CN100334722C - Multiple chip integrated light-emitting diode frame - Google Patents
Multiple chip integrated light-emitting diode frame Download PDFInfo
- Publication number
- CN100334722C CN100334722C CNB2004100607097A CN200410060709A CN100334722C CN 100334722 C CN100334722 C CN 100334722C CN B2004100607097 A CNB2004100607097 A CN B2004100607097A CN 200410060709 A CN200410060709 A CN 200410060709A CN 100334722 C CN100334722 C CN 100334722C
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- China
- Prior art keywords
- electrode
- emitting diode
- light
- led
- integrated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The present invention relates to a multiple chip integrated light-emitting diode frame which is provided with two frame structures that one frame structure adopts a comb-shaped electrode, and the other frame structure adopts a tubular electrode. A plurality of light emitting diode chips are integrated on the two frames. The luminescence intensity of a single encapsulated light emitting diode is raised, and simultaneously, the heat dispersion of the light emitting diode is improved.
Description
Technical field
The present invention is the integrated light-emitting diodes tube frame of a kind of multicore sheet, and it is a kind of LED framework that can simultaneously the attaching of a plurality of light-emitting diodes (LED) chip be encapsulated within it.
Background technology
In recent years, along with the development of electronics, communication industry, the use of light-emitting diode is increasingly extensive; In addition, along with improving constantly of lumination of light emitting diode performance, light-emitting diode is also expanding new application, as lighting field.
Among prior art, some patents at the LED framework are arranged, as Chinese patent 01106620.2,99123645.9 etc., these patents mainly are at the luminescent properties that improves single led chip or improve the manufacture craft of framework.
For now, the luminous power of single led chip also is not enough to satisfy the needs of some application, and therefore common solution is the light source that the form that a plurality of packaged LED form array is obtained big luminous power now.Yet this method has increased the extra cost of LED being carried out array design.
In addition, led chip is attended by a certain amount of heat in luminous, and this heat is the main reason that causes LED to lose efficacy.Therefore, reducing heat that LED produces and the heat dispersion that improves LED is to improve one of essential factor of considering of LED performance institute, and reasonably Frame Design is unusual key for the heat radiation of chip.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of multicore sheet integrated light-emitting diodes tube frame, adopt this framework can be in an encapsulation integrated a plurality of led chips simultaneously as required, thereby reach the effect similar to led array.
The present invention adopts following technical scheme:
The light-emitting diodes tube frame that multicore sheet provided by the invention is integrated, its structure is: be made up of tubular electrode and the wire electrode that is positioned at its cavity center, they all have pin, and adopt insulating material to isolate between them.Be used to attach the electrode that several light-emitting diode chip for backlight unit are led chip around the tubular electrode, another electrodes of these led chips is caused on the wire electrode with gold thread respectively.
Above-mentioned led chip can adopt conductive silver glue to be attached on the tubular electrode.
The present invention since in an encapsulation integrated a plurality of led chips simultaneously as required, compared with prior art, have that volume is little, packaging cost is low, and the advantages such as heat dispersion that can improve LED well, thereby improve luminous efficiency and the property stable and reliable for performance of LED.
Description of drawings
Fig. 1 is the schematic diagram of a kind of structure of the present invention.
Fig. 2 is the schematic diagram of another kind of structure of the present invention.
Fig. 3 is the vertical view of Fig. 2.
Embodiment
The invention will be further described below in conjunction with embodiment and accompanying drawing.
The present invention is the integrated light-emitting diodes tube frame of a kind of multicore sheet, and it has two kinds of structures.
One. the light-emitting diodes tube frame that multicore sheet as shown in Figure 1 is integrated
Its structure is: be made up of comb electrode 3 and 4, two comb electrodes have at least two and the identical broach of quantity.Sequence number 1,2 is respectively the pin of comb electrode 3 and 4, and it is used to connect external power supply.
The light-emitting diodes tube frame that the multicore sheet of said structure is integrated can be used for assembling led chip.Specifically: each broach on one of them comb electrode (for example comb electrode 4) is used to attach an electrode of a led chip 5, and it is on the broach of comb electrode 3 that another electrode of led chip 5 is caused another corresponding with it comb electrode with gold thread 6.
