Electric Ind Co Ltd | 高温はんだ材料,高温はんだ材料評価方法および電気/電子機器ならびにはんだ接合構造体 |
Also Published As
Publication number | Publication date |
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CN1775455A (zh) | 2006-05-24 |
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Owner name: SUZHOU ZHIQIAO NEW MATERIALS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: HUANG DEHUAN Effective date: 20101220 |
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Free format text: CORRECT: ADDRESS; FROM: 200060 ROOM 301, NO. 13, LANE 288, MACAO ROAD, PUTUO DISTRICT, SHANGHAI TO: 215200 WEST OF PANGJIN ROAD, SCIENCE AND TECHNOLOGY VENTURE PARK, WUJIANG ECONOMIC DEVELOPMENT ZONE, WUJIANG CITY, SUZHOU CITY, JIANGSU PROVINCE |
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Effective date of registration: 20101220 Address after: 215200 Jiangsu city of Suzhou province Wujiang City Economic Development Zone of Wujiang science and Technology Park Pang Road West Patentee after: Suzhou Zhiqiao New Materials S&T Co., Ltd. Address before: 200060, room 13, No. 288, Lane 301, Macao Road, Shanghai, Putuo District Patentee before: Huang Dehuan |
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Effective date of registration: 20170626 Address after: 215299 science and Technology Pioneer Park, Wujiang Economic Development Zone, Suzhou, Jiangsu Patentee after: Wujiang Haibo Technology Venture Investment Company Limited Address before: 215200 Jiangsu city of Suzhou province Wujiang City Economic Development Zone of Wujiang science and Technology Park Pang Road West Patentee before: Suzhou Zhiqiao New Materials S&T Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080130 Termination date: 20191212 |
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CF01 | Termination of patent right due to non-payment of annual fee |