Two. the light-emitting diodes tube frame that multicore sheet as shown in Figure 2 is integrated
Its structure is: be made up of tubular electrode 7 and the wire electrode 8 that is positioned at its cavity center, they are equipped with the pin (drawing) that connects external power supply.
The light-emitting diodes tube frame that the multicore sheet of said structure is integrated can be used for assembling led chip.Specifically: be used to attach the electrode that several light-emitting diode chip for backlight unit are led chip 10 around the tubular electrode 7, another electrodes of these led chips 10 is caused on the wire electrode 8 with gold thread 11 respectively.Because led chip directly is attached on the good tubular electrode of heat conductivility, this makes the radiating effect of led chip strengthen greatly.Available insulating material 9 is isolated between tubular electrode 7 and wire electrode 8.
When carrying out the attaching of led chip, can adopt conductive silver glue to attach.Whole framework can adopt the conventional package method to encapsulate.
The integrated light-emitting diodes tube frame of the multicore sheet of above-mentioned two kinds of structures all can attach more than one led chip according to actual needs, thereby has aforesaid advantage.
Claims (2)
1. light-emitting diodes tube frame that the multicore sheet is integrated is characterized in that: be made up of tubular electrode (7) and the wire electrode (8) that is positioned at its cavity center, they all have pin, and adopt insulating material (9) to isolate between them; Be used to attach the electrode that several light-emitting diode chip for backlight unit are led chip (10) around the tubular electrode (7), another electrode of these led chips (10) uses gold thread (11) to cause on the wire electrode (8) respectively.
2. the light-emitting diodes tube frame that multicore sheet according to claim 1 is integrated is characterized in that: led chip (10) adopts conductive silver glue to be attached on the tubular electrode (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100607097A CN100334722C (en) | 2004-08-11 | 2004-08-11 | Multiple chip integrated light-emitting diode frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100607097A CN100334722C (en) | 2004-08-11 | 2004-08-11 | Multiple chip integrated light-emitting diode frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1588641A CN1588641A (en) | 2005-03-02 |
| CN100334722C true CN100334722C (en) | 2007-08-29 |
Family
ID=34603547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100607097A Expired - Fee Related CN100334722C (en) | 2004-08-11 | 2004-08-11 | Multiple chip integrated light-emitting diode frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100334722C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107092130A (en) * | 2016-09-30 | 2017-08-25 | 深圳市玲涛光电科技有限公司 | Light source assembly and its display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62248271A (en) * | 1986-04-21 | 1987-10-29 | Copal Co Ltd | Led array light source |
| CN2567784Y (en) * | 2002-07-18 | 2003-08-20 | 一诠精密工业股份有限公司 | Support structure for light-emitting diode |
| CN2574224Y (en) * | 2002-09-29 | 2003-09-17 | 佛山市光电器材公司 | Support for mfg. power type LED |
| CN2612075Y (en) * | 2003-02-08 | 2004-04-14 | 光鼎电子股份有限公司 | Package structure for LED |
-
2004
- 2004-08-11 CN CNB2004100607097A patent/CN100334722C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62248271A (en) * | 1986-04-21 | 1987-10-29 | Copal Co Ltd | Led array light source |
| CN2567784Y (en) * | 2002-07-18 | 2003-08-20 | 一诠精密工业股份有限公司 | Support structure for light-emitting diode |
| CN2574224Y (en) * | 2002-09-29 | 2003-09-17 | 佛山市光电器材公司 | Support for mfg. power type LED |
| CN2612075Y (en) * | 2003-02-08 | 2004-04-14 | 光鼎电子股份有限公司 | Package structure for LED |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1588641A (en) | 2005-03-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hubei Hualong Automobile Light Co.,Ltd. Assignor: Huazhong University of Science and Technology Contract fulfillment period: 2007.10.10 to 2012.10.10 Contract record no.: 2009420000069 Denomination of invention: Multiple chip integrated light-emitting diode frame Granted publication date: 20070829 License type: Exclusive license Record date: 2009.7.10 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2007.10.10 TO 2012.10.10; CHANGE OF CONTRACT Name of requester: HUBEI HUALONG CAR LAMP CO., LTD. Effective date: 20090710 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070829 Termination date: 20170811 |
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| CF01 | Termination of patent right due to non-payment of annual fee |